JPS62226687A - Printed wiring board with copper plated aperture and manufacture of the same - Google Patents
Printed wiring board with copper plated aperture and manufacture of the sameInfo
- Publication number
- JPS62226687A JPS62226687A JP7044286A JP7044286A JPS62226687A JP S62226687 A JPS62226687 A JP S62226687A JP 7044286 A JP7044286 A JP 7044286A JP 7044286 A JP7044286 A JP 7044286A JP S62226687 A JPS62226687 A JP S62226687A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- printed wiring
- wiring board
- hole
- continuous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 13
- 229910052802 copper Inorganic materials 0.000 title description 13
- 239000010949 copper Substances 0.000 title description 13
- 238000007747 plating Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 238000005553 drilling Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 241001424392 Lucia limbaria Species 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は１両面または多層構造のプリント配線基板およ
びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a single-sided or multilayer printed wiring board and a method for manufacturing the same.
（従来技術）
この種のプリント配線基板は、高周波回路部品等を取り
付けたり、プリント配線基板自体を接合するために、基
板内に一部スルーホール以外の開口部が形成され、この
開口部の周囲の表裏面およびこれを接合するよって開口
縁に銅メッキが施される。第２図に示す如く、従来この
ようなプリント配線基板１２の開口部１０の形成工事は
、 ＮＣ制御によるルータ−や、金型１３．１４によっ
て行われている。開口部の表裏面を電気的に導通状態に
するためには、金属板等を開口部周縁に付加して導通さ
せている。(Prior art) This type of printed wiring board has an opening other than a through hole formed in the board in order to attach high-frequency circuit components, etc. or to bond the printed wiring board itself, and the area around this opening is Copper plating is applied to the front and back surfaces and the edges of the opening by joining them. As shown in FIG. 2, the formation of the opening 10 of the printed wiring board 12 has conventionally been carried out using an NC-controlled router or molds 13 and 14. In order to make the front and back surfaces of the opening electrically conductive, a metal plate or the like is added to the periphery of the opening for electrical continuity.
（発明が解決しようとする問題点）
上述したように開口部を打抜き加工等で形成すると、開
口部切゛断縁に沿う部分では仕上り面の性状かラ一般ス
ルーホールのように鋼メッキが形成できない。したがっ
て、高周波回路部品の取り付け＃において、特にグラン
ドパターンを基板外形に付加する必要があるような場合
、金属板等の機械部品を新たに追加して半田付けやねじ
止めするしかなく、取り付けのための基板上のスペース
や工数増加の原因となっていた。(Problem to be Solved by the Invention) When the opening is formed by punching as described above, steel plating may be formed in the part along the cutting edge of the opening due to the nature of the finished surface, as is the case with general through-holes. Can not. Therefore, when installing high-frequency circuit components, especially when it is necessary to add a ground pattern to the board outline, there is no choice but to add a new mechanical component such as a metal plate and solder or screw it. This caused an increase in the space on the board and the number of man-hours required.
（問題点を解決するための手段）
本発明に係るプリント配線基板は、基板の板面内に貫ｊ
ｎ Ｌ、た開口部が形成され、前記開口部の一部に該開
口部の一部′／ｃ該開口部の輪郭予定線より外１ｌｌ１
１に脹らんだ複数の連続円弧状部分が形成され。(Means for Solving the Problems) The printed wiring board according to the present invention has a penetrating structure in the board surface of the board.
n L, an opening is formed in a part of the opening, and a part of the opening is outside the planned contour line of the opening.
1, a plurality of continuous arc-shaped parts are formed.
前記連続円弧状部分の輪郭縁に導体メッキが施され、か
つ該連続円弧状部分の両端近傍位置で前記導体メッキを
欠除せしめる小穴部が形成されて成るものである。Conductive plating is applied to the contour edge of the continuous arc-shaped portion, and small holes are formed near both ends of the continuous arc-shaped portion to remove the conductor plating.
上述の如きプリント配線基板を製造する工程としては、
一般スルーホール用の穴明は工程時に、開口部を画成す
る外形線即ち開口部輪郭予定線上またはこれて平行する
直線上にその中心をおきかつその穴径以下のピッチによ
って送られ、前記輪郭予定線より外側に連続した円弧状
部分が形成されるよう罠穴明けする工程と、スルーホー
ルメッキ後に、すでに形成された連続円弧形部分の両端
穴の外側で該連続円弧形部分の大半径以下の距離に中心
をおくドリル穴を２個明ける工程とを有する。The process of manufacturing the above-mentioned printed wiring board is as follows:
Drilling for general through-holes is performed during the process by placing the center on the outline line that defines the opening, that is, on the planned opening outline line, or on a straight line parallel to this, and at a pitch that is equal to or less than the hole diameter. A step of drilling a trap hole so that a continuous arc-shaped part is formed outside the planned line, and a step of drilling the diameter of the continuous arc-shaped part outside the holes at both ends of the continuous arc-shaped part that has already been formed after through-hole plating. and drilling two drill holes whose centers are located at a distance less than or equal to the radius.
（実施例）
次だ１本発明を図面を参照しながら実施例について説明
する。(Example) Next, an example of the present invention will be described with reference to the drawings.
第１図（ａ）は本発明の方法によって整造されたプリン
ト配線基板１２の斜視図であり、第１図（ｂ）は本発明
のプリント配線基板の連続大部分およびその内周輪郭部
に形成されるメッキ部分の拡大平面図である。プリント
配線基板１２のプリント基材１はそのほぼ中央部に矩形
状の開口部１ｏが形成され、開口部１０の輪郭縁の一部
に銅メツキ部４を有し、この部分で表面側銅パターン２
と裏面側銅パターン３が接続されている。５は一部スル
ーホールであって、周知の如くメッキが施され表裏ｍｌ
が接続されている。開口部１０の銅メツキ部４が形成さ
れる輪郭部分は、後述する如く矩形開口部を画成する直
線状の開口部輪郭予定線（仕上り外形線）１１よりも外
側へ、蛇腹状に、正確には連続円弧形状に、張り出てい
る。FIG. 1(a) is a perspective view of a printed wiring board 12 prepared by the method of the present invention, and FIG. 1(b) shows a continuous majority of the printed wiring board of the present invention and its inner peripheral contour. FIG. 3 is an enlarged plan view of a plated portion to be formed. The printed base material 1 of the printed wiring board 12 has a rectangular opening 1o formed almost in the center thereof, and has a copper plating part 4 in a part of the contour edge of the opening 10, and the surface side copper pattern is formed in this part. 2
and the back side copper pattern 3 are connected. 5 is a partially through hole, which is plated as is well known, and the front and back sides are ml.
is connected. The contour portion of the opening 10 where the copper plating portion 4 is formed is precisely contoured in a bellows-like manner outwards from the linear planned opening contour line (finished external contour line) 11 that defines the rectangular opening, as will be described later. It protrudes in a continuous arc shape.
第１図（ｂ）を参照して銅メツキ部４の形成方法および
これに関連して第１図（ａ）のプリント配線基板の製造
工程について説明する。まず矩形の開口部１０を形成す
る前に、開口部輪郭予定線１１の延長上に中心装置きか
つ半径ａの径で、しかも２ａより小さいピッチＰで送ら
れて穴加工された連続穴７（図示実施例では７個の穴）
が形成される。Referring to FIG. 1(b), a method for forming the copper plated portion 4 and a related manufacturing process for the printed wiring board shown in FIG. 1(a) will be described. First, before forming the rectangular opening 10, a continuous hole 7 ( (7 holes in the illustrated embodiment)
is formed.
このような連続穴７は開口部１０の対向した２辺部分に
形成されるが、このときは前述の如く矩形開口部１０の
最終外形加工はなされておらず、つまりプリント基材上
には矩形開口部１０けまだ画成されず、破５腺９で示す
ような穴加工の連続１−た外観を呈している。この後、
スルーホール５（第１図（ａ））および開口部周囲の板
面部分および前記連続穴７の穴縁部に銅メッキを施す。Such a continuous hole 7 is formed on two opposing sides of the opening 10, but at this time, the final external shape of the rectangular opening 10 is not processed as described above, that is, a rectangular shape is formed on the print substrate. The opening 10 is not defined and has the appearance of a continuous hole machining as shown by the broken hole 9. After this,
Copper plating is applied to the through hole 5 (FIG. 1(a)), the plate surface portion around the opening, and the hole edge of the continuous hole 7.
このように連続したドリル加工法を採用することにより
、従来の工程の中で使用されていた工作機械をそのまま
使用でき、かつ通常のスルーホールと同じく滑らかな加
工断面を形成することができ、これによって銅メツキ処
理での密着性がよく安定した銅メツキ部４が得られる。By adopting this continuous drilling method, the machine tools used in the conventional process can be used as is, and the machined cross section can be formed as smoothly as a normal through hole. As a result, a copper-plated portion 4 with good adhesion and stability during copper plating treatment can be obtained.
次にスルーホールおよび連続穴７の鋼メツキ工程終了後
、この連続穴７の両端近傍位ｍにドリルによる小穴６の
穴加工を行う。この工程は前記連続穴７の両端に位置す
る穴部の外側の基材板面上に位置し、それ自身（小穴６
）の大半径す寸法よりも小さい距離ｄだけ連続穴７０周
縁から離れた位ｔＩｔＩＩＣ中心を定めて穴加工を行う
。この連続式両端の２個の小穴６は、連続穴の両端近傍
位置の銅メッキ部４ｔ一部分的に破断す′る役目を果す
。このような鋼メッキ破断ないし中１所部分がないと、
両工程の矩形開口部打抜き加工時に桐メッキ連結部が大
きく剥離、破断される虞れがある。しかし上述のような
小さな銅メツキ破断加工を前もって行っておくことによ
り、その後の開口部最終外形加工工程において、ルータ
−または金型によって銅メツキ部が広範囲に連続破損す
るのが防止される。Next, after completing the steel plating process for the through holes and the continuous hole 7, small holes 6 are formed using a drill at positions m near both ends of the continuous hole 7. This step is performed on the surface of the base material plate outside the hole portions located at both ends of the continuous hole 7.
) The hole is machined by setting the center of the continuous hole 70 at a distance d smaller than the large radius dimension of the hole 70. The two small holes 6 at both ends of the continuous hole serve to partially break off the copper plated portion 4t near both ends of the continuous hole. If there is no such steel plating breakage or one part in the middle,
During the punching of the rectangular opening in both processes, there is a risk that the paulownia plated connection portion may be significantly peeled off or broken. However, by performing the small copper plating breakage process in advance as described above, it is possible to prevent the copper plating part from being continuously damaged over a wide range by a router or a mold in the subsequent final opening contour processing step.
つまり連続式最外端の銅メツキ端部８は最終外形加工時
に仮りに破損したとしてもメッキ部が小穴６′Ｆ−より
中断されているので、この破損の影響はそれより先には
及ばない。この小穴加工の後、矩形開口部の最終外形加
工が行われる。In other words, even if the copper-plated end 8 at the outermost end of the continuous type were to be damaged during the final external processing, the plating is interrupted by the small hole 6'F-, so the effect of this damage will not extend beyond that point. . After this small hole machining, final contour machining of the rectangular opening is performed.
（発明の効果）
以上説明したように本発明は、従来のプリント配線基板
の製造工程で使用されているのと同様の設置ｊｈをもっ
てプリント基材開口外形線に沿った開口縁部分に鋼メッ
キ加工を施すことが可能となる。(Effects of the Invention) As explained above, the present invention can process steel plating on the opening edge portion along the opening outline of the printed substrate with the same installation jh as used in the manufacturing process of conventional printed wiring boards. It becomes possible to perform
こｎによって高周波回路部品等を取り付けたり、プリン
ト配線基板自体を接合したりする１祭に、直接プリント
配線基板の断面に半田付けでき、製造工数削減および特
性向上を図ることができる。This allows soldering directly to the cross section of the printed wiring board during the process of attaching high frequency circuit components and bonding the printed wiring board itself, thereby reducing manufacturing man-hours and improving characteristics.
第１図（ａ）は本発明の方法によって製造さｆ″したプ
リント配線基板の斜視図、第１図（ｂ）は本発明のプリ
ント配線基板の銅メッキを施さｊ、た連続大部分の拡大
平面図、ｍ２図は従来工法による基板開口部の形成動作
を示す金型の斜視図である。
１・・・プリント基材、 ２．３・・・銅パターン
。
４・・・銅メツキ部、 ５・・・スルーホール。
６・・・小穴、 ７・・・連続穴、１０・
・・開口部、 １１・・・開口部輪郭予定線。
１２・・・プリント配線基°板。FIG. 1(a) is a perspective view of a printed wiring board manufactured by the method of the present invention, and FIG. 1(b) is an enlarged view of a continuous portion of the printed wiring board of the present invention after being copper-plated. The plan view and the m2 diagram are perspective views of a mold showing the operation of forming a substrate opening by a conventional method. 1... Printed base material, 2.3... Copper pattern. 4... Copper plating part, 5...Through hole. 6...Small hole, 7...Continuous hole, 10.
... Opening, 11... Opening outline planned line. 12...Printed wiring board.
Claims (2)
記開口部の一部に該開口部の輪郭予定線より外側へ張り
出た複数の連続拡開部分が形成され、前記連続拡開部分
の輪郭縁に導体メッキが施され、かつ該連続拡開部分の
両端近傍位置で前記導体メッキを欠除せしめる切開部が
形成されることを特徴とするプリント配線基板。(1) A penetrating opening is formed in the board surface of the substrate, a plurality of continuous enlarged portions are formed in a part of the opening, and extend outward from the planned contour line of the opening, and 1. A printed wiring board characterized in that conductor plating is applied to the contour edge of the expanded portion, and cutouts are formed near both ends of the continuously expanded portion to remove the conductor plating.
郭線に沿つて導体メッキを施してプリント配線基板を製
造する方法において、前記開口部以外の一般スルーホー
ルの穴明け工程時に、前記開口部の輪郭予定線上又はこ
れに平行な直線上に中心を定めて複数の連続穴をその穴
径以下のピッチで穴明け加工し、前記連続穴およびスル
ーホールのメッキ後に、前記連続穴の両端部分の外側に
該連続穴の輪郭に一部分かかるような小穴を明け、その
後に前記開口部を打抜き加工することを特徴とするプリ
ント配線基板の製造方法。(2) In a method of manufacturing a printed wiring board by forming an opening in the surface of the board and applying conductor plating along the outline of the opening, drilling a general through hole other than the opening. During the process, a plurality of continuous holes are drilled at a pitch equal to or less than the hole diameter with the center set on the planned contour line of the opening or on a straight line parallel thereto, and after plating the continuous holes and through holes, the A method for manufacturing a printed wiring board, which comprises making small holes on the outside of both end portions of a continuous hole so as to partially overlap the outline of the continuous hole, and then punching out the openings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7044286A JPH0644666B2 (en) | 1986-03-28 | 1986-03-28 | Printed wiring board having an opening with copper plating and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7044286A JPH0644666B2 (en) | 1986-03-28 | 1986-03-28 | Printed wiring board having an opening with copper plating and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62226687A true JPS62226687A (en) | 1987-10-05 |
| JPH0644666B2 JPH0644666B2 (en) | 1994-06-08 |
Family
ID=13431612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7044286A Expired - Lifetime JPH0644666B2 (en) | 1986-03-28 | 1986-03-28 | Printed wiring board having an opening with copper plating and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644666B2 (en) |
-
1986
- 1986-03-28 JP JP7044286A patent/JPH0644666B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644666B2 (en) | 1994-06-08 |
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