JP3514961B2 - Method of identifying split board, method of manufacturing the same, and split board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a split substrate identifying method and manufacturing method, and in a substrate composed of a plurality of split substrates in one sheet, particularly in which position on the sheet the split substrate is located after the substrate is divided. It is about how to make it possible to determine whether there was.

[0002]

2. Description of the Related Art Conventionally, one sheet-shaped printed circuit board composed of a split substrate (referred to as a substrate having the same size, the same shape and the same specifications, obtained by dividing one sheet of printed circuit board) is a chip. The mounter automatically mounts the component by placing the component at a predetermined position on each of the split boards or by placing the component on each of the split boards at a predetermined position according to the specifications. After that, the parts were temporarily fixed with an adhesive and fixed by soldering. After that, using a cutting machine called a router, a slit (called a split portion) for cutting from one sheet of printed circuit board to a split board or V
A groove (called a split portion) was processed. The printed board was divided according to the slits or the V-grooves to obtain a split board.

In the split substrate thus obtained,
There is a possibility that defective products may be generated due to the processing steps such as the chip mounter and the soldering device. However, the method of constructing a printed circuit board composed of a plurality of sheet-shaped split boards on which the above-mentioned components are mounted is particularly limited even if the split boards have the same shape, size, and specifications. Since the printed circuit board was divided, it was not possible to identify the position on the sheet where the split board was located.

[0004]

In the prior art, after dividing the printed circuit board, if the above-mentioned defective product occurs without specifying the position on the sheet before the division of the divided board, each divided board is divided. I was investigating the cause of the failure and taking countermeasures. However, even if the location of this failure occurs at a specific position on the split board, it was impossible to determine which position on the construction of one sheet the split board was, and thus only one failure It was treated as a phenomenon, and no countermeasure for the fundamental cause of the failure was taken. Therefore, a defect that has occurred due to the same cause will reoccur, and there is a problem that the cause of the defect cannot be removed.

To solve this problem, for example, a display device substrate having an identification mark outside the display device substrate region has been proposed. However, this method has a problem that an extra process is required to add the identification mark, and the cost is increased. Related to this,
There is a technique described in JP-A-9-105895. In addition, in order to identify which part of a single board the printed board is, in a plurality of printed boards in which parts are arranged in the same position by dividing the same size and shape from one board, It has been proposed to use a figure of a writing component as an identification mark. However, this method has a problem that it is troublesome because it is necessary to draw the figure of the part and the like. Related to this is the technique described in Japanese Patent Laid-Open No. 7-245455.

The object of the present invention was made in view of the above problems of the prior art, and it can be obtained from a single-sheet printed circuit board without requiring special processing or printing and without changing the conventional steps. A method for identifying a split board, a method for manufacturing the split board, and a split board capable of specifying a position of the split board having the same shape and size on the printed board and taking a fundamental countermeasure against a location where a failure occurs in the split board. To provide a substrate.

[0007]

In order to achieve the above object, a method for identifying a split board according to the present invention is a method for identifying a plurality of split boards obtained from one sheet of printed board with identification marks on the printed board. In the identification method for identifying the position, the slit which is a split portion for dividing the printed board is set to a different position for each split board, and a slit portion at a different position is formed on each split board after the split. The protruding portion is used as the identification mark.

A method for manufacturing a split board according to the present invention is a method for manufacturing a plurality of split boards in which an identification mark of a position on the print board is attached from one sheet of the print board for dividing the printed board. The position of the slit that is the split portion is changed and processed for each of the split boards, the printed board is divided according to the slit, and a plurality of split boards that have the slit portions at the different positions as the identification marks are provided. It is characterized by obtaining.

The split board according to the present invention is a plurality of split boards having a position identifying mark on the printed board obtained from one sheet of the printed board, and the printed board whose position is changed for each split board. a slit which is divided portion of the substrate is provided, in divided each such divided board in the slit, is characterized in that said indicia a protrusion portion of the different positions of the slits are formed.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a method for identifying a position of a split board on a printed circuit board before division according to the present invention and a method for manufacturing a split board capable of identifying the position will be described below with reference to FIGS. To do.

[Embodiment 1] FIG. 1 is an embodiment of a method of manufacturing a split board according to the present invention, in which a position on a printed board can be identified. As shown in the figure, this is an example of taking one sheet and two sheets. Shaded parts 10a, 10b, 10c, 10d
Is a part where the printed circuit board 100 is cut out with a slit,
The V-cuts 20a, 20b, 20c, 20d are the split boards I,
It is a groove to divide into II. These slits 10 (10
a, 10b, 10c, 10d) and V cut 2
0 (generic name of 20a, 20b, 20c, 20d) was usually processed by a router. The slits 10 and the V-cuts 20 may be arbitrarily determined according to the specifications and materials of the printed circuit board 100 in consideration of the difficulty of division and the like. As shown in the drawing, the difference between the two split boards I and II is only the positions (2 mm portion in the drawing) of the board connecting portions of 1 and 2 in the figure. In the present embodiment, the positions of the board connecting portion 1 of the board I shown in the drawing and the board connecting portion 2 of the board II shown in the drawing are 6 mm.
It is configured with a slight shift.

The size by which this position is shifted depends on the split substrates I and II.
It can be set arbitrarily within the range that does not interfere with the function of. The processing of this part by the router is a place where there is no problem in terms of assembly and function, and does not require modification or addition to the conventional processing process. The sheet of the printed circuit board 100 is divided by a slitting machine according to the slits 10 and the V-cuts 20, and at the same time, the upper part, the middle part, the lower part and the left and right parts of the upper part, the lower part of the left and right parts, and the total of the lower part are measured. Two split substrates I and II can be obtained by removing seven unnecessary portions. The 1 mm and 2 mm portions of 2 mm remain as protrusions on the split substrates I and II even after the division. This protrusion can be used as an identification mark of the split substrate.

Embodiment 2 With reference to FIGS. 2 and 3, an embodiment of a method for identifying a position of a split board before division on a printed board according to the present invention will be described. FIG. 2 is an explanatory diagram of an embodiment of a method of identifying a split board position on a printed board according to the present invention. In the present embodiment, an example of taking four sheets with one sheet will be described. In the present embodiment, unlike the above-described [Embodiment 1] of FIG. 1, the positions of the board connecting portions 1 and 2 are not shifted on each split board, but rather as shown in 3 and 4 of FIG. By providing a small hole on the cut 20, the small hole is used as an identification mark. In the small holes, 1φ is 2 in 3 parts and 1φ is 4 in 4 parts. That is, in the split substrates I, II, III, and IV after dividing this sheet, the small holes provided on the V-cut 20 are split substrates I, II, and II.
It remains as a notch on the outer edge of I and IV. If there is one notch on the upper left outer edge, it means the substrate of the III section, and if there are two notches on the upper left outer edge, it means the substrate of the IV section.

FIG. 3 is a modification of the embodiment of the method for identifying the split board position on the printed board of FIG. FIG. 3 shows FIG.
It is explanatory drawing of other embodiment of the identification method of the split board position of FIG. In the present embodiment, the slit 10 is stopped and all the V cuts 20 are divided. As shown in FIG. 2, small holes for identification are provided in the 5th and 6th portions. The small holes have two 1φs in the 5th part and four 1φs in the 6th part. The method of obtaining the divided substrate by division and the specification of the position after division are the same as the method described in FIG.

The present invention is not limited to the above-described embodiment, and small holes are formed in the printed wiring pattern on the board and at a place which does not affect the function at the time of assembly, for example, a board without holes and a board with holes or holes. Various modifications such as identification based on the number of

FIG. 4 is an explanatory view of another example of the method for identifying the position of the split board on the printed board. This example is different from the above-mentioned [Embodiment 1] and [Embodiment 2], and is an example in which the printed board 100 is printed with silk.
As an example, “A” is printed on 7 parts of the printed circuit board 100. If you take two sheets of one sheet, you can print "B" on the second sheet, and if you take four sheets of one sheet,
It suffices to print “B”, “C”, and “D” sequentially. This identification mark does not have to be "A", "B", ..., And any mark can be used as long as it can be identified by "1", "2", ....

FIG. 5 is a modification of FIG. 4, in which a copper foil of a printed wiring pattern is etched and used instead of silk printing. FIG. 5 is an explanatory diagram of still another example of the method for identifying the position of the split board on the printed board. As shown in FIG. 8 part, the copper foil of the printed circuit board 100 is etched as “A”. As in the case of FIG. 4, this identification mark may be sequentially increased to “B”, “C”, and “D” each time the number of sheets per sheet increases.

However, in the example of FIGS. 4 and 5, each time the number of split substrates per sheet increases, the data of the silk and the printed wiring pattern increase, so that the above-mentioned [Embodiment 1] described with reference to FIGS. ], There is a disadvantage that the processing man-hour is increased as compared with [Embodiment 2].

[0019]

As described above in detail, according to the method of identifying the position of the split board on the printed board, the method of manufacturing the split board and the structure of the split board according to the present invention, the print before the division is performed on the split board after the division. Since the position that can be placed on the substrate can be specified, if there is a cause due to the position of the split substrate at the time of failure occurrence, elucidation of the cause serves as a guide, and there is an effect that the production process and efficiency can be improved. In other words, for example, when a component mounter is located at a certain mounting position, the component cannot be mounted properly, or the printed circuit board may bend due to the way the board is fixed during mounting, which may interfere with component mounting. It has the effect of assisting in investigating the cause and analyzing it.
In addition, by recording the position at the time of failure occurrence, including external accidents, the statistics can be used as a clue for investigating the cause of any failure.

[Brief description of drawings]

FIG. 1 is an embodiment of a method of manufacturing a split board whose position on a printed board can be identified according to the present invention.

FIG. 2 is an explanatory diagram of an embodiment of a method of identifying a split board position on a printed board according to the present invention.

FIG. 3 is an explanatory diagram of another embodiment of the method of identifying the split board position in FIG.

FIG. 4 is an explanatory diagram of another example of the method for identifying the position of the split board on the printed board.

FIG. 5 is an explanatory diagram of still another example of the method for identifying the position of the split board on the printed board.

[Explanation of symbols]

1, 2 ... Identification marks 3 due to differences in substrate connecting portions 3, 4, 5, 6 ... Identification marks 7 by holes formed in V-cut portions 7, 8 ... Identification marks 10 by silk or etching 10 ... Generic names of slits 10a, 10b, 10c 10d ... Slit 20 ... V cut generic name 20a, 20b, 20c, 20d ... V cut 100 ... Printed circuit board

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Claims (3)

(57) [Claims] 1. A method for identifying a plurality of split boards obtained from one sheet of print boards by using identification marks to identify positions on the print board, wherein slits for splitting the print board are provided. A method for identifying a split substrate, wherein the split substrate has different positions, and the protrusions formed by the slit portions at different positions in the split substrates after division are used as the identification marks. 2. The print from one sheet of printed circuit board
In a method of manufacturing a plurality of split boards with identification marks of positions on the board , a slit that is a split portion for dividing the printed board.
Change the position of the blade for each of the split boards and process it.
The printed circuit board is divided according to
Multiple split substrates with the slit portion of the table as the identification mark
A method for manufacturing a split substrate, which comprises: 3. A plurality of split boards having a position identification mark on the print board obtained from one sheet of the print board , wherein the print is changed in position for each of the split boards. Board split
Minute slit is provided and the slit is divided by the slit.
Forming slits at different positions on each split board
The split base is characterized by using the protruding portion as the identification mark.
Board .