JPH0745916A - Printed wiring board - Google Patents

Abstract

PURPOSE:To obtain a printed wiring board, wherein a unit board is not separated from the multiple-board sheet in automatic mounting and the number of unit boards obtained from a regular blank and the effective mounting area of the unit board are increased. CONSTITUTION:A plurality of polygonal unit boards are formed on the surface of a multiple board sheet 1 in preparing printed wiring boards. In this wiring board, a cut line 5 and perforated parts 4 are formed at least at one place between end parts 3a of a slit 3 forming a perimeter of unit boards 6 constituting unit boards 2. The perforated parts 4 are provided at least at two places. The positions, where the cut line 5 and the perforated parts 4 are formed, are provided at the parts inner than a unit board perimeter 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board in which a plurality of single substrates are mounted on a multi-chamfered sheet substrate, and after mounting components, each single substrate is divided into individual pieces.

[0002]

2. Description of the Related Art FIG. 2 is a view partially showing a single substrate 2 in a conventional multi-chamfered sheet substrate. Actually, a plurality of single-piece substrates 2 are attached to the multi-sided sheet substrate 1. When manufacturing a printed wiring board of this kind of hybrid integrated circuit, a large-sized fixed-size board (1 × 1 m ² or 1
A plurality of single boards 2 are mounted on a surface of x 1.2 m ² ), and a circuit configuration, a component mounting hole, etc. are formed for each single board 2 in units of large-sized fixed boards, and then, automatically. It is common to manufacture the multi-chambered sheet substrate 1 by cutting it into a size that can be set in a mounting machine. The slits 3 and the perforations 4 are simultaneously processed when the multi-chambered sheet substrate 1 is manufactured. The slit 3 has a width T of 1 mm outside the outer peripheral portion 6 of the single substrate, the perforation 4 is 1 mm in diameter on the center line of the slit 3, and the interval P between the perforation 4 and the end 3a of the slit 3 is 1 mm. . The number of perforations 4 is one. In this case, the size of the single substrate 2 is regulated by the frame 7 formed by extending the cutting line.

This perforation 4 is one of the single substrate 2 in FIG.
Although there is one location on one side, there may be multiple locations on one side of the single substrate 2 depending on the size of the single substrate 2. The multi-chamfered sheet substrate 1 thus manufactured is set in an automatic mounting machine, components are mounted on each single substrate 2, and then the multi-chamber sheet substrate 1 is cut into individual pieces of the single substrate 2 at the cutting line 5. A method of manufacturing a printed board by dividing into two is well known.

[0004]

According to the method described above,
Since there is only one perforation, the total distance of the part corresponding to the cutting line is short, so the supporting force is small, and the cutting line is sheared by the force applied when components are automatically mounted, and the single substrate is separated from the multi-faced sheet substrate. There is a problem. Further, since the cutting line is outside the outer peripheral portion of the single substrate, the size of the single substrate is restricted within the frame formed by extending the cutting line,
There is also a problem that the number of single substrates that can be obtained from the differential-sized substrate is reduced, and the effective mounting area of the single substrates is also reduced.

The present invention has been made in view of the above problems, and an object thereof is to prevent the single substrate from being separated from the multi-sided sheet substrate during automatic mounting, and further to obtain the number of single substrates that can be obtained from the regular size substrate and An object of the present invention is to provide a printed wiring board that increases the effective mounting area of a single board.

[0006]

According to the present invention, the above-mentioned object is, in a printed wiring board manufactured by imposing a plurality of polygonal single substrates on a multi-chamfered sheet substrate, adjacent from each corner. Each end of a slit that extends to a corner and forms an outer peripheral portion of a single substrate that constitutes a single substrate is provided so as to project inwardly of the single substrate, and at least one cutting line and a sewing machine are provided between the projected ends. It is what formed the eyes. And
It is effective to make the number of perforations between the ends of the slit at least two. Further, it is effective to form perforations on the cutting line.

[0007]

According to the structure of the present invention, in a printed wiring board manufactured by imposing a plurality of polygonal single-piece substrates on a multi-chamfered sheet substrate, a cutting line is formed inside the outer periphery of the single-piece substrate forming the single-piece substrate. Since the perforations are located and the protruding portions are eliminated, the number of sheets and the effective mounting area of the single substrate that can be taken from the differential constant length substrate are increased. Furthermore, by providing at least two perforations, the total length of the cutting lines increases, the supporting force that can withstand the force received during automatic mounting increases accordingly, and the single substrate does not separate during automatic mounting. .

[0008]

FIG. 1 is a block diagram showing this embodiment. In this figure, the slits, perforations, etc. are exaggerated and enlarged. Those having the same functions as those in the conventional example are designated by the same reference numerals. This embodiment will be described with reference to FIG. Similar to the conventional example, the slit 3 and the perforations 4 have a width T of 1 mm outside the outer peripheral portion 6 of the single substrate, the perforations 4 have a diameter of 1 mm on the center line of the slit 3, and the perforations 4 and the slits. The distance P between the end portion 3a of 3 and the outer peripheral portion of the perforation 4 was 1 mm, and the number of perforations 4 was two.
The outer dimensions of the single substrate 2 were 80 × 98 mm ^{2 which} is more efficient than the standard substrate in the number of 1 × 1.2 m ² . Four pieces of the single-piece substrate 2 were attached to the multi-sided sheet substrate 1 from the standard length substrate, and two pieces of the single-piece substrate 2 were attached to each other, and press working was performed using a press die. This process can be easily done using an NC router or the like. The multi-layered sheet substrate 1 obtained here was set in an automatic mounting machine to mount components. During this time, the phenomenon that the single substrate 2 was separated by the force due to the automatic mounting did not occur. In this case, the external dimensions of the single substrate 2 is 1 ×
80m, which is more efficient than the 1.2m ² standard size substrate
Since it is 98 mm ² , the number of single substrates 2 that can be taken is 9%,
The effective mounting area of the single substrate 2 increased by 5.7% from the conventional example. It should be noted that although the number of single substrates 2 to be taken may not increase depending on the size of the external dimensions of the single substrates 2, it has been confirmed that the mounting effective area of the single substrates 2 necessarily increases.

After the component mounting, the single substrate 2 was separated by hand, but no problem occurred. It is also possible to separate the single substrate 2 after component mounting without difficulty by using a simple jig or the like.

[0010]

As described above, according to the present invention, in a printed wiring board manufactured by imposing a plurality of polygonal single substrates on a multi-chamfered sheet substrate, the outer periphery of the single substrate constituting the single substrate By forming cutting lines and perforations on the inner side, the single substrate does not separate from the multi-chambered sheet substrate during automatic mounting, further increasing the effective mounting area of the single substrate, and depending on the outer diameter of the single substrate, It is possible to significantly increase the number of single substrates that can be obtained from the standard size substrate. Further, the cost of the printed wiring board can be greatly reduced depending on the outer diameter of the single board.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a printed wiring board according to the present invention.

FIG. 2 is a configuration diagram of a printed wiring board according to a conventional example.

[Explanation of symbols]

 1 Multi-Chamfering Sheet Substrate 2 Single Substrate 3 Slit 3a Edge 4 Perforation 5 Cutting Line 6 Single Substrate Perimeter 7 Frame

Claims (3)

[Claims] 1. In a printed wiring board manufactured by imposing a plurality of polygonal single substrates on a multi-chamfered sheet substrate, an outer periphery of the single substrate extending from each corner to an adjacent corner side to form the single substrate. Each end of the slit forming the part is projected inward of the single substrate, and at least 1 is provided between the projected ends.
A printed wiring board having cut lines and perforations formed at some places. 2. The printed wiring board according to claim 1, wherein the number of perforations is at least two. 3. The wiring board according to claim 1 or 2,
A printed wiring board having perforations formed on a cutting line.