JP2002043719A - Printed wiring board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board that can efficiently remove an unnecessary portion and the like of the printed wiring board where electronic parts are mounted. SOLUTION: The manufacturing method comprises: a step such that a hole 4 for a normal through hole, a breakage with a smaller diameter than the hole 4 and a small hole 5 f or a through hole for setting a mounting position of an electronic parts are simultaneously drilled at a predetermined position on the printed wiring board 1; a step such that a through hole plating treatment is executed on the printed wiring board 1 that two holes 4, 5 for a through holes of different diameter and size are drilled; and a step such that the breakage with a small diameter, the small hole 5a on the printed wiring board 1 being subjected to the through hole plating treatment are drilled again to almost the same size of diameter with a hole 4a for the normal plated through hole being subjected to the plating treatment, and a hole 5b for un-plated through hole is drilled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a manufacturing method which enables efficient manufacture of a printed wiring board on which electronic components are mounted.

[0002]

2. Description of the Related Art Conventionally, when a printed wiring board is manufactured, it starts by cutting a board material (copper-clad laminate) into predetermined dimensions. In cutting the substrate material (hereinafter referred to as a wiring substrate), a cutting jig such as a shear or a saw is usually used. If the wiring board is cut with a shear or the like, and if the burrs of the copper foil or the resin or fiber debris that make up the wiring board remain on the cut surface, the pattern will be removed in the subsequent mounting process of the electronic components on the wiring board. Since this causes defects such as disconnection and short circuit, chamfering and polishing of the cut end face are performed after each cutting, so that there is a problem that the manufacturing work of the wiring board cannot be efficiently performed.

[0003]

For this reason, recently, for example, in the case of a single-sided wiring board, a large number of small holes are perforated at the cutting position by punching or the like.
After the components are mounted, the wiring board is divided at the perforation position and incorporated into an electronic device. Since it is not necessary to perform through-hole plating on the single-sided wiring board, it is a very effective means to provide small holes like perforations at cutting locations.

On the other hand, when the wiring board is a double-sided board or a multilayer board, it is important to use a glass substrate, which is generally difficult to process the wiring board itself, and the quality of through-holes is important. The holes for the through holes are usually drilled. In the case of a double-sided board or the like, holes for the regular through holes and perforated small holes are formed at the same time to divide the wiring board, and thereafter, when the wiring board itself is plated, a regular through hole is formed. All holes for holes and perforated small holes are to be plated.
In this case, if the wiring board itself is divided by using a perforated small hole, and the small hole portion is plated, the front and back surfaces of the double-sided board are plated similarly to the hole for a regular through hole. Therefore, this method cannot be adopted.

For this reason, a hole for a regular through hole is generally formed, and after this hole is plated with a through hole, non-plating for dividing a wiring board or setting a mounting position of an electronic component is performed. Small holes for through holes (hereinafter,
(Referred to simply as small holes), and the wiring board is divided using the small holes. However, this method can solve the problem that both surfaces of the wiring board are electrically connected because a small hole for division or the like is provided after the plating process, but has the following problem.

That is, when a small hole is formed for dividing the wiring board or for setting a mounting position of an electronic component or the like, if the positioning operation of the small hole is repeated, it is inevitable that the positional deviation will occur. In addition to the accumulation, there is expansion and contraction or deformation of the wiring board itself, so the position of the small hole as a reference will move, and while drilling small holes for division etc. The position of the small hole is deviated in accuracy, making it difficult to divide the wiring board and mount electronic components at the correct position, which has been a major cause of board failure.

[0007] In particular, in the case where a plurality of wiring boards are piled and drilled, misalignment due to bending of the drill is likely to occur. As a result, small holes for dividing the wiring board and the like are drilled at predetermined positions. May not be able to do so, which may reduce the yield of substrate manufacturing,
There has been a problem that the work of drilling small holes for division or the like becomes inefficient, and the manufacturing cost of this type of wiring board is increased.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a non-plated through-hole for setting a break position of an unnecessary portion, such as dividing a printed wiring board, or setting a mounting position and a mounting direction of a mounted component. It is an object of the present invention to provide a method for manufacturing a printed wiring board, in which holes can be quickly and easily formed at appropriate positions.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a printed wiring board before a conductor pattern is formed and before a hole for a through-hole is formed. A step of simultaneously drilling a hole for a hole and a small hole for a through hole for setting a break position of a printed wiring board smaller than this hole and a mounting position of an electronic component, and a step for forming two through holes having different diameters. A step of performing a through-hole plating process on the printed wiring board having the holes formed therein, and a small hole for the through-hole for breaking / positioning the small-diameter of the printed wiring board subjected to the through-hole plating process is plated with a regular hole. Forming a hole for a non-plated through-hole by re-drilling the hole having substantially the same diameter as the hole for the plated-through hole of the printed wiring board. It is obtained by the method of.

In the present invention, the small hole for a through hole for setting the break position of the printed wiring board and the mounting position of the electronic component is provided after the plating processing of the printed wiring board.
Oval or round non-plated holes for non-plated through-holes are formed by removing through-hole plating using a drill with approximately the same diameter as the hole for the regular plated through-hole that has been plated. And

According to the present invention, as described above, the holes for the non-plated through holes to be used for breaking the printed wiring board and for setting the mounting position of the electronic parts are firstly provided with small holes for positioning at predetermined positions. Since the hole for the regular plating through hole was drilled at the same time as the hole for the regular plated through hole, the printed wiring board was plated, and then the small hole was re-drilled so as to remove the plated portion so that the printed wiring board was manufactured. Since the position of the hole for the non-plated through-hole does not shift at all, the printed wiring board can be broken at a set position at all times, and the electronic component can be mounted, which is convenient.

In the case of removing a plated portion from a hole for a non-plated through hole, a large diameter drill is used.
In this case, most of the holes are drilled in an elliptical (horizontal) shape in the breaking direction due to micro-vibration generated by the rotation of the drill. Quick removal of unnecessary parts
This can be performed easily and accurately, and as a result, the productivity of this type of printed wiring board can be improved satisfactorily, and its manufacturing cost can be easily reduced.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In FIGS. 1 and 2, reference numeral 1 denotes a double-sided or multilayer printed wiring board (hereinafter simply referred to as a single-sided) formed by bonding copper foils 3 and 3 to both front and back surfaces of an insulating plate 2 made of glass epoxy, plastic sheet or the like. Substrate). Then, as shown in FIG. 1, electronic components are mounted on the substrate 1 or a predetermined diameter is provided in order to conduct the copper foils 3 and 3 adhered to both surfaces of the substrate 1. Holes 4 for regular through-holes (final finish will be conductive holes) are drilled at predetermined positions on the substrate 1 using drills (not shown).

Reference numeral 5 denotes holes for breaking through holes (hereinafter referred to as small holes for breaking) drilled by using a drill (not shown) in order to break unnecessary portions of the substrate 1 formed in predetermined numbers near four corners of the substrate 1. ), The small hole for breaking (the final finish is a non-conductive hole) 5 is formed with a diameter smaller than the diameter of the hole 4 for the through hole (for example, about １ ／ of the hole 4). ing. In the present embodiment, the small holes 5 for breakage are formed at the four corners of the substrate 1. However, the present invention is not limited to this. For example, when the substrate 1 is divided into two at a predetermined position, At the division position, a predetermined number of small holes for division may be formed.

As described above, the holes 4 for regular through holes for mounting electronic parts and the like and the small holes 5 for breakage are formed on the substrate 1 as shown in FIG.
As shown in (1), when a required number of holes are formed at predetermined positions, the substrate 1 is subjected to a plating process such as copper plating. By performing the plating process, as shown in FIGS.
The inner surface of the front and back (both) surfaces, the holes 4 for regular through-holes, and the small holes 5 for breakage are plated to form the substrate 1
The first and second plating layers 6 and 6a are formed on the front and back surfaces, holes 4a (conductive holes) for regular plating through holes, and small holes 5a (conductive holes) for breakage.

When the plating process on the substrate 1 is completed,
The break small hole 5a is replaced with a regular plated through hole hole 4a.
Process to approximately the same diameter. In this case, for example,
As shown in FIG. 5, a drill 7 having a larger diameter than the small hole 5a is pressed against the small hole 5a for breakage, and the drill 7 is rotated as it is to make the small hole 5a substantially equal to the hole 4a for a plated through hole. The insulating plate 2 is cut to the same diameter including the plating layer 6a, and a hole (non-conductive hole) 5b for a non-plated through hole is formed as shown in FIGS.

Hole 5b for non-plated through hole
Presses the tip of a drill 7 having substantially the same diameter as the hole 4a for the plated-through hole against the small hole 5a for breaking, and in this state, when the drill 7 is rotated at a high speed, the drill 7 itself newly drills a hole. Unlike the case, the small hole 5a is easily vibrated due to cutting the small hole 5a itself into a large diameter along the existing small hole for breaking 5a, and the hole 5b for the non-plated through hole drilled by the drill 7 is mostly circular ( The opening is not a perfect circle but an oval (oval) as shown in FIG.

In this case, not all are oval, and some of them are naturally formed in a perfect circle as in the case of newly drilling. When the holes 5b for the non-plated through holes are formed, as shown in FIG. 6, most of the holes 5b are elliptical at the four corners (in the case of this example) of the substrate 1 along the breaking direction. As a result, the substrate 1 can be easily broken by bending its corners upward and downward along the holes 5b for non-plated through holes.

That is, the hole 5b is largely formed in an oval shape and can be drilled along the breaking direction, so that the four corners, which are unnecessary portions of the substrate 1, can be removed.
By using the holes 5b for the non-plated through-holes, it can be performed quickly, easily, and smoothly, which is convenient.

The broken portion 8 of the substrate 1 is formed as shown in FIGS.
As described above, the plated portion is removed by drilling the hole 5b itself to a large diameter by cutting the drill 7 as described above, so that the front and back surfaces of the substrate 1 are electrically connected at the broken portion 8. Never.

Further, after the mounting components are mounted on the substrate 1, the periphery of the substrate 1 excluding the break portion 8 is cut off. Except for the hole 4a for a hole, the front and back surfaces can be formed so as not to conduct, so that there is no adverse effect caused by conduction in a non-conducting portion. In addition,
Although the present invention has been described with respect to an example in which the four corners of the substrate 1 are broken, the present invention is not limited to this, and it is needless to say that the present invention can also be used in forming a perforation when dividing the substrate 1 into two or more. No.

Although the present invention has been described with reference to the embodiment in which the hole 5b for a non-through hole used for breaking an unnecessary portion of the substrate 1 is provided, the present invention is not limited to this. It is needless to say that the present invention can also be used when a hole for positioning for setting the position at which the electronic component is mounted on the substrate 1 or a hole for determining the direction for setting the mounting direction of the electronic component is formed.

[0023]

As described above, according to the present invention, the holes for the non-plated through holes for breaking the printed wiring board and for setting the mounting position of the electronic parts are used for positioning at the predetermined position first. After drilling a small hole at the same time as the hole for the regular plating through hole and plating the printed wiring board, the small hole is re-drilled so as to remove the plated portion with a large diameter drill, and the printed wiring board is removed. Manufacturing is performed, so when forming holes for non-plated through holes, the processing position does not shift at all, so the printed wiring board is always broken at a predetermined position that has been set, and electronic components It is convenient because it can be mounted without making a mistake in its mounting position and direction.

When a plated portion is to be removed, a drill having a large diameter is used for a hole for a non-through hole. In this case, most of the holes are elliptical in the breaking direction due to micro-vibration caused by rotation of the drill. The use of this elliptical hole makes it possible to quickly, easily and accurately remove unnecessary parts of the printed wiring board. The productivity of the wiring board can be improved satisfactorily, and the manufacturing cost can be easily reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a printed wiring board according to the present invention in which a hole for a regular through hole and a small hole for a through hole having a small diameter for dividing and breaking are formed.

FIG. 2 is a cross-sectional view showing a main part of FIG.

FIG. 3 is a perspective view showing a state where a plating process is performed on the printed wiring board of FIG. 1;

FIG. 4 is a cross-sectional view showing a main part of FIG.

FIG. 5 is an explanatory view of a case where small holes for dividing and breaking a printed wiring board are formed with a large diameter.

FIG. 6 is a perspective view showing a printed wiring board of the present invention in which holes for non-plated through holes for splitting and breaking are formed in FIG.

FIG. 7 is a sectional view showing a main part of FIG. 6;

FIG. 8 is a perspective view showing a state in which the printed wiring board of the present invention is broken at a hole portion for a non-plated through hole.

FIG. 9 is an enlarged perspective view showing a broken portion of the printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 4 Hole for regular through hole 4a Hole for regular plated through hole 5 Small hole for through hole for dividing / breaking 5a Hole for plated through hole 5b Hole for non-plated through hole 6,6a Plating Layer 7 drill

Claims (2)

[Claims] In a printed circuit board before a conductor pattern is formed and before a hole for a through hole is formed, a hole for a regular through hole is formed at a predetermined position on the printed circuit board; A step of simultaneously forming a small hole for a through hole for setting a break position of a smaller-diameter printed wiring board and a mounting position of an electronic component; and a printed wiring having two through holes having different diameters. A step of performing a through-hole plating process on the board, and a small hole for a through hole for the small-diameter breakage / positioning of the printed wiring board subjected to the through-hole plating process, a hole for a regular plated through-hole that has been plated. Forming a hole for a non-plated through-hole by re-drilling holes having dimensions substantially the same as each other. 2. A small hole for a through hole for setting a break position of the printed wiring board and a mounting position of an electronic component is substantially the same as a hole for a regular plated through hole plated after the plating processing of the printed wiring board. 2. The method for manufacturing a printed wiring board according to claim 1, wherein a hole for a non-plated through-hole in an elliptical shape or a perfect circular shape is formed by removing the through-hole plating by using a drill having a diameter.