CN202202008U - Stirring device for electroplating solution - Google Patents

Stirring device for electroplating solution Download PDF

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Publication number
CN202202008U
CN202202008U CN2011202465151U CN201120246515U CN202202008U CN 202202008 U CN202202008 U CN 202202008U CN 2011202465151 U CN2011202465151 U CN 2011202465151U CN 201120246515 U CN201120246515 U CN 201120246515U CN 202202008 U CN202202008 U CN 202202008U
Authority
CN
China
Prior art keywords
electroplating solution
ppr pipe
ppr
cell body
groove body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011202465151U
Other languages
Chinese (zh)
Inventor
张光前
项昕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU DONGFANG SURFACE TECHNOLOGY Co Ltd
Original Assignee
HANGZHOU DONGFANG SURFACE TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU DONGFANG SURFACE TECHNOLOGY Co Ltd filed Critical HANGZHOU DONGFANG SURFACE TECHNOLOGY Co Ltd
Priority to CN2011202465151U priority Critical patent/CN202202008U/en
Application granted granted Critical
Publication of CN202202008U publication Critical patent/CN202202008U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a stirring device for electroplating solution, comprising an electroplating solution groove body, wherein at least one second PPR (Package Power Reactor) pipe with upward vertical holes is arranged at the bottom of the groove body; the second PPR pipe is communicated with an outlet of a vacuum pump mounted aside the groove body or an upright pump on the groove solution; an inlet of the vacuum pump or the upright pump is communicated with the groove body by a first PPR pipe; a valve for controlling a stirring force is arranged on the second PPR pipe; the second PPR pipe is installed on the bottom centre of the groove body; and diameter and hole spacing of the holes on the second PPR pipe are determined by power of a magnetic pump. Thus, the stirring device disclosed by the utility model has the characteristics of simple structure, safety and convenience in use, improves level off performance of the electroplating solution greatly without adverse effect generated by the electroplating solution, and the like.

Description

A kind of electroplating solution is used whipping appts
Technical field
The utility model relates to a kind of electroplating solution and use whipping appts, belong to the metal surface treating device technical field.
Background technology
At present, the whipping appts that field of electroplating is used mainly is that pneumatic blending, negative electrode move (comprising that negative electrode rotates), but some particular electrical plating liquor maybe can not use above-mentioned whipping appts, and some promptly enables to use and can not reach good effect.Can not use pneumatic blending (ferrous ion under pneumatic blending in the plating bath can be oxidized to deleterious ferric ion very soon) such as the Rhometal plating bath; The leveling performance that stirs the not enough plating bath of dynamics if the use negative electrode moves can not obtain fine performance; It is slow to go out ray velocity; Prolong electroplating time, increased production cost.
Summary of the invention
The purpose of the utility model is to overcome the deficiency that prior art exists, and provides a kind of electroplating solution that can improve the leveling performance of plating bath greatly and don't can make electroplating solution produce untoward reaction to use whipping appts.
The purpose of the utility model is accomplished through following technical scheme; It includes an electroplate liquid cell body; The bottom of this cell body is equipped with at least one PPR pipe two with hole vertically upward; This PPR pipe two communicates with the vertical type pump outlet of vacuum pump that is installed in the cell body next door or tank liquor top, and the import of said vacuum pump or vertical pump is managed one through PPR and communicated with cell body.
The valve of control stirring dynamics is installed on the described PPR pipe two of the utility model, and described PPR pipe two is mounted in the mid-way of cell body bottom, and hole diameter of being offered on it and pitch-row system set according to the watt level of magnetic drive pump.
The utlity model has simple in structurely, safe and convenient to use, can improve the leveling performance of plating bath greatly and don't can make electroplating solution produce characteristics such as untoward reaction.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Fig. 2 is the said internal structure synoptic diagram of the utility model.
Embodiment
To combine below accompanying drawing to the utility model make detailed introduction: Fig. 1, shown in 2; The utility model includes an electroplate liquid cell body 1; The bottom of this cell body 1 is equipped with at least one and manages 23 with the PPR of hole 2 vertically upward; This PPR manages 23 and communicates with the vertical type pump outlet of the vacuum pump 4 that is installed in cell body 1 next door or tank liquor top, and the import of said vacuum pump 4 or vertical pump is managed 1 through PPR and communicated with cell body 1.
The described PPR of the utility model manages the valve 6 that control stirring dynamics is installed on 23, described PPR manage 23 be mounted in cell body 1 bottom the mid-way, the hole diameter of being offered on it is to set according to the watt level of magnetic drive pump with pitch-row.The utility model is in concrete embodiment, and it can be one that said PPR manages 23, and also two, also many.

Claims (2)

1. an electroplating solution is used whipping appts; It includes an electroplate liquid cell body; The bottom that it is characterized in that this cell body (1) is equipped with at least one with the PPR pipe two (3) of hole (2) vertically upward; This PPR pipe two (3) communicates with the vertical type pump outlet of vacuum pump (4) that is installed in cell body (1) next door or tank liquor top, and the import of said vacuum pump (4) or vertical pump is managed one (5) through PPR and communicated with cell body (1).
2. electroplating solution according to claim 1 is used whipping appts, it is characterized in that being equipped with on the described PPR pipe two (3) valve (6) of control stirring dynamics, and described PPR pipe two (3) is mounted in the mid-way of cell body (1) bottom.
CN2011202465151U 2011-07-13 2011-07-13 Stirring device for electroplating solution Expired - Fee Related CN202202008U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011202465151U CN202202008U (en) 2011-07-13 2011-07-13 Stirring device for electroplating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011202465151U CN202202008U (en) 2011-07-13 2011-07-13 Stirring device for electroplating solution

Publications (1)

Publication Number Publication Date
CN202202008U true CN202202008U (en) 2012-04-25

Family

ID=45966140

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011202465151U Expired - Fee Related CN202202008U (en) 2011-07-13 2011-07-13 Stirring device for electroplating solution

Country Status (1)

Country Link
CN (1) CN202202008U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104514028A (en) * 2013-08-30 2015-04-15 鼎展电子股份有限公司 Electroplating equipment
CN106283168A (en) * 2016-09-29 2017-01-04 成都鼎翔通信技术有限公司 The electroplanting device of firm clamping pcb board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104514028A (en) * 2013-08-30 2015-04-15 鼎展电子股份有限公司 Electroplating equipment
CN106283168A (en) * 2016-09-29 2017-01-04 成都鼎翔通信技术有限公司 The electroplanting device of firm clamping pcb board
CN106283168B (en) * 2016-09-29 2018-06-19 上海栎胜信息科技中心 The electroplanting device of firm clamping pcb board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120425

Termination date: 20160713