CN104514028A - Electroplating equipment - Google Patents
Electroplating equipment Download PDFInfo
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- CN104514028A CN104514028A CN201310388863.6A CN201310388863A CN104514028A CN 104514028 A CN104514028 A CN 104514028A CN 201310388863 A CN201310388863 A CN 201310388863A CN 104514028 A CN104514028 A CN 104514028A
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Abstract
The invention discloses electroplating equipment. The electroplating equipment comprises a tank, a plurality of guide wheels, at least one electroplating anode, and a separation trough; wherein the separation trough is arranged in the tank, and at least one side surface of the separation trough is provided with a plurality of through holes. The electroplating liquid is introduced into the tank through the separation trough or the bottom and then sprayed on a member to be electroplated that is close to the electroplating anode.
Description
Technical field
The present invention relates to a kind of electroplating device manufacturing flexible printed circuit, particularly relate to a kind of electroplating device with separation trough.
Background technology
Be conventionally used to the electroplating device manufacturing flexible printed circuit and usually have volume to volume (roll-to-roll) structure, namely unplated piece is in above-mentioned electroplating device, utilizes multiple guide wheel with level or vertical mode continus convergence.Because the electroplating solution be contained in electroplating cell body can be longer along with electroplating time, reduce the concentration of metal ion in electroplating solution, therefore need the electroplating solution that Continuous Perfusion is fresh in electroplating cell body, to form the electroplating device of continous way.
For example, generally traditional coppered wire technological process major part is produced on pliability soft board.Wherein, no matter be level or vertical plating mode, when forming blind hole or thickening copper film, only have one or two galvanic anode in usual groove, namely only electroplate the one side of soft board or electroplate the two-sided of soft board simultaneously.But above-mentioned plating mode often needs longer electroplating time, increase the cost of time and equipment.
Moreover, general pliability unplated piece comprises polyethylene terephthalate (PET) or polyimide (polyimide, PI), it forms conductive layer via evaporation (evaporation), sputter (sputtering) or chemical deposition (chemical deposition), in order to the conductive leading end material as plating.But, because conductive layer is very thin metal level (such as copper film), therefore fixture cannot be used to fix unplated piece as traditional technology process, and need to use cathode wheel, form conveying belt and provide negative electrode electrical.
In traditional electroplating device, the difference of concentration of metal ions between old electroplating solution and fresh electroplating solution, can be produced.And use whipping appts to the limited success solved the problem.On the other hand, during with whipping appts mixing new, old electroplating solution, the correct concentration of metal ion in wayward electroplating solution, and the both sides of unplated piece belong to high Current Zone, the plating thickness of different batches may be caused uneven, and the even concentration therefore promoting metal ion is more aobvious for important.
Therefore, need a kind of electroplating device of manufacture flexible printed circuit newly at present badly, to solve the defect that traditional electrical coating apparatus produces.
Summary of the invention
The invention provides a kind of electroplating device, in order to solve the defect of traditional electrical coating apparatus, and reach the object of electroplating solution Homogeneous phase mixing and lifting electroplating efficiency.
One aspect of the present invention is to provide a kind of electroplating device.This electroplating device comprises cell body, multiple guide wheel, at least one cathode wheel, at least one galvanic anode and separation trough.Wherein, cell body in order to hold electroplating solution, and has liquid level when electroplating solution is contained in cell body.
These guide wheels are arranged in cell body, and with a transport path continus convergence unplated piece.Wherein unplated piece go out transport path at least partially in be immersed in the liquid level of electroplating solution under.
Cathode wheel to be arranged in cell body and to be positioned on the liquid level of electroplating solution, and not contact plating solution.Cathode wheel provides negative electrode electrical for this unplated piece, and the metal ion in reduction electroplating solution, unplated piece forms metal level.
Galvanic anode is arranged on transport path, and under being dipped in the liquid level of electroplating solution.Wherein galvanic anode is parallel or be vertically set in the plane of unplated piece.Galvanic anode oxidation produces metal ion in electroplating solution, metal ion is reduced having on the electrical unplated piece of negative electrode, forms metal level.
Separation trough is arranged in cell body, and at least one side of separation trough has multiple through hole.Wherein electroplating solution passes among cell body via separation trough, and sprays in fact to the unplated piece near galvanic anode.
According to one embodiment of the invention, above-mentioned transport path comprises U-shaped, V-shaped or trilateral.
According to one embodiment of the invention, above-mentioned transport path is U-shaped.
According to one embodiment of the invention, above-mentioned guide wheel is level, vertical or have angle with liquid level.
According to one embodiment of the invention, the material of above-mentioned cathode wheel is metal, or metal and nonmetal formed matrix material.
According to one embodiment of the invention, the material of above-mentioned cathode wheel is stainless steel, copper, titanium or above-mentioned metal and nonmetal formed matrix material.
According to one embodiment of the invention, above-mentioned cathode wheel is level or has angle with liquid level.
According to one embodiment of the invention, above-mentioned electroplating device also comprises at least one relief groove, and is arranged in cell body, is plated fluid challenge generation disturbance, and affects the homogeneity of coatings thickness in order to reduce unplated piece.
According to one embodiment of the invention, above-mentioned relief groove has multiple through hole.
According to one embodiment of the invention, these through holes of above-mentioned relief groove pass into electroplating solution in cell body, be plated fluid challenge generation disturbance, and affect the homogeneity of coatings thickness in order to reduce unplated piece.
According to one embodiment of the invention, these through holes of above-mentioned relief groove in order to form multiple bubble in electroplating solution, in order to Homogeneous phase mixing electroplating solution.
According to one embodiment of the invention, the material of above-mentioned relief groove comprises acid and alkali-resistance material.
According to one embodiment of the invention, the material of above-mentioned relief groove comprises polyvinyl chloride (PVC), polypropylene (PP) or polyethylene (PE).
According to one embodiment of the invention, above-mentioned galvanic anode is metal.
According to one embodiment of the invention, above-mentioned galvanic anode is copper, stainless steel or titanium.
According to one embodiment of the invention, above-mentioned galvanic anode is titanium net or titanium plate.
According to one embodiment of the invention, the surface of above-mentioned galvanic anode also comprises iridium oxide, tantalum oxide or its combination.
According to one embodiment of the invention, above-mentioned galvanic anode is two galvanic anodes, is separately positioned on the two ends of transport path, and under being immersed in this liquid level of electroplating solution.
According to one embodiment of the invention, above-mentioned galvanic anode to the two ends being separately positioned on U-shaped transport path, and under being immersed in the liquid level of electroplating solution.
According to one embodiment of the invention, the section of above-mentioned separation trough is square, del, trilateral or multiple tubular structure.
According to one embodiment of the invention, these through holes of above-mentioned separation trough are circular hole or honeycomb.
According to one embodiment of the invention, above-mentioned unplated piece comprises flexible PCB.
Accompanying drawing explanation
Fig. 1 is the electroplating device diagrammatic cross-section according to one embodiment of the invention;
Fig. 2 A and 2B is the electroplating device diagrammatic cross-section according to one embodiment of the invention, wherein comprises relief groove;
Fig. 3 A is the vertical view of the electroplating device of Fig. 1;
Fig. 3 B is the vertical view of the electroplating device according to one embodiment of the invention;
Fig. 4 A is the electroplating device diagrammatic cross-section according to one embodiment of the invention, and wherein the section of separation trough is del;
Fig. 4 B is the electroplating device diagrammatic cross-section according to one embodiment of the invention, and wherein the section of separation trough is triangular in shape; And
Fig. 5 A and 5B is the shape of through holes of the separation trough according to one embodiment of the invention.
Embodiment
Then coordinate accompanying drawing to describe the present invention in detail with embodiment, at accompanying drawing or in describing, similar or identical part uses identical symbol or numbering.In the accompanying drawings, the shape of embodiment or thickness may expand, and to simplify or convenient sign, and in accompanying drawing, the part of element will pass through text description.Apprehensible, the various forms that element that is not shown or that do not describe can be known to those skilled in the art.
Fig. 1 is the diagrammatic cross-section of the electroplating device 100 according to one embodiment of the invention.In FIG, electroplating device 100 comprises cell body 110, multiple guide wheel 120, at least one cathode wheel 121, at least one galvanic anode 130 and separation trough 140.
Cell body 110 is in order to hold electroplating solution 150.When wherein electroplating solution 150 is contained in cell body 110, electroplating solution 150 has liquid level 151.In one embodiment of this invention, cell body is made up of base plate, two side plates and two overflow plates.In one embodiment of this invention, electroplating solution comprises metal ion, and wherein metal ion can be cupric ion, cobalt ion, nickel ion, zine ion, tin ion or silver ions, but not as restriction.
Guide wheel 120 is arranged in cell body 110.Wherein, guide wheel 120 arranges and forms transport path in cell body, and with transport path continus convergence unplated piece 160.In one embodiment of this invention, guide wheel is level, vertical or have angle with liquid level.
Unplated piece 160 transport path at least partially in be immersed in the liquid level 151 times of electroplating solution 150.In one embodiment of this invention, transport path such as can be U-shaped, V-shaped or trilateral, but not as restriction.In another embodiment of the invention, transport path is U-shaped, as shown in Figure 1, under wherein the transport path of a part is immersed in the liquid level of electroplating solution.In one embodiment of this invention, unplated piece comprises flexible printed circuit (FPC) or pliability copper clad laminate (FCCL), but not as restriction.
Cathode wheel 121 is arranged in cell body 110, and on the liquid level 151 of electroplating solution 150, non-contact plating solution 150.Wherein, cathode wheel 121 provides negative electrode electrical for unplated piece 160, in order to the metal ion reduced in electroplating solution 150, and forms metal level on unplated piece 160.In one embodiment of this invention, the material of cathode wheel is metal, such as, can be stainless steel, copper, titanium or above-mentioned metal and nonmetal formed matrix material, but not as restriction.In another embodiment of the invention, the surface of cathode wheel is through grinding and polishing process.
Galvanic anode 130 is arranged on transport path, and is immersed in the liquid level 151 times of electroplating solution 150.Wherein, galvanic anode 130 is set in parallel in the plane of unplated piece 160.And galvanic anode 130 provides anode electrical, and oxidation produces metal ion in electroplating solution 150.In one embodiment of this invention, galvanic anode is two galvanic anodes, and it is separately positioned on the different two ends of transport path, and under being immersed in the liquid level of electroplating solution.In another embodiment of the invention, two galvanic anodes are separately positioned on the different two ends of U-shaped transport path, and under being immersed in the liquid level of electroplating solution, as shown in Figure 1.In another embodiment of the present invention, galvanic anode is metal, such as, can be copper, stainless steel or titanium, but not as restriction.In one embodiment of this invention, galvanic anode is titanium net or titanium plate, it also comprises iridium oxide, tantalum oxide or its combination.
Separation trough 140 is arranged in cell body 110, and at least one side of separation trough 140 has multiple through hole 141.Wherein, electroplating solution 150 passes among cell body 110 via separation trough 140, and sprays in fact to the unplated piece 160 near galvanic anode 130.In one embodiment of this invention, the section of separation trough be square, del, trilateral or multiple tubular structure.
In FIG, electroplating solution 150 injects separation trough 140 in the direction of arrow A, and is sprayed to the unplated piece 160 near galvanic anode 130 by through hole 141 in the direction of arrow B.Further, the liquid level 151 of too much electroplating solution 150 can exceed cell body 110, and overflows cell body 110 as shown by arrow C.
Fig. 2 A is the electroplating device 200a diagrammatic cross-section according to one embodiment of the invention, wherein comprises relief groove 210a.In fig. 2, the structure composition of electroplating device 200a is similar to Fig. 1, in electroplating device 200a, be just additionally provided with relief groove 210a, two cathode wheel 121 and two galvanic anodes 130.
Relief groove 210a is arranged on the bottom of cell body 110.Wherein, relief groove 210a has opening 211, in order to pass into fresh electroplating solution.Further, relief groove 210a also has the multiple through holes 212 towards cell body 110 inside, in order to the electroplating solution in Homogeneous phase mixing cell body 110.
At the two ends of unplated piece 160, there are four cathode wheel 121 and four galvanic anodes 130 respectively.Thus, just can electroplate two surfaces that unplated piece 160 is different simultaneously, to accelerate electroplating efficiency, promote production capacity.
Fig. 2 B is the electroplating device 200b diagrammatic cross-section according to one embodiment of the invention, wherein comprises relief groove 210b.In fig. 2b, the structure composition of electroplating device 200b is similar to Fig. 2 A, and just relief groove 210b extends to the both sides of cell body 110.
Because relief groove 210b extends to the both sides of cell body 110, therefore by the through hole 212 on relief groove 210b, fresh electroplating solution is sprayed to the unplated piece near galvanic anode, be plated fluid challenge generation disturbance to reduce unplated piece, avoid the homogeneity affecting coatings thickness.In one embodiment of this invention, the material of relief groove comprises acid and alkali-resistance material.In another embodiment of the invention, the material of relief groove comprises polyvinyl chloride (PVC), polypropylene (PP) or polyethylene (PE).
In one embodiment of this invention, by being arranged on the combination of unplated piece two ends cathode wheel and galvanic anode, can electroplating efficiency being accelerated, and significantly promote production capacity.In one embodiment of this invention, the rate of deposition of unplated piece can promote 200%.
On the one hand, the electroplating device that embodiments of the invention provide all has separation trough, in order to supply fresh and concentration accurately electroplating solution in cell body.Because electroplating solution can be longer along with electroplating time, and reduce the concentration of metal ion in electroplating solution.Therefore in an embodiment of the present invention, by the through hole on separation trough, can by fresh and concentration accurately electroplating solution spray to the unplated piece near galvanic anode, effectively to promote the coating quality of unplated piece.
On the other hand, the electroplating device that embodiments of the invention provide all has two galvanic anodes, in order to increase electroplating efficiency, promotes output usefulness.Due in electroplating device, unplated piece needs just have electroplating effect near galvanic anode.Therefore in an embodiment of the present invention, by arranging two galvanic anodes at the different two ends of transport path, electric field can be avoided to influence each other on the one hand, the electroplating time of identical thickness of coating can be shortened on the other hand, to promote output usefulness.
Fig. 3 A is the vertical view of the electroplating device 100 of Fig. 1.In figure 3 a, unplated piece 160 is along the guide wheel 120 immersion plating solution 150 being arranged in cell body 110 both sides.Separation trough 140 is positioned at the centre of cell body 110, and wherein the through hole 141 of separation trough 140 both sides in the direction of arrow B, sprays fresh electroplating solution 150 on unplated piece 160.
Fig. 3 B is the vertical view of the electroplating device 300 according to one embodiment of the invention.In figure 3b, electroplating device 300 comprises cell body 310, multiple guide wheel 320, at least one cathode wheel 321, at least one galvanic anode 330 and separation trough 340.Wherein, cell body 310 is in order to hold electroplating solution 350.Guide wheel 320 arranges and forms transport path in cell body, and with transport path continus convergence unplated piece 360.Galvanic anode 330 is arranged on transport path, and is set in parallel in the plane of unplated piece 360.
Separation trough 340 is positioned at the centre of cell body 310, and wherein the through hole of separation trough 340 both sides in the direction of arrow B, sprays fresh electroplating solution 350 on unplated piece 360.
Be with the different part of Fig. 3 A, in Fig. 3 B, the guide wheel 320 of electroplating device 300 and cathode wheel 321 are all perpendicular to the liquid level of electroplating solution 350.Wherein, guide wheel 320 is arranged in cell body 310, and under being positioned at the liquid level of electroplating solution 350; Cathode wheel 321 is then arranged on outside cell body 310, non-contact plating solution 350.When unplated piece 360 is arranged on transport path, unplated piece 360 is positioned at electroplating solution 350 times, and perpendicular to the liquid level of electroplating solution 350.
Fig. 4 A is according to the electroplating device 400a diagrammatic cross-section of one embodiment of the invention, and wherein the section of separation trough 440a is del.In Figure 4 A, electroplating device 400a comprises cell body 410, multiple guide wheel 420, at least one cathode wheel 421, at least one galvanic anode 430 and separation trough 440a.
The guide wheel 420 of electroplating device 400a forms V-shape transport path, and by V-shape transport path continus convergence unplated piece 460.Wherein, because transport path is V-shape, therefore the section of separation trough 440a is then in del.Fresh electroplating solution 450 in the direction of arrow A, by the through hole 441 on separation trough 440a, by electroplating solution 450 along arrow B direction, is injected on the unplated piece 460 of galvanic anode 430.Further, because the liquid level 451 of too much electroplating solution 450 can overflow cell body 410 in the direction of arrow C.
Wherein, cathode wheel 421 provides negative electrode electrical 460 for unplated piece, in order to the metal ion reduced in electroplating solution 450, and on unplated piece, forms metal level 460.And galvanic anode 430 provides anode electrical, and oxidation produces metal ion in electroplating solution 450.
In one embodiment of this invention, the material of cathode wheel is metal, such as, can be stainless steel, copper or titanium, but not as restriction.In another embodiment of the invention, the surface of cathode wheel is through grinding and polishing process.In another embodiment of the present invention, galvanic anode is metal, such as, can be copper, stainless steel or titanium, but not as restriction.In one embodiment of this invention, galvanic anode is titanium net or titanium plate, it also comprises iridium oxide, tantalum oxide or its combination.
Fig. 4 B is the electroplating device 400b diagrammatic cross-section according to one embodiment of the invention, and wherein the section of separation trough 440b is triangular in shape.In figure 4b, electroplating device 400b comprises cell body 410, multiple guide wheel 420, at least one galvanic anode 430 and separation trough 440b.
The guide wheel 420 of electroplating device 400b forms trilateral transport path, and by trilateral transport path continus convergence unplated piece 460.Wherein, because transport path is triangular in shape, therefore the section of separation trough 440b is then triangular in shape.Fresh electroplating solution 450 in the direction of arrow A, by the through hole 441 on separation trough 440b, by electroplating solution 450 in the direction of arrow B, is injected on the unplated piece 460 of galvanic anode 430.Further, because the liquid level 451 of too much electroplating solution 450 in the direction of arrow C, can overflow cell body 410.
Wherein, cathode wheel 421 provides negative electrode electrical 460 on unplated piece, in order to the metal ion reduced in electroplating solution 450, and on unplated piece, forms metal level 460.And galvanic anode 430 provides anode electrical, and oxidation produces metal ion in electroplating solution 450.
In one embodiment of this invention, the material of cathode wheel is metal, such as, can be stainless steel, copper or titanium, but not as restriction.In another embodiment of the invention, the surface of cathode wheel is through grinding and polishing process.In another embodiment of the present invention, galvanic anode is metal, such as, can be copper, stainless steel or titanium, but not as restriction.In one embodiment of this invention, galvanic anode is titanium net or titanium plate, it also comprises iridium oxide, tantalum oxide or its combination.
Fig. 5 A and Fig. 5 B is through hole 510a according to separation trough 500a and 500b of one embodiment of the invention and 510b shape.In general, the shape of through holes on separation trough such as can be circular hole, honeycomb, trilateral, square or other geometrical shapies, but not as restriction.In one embodiment of this invention, the through hole 510a shape on separation trough 500a is circular hole, as shown in Figure 5A.In another embodiment of the invention, the through hole 510b shape on separation trough 500b is honeycomb, as shown in Figure 5 B.
In an embodiment of the present invention, due to separation trough can directly supply fresh and concentration accurately electroplating solution on the unplated piece near galvanic anode, therefore obviously can promote the quality of coating.In addition, by arranging relief groove on electroplating device, the hybrid system of traditional stirring-type can be replaced, reaching the effect of Quick uniform mixing, and fresh electroplating solution can be supplemented in cell body.On the other hand, by arranging two galvanic anodes on the transport path of unplated piece, the electroplating time of identical thickness of coating can be shortened, and significantly promote the production capacity of electroplating device.
Although embodiments of the invention openly as above; so itself and be not used to limit the present invention, any those of ordinary skill in the art, without departing from the spirit and scope of the present invention; when doing a little variation and retouching, therefore protection scope of the present invention is as the criterion when defining with claims.
Claims (21)
1. an electroplating device, is characterized in that, comprises:
Cell body, it has liquid level in order to hold electroplating solution when wherein this electroplating solution is contained in this cell body;
Multiple guide wheel, it is arranged in above-mentioned cell body;
At least one cathode wheel, it is arranged on the above-mentioned electroplating solution liquid level in above-mentioned cell body, and do not contact above-mentioned electroplating solution, wherein this cathode wheel and these guide wheels above-mentioned form transport path continus convergence unplated piece, wherein this unplated piece this transport path at least partially in be immersed in the liquid level of above-mentioned electroplating solution under;
At least one galvanic anode, it is arranged on above-mentioned transport path, and under being immersed in the liquid level of above-mentioned electroplating solution, wherein this galvanic anode is set in parallel in the plane of above-mentioned unplated piece; And
Separation trough, it is arranged in above-mentioned cell body, and at least one side of this separation trough has multiple through hole, and wherein above-mentioned electroplating solution passes among above-mentioned cell body via this separation trough, and sprays to the above-mentioned unplated piece near above-mentioned galvanic anode.
2. electroplating device as claimed in claim 1, it is characterized in that, described transport path comprises U-shaped, V-shape or trilateral.
3. electroplating device as claimed in claim 1, it is characterized in that, described transport path is U-shaped.
4. electroplating device as claimed in claim 3, it is characterized in that, these galvanic anodes described are separately positioned on the different two ends of described U-shaped transport path, and under being immersed in the liquid level of described electroplating solution.
5. electroplating device as claimed in claim 1, is characterized in that, these guide wheels described be level, vertically or have angle with described liquid level.
6. electroplating device as claimed in claim 1, is characterized in that, the material of described cathode wheel is metal or metal and nonmetal formed matrix material.
7. electroplating device as claimed in claim 6, is characterized in that, the material of described cathode wheel is stainless steel, copper, titanium or these metals described and nonmetal formed matrix material.
8. electroplating device as claimed in claim 1, is characterized in that, described cathode wheel be level, vertically or have angle with liquid level.
9. electroplating device as claimed in claim 1, it is characterized in that, also comprise at least one relief groove, it is arranged in described cell body, is plated fluid challenge generation disturbance in order to reduce unplated piece.
10. electroplating device as claimed in claim 9, it is characterized in that, described relief groove has multiple through hole.
11. electroplating devices as claimed in claim 10, is characterized in that, these through holes described of described relief groove pass in described electroplating solution to described cell body, are plated fluid challenge generation disturbance in order to reduce unplated piece.
12. electroplating devices as claimed in claim 9, it is characterized in that, the material of described relief groove comprises acid and alkali-resistance material.
13. electroplating devices as claimed in claim 12, it is characterized in that, described acid and alkali-resistance material comprises polyvinyl chloride, polypropylene or polyethylene.
14. electroplating devices as claimed in claim 1, it is characterized in that, described galvanic anode is metal.
15. electroplating devices as claimed in claim 1, it is characterized in that, described galvanic anode is copper, stainless steel or titanium.
16. electroplating devices as claimed in claim 15, is characterized in that, described galvanic anode is titanium net or titanium plate.
17. electroplating devices as claimed in claim 16, is characterized in that, the surface of described galvanic anode has iridium oxide, tantalum oxide or its combination.
18. electroplating devices as claimed in claim 1, it is characterized in that, described galvanic anode is two galvanic anodes, is separately positioned on the two ends of described transport path, and under being immersed in the liquid level of described electroplating solution.
19. electroplating devices as claimed in claim 1, is characterized in that, the section of described separation trough is square, del, trilateral or multiple tubular structure.
20. electroplating devices as claimed in claim 1, is characterized in that, these through holes described of described separation trough are circular hole or honeycomb.
21. electroplating devices as claimed in claim 1, it is characterized in that, described unplated piece comprises flexible PCB.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310388863.6A CN104514028A (en) | 2013-08-30 | 2013-08-30 | Electroplating equipment |
| HK15104936.2A HK1204347A1 (en) | 2013-08-30 | 2015-05-25 | Electroplating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310388863.6A CN104514028A (en) | 2013-08-30 | 2013-08-30 | Electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104514028A true CN104514028A (en) | 2015-04-15 |
Family
ID=52789892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310388863.6A Pending CN104514028A (en) | 2013-08-30 | 2013-08-30 | Electroplating equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104514028A (en) |
| HK (1) | HK1204347A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1521042A1 (en) * | 1964-12-24 | 1969-07-17 | Telefunken Patent | Manufacturing process for a plurality of identical printed circuits |
| CN201186955Y (en) * | 2007-11-28 | 2009-01-28 | 亚智科技股份有限公司 | Flexible material electroplating apparatus |
| CN202011914U (en) * | 2010-12-31 | 2011-10-19 | 平高集团有限公司 | Plating bath for performing silver-graphite composite plating and plating equipment |
| CN202202008U (en) * | 2011-07-13 | 2012-04-25 | 杭州东方表面技术有限公司 | Stirring device for electroplating solution |
| CN202688479U (en) * | 2012-07-30 | 2013-01-23 | 华纳国际（铜陵）电子材料有限公司 | Copper foil surface treating machine |
-
2013
- 2013-08-30 CN CN201310388863.6A patent/CN104514028A/en active Pending
-
2015
- 2015-05-25 HK HK15104936.2A patent/HK1204347A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1521042A1 (en) * | 1964-12-24 | 1969-07-17 | Telefunken Patent | Manufacturing process for a plurality of identical printed circuits |
| CN201186955Y (en) * | 2007-11-28 | 2009-01-28 | 亚智科技股份有限公司 | Flexible material electroplating apparatus |
| CN202011914U (en) * | 2010-12-31 | 2011-10-19 | 平高集团有限公司 | Plating bath for performing silver-graphite composite plating and plating equipment |
| CN202202008U (en) * | 2011-07-13 | 2012-04-25 | 杭州东方表面技术有限公司 | Stirring device for electroplating solution |
| CN202688479U (en) * | 2012-07-30 | 2013-01-23 | 华纳国际（铜陵）电子材料有限公司 | Copper foil surface treating machine |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1204347A1 (en) | 2015-11-13 |
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