TW201508095A - Electroplating apparatus for manufacturing flexible printed circuit board - Google Patents

Abstract

The present disclosure provides an electro-plating apparatus. The electro-plating apparatus comprises a bath, a plurality of rolls, at least one electro-plating electrode, and a separation trough. In which, the separation trough is positioned in the bath, and at least one side-surface of the separation through has a plurality of holes. An electro-plating solution feeds into the bath through the separation trough or the bottom of the bath, and essentially spreads toward an object to be plated near an electro-plating electrode.

Description

Electroplating equipment for manufacturing flexible printed circuit boards

The present invention relates to an electroplating apparatus for manufacturing a flexible printed circuit board, and more particularly to an electroplating apparatus having a separation groove.

Conventional electroplating equipment for manufacturing flexible printed circuit boards generally has a roll-to-roll structure in which a part to be plated is attached to the above electroplating apparatus, and is continuously conveyed horizontally or vertically by a plurality of guide wheels. . Since the plating solution contained in the plating bath will reduce the concentration of metal ions in the plating solution as the plating time is longer, it is necessary to continuously inject a fresh plating solution into the plating tank to form a continuous plating apparatus.

For example, most conventional copper plating processes are mostly made on flexible flexible boards. Among them, whether it is a horizontal or vertical plating method, when forming a blind hole or a thick copper film, there is usually only one or two plated anodes in the groove, that is, only one side of the plated soft board or both sides of the plated soft board. However, the above plating methods often require longer plating times, increasing the time and equipment cost.

Furthermore, the generally flexible material to be plated comprises polyethylene terephthalate (PET) or polyimide (PI), which is vapor-deposited. Evaporation, sputtering, or chemical deposition forms a conductive layer for use as an electroconductive front end material for electroplating. However, since the conductive layer is a very thin metal layer (for example, a copper film), it is not possible to fix the object to be plated using a jig as in the conventional process, and it is necessary to use a cathode wheel to form a conveyor belt and provide cathode electrical properties.

In conventional electroplating equipment, a difference in metal ion concentration occurs between the old plating solution and the fresh plating solution. Moreover, the use of a stirring device has limited effectiveness in solving the above problems. On the other hand, when mixing new and old plating solutions with a stirring device, it is difficult to control the correct concentration of metal ions in the plating solution, and the two sides of the parts to be plated belong to a high current area, which may result in uneven thickness of plating layers of different batches. Therefore, it is more important to increase the uniformity of the concentration of metal ions.

Therefore, there is a need for a new electroplating apparatus for manufacturing flexible printed circuit boards to solve the defects caused by conventional electroplating equipment.

The invention provides an electroplating device for solving the defect of the conventional electroplating equipment and achieving the purpose of uniformly mixing the plating solution and improving the electroplating efficiency.

One aspect of the present invention is to provide an electroplating apparatus. The electroplating apparatus comprises a tank body, a plurality of guide wheels, at least one cathode wheel, at least one plated anode, and a dividing groove. Wherein, the tank system is used to hold a plating solution, and has a liquid level when the plating solution is contained in the tank.

The guide wheels are arranged in the trough body and continuously conveyed by a conveying path A piece to be plated. The portion to be plated is immersed in the liquid surface of the plating solution in at least a portion of the delivery path.

The cathode wheel train is disposed in the tank body and on the liquid surface of the plating solution, and does not contact the plating solution. The cathode wheel train provides cathode electrical properties to the material to be plated, and reduces metal ions in the plating solution to form a metal layer on the member to be plated.

The plating anode is disposed on the transport path and immersed under the liquid surface of the plating solution. The electroplating anodes are arranged in parallel or perpendicular to the plane of the member to be plated. The electroplating anode is oxidized to generate metal ions in the plating solution, and the metal ions are reduced in the cathode to be plated to form a metal layer.

The separation groove is disposed in the groove body, and at least one side surface of the separation groove has a plurality of through holes. The plating solution is introduced into the tank through the separation groove, and is substantially sprayed toward the device to be tested near the plating anode.

According to an embodiment of the invention, the transport path comprises a U-shape, a V-shape or a triangle.

According to an embodiment of the invention, the transport path is U-shaped.

According to an embodiment of the invention, the guide wheel is horizontal, vertical or at an angle to the liquid mask.

According to an embodiment of the invention, the material of the cathode wheel is a metal or a composite material composed of a metal and a non-metal.

According to an embodiment of the invention, the material of the cathode wheel is stainless steel, copper, titanium, or a composite material of the above metal and non-metal.

According to an embodiment of the invention, the cathode wheel train is horizontal or at an angle to the liquid mask.

According to an embodiment of the invention, the electroplating apparatus further comprises at least A pressure reducing groove is disposed in the tank body to reduce the disturbance of the plating material to be impacted by the plating solution, and affect the uniformity of the thickness of the coating layer.

According to an embodiment of the invention, the pressure reducing groove has a plurality of through holes.

According to an embodiment of the invention, the through holes of the pressure reducing groove are introduced into the plating solution to reduce the disturbance of the plating solution to be affected by the plating solution, and affect the uniformity of the thickness of the coating layer.

According to an embodiment of the invention, the through holes of the pressure reducing groove are used to form a plurality of bubbles in the plating solution for uniformly mixing the plating solution.

According to an embodiment of the invention, the material of the pressure reducing groove comprises an acid and alkali resistant material.

According to an embodiment of the invention, the material of the pressure reducing groove comprises polyvinyl chloride (PVC), polypropylene (PP) or polyethylene (PE).

According to an embodiment of the invention, the electroplating anode is a metal.

According to an embodiment of the invention, the electroplating anode is copper, stainless steel or titanium.

According to an embodiment of the invention, the electroplating anode is a titanium mesh or a titanium plate.

According to an embodiment of the invention, the surface of the electroplating anode further comprises ruthenium oxide, ruthenium oxide or a combination thereof.

According to an embodiment of the invention, the plating anode is a two-electroplating anode, which is respectively disposed at two ends of the conveying path and immersed under the liquid surface of the plating solution.

According to an embodiment of the invention, the pair of plating anodes are respectively disposed at two ends of the U-shaped conveying path and immersed under the liquid surface of the plating solution.

According to an embodiment of the invention, the partitioning groove has a square, an inverted triangle, a triangle, or a plurality of tubular structures.

According to an embodiment of the present invention, the through holes of the partitioning groove are in the shape of a circular hole or a honeycomb.

According to an embodiment of the invention, the member to be plated comprises a flexible printed circuit board.

100, 200a, 200b, 300, 400a, 400b‧‧‧ plating equipment

110, 310, 410‧‧‧

120, 320, 420‧‧·guide wheels

121, 321, 421‧‧‧ cathode wheel

130,330,430‧‧‧Electroplating anode

140, 340, 440a, 440b, 500a, 500b‧‧‧ separate slots

141, 212, 441, 510a, 510b‧‧‧ through holes

150, 350, 450‧‧‧ plating solution

151, 451‧‧ ‧ liquid level

160, 360, 460‧‧‧ to be plated

210a, 210b‧‧‧Relief tank

211‧‧‧ openings

A, B, C‧‧‧ arrows

1 is a schematic cross-sectional view of an electroplating apparatus according to an embodiment of the present invention; and 2A and 2B are cross-sectional views of a plating apparatus according to an embodiment of the present invention, including a pressure reducing groove; 1A is a top view of a plating apparatus according to an embodiment of the present invention; FIG. 4A is a plating apparatus according to an embodiment of the present invention; A cross-sectional view in which the cross section of the partition groove is an inverted triangle; FIG. 4B is a schematic cross-sectional view of the electroplating apparatus according to an embodiment of the present invention, wherein the cross section of the partition groove is triangular; and FIGS. 5A and 5B are according to the present invention. The through hole pattern of the separation groove shown in one embodiment.

The invention will be described in detail by way of example and with reference to the accompanying drawings In the drawings, the shape or thickness of the embodiments may be expanded to simplify or facilitate the labeling, and the parts of the elements in the drawings will be described in the text. It will be appreciated that elements not shown or described may be in a variety of styles known to those skilled in the art.

1 is a schematic cross-sectional view of a plating apparatus 100 according to an embodiment of the present invention. In FIG. 1 , the electroplating apparatus 100 includes a tank body 110 , a plurality of guide wheels 120 , at least one cathode wheel 121 , at least one plated anode 130 , and a dividing groove 140 .

The tank 110 is used to hold a plating solution 150. When the plating solution 150 is contained in the tank body 110, the plating solution 150 has a liquid surface 151. In an embodiment of the invention, the trough system consists of a bottom plate, two side plates, and two overflow plates. In an embodiment of the invention, the plating solution comprises a metal ion, wherein the metal ion may be copper ion, cobalt ion, nickel ion, zinc ion, tin ion or silver ion, but is not limited thereto.

The guide wheel 120 is disposed in the tank body 110. The guide wheels 120 are arranged in the tank body to form a conveying path, and a conveying member 160 is continuously conveyed by the conveying path. In one embodiment of the invention, the guide wheel is horizontal, vertical, or at an angle to the liquid mask.

The plate to be plated 160 is immersed in the liquid surface 151 of the plating solution 150 in at least a portion of the conveying path. In an embodiment of the invention, the transport path may be, for example, a U-shape, a V-shape or a triangle, but is not limited thereto. In another embodiment of the invention, the transport path is U-shaped, as shown in Figure 1, wherein a portion of the transport path is immersed under the liquid level of the plating solution. In an embodiment of the invention, the member to be plated comprises a flexible printed circuit board (FPC) or a flexible copper foil substrate (FCCL), but is not limited thereto.

The cathode wheel 121 is disposed in the tank body 110 and is not in contact with the plating solution 150 on the liquid surface 151 of the plating solution 150. The cathode wheel 121 is provided with a cathode electrically connected to the member to be plated 160 for reducing metal ions in the plating solution 150 and forming a metal layer on the member to be plated 160. In an embodiment of the present invention, the material of the cathode wheel is metal, for example, stainless steel, copper, titanium or a composite material of the above metal and non-metal, but is not limited thereto. In another embodiment of the invention, the surface of the cathode wheel is subjected to a lapping and polishing process.

The plating anode 130 is disposed on the transport path and immersed under the liquid surface 151 of the plating solution 150. The plating anodes 130 are disposed in parallel on the plane of the member to be plated 160. And the plating anode 130 provides anode electrical properties and oxidizes to produce metal ions in the plating solution 150. In an embodiment of the invention, the electroplating anode is a two-electroplating anode which is respectively disposed at different ends of the conveying path and immersed under the liquid surface of the plating solution. In another embodiment of the present invention, the two electroplating anodes are respectively disposed at different ends of the U-shaped transport path and immersed under the liquid surface of the plating solution, as shown in FIG. In still another embodiment of the present invention, the plating anode is a metal, such as copper, stainless steel or titanium, but is not limited thereto. In an embodiment of the invention, the electroplating anode is a titanium mesh or a titanium plate, and further comprises cerium oxide, cerium oxide or a combination thereof.

The partitioning groove 140 is disposed in the tank body 110, and at least one side surface of the partitioning groove 140 has a plurality of through holes 141. The plating solution 150 is introduced into the tank body 110 through the separation groove 140, and is substantially sprayed toward the material to be plated 160 near the plating anode 130. In an embodiment of the invention, the section of the dividing groove is square, inverted triangle, triangular, or a plurality of tubular structures.

In Fig. 1, the plating solution 150 is injected into the separation groove 140 in the direction of the arrow A, and is ejected toward the plated member 160 to be plated near the plated anode 130 by the through hole 141 in the direction of the arrow B. Moreover, the liquid level 151 of the excess plating solution 150 will rise above the tank body 110 and overflow out of the tank body 110 as indicated by the arrow C.

2A is a schematic cross-sectional view of a plating apparatus 200a according to an embodiment of the present invention, including a pressure reducing groove 210a. In Fig. 2A, the electroplating apparatus 200a has a structural composition similar to that of Fig. 1, except that a pressure reducing groove 210a, two cathode wheels 121, and two plating anodes 130 are additionally provided in the plating apparatus 200a.

The pressure reducing groove 210a is provided at the bottom of the tank body 110. The pressure reducing groove 210a has an opening 211 for introducing a fresh plating solution. Moreover, the pressure reducing groove 210a also has a plurality of through holes 212 facing the inside of the groove body 110 for uniformly mixing the plating solution in the tank body 110.

At the two ends of the plate to be plated 160, there are four cathode wheels 121 and four plated anodes 130, respectively. In this way, the opposite surfaces of the plated member 160 can be simultaneously plated to accelerate the plating efficiency and increase the productivity.

2B is a plating apparatus according to an embodiment of the present invention A schematic cross-sectional view of the apparatus 200b includes a pressure relief tank 210b. In Fig. 2B, the electroplating apparatus 200b has a structural composition similar to that of Fig. 2A, except that the pressure reducing grooves 210b extend to both sides of the tank body 110.

Since the pressure reducing groove 210b extends to the two sides of the tank body 110, the fresh plating solution can be sprayed toward the plated portion to be plated by the through hole 212 on the pressure reducing groove 210b to reduce the plating of the material to be plated. The solution impact creates a disturbance that affects the uniformity of the thickness of the coating layer. In an embodiment of the invention, the material of the pressure reducing groove comprises an acid and alkali resistant material. In another embodiment of the invention, the material of the pressure reducing groove comprises polyvinyl chloride (PVC), polypropylene (PP) or polyethylene (PE).

In one embodiment of the present invention, by combining the two-terminal cathode wheel to the plated anode to be plated, the plating efficiency can be accelerated and the productivity can be greatly improved. In an embodiment of the invention, the plating rate of the parts to be plated can be increased by 200%.

In one aspect, the electroplating apparatus provided by the embodiments of the present invention has a separation groove for supplying a fresh and accurate plating solution into the tank. Since the plating solution has a longer plating time, the concentration of metal ions in the plating solution is lowered. Therefore, in the embodiment of the present invention, by separating the through holes in the groove, a fresh and accurate plating solution can be sprayed toward the plate to be plated near the plated anode to effectively improve the plating quality of the member to be plated.

On the other hand, the electroplating equipment provided by the embodiments of the present invention all have two electroplating anodes for increasing electroplating efficiency and improving output efficiency. Since in the electroplating equipment, the material to be plated needs to be close to the electroplated anode to have an electroplating effect. Therefore, in the embodiment of the present invention, by providing two electroplated anodes on the conveying path The different ends of the diameter can avoid the interaction of the electric fields on the one hand, and shorten the plating time of the same plating thickness on the other hand to improve the output efficiency.

Fig. 3A is a plan view showing the plating apparatus 100 of Fig. 1. In FIG. 3A, the member to be plated 160 is immersed in the plating solution 150 along the guide wheels 120 on both sides of the tank body 110. The partitioning groove 140 is located at the center of the tank body 110. The through holes 141 of the two sides of the partitioning groove 140 are sprayed with a fresh plating solution 150 on the object to be plated 160 in the direction of the arrow B.

3B is a top plan view of a plating apparatus 300 in accordance with an embodiment of the present invention. In FIG. 3B, the electroplating apparatus 300 includes a tank body 310, a plurality of guide wheels 320, at least one cathode wheel 321, a plated anode 330, and a partition groove 340. The tank 310 is used to hold a plating solution 350. The guide wheels 320 are arranged in the tank body to form a conveying path, and a conveying member 360 is continuously conveyed by the conveying path. The plated anodes 330 are disposed on the conveying path and are disposed in parallel on the plane of the member to be plated 360.

The separation groove 340 is located at the center of the groove body 310. The through holes on both sides of the separation groove 340 are sprayed with the fresh plating solution 350 on the object to be plated 360 in the direction of the arrow B.

The difference from FIG. 3A is that the guide wheel 320 and the cathode wheel 321 of the electroplating apparatus 300 in FIG. 3B are perpendicular to the liquid level of the plating solution 350. The guide wheel 320 is disposed in the tank body 310 and located under the liquid surface of the plating solution 350. The cathode wheel 321 is disposed outside the tank body 310 and is not in contact with the plating solution 350. When the object to be plated 360 is disposed on the conveying path, the portion to be plated 360 is located under the plating solution 350 and perpendicular to the liquid level of the plating solution 350.

4A is a plating apparatus according to an embodiment of the present invention. A schematic cross-sectional view of the device 400a, wherein the partition groove 440a has an inverted triangle shape. In FIG. 4A, the plating apparatus 400a includes a tank body 410, a plurality of guide wheels 420, at least one cathode wheel 421, at least one plated anode 430, and a partition groove 440a.

The guide wheel 420 of the plating apparatus 400a forms a V-shaped conveying path, and continuously conveys a sheet to be plated 460 by a V-shaped conveying path. Among them, since the conveying path is V-shaped, the cross section of the dividing groove 440a is an inverted triangle. The fresh plating solution 450 is sprayed in the direction of the arrow A by the through hole 441 in the partition groove 440a to spray the plating solution 450 in the direction of the arrow B to the member to be plated 460 adjacent to the plated anode 430. Moreover, since the liquid level 451 of the excessive plating solution 450 will overflow the tank body 410 in the direction of the arrow C.

The cathode wheel 421 is provided with a cathode electrically connected to the member to be plated 460 for reducing metal ions in the plating solution 450 and forming a metal layer on the member to be plated 460. And the plated anode 430 provides anodic electrical properties and oxidizes to produce metal ions in the plating solution 450.

In an embodiment of the invention, the material of the cathode wheel is metal, such as stainless steel, copper or titanium, but is not limited thereto. In another embodiment of the invention, the surface of the cathode wheel is subjected to a lapping and polishing process. In still another embodiment of the present invention, the plating anode is a metal, such as copper, stainless steel or titanium, but is not limited thereto. In an embodiment of the invention, the electroplating anode is a titanium mesh or a titanium plate, and further comprises cerium oxide, cerium oxide or a combination thereof.

4B is a plating apparatus according to an embodiment of the present invention. A schematic cross-sectional view of the 400b, wherein the partition groove 440b has a triangular cross section. In FIG. 4B, the plating apparatus 400b includes a tank 410, a plurality of guide wheels 420, at least one plated anode 430, and a partition groove 440b.

The guide wheel 420 of the electroplating apparatus 400a forms a triangular conveying path, and a sheet to be plated 460 is continuously conveyed by a triangular conveying path. Wherein, since the conveying path is triangular, the section of the dividing groove 440b is triangular. The fresh plating solution 450 is sprayed in the direction of the arrow A by the through hole 441 in the partition groove 440b to spray the plating solution 450 in the direction of the arrow B to the member to be plated 460 adjacent to the plated anode 430. Moreover, since the liquid level 451 of the excessive plating solution 450 will overflow the tank body 410 in the direction of the arrow C.

The cathode wheel 421 is provided with a cathode electrically connected to the member to be plated 460 for reducing metal ions in the plating solution 450 and forming a metal layer on the member to be plated 460. And the plated anode 430 provides anodic electrical properties and oxidizes to produce metal ions in the plating solution 450.

In an embodiment of the invention, the material of the cathode wheel is metal, such as stainless steel, copper or titanium, but is not limited thereto. In another embodiment of the invention, the surface of the cathode wheel is subjected to a lapping and polishing process. In still another embodiment of the present invention, the plating anode is a metal, such as copper, stainless steel or titanium, but is not limited thereto. In an embodiment of the invention, the electroplating anode is a titanium mesh or a titanium plate, and further comprises cerium oxide, cerium oxide or a combination thereof.

5A and 5B are diagrams showing the through holes 510a and 510b of the separation grooves 500a and 500b according to an embodiment of the present invention. Generally speaking, The through hole pattern on the separation groove may be, for example, a circular hole shape, a honeycomb shape, a triangle shape, a square shape, or other geometric shapes, but is not limited thereto. In an embodiment of the present invention, the through hole 510a pattern on the partition groove 500a is a circular hole shape as shown in FIG. 5A. In another embodiment of the present invention, the through hole 510b pattern on the partition groove 500b is honeycomb-shaped as shown in FIG. 5B.

In the embodiment of the present invention, since the separation groove can directly supply the fresh and accurate concentration plating solution on the member to be plated close to the plated anode, the quality of the plating layer can be remarkably improved. In addition, by providing a pressure reducing groove on the plating equipment, the conventional stirring mixing method can be used to achieve the effect of rapid and uniform mixing, and a fresh plating solution can be added to the tank. On the other hand, by providing the two electroplated anodes on the transport path of the member to be plated, the plating time of the same plating thickness can be shortened, and the productivity of the electroplating apparatus can be greatly improved.

Although the embodiments of the present invention have been disclosed as above, it is not intended to limit the present invention, and any person skilled in the art can make some modifications and retouchings without departing from the spirit and scope of the present invention. The scope is defined as defined in the scope of the patent application.

100‧‧‧Electroplating equipment

110‧‧‧ tank

120‧‧‧guide wheel

121‧‧‧Cathode wheel

130‧‧‧Electroplated anode

140‧‧‧Separation slot

141‧‧‧through hole

150‧‧‧ plating solution

151‧‧‧ liquid level

160‧‧‧To be plated

A, B, C‧‧‧ arrows

Claims (21)

An electroplating apparatus comprising: a tank body for containing a plating solution, wherein the plating solution has a liquid surface when being contained in the tank body; a plurality of guide wheels are disposed in the tank body; at least one cathode wheel, Provided in the tank body and on the liquid surface of the plating solution, and not contacting the plating solution, wherein the cathode wheel and the guide wheels form a conveying path for continuously conveying a to-be-plated part, wherein the to-be-plated part is At least a portion of the transport path is immersed in the liquid surface of the plating solution; at least one plating anode is disposed on the transport path and immersed under the liquid surface of the plating solution, wherein the plating anode is disposed in parallel a plane of the member to be plated; and a partitioning groove is disposed in the groove body, the at least one side of the dividing groove has a plurality of through holes, wherein the plating solution is introduced into the groove body through the dividing groove And substantially injecting the article to be plated close to the plated anode. The electroplating apparatus of claim 1, wherein the transport path comprises a U-shape, a V-shape, or a triangle. The electroplating apparatus according to claim 1, wherein the conveying path is U-shaped. The electroplating apparatus according to claim 3, wherein the electroplating anodes are respectively disposed at different ends of the U-shaped conveying path and immersed under the liquid surface of the plating solution. The electroplating apparatus of claim 1, wherein the guide wheels are horizontal, vertical, or at an angle to the liquid mask. The electroplating apparatus according to claim 1, wherein the material of the cathode wheel is a metal or a composite material composed of a metal and a non-metal. The electroplating apparatus of claim 6, wherein the material of the cathode wheel is stainless steel, copper, titanium, or a composite material of the metal and non-metal. The electroplating apparatus of claim 1, wherein the cathode wheel train is horizontal, vertical or at an angle to the liquid mask. The electroplating apparatus according to claim 1, further comprising at least one pressure reducing groove disposed in the tank body for reducing the disturbance of the object to be plated by the impact of the plating solution. The electroplating apparatus of claim 9, wherein the decompression tank has a plurality of through holes. The electroplating apparatus of claim 10, wherein the through holes of the decompression tank pass into the plating solution into the tank body to reduce the disturbance of the object to be plated by the impact of the plating solution. The electroplating apparatus according to claim 9, wherein the material of the decompression tank comprises an acid and alkali resistant material. The electroplating apparatus of claim 12, wherein the acid and alkali resistant material comprises polyvinyl chloride (PVC), polypropylene (PP) or polyethylene (PE). The electroplating apparatus of claim 1, wherein the electroplated anode is a metal. The electroplating apparatus of claim 1, wherein the electroplating anode is copper, stainless steel or titanium. The electroplating apparatus according to claim 15, wherein the electroplating anode is a titanium mesh or a titanium plate. The electroplating apparatus of claim 16, wherein the surface of the electroplated anode has ruthenium oxide, ruthenium oxide or a combination thereof. The electroplating apparatus according to claim 1, wherein the electroplating anode is a two electroplating anode, which are respectively disposed at two ends of the conveying path and immersed under the liquid surface of the plating solution. The electroplating apparatus according to claim 1, wherein the partitioning groove has a square, an inverted triangle, a triangular shape, or a plurality of tubular structures. The electroplating apparatus according to claim 1, wherein the through holes of the separation groove are round holes or honeycomb. The electroplating apparatus of claim 1, wherein the member to be plated comprises a flexible printed circuit board.