KR100407641B1 - Dummy land pattern of printed circuit board - Google Patents

Dummy land pattern of printed circuit board Download PDF

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Publication number
KR100407641B1
KR100407641B1 KR1019970006101A KR19970006101A KR100407641B1 KR 100407641 B1 KR100407641 B1 KR 100407641B1 KR 1019970006101 A KR1019970006101 A KR 1019970006101A KR 19970006101 A KR19970006101 A KR 19970006101A KR 100407641 B1 KR100407641 B1 KR 100407641B1
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South Korea
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land patterns
dummy
circuit board
printed circuit
dummy land
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KR1019970006101A
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Korean (ko)
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KR19980069173A (en
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이제현
한영렬
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삼성전자주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A dummy land pattern of a printed circuit board is provided to increase the reliability of a surface mounting by decreasing a cohesion difference for a solder cream between a dummy land pattern and a general land pattern. CONSTITUTION: External leads(21) of a surface mounting type package(20) are soldered to general land patterns(31) and dummy land patterns(33) of a printed circuit board(30) at a reflow process. Each of the external leads(21) has a width of W3. An inner width(W4) of the respective dummy land patterns(33) is narrower than an outer width(W5) thereof. A ratio of area between the respective dummy land patterns(33) and the respective general land patterns(31) is less than 1.5 times, even though the outer width(W5) is wider in 1.5 times than a width(W1) of the respective general land patterns(31). Therefore, a cohesion difference for a solder cream between the general land patterns(31) and the dummy land patterns(33) is reduced.

Description

인쇄회로기판의 더미 랜드패턴Dummy Land Pattern of Printed Circuit Board

본 발명은 인쇄회로기판의 더미 랜드패턴에 관한 것으로, 더욱 상세하게는 더미 랜드패턴과 일반 랜드패턴의 사이의 솔더크림의 응집력 차이를 감소시켜 표면실장형 패키지의 표면실장 신뢰성을 향상시키도록 한 인쇄회로기판의 더미 랜드패턴에 관한 것이다.The present invention relates to a dummy land pattern of a printed circuit board, and more particularly, to reduce the difference in cohesion of solder cream between a dummy land pattern and a general land pattern to improve surface mounting reliability of a surface mount package. The present invention relates to a dummy land pattern of a circuit board.

일반적으로 널리 알려진 바와 같이, QFP(quad flat package)와 SOJ(small outline j-bend package)과 같은 표면실장형 패키지의 표면실장공정은 인쇄회로기판의 랜드패턴들 위에 솔더크림(solder cream)을 코팅하고 표면실장형 패키지의 외부리드들을 상기 랜드패턴들 위에 놓은 후 상기 솔더크림을 리플로우(reflow)시키는 과정으로 이루어져 있다.As is commonly known, the surface mount process of surface mount packages such as quad flat package (QFP) and small outline j-bend package (SOJ) is used to coat solder cream on land patterns of the printed circuit board. And reflowing the solder cream after placing external leads of the surface mount package on the land patterns.

리플로우 과정중 프리히팅과 히팅 및 냉각단계를 거치는 동안 상기 랜드패턴들에 입혀져 있던 솔더크림이 용융, 경화되어 상기 외부리드들과 랜드패턴들이 견고하게 접속된다. 따라서, 표면실장형 패키지의 표면실장이 완료된다.During the reflow process, the solder cream applied to the land patterns during the preheating, heating, and cooling steps is melted and cured, and the outer leads and the land patterns are firmly connected. Thus, the surface mounting of the surface mount package is completed.

도 1은 종래 기술에 의한 인쇄회로기판의 랜드패턴들에 표면실장형 패키지가 실장된 상태를 나타낸 개략도이다.1 is a schematic view showing a state in which a surface mount package is mounted on land patterns of a conventional printed circuit board.

도시된 바와 같이, 인쇄회로기판(10)의 표면 위에 직사각형의 일반 랜드패턴들(11)이 형성되어 있고, 일반 랜드패턴들(11)의 양 외측에 직사각형의 더미 랜드패턴들(13)이 하나씩 형성되어 있다. 여기서, 일반 랜드패턴들(11)의 폭이 W1이고 더미 랜드패턴들(13)의 폭이 W2이다.As illustrated, rectangular general land patterns 11 are formed on the surface of the printed circuit board 10, and rectangular dummy land patterns 13 are formed on both sides of the general land patterns 11. Formed. Here, the widths of the general land patterns 11 are W1 and the widths of the dummy land patterns 13 are W2.

이와 같이 구성된 인쇄회로기판의 랜드패턴들에 표면실장형 패키지의 실장을 살펴보면 다음과 같다.Looking at the mounting of the surface-mount package to the land patterns of the printed circuit board configured as described above are as follows.

표면실장형 패키지(20)의 외부리드들(21)이 리플로우 공정에서 인쇄회로기판(10)의 일반 랜드패턴들(11)과 더미 랜드패턴들(13)에 대응하여 솔더링된다. 여기서, 외부리드들(21)의 폭이 W3이다.The outer leads 21 of the surface mount package 20 are soldered in correspondence with the general land patterns 11 and the dummy land patterns 13 of the printed circuit board 10 in the reflow process. Here, the width of the outer leads 21 is W3.

이때, 더미 랜드패턴들(13)의 폭(W2)이 일반 랜드패턴들(11)의 폭(W1)보다 1.5배 넓으므로 더미 랜드패턴들(13)과 일반 랜드패턴들(11) 사이의 솔더크림의 응집력 차이가 매우 크다. 이는 리플로우시 솔더크림의 응집력이 솔더크림의 체적에 비례하기 때문이다.In this case, since the width W2 of the dummy land patterns 13 is 1.5 times wider than the width W1 of the general land patterns 11, the solder between the dummy land patterns 13 and the general land patterns 11 may be reduced. The difference in cohesion of the cream is very large. This is because the cohesive force of the solder cream is proportional to the volume of the solder cream during reflow.

그런데, 표면실장형 패키지의 피치가 더욱 미세화되어 가고 있는데 현재 0.5mm 이하의 미세 피치를 갖는 표면실장형 패키지도 표면실장되고 있다. 이러한 미세 피치의 표면실장형 패키지의 경우, 더미 랜드패턴들(13)이 리플로우 진행 방향을 기준으로 일반 랜드패턴들(11)의 최전방과 최후방에 각각 위치하고 있으므로 리플로우 단계에서 더미 랜드패턴(13) 위의 솔더크림이 용융되는 시간과, 일반 랜드패턴들(11) 위의 솔더크림이 용융되는 시간 사이의 차이가 심하게 발생한다. 이로 인해, 표면실장형 패키지(20)의 외부리드들(21)의 틀어짐과 어긋남과 같은 불량현상이 자주 발생하였다.By the way, the pitch of a surface mount package is becoming more refined, but the surface mount package which has a fine pitch of 0.5 mm or less is also surface-mounted. In the case of such a fine pitch surface mount package, the dummy land patterns 13 are positioned at the front and rear of the general land patterns 11 with respect to the reflow progress direction, respectively. 13) The difference between the time that the above solder cream is melted and the time when the solder cream on the general land patterns 11 is melted is severely generated. As a result, defects such as misalignment and misalignment of the outer leads 21 of the surface mount package 20 frequently occur.

또한, 더미 랜드패턴들(13)의 폭(W2)이 일반 랜드패턴들(11)의 폭(W1)보다 1.5배 확대되어 있는데 이는 외부리드들(21)이 더미 랜드패턴들(13) 위의 솔더크림에 충분히 젖게 하여 납땜성을 향상시킴과 아울러 표면실장 완료된 패키지가 외부 충격으로부터 충분한 신뢰성을 갖도록 하기 위함이다. 하지만, 더미 랜드패턴들(13)의 폭(W2)이 일반 랜드패턴들(11)의 폭(W1)보다 1.5배 되므로 인하여 리플로우 단계에서 더미 랜드패턴들(13)과 일반 랜드패턴들(11) 사이의 솔더크림의 응집력 차이가 심각하게 나타난다. 결국, 솔더크림의 과납과 이로 인한 랜드패턴들과의 전기적 단락과 같은 불량현상이 자주 발생하여 코팅할 솔더크림의 양을 조정하는데 많은 어려움이 있었다.In addition, the width W2 of the dummy land patterns 13 is 1.5 times larger than the width W1 of the general land patterns 11, so that the outer leads 21 are disposed on the dummy land patterns 13. This is to improve the solderability by sufficiently wetting the solder cream and to ensure that the surface-mounted package has sufficient reliability from external impact. However, since the width W2 of the dummy land patterns 13 is 1.5 times larger than the width W1 of the general land patterns 11, the dummy land patterns 13 and the general land patterns 11 in the reflow step are performed. The difference in cohesion of solder cream between the two is severe. As a result, defects such as overcharging of solder cream and electrical short circuits with land patterns are frequently caused, and thus, it is difficult to adjust the amount of solder cream to be coated.

따라서, 본 발명의 목적은 리플로우시 더미 랜드패턴들의 형상을 변경하여 표면실장형 패키지의 표면실장 신뢰성을 향상시키도록 한 인쇄회로기판의 더미 랜드패턴을 제공하는데 있다.Accordingly, an object of the present invention is to provide a dummy land pattern of a printed circuit board to change the shape of the dummy land patterns during reflow to improve the surface mounting reliability of the surface mount package.

도 1은 종래 기술에 의한 인쇄회로기판의 랜드패턴들에 표면실장형 패키지가 실장된 상태를 나타낸 개략도.1 is a schematic diagram showing a state in which a surface mount package is mounted on land patterns of a conventional printed circuit board.

도 2는 본 발명에 의한 인쇄회로기판의 더미 랜드패턴에 표면실장형 패키지가 실장된 상태를 나타낸 개략도.Figure 2 is a schematic diagram showing a state in which the surface-mount package is mounted on the dummy land pattern of the printed circuit board according to the present invention.

* 도면의주요부분에대한부호의설명 *Explanation of symbols on the main parts of the drawing

10: 인쇄회로기판 11: 일반 랜드패턴10: printed circuit board 11: general land pattern

13: 더미 랜드패턴 20: 표면실장형 패키지13: dummy land pattern 20: surface mount package

21: 외부리드 30: 인쇄회로기판21: external lead 30: printed circuit board

31: 일반 랜드패턴 33: 더미 랜드패턴31: general land pattern 33: dummy land pattern

이와 같은 목적을 달성하기 위한 본 발명에 의한 인쇄회로기판의 더미 랜드패턴은 더미 랜드패턴들의 폭을 길이에 따라 다르게 하는 것을 특징으로 한다. 이에 의하면, 더미 랜드패턴들과 일반 랜드패턴들 사이의 면적 차이가 감소하여 리플로우시 솔더크림의 응집력 차이가 감소하고 솔더크림의 과납과 단락 등과 같은 불량현상의 발생이 방지된다. 따라서, 표면실장형 패키지의 실장 신뢰성이 향상된다.The dummy land pattern of the printed circuit board according to the present invention for achieving the above object is characterized by varying the width of the dummy land pattern according to the length. As a result, the area difference between the dummy land patterns and the general land patterns is reduced, so that the difference in the cohesive force of the solder cream during reflow is reduced, and the occurrence of defects such as excessive soldering and short circuit of the solder cream is prevented. Thus, the mounting reliability of the surface mount package is improved.

이하, 본 발명에 의한 인쇄회로기판의 더미 랜드패턴을 첨부된 도면을 참조하여 상세히 설명하기로 한다. 종래의 부분과 동일한 부분에는 동일한 부호를 부여한다.Hereinafter, a dummy land pattern of a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings. The same code | symbol is attached | subjected to the part same as a conventional part.

도 2는 본 발명에 의한 인쇄회로기판의 더미 랜드패턴에 표면실장형 패키지가 실장된 상태를 나타낸 개략도이다.2 is a schematic view showing a surface-mounted package mounted on a dummy land pattern of a printed circuit board according to the present invention.

도시된 바와 같이, 인쇄회로기판(30)은 더미 랜드패턴(33)의 전체 길이중 일정 부분이 내측 폭(W4)을 가지고 나머지 부분이 외측 폭(W5)을 가지며 외측 폭(W5)이 내측 폭(W4) 보다 넓게 형성된 것을 제외하면 도 1의 구조와 동일하다.As shown, the printed circuit board 30 has a portion of the total length of the dummy land pattern 33 has an inner width W4, the remaining portion has an outer width W5, and the outer width W5 has an inner width. It is the same as the structure of FIG. 1 except that it is formed wider than (W4).

이와 같이 구성된 인쇄회로기판의 랜드패턴들에 표면실장형 패키지의 실장을 살펴보면 다음과 같다.Looking at the mounting of the surface-mount package to the land patterns of the printed circuit board configured as described above are as follows.

먼저, 표면실장형 패키지(20)의 외부리드들(21)이 리플로우 공정에서 인쇄회로기판(30)의 일반 랜드패턴들(31)과 더미 랜드패턴들(33)에 대응하여 솔더링된다. 여기서, 외부리드들(21)의 폭이 W3이다.First, the outer leads 21 of the surface mount package 20 are soldered in correspondence with the general land patterns 31 and the dummy land patterns 33 of the printed circuit board 30 in the reflow process. Here, the width of the outer leads 21 is W3.

이때, 더미 랜드패턴들(33)의 내측 폭(W4)이 외측 폭(W5) 보다 좁으므로 외측 폭(W5)이 일반 랜드패턴들(31)의 폭(W1)보다 1.5배 넓을지라도 더미 랜드패턴들(33)과 일반 랜드패턴들(31)의 면적대비가 1.5배 이하로 된다.At this time, since the inner width W4 of the dummy land patterns 33 is narrower than the outer width W5, the dummy land pattern may be 1.5 times wider than the width W1 of the general land patterns 31. The area ratio of the fields 33 and the general land patterns 31 is 1.5 times or less.

그러므로, 더미 랜드패턴들(33)과 일반 랜드패턴들(31) 사이의 솔더크림의 응집력 차이가 종래에 비하여 감소하므로 리플로우 단계에서 더미 랜드패턴들(33)과 일반 랜드패턴들(31) 사이의 솔더크림의 응집력 차이 또한 종래에 비하여 감소한다. 또한, 더미 랜드패턴의 외측 폭(W5)이 도 1의 더미 랜드패턴(13)의 폭(W2)과 동일하게 형성되어 있으므로 솔더링의 강화를 종전과 마찬가지로 유지할 수 있다.Therefore, the difference in the cohesion force of the solder cream between the dummy land patterns 33 and the general land patterns 31 is reduced compared to the conventional one, so that the dummy land patterns 33 and the general land patterns 31 in the reflow step are reduced. The cohesion difference of the solder cream is also reduced compared to the conventional. In addition, since the outer width W5 of the dummy land pattern is formed to be the same as the width W2 of the dummy land pattern 13 of FIG. 1, the reinforcing of soldering can be maintained as before.

그리고, 미세 피치의 표면실장형 패키지를 실장하는 경우, 솔더크림의 과납으로 인한 외부리드들(21)의 단락을 방지하여 솔더크림의 양을 용이하게 조정할 수 있다. 이와 더불어, 리플로우 단계에서 더미 랜드패턴(33) 위의 솔더크림이 용융되는 시간과, 일반 랜드패턴들(31) 위의 솔더크림이 용융되는 시간 사이의 차이가 감소하여 표면실장형 패키지(20)의 외부리드들(21)의 틀어짐과 어긋남과 같은 불량현상의 발생을 방지할 수 있다.In addition, when mounting a surface-mount package having a fine pitch, the amount of solder cream may be easily adjusted by preventing a short circuit of the external leads 21 due to excessive solder cream. In addition, the difference between the time that the solder cream on the dummy land pattern 33 is melted and the time when the solder cream on the general land patterns 31 is melted in the reflow step is reduced, thereby reducing the surface mount package 20. It is possible to prevent the occurrence of defects, such as misalignment and misalignment of the outer leads (21).

이상에서 상세히 설명한 바와 같이, 본 발명에 따른 인쇄회로기판의 더미 랜드패턴은 전체 길이중 일부인 내측 폭을 외측 폭보다 작게 형성하여 더미 랜드패턴 고유의 역할을 수행하면서도 일반 랜드패턴들과의 면적대비 차이를 감소시켜 솔더크림의 응집력 차이를 감소시킨다. 따라서, 솔더크림의 과납과 이로 인한 이웃 외부리드들의 전기적 단락을 방지하여 표면실장형 패키지의 표면실장 신뢰성을 향상시킨다.As described in detail above, the dummy land pattern of the printed circuit board according to the present invention forms an inner width, which is a part of the overall length, smaller than the outer width, thereby performing a unique role of the dummy land pattern, while being different from the area comparison with the general land patterns. Reduce the difference in cohesion of solder cream. Accordingly, overcharge of solder cream and consequent electrical short circuit of neighboring external leads are prevented, thereby improving surface mounting reliability of the surface mount package.

Claims (1)

표면실장형 패키지를 실장하기 위한 일반 랜드패턴과 더미 랜드패턴을 갖는 인쇄회로기판에 있어서,In a printed circuit board having a general land pattern and a dummy land pattern for mounting a surface mount package, 상기 더미 랜드패턴의 전체 길이중 내측부분의 폭이 외측부분의 폭보다 작게 형성되어 상기 더미 랜드패턴과 상기 일반 더미패턴과의 면적대비 감소를 이룩하는 것을 특징으로 하는 인쇄회로기판의 더미 랜드패턴.The width of the inner portion of the overall length of the dummy land pattern is formed smaller than the width of the outer portion to achieve a reduction in area ratio between the dummy land pattern and the general dummy pattern.
KR1019970006101A 1997-02-27 1997-02-27 Dummy land pattern of printed circuit board KR100407641B1 (en)

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