JPS62287686A - Printed wiring board and manufacture of the same - Google Patents
Printed wiring board and manufacture of the sameInfo
- Publication number
- JPS62287686A JPS62287686A JP13138386A JP13138386A JPS62287686A JP S62287686 A JPS62287686 A JP S62287686A JP 13138386 A JP13138386 A JP 13138386A JP 13138386 A JP13138386 A JP 13138386A JP S62287686 A JPS62287686 A JP S62287686A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- wiring board
- holes
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 description 9
- 238000005553 drilling Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000035935 pregnancy Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
1 発明の詳細な説明
〔産業上の利用分野〕
本発明は印刷配線基板およびその製造方法に関し、とく
に印刷配線基板の電子部品取付けの透孔や、表裏面導通
のスルホールなどの孔と近接した位置にある外形端面の
形状およびその加工方法に関する。Detailed Description of the Invention 1. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a printed wiring board and a method for manufacturing the same, and in particular to through holes for mounting electronic components on printed wiring boards and through holes for conduction between the front and back surfaces. The present invention relates to the shape of an external end face located close to a hole such as a hole, and a method of processing the same.
従来、印刷配線基板に設けた孔と近接する位置の端面の
外形加工は、あらかじめ孔IN/C孔明機等により穿設
し、必要に応じてスルホールめっきを施した後、プレス
金型等のパンチングにより、孔がひずみを起さない位置
で所定寸法よシ1回シ大きく外形をプレス加工して枠取
りし、指定寸法迄仕上加工するか、または、ルータ−加
工で形成していた。Conventionally, the external shape of the end face in the vicinity of the hole provided in the printed wiring board was previously drilled using a hole IN/C drilling machine, etc., and after performing through-hole plating as necessary, punching with a press mold, etc. Therefore, the outer shape of the hole is pressed once larger than the predetermined size at a position where the hole does not cause distortion, and then the outer shape is framed and finished to the specified size, or the hole is formed by router processing.
このため、従来例の前者のような場合には、印刷配線基
板の外形をパンチング加工するため、孔と近接した位置
の外形輪郭の端面が、剪断時の衝撃で押潰されて、孔に
ひずみ等の影響を与えない位置で太き目に打抜く、欠点
があった。またこの寸法を少くした場合、孔にひずみを
生じる欠点があった。従ってこの孔に電子部品のリード
を挿入して実装する時に、簡単に電子部品のリードを挿
入することが出来なかった。一方、孔壁面にめっき層を
施しだ場合のスルホール孔では、このめっき層の一部が
損傷して印刷配線基板の表裏面の導通接続が断線状態と
なる異常を発生したりする。For this reason, in the former case of the conventional example, since the outer shape of the printed wiring board is punched, the end face of the outer contour near the hole is crushed by the impact during shearing, causing strain in the hole. There was a drawback that the punch was punched out thickly in a position that would not have any effect. Further, when this dimension is reduced, there is a drawback that distortion occurs in the hole. Therefore, when mounting electronic component leads by inserting them into these holes, it was not possible to easily insert the electronic component leads. On the other hand, in a through hole where a plating layer is applied to the hole wall surface, a part of the plating layer may be damaged, causing an abnormality in which the conductive connection between the front and back surfaces of the printed wiring board is broken.
また従来例の後者のルータ−加工では、ルータ−ビット
に用いた切削加工であり、外形の各端面は清面状態に仕
上げて均一にするため、加工時間を多く要し、量産品加
工の場合には適さない欠点があった。In addition, in the latter type of router machining in the conventional example, the cutting process is used for router bits, and each end face of the external shape is finished in a clean and uniform state, so it takes a lot of machining time, and it is difficult to process mass-produced products. had some disadvantages that made it unsuitable.
本発明の目的は、かかる従来欠点を解決した印刷配線基
板およびその製造方法を提供することにある。An object of the present invention is to provide a printed wiring board and a method for manufacturing the same that solves the above conventional drawbacks.
本発明によれば、外形輪郭の縁部に沿って近接して設け
られた複数の貫通孔と対向したピッチ間隔で微小円弧部
の切欠きの端面部が得られる。また印刷配線基板に縁部
に沿って配設する第1の貫通孔を形成する工程と、第1
の貫通孔と同一間隙で第2の貫通孔を形成する工程と、
印刷配線基板の外形をプレス金型にし、第2の貫通孔の
径の1710以下が外形輪郭に残る位置で切断する工程
を含むことを特徴とする印刷配線基板の製造方法が得ら
れる。According to the present invention, the end face portion of the notch of the minute circular arc portion is obtained at a pitch interval opposite to a plurality of through holes provided close to each other along the edge of the external contour. There is also a step of forming a first through hole along an edge of the printed wiring board;
forming a second through hole with the same gap as the through hole;
A method for manufacturing a printed wiring board is obtained, which includes the step of forming the external shape of the printed wiring board into a press mold and cutting the printed wiring board at a position where a diameter of 1710 mm or less of the diameter of the second through hole remains on the external outline.
以下、本発明の実施例を第1図〜第4図を参照して説明
する。Embodiments of the present invention will be described below with reference to FIGS. 1 to 4.
第1図は本発明印刷配線基板の斜視図である。FIG. 1 is a perspective view of the printed wiring board of the present invention.
図中、符号1はガラスエポキシ樹脂などの絶縁板の表裏
面に図示省略した回路パターンを有する印刷配線板、2
は印刷配線基板の表裏面を接続するスルホール孔である
。3はプレス金型のパンチングで外形抜き加工した外形
端面であシ、印刷配線基板面に設けた孔と外形輪郭が比
較的離れている端面を示す。4はスルホール孔2に近接
した位置に設けた微小円弧部であシ、5は微小円弧部4
を形成した外形輪郭の一端面である。In the figure, reference numeral 1 indicates a printed wiring board having a circuit pattern (not shown) on the front and back surfaces of an insulating board such as a glass epoxy resin;
is a through hole that connects the front and back surfaces of the printed wiring board. Reference numeral 3 indicates an end face having an outer shape cut out by punching with a press die, and shows an end face where the outer outline is relatively distant from the hole provided in the printed wiring board surface. Reference numeral 4 indicates a micro-arc portion provided in the vicinity of the through-hole hole 2; 5 indicates a micro-arc portion 4;
This is one end surface of the outer contour formed by the .
次に本発明の印刷配線基板の製造方法を第2図〜第4図
で説明する。Next, a method for manufacturing a printed wiring board according to the present invention will be explained with reference to FIGS. 2 to 4.
まず、第4図に示す如く印刷配線基板を形成するための
ガラスエポキシ樹脂などの絶縁板9を、印刷配線板が加
工出来る所定寸法に材料ブランク取シする。First, as shown in FIG. 4, an insulating plate 9 made of glass epoxy resin or the like for forming a printed wiring board is blanked to a predetermined size that can be processed into a printed wiring board.
次に印刷配線基板の表裏面のパターンを導通接続に用い
るスルホール孔の下孔2CをN/C孔明機等を用いて穿
設する。この工程時に外形輪郭の縁部に沿って近接して
設ける第1の貫通孔に対向した位置すなわち、外形輪郭
エリヤ外に第2の貫通孔7を穿設する。Next, pilot holes 2C of through-holes used for conductive connection are formed in the patterns on the front and back surfaces of the printed wiring board using an N/C drilling machine or the like. During this step, a second through hole 7 is bored at a position opposite to the first through hole provided close to the edge of the outer contour, that is, outside the outer contour area.
次に第2図を用いて前述の工程時における孔位置と孔径
の関係について説明する。Next, the relationship between the hole position and hole diameter during the above-mentioned process will be explained using FIG.
第3図は孔明は工程後に公知のスルホールめっきと現像
・エツチング処理工程を完了し回路形成された第1の貫
通孔と第2の貫通孔部分の拡大平面図である。FIG. 3 is an enlarged plan view of the first through-hole and second through-hole portions in which a circuit has been formed after the well-known through-hole plating and development/etching processes are completed.
スルホール孔2の表裏の孔縁にはランド2Aがちシ、回
路パターン2Bが施されている。外形輪郭線f′i6で
示しである。スルホール孔2の孔壁と外形輪郭線の距離
は、第1図に示す印刷配線基板の板厚を以上離した寸法
が一般に用いられているが、近年では装置が小形化にな
シ印刷配線密度が増してt以下の物が、必要となってい
る。従って、プレス金型による外形抜きパンチングの剪
断VJ撃でスルホール孔2が変形しないように、第2の
貫通孔7を穿設する必要がある。この貫通孔7の位置は
外形をプレス金型にてパンチング形成した後に、貫通孔
の直径Dφの1/10以下が外形輪郭の縁部にH寸法残
る位置で、スルホール孔2と同一寸法ピッチと同一間隔
にて穿設する。従って第2の貫通孔の直径はとの2寸法
によって定まる。2寸法が小さい場合で直径Dφが大き
い場合には、llJシの孔と接触してN/C孔明時にド
リル折れ等発生して悪形41を与える。また2寸法が2
51131程度の比較的大きなピッチ寸法の場合には2
φ程度のドリル径を用いてドリル折れ等が無く効率よ〈
穿設できる。The front and back edges of the through-hole hole 2 are provided with lands 2A and a circuit pattern 2B. This is indicated by an external contour line f'i6. The distance between the hole wall of the through-hole hole 2 and the external contour line is generally the distance greater than the board thickness of the printed wiring board shown in Figure 1, but in recent years, as devices have become smaller, the printed wiring density has increased. has increased, and things less than t are needed. Therefore, it is necessary to drill the second through-hole 7 so that the through-hole hole 2 is not deformed by the shear VJ impact of the punching process using the press die. The position of the through hole 7 is such that after the outer shape is formed by punching with a press die, 1/10 or less of the diameter Dφ of the through hole remains at the edge of the outer shape, and the same dimension pitch as the through hole hole 2. Drill holes at the same intervals. Therefore, the diameter of the second through hole is determined by the two dimensions. If the two dimensions are small and the diameter Dφ is large, the drill will come into contact with the 11J hole and break during N/C drilling, resulting in a bad shape 41. Also, 2 dimensions are 2
In the case of a relatively large pitch size of about 51131, 2
Using a drill diameter of about φ, there is no drill breakage and it is efficient.
Can be drilled.
次に第3図と第4図金剛いてスルホール孔2と近接した
外形端面部5が微小円弧部4に形成されてゆく過程を説
明する。Next, a process in which the outer end surface portion 5 adjacent to the through-hole hole 2 is formed into the minute circular arc portion 4 will be described with reference to FIGS. 3 and 4.
前述の工程で第2の円形孔7を穿設すること絶縁基板内
のガラスクロスのメッシユが貫通孔によってそれぞれ切
削分断される。そして図示省略した金型の金型打抜き基
準パイロットピンを配設させた、打抜き部を用いて、第
4図に示す絶縁基板9のプレス用パイロット孔8を3箇
所合わせてプレス抜きする。このとき、絶縁基板に第2
の円形孔を穿設した位置と、プレス金型の外形輪郭形成
刃先とで1/10以下の径が、印刷配線基板の外形輪郭
の縁部に残る位置でプレス加工出来るように、金型の打
抜き基準パイロットピンと、印刷配線基板のパイロット
孔8とが配設されている。By forming the second circular holes 7 in the above-described process, the mesh of glass cloth in the insulating substrate is cut and divided by the through holes. Then, using a punching section in which a mold punching reference pilot pin of a mold (not shown) is arranged, three press pilot holes 8 of the insulating substrate 9 shown in FIG. 4 are aligned and punched. At this time, the second
The mold is designed so that the diameter of the press mold is 1/10 or less between the position where the circular hole is drilled and the cutting edge of the press mold for forming the outline of the printed wiring board. A punching reference pilot pin and a pilot hole 8 of the printed wiring board are provided.
従って第2の貫通孔7同志が1/10以下を残す位置を
結んだ線上でプレス抜きを正確に行なうことが出来、近
接したスルホール孔を破損せずに、スルホール孔2と近
接した外形端面部5を微小円弧部に形成することが出来
る。Therefore, press punching can be performed accurately on the line connecting the positions where 1/10 or less of the second through-hole 7 is left, and the external end face adjacent to the through-hole 2 can be punched without damaging the adjacent through-hole. 5 can be formed into a minute circular arc portion.
以上、本発明によシ次の効果がある。 As described above, the present invention has the following effects.
(1)第1のスルホール孔等と一諸に第2の円形孔を穿
設することによシ、特別の工程も要さずに孔と外形輪郭
の残シ寸法が少ない印刷線基板の加工でもプレス加工の
対応ができる。(1) By drilling a second circular hole along with the first through-hole, etc., a printed circuit board can be processed with a small remaining size of the hole and external outline without the need for any special process. However, we can handle press processing.
(!1)プレス金型の剪断打抜き加工時に孔が近接する
端面部のエリヤ−外に第2の円形孔が穿設されであるの
で、孔壁から外形輪郭までの残う寸法が少ない仕上り端
面を孔を破壊することなく設けることができる利点があ
る。(!1) During the shear punching process of the press die, the second circular hole is drilled outside the area of the end face where the hole is close to, so the finished end face has less remaining dimension from the hole wall to the external outline. This has the advantage that the holes can be provided without destroying them.
第1図は本発明一実施例の印刷配線基板の斜視図、第2
図は本発明の第1の円形孔と第2の円形孔を穿設する位
置関係を示す拡大平面図、第3図は外形端面の微小円弧
状況を示す斜視図、第4図は本発明一実施例の絶縁基板
の斜視図。
1・・・・・・印刷配線基板、2・・・・・・スルホー
ル孔、2人・・・・・・ランド、2B・−・・・・回路
パターン、2C・・・・・・下孔、3・・・・−・外形
端面、Dφ・・・・・・(第2の円形貫通孔の)直径、
4・・・・・・微小円孔部、H・・・・・・(微小円孔
部の)残シ寸法、訃・・・・・(孔と近接した)外形端
面部、P・・・・・・孔ピッチ、6・・・・・・外形輪
郭線、t・・・・・・板厚、7・・・・−・第2の円形
貫通孔、8・・・・・・(基板の)パイロット孔、9・
・・・−・絶縁板。
・\ −l
イ:1=孕; ノ mFIG. 1 is a perspective view of a printed wiring board according to one embodiment of the present invention, and FIG.
The figure is an enlarged plan view showing the positional relationship between the first circular hole and the second circular hole of the present invention, FIG. FIG. 2 is a perspective view of an insulating substrate according to an example. 1...Printed wiring board, 2...Through hole, 2 people...Land, 2B...Circuit pattern, 2C...Prepared hole , 3...---outer end surface, Dφ...(diameter of the second circular through hole),
4...Minute circular hole part, H...Remaining dimensions (of the minute circular hole part), End part...(close to the hole) external end surface part, P... ... Hole pitch, 6 ... Outline, t ... Plate thickness, 7 ... - Second circular through hole, 8 ... (Substrate ) Pilot hole, 9.
・・・−・Insulating board.・\ -l i:1=pregnancy; no m
Claims (2)
の貫通孔と、前記貫通孔と対向したピッチ間隔で微小円
弧部の切欠きの端面部を有することを特徴とする印刷配
線基板。(1) Printed wiring characterized by having a plurality of through holes provided close to each other along the edge of the external contour, and an end surface of a notch of a minute circular arc portion at a pitch interval opposite to the through holes. substrate.
孔を形成する工程と、前記第1の貫通孔と同一間隙で第
2の貫通孔を形成する工程と、前記基板の外形をプレス
金型にて、第2の貫通孔の径の1/10以下が外形輪郭
の縁部に残る位置で切断する工程を含むことを特徴とす
る印刷配線基板の製造方法。(2) forming a first through hole along the edge of the printed wiring board; forming a second through hole with the same gap as the first through hole; A method for manufacturing a printed wiring board, comprising the step of cutting the outer shape using a press mold at a position where 1/10 or less of the diameter of the second through hole remains at the edge of the outer shape outline.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13138386A JPS62287686A (en) | 1986-06-05 | 1986-06-05 | Printed wiring board and manufacture of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13138386A JPS62287686A (en) | 1986-06-05 | 1986-06-05 | Printed wiring board and manufacture of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62287686A true JPS62287686A (en) | 1987-12-14 |
Family
ID=15056668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13138386A Pending JPS62287686A (en) | 1986-06-05 | 1986-06-05 | Printed wiring board and manufacture of the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62287686A (en) |
-
1986
- 1986-06-05 JP JP13138386A patent/JPS62287686A/en active Pending
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