JPS6039894A - Method of producing printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing a printed circuit board, and more specifically, to manufacturing a printed circuit board having both solder through holes (for example, for mounting components) and non-conductive through holes (for example, for mounting a printed circuit board). The present invention relates to a method of manufacturing a printed circuit board in which the drilling of both through-holes is completed in one step.

Conventionally, in order to manufacture a printed circuit board in which solder through holes and non-conductive through holes coexist, holes for solder through holes are first formed in a material X board 2 with copper foil 1 bonded to both upper and lower surfaces, as shown in Fig. 1a. 3 is drilled using an NC drilling machine. Next, both surfaces of the material substrate 2 are polished to remove burrs 4, and then copper plating 5 is applied to both upper and lower surfaces of the material substrate 2 and the holes 3 for solder through holes as shown in FIG. Then, on top of that, Figure 1C
A photosensitive film 6 is applied as shown in FIG. 1, a required portion is exposed and developed, and the exposed portion is used as a mask and left as a resist 7 as shown in FIG. 1d. Next, copper plating is applied to the material substrate 2 as necessary, and solder plating 9 is applied as shown in FIG. 1e to make the holes 3 for the solder through holes 3'. 7 is removed as shown in FIG. 1f, the solder plating 9 is etched as a resist, and the copper plating 5 and copper foil 1 in the area where the mask resist 7 has been removed are etched away as shown in FIG. 1g. form a circuit. Next, as shown in the first diagram, non-conductive through hole holes of 1° are drilled in required portions of the raw material substrate 2 using an NC drilling machine. Next, the periphery of the hole 10 is polished to remove the burr 11, and then the solder resist seams 2 are punched out as shown in FIG. 1i. Finally, the first printed circuit board is processed.

By the way, in such a conventional printed circuit board manufacturing method, holes 3 for solder through holes and holes 10 for nonconductive through balls are
Since it is not possible to drill holes using an NC drilling machine the first time, in other words, holes 3 for solder through balls cannot be drilled.
If a hole 10 for a non-conductive through hole is also drilled at the same time, when solder plating is performed afterwards, the hole 10 for a non-conductive through hole will be formed.
Since the holes are also plated with solder, it is not possible to make holes in the first pass, so after forming the circuit by etching, the holes are drilled again to form holes 1o for non-conductive through holes. Therefore, not only does it take a lot of man-hours, but it is extremely troublesome and time-consuming to accurately position and center the board on the NC drilling machine, and the polishing work to remove the excess must be performed twice, which reduces the productivity of printed circuit boards. It has become the second bottleneck.

The present invention has been made in order to solve the problems of the conventional manufacturing method of the printed circuit board 1 to the board, and the holes for the solder through balls and the holes for the non-conductive through balls cannot be drilled at the first time. It is an object of the present invention to provide a method for manufacturing a printed circuit board in which the holes for non-conductive through-holes are never solder-plated when solder-plated later even if the holes are drilled.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The method for manufacturing a printed circuit board according to the present invention will be explained below with reference to the drawings. First, as shown in FIG. 2a, holes 3 for solder through holes and holes 10 for nonconductive through holes are simultaneously drilled using an NC drilling machine in a material substrate 2 having copper foils 1 bonded to both upper and lower surfaces. Next, both sides of the material substrate 2 are polished 4.
After removing 11', copper plating 5 is applied to the bottom surface of the substrate 2 and the holes 3 for the solder through balls as shown in FIG. Then, a photosensitive film 6 is placed thereon as shown in FIG. 2C.
The holes 3 for non-conductive through-holes and other required areas are exposed to light, and the exposed areas are left as a second mask resist 7' as shown in 1d.

Next, copper plating is applied to the material substrate 2 as necessary.
As shown in Figure e, solder plating 9 is applied to form the holes 3 into solder through balls 3'. Next, the mask resist 7'
211f, the solder plating 9 is etched as a resist, and the copper plating 5 and copper foil 1 in the area where the mask resist 7' has been removed are etched away as shown in FIG. 2g to complete the circuit. At the same time, the hole 10' is formed into a non-conductive through ball 14.

Next, solder resist lines 2 are printed on this printed circuit board 13' as shown in the second diagram. Finally, the outer shape of the printed circuit board 13' is processed.

As described above, in the method of manufacturing a printed circuit board of the present invention, after the solder plating 9 is applied to the material substrate 2, the mask resist 7 is applied.
' is removed and the solder plating 9 is etched as a resist to form a circuit and the hole 10' is made into a non-conductive through-hole 14. Since it is possible to drill a hole of 10゛ for the purpose, drilling can be done with one NC hole machine. Therefore, the number of man-hours is reduced, and you only need to position and center the board on the NC drilling machine once, which saves time and effort.Furthermore, you only need to polish the board once to remove the burrs caused by drilling, so you can easily There are many things that contribute to improving productivity.

[Brief explanation of the drawing]

FIGS. 1A to 1I are sectional views of main parts showing the steps of a conventional method for manufacturing a printed circuit board, and FIGS. 2A to 2A are sectional views of main parts showing the steps of a method of manufacturing a printed circuit board according to the present invention. 1--One wire foil, 2--M-Material board, 3--One hole for solder ball, 3'--One solder ball, 4--
-Bori, 5-----1 Copper plating, 6-----1 Photosensitive film, 7'--Mask resist 19-----1 Solder plating, 10'--111-Non Hole for conductive through ball, LL' ----- Burr, 12 --- Solder resist, 13' --- Printed circuit board, 1, t----
Non-conductive Surbol. (Hereinafter related to the present invention) Applicant: Tanaka Kikinzoku Kogyo Co., Ltd.

Claims (1)

[Claims] A hole for a solder through hole and a hole for a non-conductive through ball are simultaneously drilled in a material board with copper foil bonded on both the top and bottom sides.
Next, after polishing and scraping the periphery, copper plating is applied to the material substrate, and then a photosensitive film is applied to the second layer, and the holes for non-conductive through holes and the required areas are exposed, developed and exposed. A portion is left as a mask resist, and then solder plating is applied to the material substrate to make the hole for the solder through hole into a half-meter through hole.Then, the mask resist is removed, and the solder plating is etched as an etching resist. A method for manufacturing a printed circuit board, which comprises forming a circuit, making holes for non-conductive through balls as non-conductive parts, then printing a solder resist, and then performing external processing.