KR101776782B1 - Plating device having a plating electrode unit - Google Patents

Plating device having a plating electrode unit Download PDF

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Publication number
KR101776782B1
KR101776782B1 KR1020160024974A KR20160024974A KR101776782B1 KR 101776782 B1 KR101776782 B1 KR 101776782B1 KR 1020160024974 A KR1020160024974 A KR 1020160024974A KR 20160024974 A KR20160024974 A KR 20160024974A KR 101776782 B1 KR101776782 B1 KR 101776782B1
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KR
South Korea
Prior art keywords
plating
electrode
unit
plated
cylindrical
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KR1020160024974A
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Korean (ko)
Inventor
임창식
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임창식
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Priority to KR1020160024974A priority Critical patent/KR101776782B1/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to a plating device for plating a cylindrical plated body and, more specifically, to a plating device having a plating electrode unit for plating a cylindrical plated body which is configured to, in terms of installing a plating electrode and a plated body, lead to convenience of work for enabling the installment of the plating electrode simply, and improvement of a plating performance by enabling the installed plating electrode to be appropriately evenly installed in an inner circumference of the plated body, as well as securing the stability in accordance with the installment of the plating electrode by not requiring a worker to perform an installment work of the plating electrode on an upper part of a plating bath filled with plating liquid.

Description

[0001] The present invention relates to a plating apparatus having a plating electrode unit for plating a cylindrical plating body,

The present invention relates to a plating apparatus for plating a cylindrical body to be plated, more particularly, to a plating apparatus for plating a cylindrical body to be plated, and more particularly to a plating apparatus for plating a surface of a cylindrical body to be plated, And more particularly, to a plating apparatus having a plating electrode unit for plating a cylindrical body to be plated to bring about convenience of plating operation.

In general, a plating method of coating a surface of a plated body with a thin film of another kind of metal or alloy is not limited to the concept of surface hardening or decorative, but also includes mechanical and chemical properties (anticorrosion, abrasion resistance, weather resistance, Electric conductivity, heat resistance, etc.) on the surface of the plated body by the metal or alloy to be plated.

Examples of the plating method include an electroplating method in which a target metal existing in the form of ion (Ion) in an aqueous solution is subjected to reduction deposition on the surface of a material to be plated using electric energy, and a method in which metal ions in the plating tank are reduced A plating bath for plating the surface of the object to be plated, a chemical plating for depositing a metal layer on the surface of the object to be plated, and a hot-dip coating for immersing the object to be plated in the molten metal in the plating vessel, Various kinds of plating methods such as physical vapor deposition and chemical vapor deposition have been carried out.

Among the above plating methods, the electroplating method includes, for example, a plating bath in which an electrolytic solution (plating solution) made of copper sulfide is filled at the time of copper plating, the cathode is connected to the plating object accommodated in the plating bath, When a current is supplied to a material to be plated on a plated object, that is, a copper electrode is connected to the positive electrode, the copper is oxidized to become copper ion and moves to the negative electrode. In the negative electrode, copper is reduced to copper Copper is plated on the sieve.

In the case of performing plating on the cylindrical body to be plated by applying the electroplating method as described above, it is necessary to position the plating electrode connected to the anode evenly corresponding to the inner diameter of the cylinder, A ring type anode mounting base 30 is provided on an upper portion of the plating vessel 10 through a separate support base 31 in a state where the plating body 20 is immersed in the vessel 10 and the anode mounting base 30 And the plating electrode 40 was installed and plated so as to be positioned inside the plating body 20.

However, in the conventional plating method, in order to install the plating electrode, the worker is considerably inconvenient because the operator installs the positive electrode at the upper part of the plating tank filled with the plating liquid and then the plating electrode at a regular interval to the positive electrode mounting table again. There is a problem that uniform plating can not be performed on the inner surface of the plated body due to unequal distance from the plated body when the plated electrodes to be installed are not spaced apart from each other.

In addition, when the worker performs the work at the upper part of the plating bath filled with the plating liquid as described above, the harmful steam generated from the plating liquid inevitably flows into the skin and the respirator of the worker, Serious problems have occurred.

Korean Patent Application No. 10-1560977.

Disclosure of the Invention The present invention was conceived in order to solve the above problems, and it is an object of the present invention to provide a plated electrode and a plated body for plating a cylindrical plated body, The present invention provides a plating apparatus having a plating electrode unit for plating a cylindrical plated body so as to improve the plating performance by making it possible to uniformly install the plating electrode to be fitted to the inner diameter of the body to be plated. It is an object of the invention.

Further, the present invention provides a plating apparatus having a plating electrode unit for plating a cylindrical plated body so that a worker does not need to carry out an installation work before plating on an upper part of a plating vessel filled with a plating liquid, thereby ensuring stability with the installation of the plating electrode The present invention has the object of the present invention.

As a specific means for achieving the above object, there is provided a plating apparatus comprising an upper open cylindrical plating vessel filled with an electrolytic solution therein, and a mounting unit installed in a plating vessel in a state where a plating electrode and a plating object are installed,
In the installation unit,
A disk-shaped mounting plate on which an insulating layer is formed on the upper surface and a cylindrical body to be plated is mounted;
A shaft which is installed from an upper center to an upper portion of the mounting plate and has a trailing hook formed at an upper end thereof;
A plurality of links extending radially projecting from an upper periphery of the shaft; And
And a tubular electrode mounting base to which a plurality of plating electrodes are connected,
The electrode-
A plurality of electrode mounting holes are further formed at regular intervals on the outer circumference,
A bolt hole is further formed in the upper portion of each plating electrode,
The plating electrode may be configured such that bolts and nuts are fastened to the electrode mounting holes according to the required amount,
And a plurality of screw rods inserted into and removed from the electrode mounting hole,
The screw rod is passed through the electrode mounting hole in accordance with the required number of the plating electrode and is fastened to the electrode mounting base by fastening the nut at the both sides so that the plating electrode is installed and bolted to the nut through the bolt hole,
And the diameters of connecting the end portions of the respective screw rods can be adjusted by inserting the respective screw rods through the electrode mounting holes.

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As described above, in the plating apparatus having the plating electrode unit for plating the cylindrical plated body according to the present invention, the plating electrode and the installation unit provided with the plating body are provided separately from the plating vessel, It is possible to freely and easily install the plating electrode and to install the plated body in a state in which the installation unit is completely separated from the plating vessel during installation, and it is convenient to install the plating electrode while maintaining a uniform interval between the plating electrode and the plated body So that it is possible to obtain an effect of improving workability and plating performance.

In addition, since the plating installation unit can be completely separated from the plating vessel, it is possible to prevent the operator from falling into the plating vessel, and the harmful vapor generated from the plating liquid upon installation of the plating electrode flows into the skin and the respirator of the worker It is possible to obtain the effect that the health protection of the worker is possible.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a conventional plating apparatus for plating a cylindrical object to be plated. Fig.
2 is an exploded perspective view of a plating apparatus having a plating electrode unit for plating a cylindrical plated body according to the present invention.
3 is a perspective view showing a plating apparatus incorporating a plating electrode unit for plating a cylindrical plated body according to the present invention.
4 is a cross-sectional view of a plating apparatus having a plating electrode unit for plating a cylindrical plated body according to the present invention.
5 is a perspective view of a mounting unit of a plating apparatus having a plating electrode unit for plating a cylindrical plated body according to the present invention.
FIG. 6 is a perspective view showing another embodiment of a mounting plate of a plating apparatus having a plating electrode unit for plating a cylindrical plated body according to the present invention. FIG.
Fig. 7 is another embodiment of an electrode assembly of a plating apparatus having a plated electrode unit for plating a cylindrical plated body according to the present invention. Fig.
Fig. 8 is a mounting state of a plating apparatus having a plating electrode unit for plating a cylindrical plated body according to the present invention. Fig.
Fig. 9 is a view showing another embodiment of the installation state of the plating apparatus having the plating electrode unit for plating the cylindrical plated body of the present invention.
FIG. 10 is a view showing another embodiment of the plating electrode mounting state of the plating apparatus having the plating electrode unit for plating the cylindrical plated body of the present invention. FIG.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It should be understood that various equivalents and modifications may be present.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 2 is an exploded perspective view of a plating apparatus having a plated electrode unit for plating a cylindrical plated body according to the present invention, Fig. 3 is a perspective view showing a plating apparatus with a plated electrode unit for plating a cylindrical plated body of the present invention, Sectional view of a plating apparatus having a plating electrode unit for plating a cylindrical plating body.

As shown in Figs. 2 to 4, the plating apparatus 1 having a plating electrode unit for plating a cylindrical plated body according to the present invention comprises a plating tank 100 and a mounting unit 200. Fig.

The plating vessel 100 is an upper open type in which an electrolytic solution (plating solution) for plating is filled in the inside of the plating vessel 100 and a plating electrode 40 and a cylindrical body 20 to be plated are accommodated. In the present invention, And is formed in a cylindrical shape to fit the plated body (20).

The installation unit 200 is provided separately from the plating vessel 100 and is configured to be removably installed inside the plating vessel 100 during plating.

5, the mounting unit 200 includes a disk-shaped mounting plate 210 on which a cylindrical plated body 20 made of a metallic material is mounted. The mounting plate 210 has an upper portion And an insulating layer 211 whose electrical conductivity with the plated body 20 is cut off is formed on the surface.

At this time, it is preferable that the mounting plate 210 is configured to be smaller than the inner circumferential surface of the plating tank 100.

6, at least one vertical guide protrusion 110 is further formed on the inner circumferential surface of the plating vessel 100. The vertical guide protrusion 110 may be formed on the inner circumferential surface of the plating vessel 100, .

A plurality of through holes 212 and 212 'are formed in the mounting plate 210 of the mounting unit 200 so that the outer diameter of the mounting plate 210 is larger than the outer diameter of the inner peripheral surface of the plating tank 100 And a guide groove 213 into which the guide protrusion 110 is inserted can be further formed around the mounting plate 210. [

The mounting unit 200 is formed with a shaft 220 in the form of a metal rod, which is vertically installed from the upper center to the upper portion of the mounting plate 210 and has a pulling ring 221 formed at an upper end thereof.

A plurality of connecting rods 230 made of metal are horizontally protruded around the upper portion of the shaft 220. The connecting rods 230 formed at this time are radially shifted about the shaft 220 .

The mounting unit 200 includes an electrode mount 240 connecting the ends of the radially protruding connection unit 230 with the plating electrode 40.

At this time, when the electrode assembly 240 is connected to the connection bar 230, the electrode assembly 240 is connected to the upper end of the connection bar 230 through welding or the like.

In order to install the plating electrode 40 on the electrode mounting table 240, a plurality of electrode mounting holes 241 and 241 'are formed at regular intervals on the outer circumference of the electrode mounting table 240, A through-hole 41 is formed in the upper portion of each plating electrode 40.

Various embodiments can be applied to provide the plating electrode 40 on the electrode mounting base 240,

2 to 5, a necessary number of plating electrodes 40 are provided in each of the electrode mounting holes 241 and 241 ', and a bolt hole 41 formed in the upper portion of the plating electrode 40 (B) and nut (N).

In another embodiment, as shown in FIG. 7, it is possible to further include a plurality of threaded rods 245 and 245 'which are inserted into and removed from the respective electrode mounting holes 241 and 241'.

In this case, the screw rods 245 and 245 'pass through the electrode mounting holes 241 and 241' in accordance with the required number of the plating electrodes 40 to be installed, N through the bolt hole 41 and the screw rods 245 and 245 are inserted from both sides of the plating electrode 40 into the threaded rods 245 and 245 ' (N).

When the plating electrode 40 is installed on the screw rods 245 and 245 'as described above, the screw rods 245 and 245' of the screw rods 245 and 245 'are inserted into the electrode mounting holes 241 of the electrode mounting rods 240, 245 'provided in the electrode mounting table 240 are inserted into the electrode mounting table 240, the screw rods 245 and 245' The diameter of connecting the outer ends of the plating electrode 40 is reduced and the diameter of connecting the outer ends of the plating electrode 40 is increased at the time of withdrawal and the diameter of the plating electrode 40 can be adjusted .

Hereinafter, the operation of the plating apparatus having the plating electrode unit for plating the cylindrical plated body of the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

First, in order to perform plating of the plated body 20 using the plating apparatus 1 having the plating electrode unit for plating the cylindrical plated body according to the present invention, a plating electrode 40 connected to the anode is formed in a conventional plating vessel 2 to 5, the plating unit 100 is provided separately from the plating unit 100, and the plating unit 100 is provided with plating (plating) The installation of the plating electrode 100 and the plating electrode 40 such that the installation unit 200 can be installed in the plating vessel 100 in the state that the electrode 40 and the body 20 to be plated are installed, .

To this end, a plurality of plating electrodes 40 may be provided on the electrode mounting base 240 of the mounting unit 200 so as to correspond to the inner diameter of the plated body 20 to be plated.

That is, the plating electrode 40 to be installed is provided with a necessary number of plating electrodes 40 in each of the electrode mounting holes 241 and 241 'formed in the electrode mounting base 240 with reference to FIGS. 2 to 5 The bolt B is inserted and the nut N is fastened from the inside of the electrode mounting table 240 in a state where the electrode mounting hole 241 to which the bolt hole 41 formed on the upper part of the plating electrode 40 is to be connected, The plating electrode 40 may be installed at a predetermined distance from the periphery of the electrode mounting table 240. Each of the plating electrodes 40 installed in this way is attached to the cylindrical plated body 20, And is installed in a plane-like circular shape.

Thereafter, the plated body 20 is installed, and at this time, the plated body 20 is covered from the top so as to receive the electrode mounting table 240 having the plating electrode 40 disposed therein, The gap between the plating electrodes 40 and the inner diameter of the plated body 20 may be uniformly controlled during the installation of the insulating layer 211 on the insulating layer 211 formed on the upper surface of the plate 210.

8, a pulling ring 221 is formed on the upper end of the shaft 220, and the pulling ring 221 is connected to the pulling ring 221. [ The towing device 50 such as a crane can be connected and towed and then accommodated in the plating tank 100. [

That is, in the plating apparatus 1 having the plating electrode unit for plating the cylindrical plated body of the present invention, the worker directly places the plating electrode 40 on the upper part of the plating vessel 100 filled with the electrolyte, 20 is not required to be installed, so that the convenience and stability of the operation can be secured.

6 (a) and 6 (b), when the plating unit 100 is installed with the plating unit 40 and the plating unit 20, 9, at least one vertical guide protrusion 110 is formed on the inner circumferential surface of the plating vessel 100, and a plurality of through holes 212 and 212 ' And a guide groove 213 in which the guide protrusion 110 is installed can be formed in the periphery.

That is, in the process of the installation unit 200 being inserted into and received in the plating tank 100, the guide groove 110 of the plating tank 100 is guided through the guide groove 213 of the mounting plate 210, In the process of being immersed in the electrolytic solution by the stable installation of the installation unit 200 such that the electrolytic solution can be circulated through the through holes 212 and 212 ' The plating electrode 40 can be prevented from flowing in a state in which the gap between the plating electrode 40 and the plating electrode 40 is adjusted.

Meanwhile, in the present invention, when the diameter of the plated body 20 for plating is different from that of the plated body 20 as described above, it is possible to easily adjust the gap with the plating electrode 40 according to the diameter change of the plated body 20 This can be achieved by providing the plating electrode 40 using the threaded rods 245 and 245 'with reference to FIG.

10, the screw rods 245 and 245 'are provided on the electrode mounting holes 241 and 241' formed in the electrode mount 240, and the screw rods 245 and 245 ' Are formed to be removable through the electrode mounting holes 241 and 241 'of the electrode mounting base 240. Each of the screw rods 245 and 245' provided on the electrode mounting base 240 is connected to the electrode mounting base 240 The diameters connecting the outer ends of the threaded rods 245 and 245 'to the plating electrodes 40 are reduced and the diameters connecting the outer ends of the threaded rods 245 and 245' are enlarged at the time of withdrawal, The diameter of the electrode 40 can be adjusted.

That is, as described above, it is possible to adjust the diameter of the plating electrodes 40 installed on the screw rods 245 and 245 'by the appearance of the screw rods 245 and 245' Even if the diameter of the plated body 20 to be plated is changed, the inner diameter of the plated body 20 and the interval between the plated electrodes 40 can be adjusted. .

As described above, in the plating apparatus having the plating electrode unit for plating the cylindrical plated body according to the present invention, it is very easy to install the plating electrode and the plated body in the preliminary work for plating the cylindrical plated body, And the uniformity of the gap between the plated bodies can be adjusted, thereby improving the plating performance.

In addition, since it is not necessary for the operator to install the plating electrode and the plated body on the upper part of the plating tank filled with the electrolyte, it is possible to prevent the health of the operator due to the harmful components of the plating solution from being deteriorated.

20: Plated body 40: Plated electrode
41: Bolt hole
100: Plating tank 110: Guide bump
200: Installation unit
210: mounting plate 211: insulating layer
212, 212 ': through hole 213: guide groove
220: shaft 221: pulling ring
230: connecting rod 240: electrode holder
241, 241: Electrode mounting hole 245, 245 '

Claims (4)

An upper open cylindrical plating tank 100 in which an electrolytic solution is filled and a plating unit 100 comprising a plating unit 100 and a plating unit 100 provided with a plating electrode 40 and a plating unit 20 As a result,
The installation unit (200)
A disk-shaped mounting plate 210 on which an insulating layer 211 is formed on a top surface and a cylindrical body 20 to be plated is mounted;
A shaft 220 which is installed from the upper center to the upper portion of the mounting plate 210 and has a pulling ring 221 at an upper end thereof;
A plurality of links 230 projecting radially around the upper portion of the shaft 220; And
And a tubular electrode mounting base 240 to which a plurality of plating electrodes 40 are attached, the ends of which are connected to each other,
The electrode mounting base 240,
A plurality of electrode mounting holes 241 and 241 'are formed at regular intervals on the outer circumference,
A bolt hole 41 is further formed in the upper portion of each plating electrode 40,
The plating electrode 40 may be constructed so that the bolts B and the nuts N are fastened to the electrode mounting holes 241 and 241 '
And further includes a plurality of screw rods 245 and 245 'which are inserted into and removed from the electrode mounting holes 241 and 241'
The screw rods 245 and 245 'penetrate the electrode mounting holes 241 and 241' in accordance with the required number of the plating electrodes 40 and are fastened to the electrode mounting rods 240 by fastening the nuts N on both sides, The plating electrode 40 is installed on each of the threaded rods 245 and 245 'through the bolt hole 41 and is fastened with the nut N,
Each of the threaded rods 245 and 245 'is inserted and removed through the electrode mounting holes 241 and 241' so that the diameters of the ends of the threaded rods 245 and 245 ' And a plated electrode unit for plating the cylindrical plated body.
The method according to claim 1,
The plating vessel 100 may further include at least one vertical guide protrusion 110 on the inner circumferential surface thereof,
A plurality of through holes 212 and 212 'are formed in the mounting plate 210 of the mounting unit 200 so that the outer diameter of the through holes 212 and 212' has a sliding tolerance with the inner circumferential surface of the plating tank 100, And a guide groove 213 in which the guide protrusion 110 is inserted,
The guiding protrusion 110 of the plating vessel 100 is guided through the guiding groove 213 of the guiding plate 210 while the installation unit 200 is inserted into the plating vessel 100 so as to be installed And a plated electrode unit for plating the cylindrical plated body.
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KR1020160024974A 2016-03-02 2016-03-02 Plating device having a plating electrode unit KR101776782B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190138489A (en) * 2018-06-05 2019-12-13 김민성 suction plating device
KR102617299B1 (en) * 2023-01-31 2023-12-21 동아대학교 산학협력단 Electroplating apparatus for surface modification of pipe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190138489A (en) * 2018-06-05 2019-12-13 김민성 suction plating device
KR102164550B1 (en) * 2018-06-05 2020-10-12 김민성 suction plating device
KR102617299B1 (en) * 2023-01-31 2023-12-21 동아대학교 산학협력단 Electroplating apparatus for surface modification of pipe

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