JPS61159789A - Manufacture of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention makes it possible to carry out contour processing across an elongated through hole in which a conductive layer is formed on the inner wall without destroying the conductive layer. The present invention relates to a method of manufacturing a printed wiring board.

[Technical background of the invention and its problems] In general, through-hole printed wiring boards with elongated holes are manufactured by providing square holes during external processing, especially when vertical conduction is required. , vertical conduction is achieved by separately providing a through hole near the square hole. In addition, in recent years, instead of such secondary processing, it has become common to form elongated holes at the same time as processing other round holes and through holes, and to manufacture through-hole printed wiring boards.

Furthermore, recently, through-hole printed wiring boards have come into use, which make it possible to insert and solder components with a thickness less than the thickness of the board into the through-holes by providing such elongated through-holes on the outer end surface. It is becoming.

This through-hole printed wiring board is manufactured by providing an elongated hole so as to cross the contour processing line, and then performing external contour processing across the elongated hole by router processing, shirring processing, mold processing, etc.

However, such a through-hole printed wiring board has a problem in that when attempting to cut it along the contour line, the copper plating on the inner wall of the through-hole often peels off and the through-hole is destroyed.

[Objective of the Invention 1 The present invention has been made in response to such problems,
To provide a method for manufacturing a printed wiring board, in which the outline can be processed without destroying the conductive layer of the through hole when the outline is processed across an elongated through hole having a conductive layer on the inner wall.

[Summary of the Invention] That is, the method for manufacturing a printed wiring board of the present invention includes cutting a through-hole substrate having elongated through-holes in which a conductive layer is formed on the inner wall across at least one or more of the elongated through-holes. In a method of manufacturing a printed wiring board in which a printed wiring board is cut into a predetermined shape by cutting along a plane, a hole is drilled at the cutting position of the elongated through hole to be cut using a drill having a diameter larger than the width of the elongated through hole. By cutting away the conductive layer of the elongated through-hole and then cutting it at a predetermined cutting plane, the shape of the elongated through-hole can be processed without destroying the conductive layer.

[Embodiments of the invention] The method of the present invention will be explained below with reference to the drawings.

FIG. 1 shows a through-hole substrate 1 to which the method of the present invention is applied.
FIG.

This through-hole board 1 is made by, for example, drilling a plurality of long holes 1a11b, lc and round holes 2a, 2b in a glass cloth-epoxy resin double-sided steel-clad laminate using a drill or the like. A copper plating layer P is provided on the inner wall of each.

In the present invention, such a through-hole substrate 1 is
When cutting the outer shape lines 3a and 3b using a normal method to form a predetermined shape, cutting is performed in the following manner.

That is, as shown in Fig. 2, prior to cutting,
First, the outline processing lines 3a, 3b and the elongated through hole 1a1
Drill holes 4a, 4b, and 40 are drilled at the intersection with the center line of the elongated hole 1b11C using a drill whose diameter is slightly larger than the width of the elongated through hole 1. At this time, drilling with a drill is different from cutting using a cutting jig such as a router or shear used for external shaping, and is performed perpendicular to the board surface while rotating the teeth. The copper plating layer 1a on the inner walls of 1b and 10 will not be bulged or the like.

After this, the copper plating layer P at the cutting position of the elongated through hole is cut along the outline processing lines 3a and 3b using a router, shear, etc. in a conventional manner, as shown in Fig. 3. The copper plating layer P is removed by drilling as shown in the figure.
The external shape can be processed without causing any curling or the like.

[Embodiments of the invention] Next, examples of the present invention will be described.

Example As shown in FIG. 2, long holes and round holes were drilled in the glass-cloth-epoxy resin double-sided copper-clad laminate 1 using a 1.6nφ drill in the pattern shown in the same figure. The inner wall of the hole was plated with copper to form a through hole, and a predetermined circuit pattern was formed on both sides.

Next, the outline processing lines 3a, 3b and the elongated through hole la
A drill hole was drilled using a 1.8nφ drill at the intersection of , lb, and lc with the center line.

Thereafter, the outer shape was processed using a router along the outer shape processing lines 3a and 3b to produce a through-hole printed wiring board having a predetermined shape.

In the obtained through-hole printed wiring board, there was no destruction of the long through-holes due to cutting, and a desired circuit could be constructed by inserting and soldering parts with a thickness equal to or less than the thickness of the board.

[Effects of the Invention] As explained above, according to the method of the present invention, when cutting the outer shape across a long through hole, the conductive layer at the cut point is removed by drilling in advance, so the through hole is not destroyed. External shape processing can be performed without any need for external processing.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a through-hole board used in the method of the present invention, FIG. 2 is a plan view showing the through-hole board shown in FIG. FIG. 2 is an enlarged perspective view showing the main parts of a through-hole printed wiring board obtained by the method of the invention. 1a, 1b11c...Elongated hole through hole 2a
, 2b......Round through hole 3a,
3b......Cut surface 4a, 4b...
・・・・Drill hole P・・・・・・・・・・・・・・・・
・・・・・・Patent attorney representing copper plating layer Sasa Suyama
- Figure 1 @ Figure 2

Claims (2)

[Claims] (1) A printed wiring board in which a through-hole board having elongated through-holes with a conductive layer formed on the inner wall is cut to a predetermined outer shape by cutting a through-hole board that crosses at least one of the elongated through-holes. In the manufacturing method, a hole is drilled at the cutting position of the elongated through hole to be cut with a drill having a diameter larger than the width of the elongated through hole, the conductive layer at the cutting position is removed, and then a predetermined cutting surface is formed. A method for manufacturing a printed wiring board, characterized by cutting the printed wiring board. (2) The method for manufacturing a printed wiring board according to claim 1, wherein the conductive layer on the inner wall is a metal plating layer.