JPS61263294A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS61263294A JPS61263294A JP10500285A JP10500285A JPS61263294A JP S61263294 A JPS61263294 A JP S61263294A JP 10500285 A JP10500285 A JP 10500285A JP 10500285 A JP10500285 A JP 10500285A JP S61263294 A JPS61263294 A JP S61263294A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- auxiliary
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器に使用される、補助用分割基板を有す
るプリント配線板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a printed wiring board having an auxiliary divided substrate used in electronic equipment.
従来の技術
従来の補助用分割基板を有するプリント配線板は、第２
図に示す構成であった。１はプリント配線回路を有する
メインのプリント配線板であり、２は分割すべき補助用
分割基板である。その補助用分割基板２の両端はプリン
ト配線板１の外端に延びるスリブ）３ 、３’があり、
補助用分割用基板２とプリント配線板１の間はミシン目
状打抜孔４が設けられていた。2. Description of the Related Art A conventional printed wiring board having an auxiliary divided board has a second
The configuration was shown in the figure. 1 is a main printed wiring board having a printed wiring circuit, and 2 is an auxiliary dividing board to be divided. Both ends of the auxiliary divided board 2 have sleeves) 3 and 3' extending to the outer ends of the printed wiring board 1,
A perforated hole 4 was provided between the auxiliary dividing board 2 and the printed wiring board 1.
上記補助用分割基板２は、メインのプリント配線板１に
電子部品を実装する工程において、電子部品の挿入ま之
は装着する工程、次に半田付または半田リフローする工
程等において、基板のそり、電子部品の加重等によるス
トレスが加わることによって生じるプリント配線板の変
形や破損を防止するため、補強基板として利用されてい
た。The above-mentioned auxiliary divided board 2 is used to prevent warping of the board during the process of mounting electronic components on the main printed wiring board 1, the process of inserting and mounting the electronic components, and the process of soldering or solder reflow. It was used as a reinforcing board to prevent printed wiring boards from deforming or breaking due to stress caused by the weight of electronic components.
発明が解決しようとする問題点
上記の補助用分割基板２とプリント配線板１の間のミシ
ン目状打抜孔４とその補助用分割基板２の両端でプリン
ト配線板１の外端に延びるスリブ）３．３’の加工は通
常プレス打抜により同時に形成されることから、上記ミ
シン目状打抜孔４の間でクラック、ヒビ割れ等が生じる
という問題があった。そのために前述の電子部品実装工
程で補助用分割基板２が割れてしまうことがあり、極端
な場合には、プレス打抜直後に補助用分割基板２が割れ
て完全に分離してしまうことがあった。Problems to be Solved by the Invention The perforation-like punched holes 4 between the auxiliary divided board 2 and the printed wiring board 1 and the sleeves extending to the outer ends of the printed wiring board 1 at both ends of the auxiliary divided board 2) Since the processing of 3.3' is usually performed at the same time by press punching, there is a problem in that cracks, cracks, etc. occur between the perforated punched holes 4. For this reason, the auxiliary divided board 2 may crack during the electronic component mounting process described above, and in extreme cases, the auxiliary divided board 2 may crack and be completely separated immediately after press punching. Ta.
本発明は以上のような従来の欠点を除去するものであり
、クラックやひび割れのないプリント配線板の製造方法
に関するものである。The present invention eliminates the above-mentioned conventional drawbacks and relates to a method of manufacturing a printed wiring board that is free from cracks and cracks.
問題点全解決するための手段
本発明は補助用分割基板とメインのプリント配線板の間
のミシン目状打抜孔の形成と同時に、補助用分割基板内
に捨て孔を打抜形成することにより、上記問題点を解決
することができるものである。Means for Solving All Problems The present invention solves the above-mentioned problems by simultaneously forming perforation-like punched holes between the auxiliary divided board and the main printed wiring board and punching holes in the auxiliary divided board. It is something that can solve the problem.
作用
本発明は上述のように、ミシン目状打抜孔を加工と同時
に補助用分割基板内に捨て孔を形成するため、ミシン目
状打抜孔にプレスのストレスが生じて補助用分割基板を
外側に押し出す力が発生するが、上記捨て孔を加工する
金型のポンチは補助用分割基板を外側に移動しないよう
に固定する働きをするから、ミシン目状打抜孔間へのク
ラックの発生、ヒビ割れ、さらには分離することがなく
なるのである。Function As described above, in the present invention, since the perforation-like punched holes are processed and the waste holes are formed in the auxiliary divided substrate at the same time, press stress is generated in the perforated punched holes, causing the auxiliary divided substrate to move outward. An extrusion force is generated, but since the punch of the mold used to process the above-mentioned waste holes works to fix the auxiliary divided board so that it does not move outward, cracks may occur between the perforated punched holes. , furthermore, there will be no separation.
実施例
第１図は本発明の一実施例による補助用分割基板を有す
るプリント配線板の平面図であり、第１図において、６
はプリント配線回路を有するメインのプリント配線板で
あり、７は分割すべき補助用分割基板である。８．８′
はスリットであり、９はミシン目状打抜孔であり、１ｏ
が捨て孔である。Embodiment FIG. 1 is a plan view of a printed wiring board having an auxiliary divided board according to an embodiment of the present invention.
7 is a main printed wiring board having a printed wiring circuit, and 7 is an auxiliary dividing board to be divided. 8.8'
is a slit, 9 is a perforation-like punched hole, and 1o
is a waste hole.
プリント配線板６は絶縁基板上に周知の方法で導体回路
を形成したものである。通常は１つあるいは複数のプリ
ント配線回路を有するワークサイズで生産されたものに
部品取付用孔、ミシン目状打抜孔スリット及び外形締金
同時に打抜加工を施こすことにより、第１図に示す形状
のプリント配線板１が得られ九。その時、補助用分割基
板７の両端がプリント配線板６の外端に延びるスリット
８．８”ｉ有する場合において、プリント配線回路中の
部品取付孔、ミシン目状打抜孔９、スリン）８．８’及
び外形線を同時に打抜加工できる金型に補助用分割基板
７中に捨て孔１ｏを設けるためのポンチを追加した。こ
のようにすれば、上記打抜加工において、補助用分割基
板７はプリント配線板６はミシン目状打抜孔９′により
外側にストレスが加わるが、捨て孔１ｏにより補助用分
割基板７は外側への移動がなくなり、固定されるから、
ミシン目状打抜孔９間へのクラックの発生、ヒビ割れが
なくなった。The printed wiring board 6 is an insulating substrate on which a conductive circuit is formed by a well-known method. Normally, parts are produced in a work size with one or more printed wiring circuits, and by simultaneously punching holes for mounting parts, perforation-like punched hole slits, and external fastenings, as shown in Figure 1. A printed wiring board 1 having the shape 9 is obtained. At that time, in the case where both ends of the auxiliary divided board 7 have slits 8.8"i extending to the outer ends of the printed wiring board 6, component mounting holes in the printed wiring circuit, perforated punch holes 9, slits 8.8 A punch is added to the mold that can simultaneously punch out the auxiliary divided board 7 and the outer shape. Although stress is applied to the outside of the printed wiring board 6 due to the perforated punched holes 9', the auxiliary divided board 7 is fixed without moving outward due to the extra holes 1o.
Cracks between the perforated holes 9 and cracks are no longer present.
発明の効果
以上のように本発明によれば、補助用分割基板に捨て孔
を設けるからミシン目状打抜孔加工によるクラック、ヒ
ビ割れが防止できるため、プリント配線板の歩留が著し
く向上するものであり、工業上利用価値の大なるもので
ある。Effects of the Invention As described above, according to the present invention, the yield of printed wiring boards is significantly improved because the auxiliary dividing board is provided with waste holes, thereby preventing cracks and crazing caused by perforated punching holes. Therefore, it has great industrial utility value.
第１図は本発明のプリント配線板の製造方法の一実施例
によるプリント配線板を示す平面図であυ、第２図は従
来の方法によるプリント配線板を示す断面図である。
６・・・・・・メインのプリント配線板、７・・・・・
・補助用分割基板、８，８′・・・・・・スリット、９
・・・・・ベシン目状打抜孔、１ｏ・・・・・・捨て孔
。
第１図FIG. 1 is a plan view showing a printed wiring board according to an embodiment of the printed wiring board manufacturing method of the present invention, and FIG. 2 is a sectional view showing a printed wiring board according to a conventional method. 6... Main printed wiring board, 7...
・Auxiliary divided board, 8, 8'...Slit, 9
... Basin-shaped punched hole, 1o ... Discarded hole. Figure 1
Claims (1)
ン目状打抜孔を設けると同時に、補助用分割基板内に捨
て孔を設けることを特徴とするプリント配線板の製造方
法。A method for manufacturing a printed wiring board, characterized by providing perforated punch holes between an auxiliary divided board and a main printed wiring board, and at the same time providing a waste hole in the auxiliary divided board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10500285A JPS61263294A (en) | 1985-05-17 | 1985-05-17 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10500285A JPS61263294A (en) | 1985-05-17 | 1985-05-17 | Manufacture of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61263294A true JPS61263294A (en) | 1986-11-21 |
| JPH0149031B2 JPH0149031B2 (en) | 1989-10-23 |
Family
ID=14395874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10500285A Granted JPS61263294A (en) | 1985-05-17 | 1985-05-17 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61263294A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04163989A (en) * | 1990-10-29 | 1992-06-09 | Hitachi Aic Inc | Manufacture of printed wiring board |
-
1985
- 1985-05-17 JP JP10500285A patent/JPS61263294A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04163989A (en) * | 1990-10-29 | 1992-06-09 | Hitachi Aic Inc | Manufacture of printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0149031B2 (en) | 1989-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |