CN106917132A - A kind of electroplanting device - Google Patents
A kind of electroplanting device Download PDFInfo
- Publication number
- CN106917132A CN106917132A CN201710289002.0A CN201710289002A CN106917132A CN 106917132 A CN106917132 A CN 106917132A CN 201710289002 A CN201710289002 A CN 201710289002A CN 106917132 A CN106917132 A CN 106917132A
- Authority
- CN
- China
- Prior art keywords
- anode
- negative electrode
- cell body
- electroplanting device
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Abstract
The invention belongs to electroplating technology field, more particularly to a kind of electroplanting device.Electroplanting device includes cell body, and is arranged on solution in cell body, anode and negative electrode, wherein, the passage for solution circulation is formed between the negative electrode and anode, the bottom of the cell body is provided with the fluidic device for controlling solution to be flowed through from passage.The electroplanting device that the present invention is provided, by the setting of fluidic device, can be such that solution circulates between a cathode and an anode, it is ensured that various ion concentration uniformities in the temperature uniformity and solution of all coating contact surfaces.By the isolation of anode baffle, it can be ensured that the uniformity consistency of current density on coating, and then the uniformity of coating can be improved.
Description
Technical field
The invention belongs to electroplating technology field, more particularly to a kind of electroplanting device.
Background technology
General general electroplating bath is all made up of positive plate, cathode-workpiece and rectifier.Due to general workpiece not
It is very regular, so not being very strict to the required distance of anode and cathode.
Printing dedicated templates, because area is larger, in order to increase the wearability on surface, need in template surface before printing
Plating last layer antifriction metal (AFM), can so greatly improve number to be printed.Especially paper currency printing template, because number to be printed is larger, be
The surface abrasion of template is reduced, need in plated surface last layer hard chrome.Because printing dedicated templates are a complete plane, face
Product is 1*0.9 square metres, it is desirable to all coating uniformities in plane, is of uniform thickness, and error can not be more than 1um, especially work
The concentric thickness of thickness of part surrounding is consistent, and this just increased difficulty to electroplating technology.General coating bath frock is to protect
Card.Specific process must be adopted, just can guarantee that plane thickness of coating error is less.
In the prior art, template will ensure whole plate face thickness uniformity in plating, just can guarantee that prolonged paper
Coin printing quality.It is above-mentioned and due to edge effect in electroplating process, general coating is all that four sides plating thickness, intermediate deposit are thin
Problem is caused due to electric current distribution inequality.
Regarding to the issue above, proposition is a kind of can solve the problem that printing stencil thickness of coating present in prior art is uneven
New method.
The content of the invention
(1) technical problem to be solved
For existing technical problem, the invention provides a kind of electroplanting device, can solve the problem that and deposit in the prior art
The uneven problem of thickness of coating.
(2) technical scheme
In order to achieve the above object, the main technical schemes that the present invention is used include：
Propose a kind of electroplanting device, including cell body, and be arranged on solution in cell body, anode and negative electrode, wherein：Institute
State be formed between negative electrode and anode for solution circulation passage, positioned at the bottom of the cell body be provided with for control solution from
The fluidic device that passage flows through.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the fluidic device includes jet nozzle, the jet nozzle
Positioned at the lower section of passage；
The jet nozzle includes body, and is arranged on the multiple fluid apertures on body；The multiple fluid apertures and passage
Entrance point is oppositely arranged.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the fluidic device also includes being arranged on jet nozzle top,
Liquid barrier below negative electrode and anode；
The liquid barrier includes plate body, and is arranged on plate body the liquid flow direction for being used for adjustment by jet nozzle ejection
Strip hole.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the body is spindle rotationally arranged on cell body, and in pipe
The junction of body and cell body is provided with sealing device.
As a kind of preferred scheme of above-mentioned electroplanting device, also including attached groove, and the filter connected with the attached groove；
The top of the cell body is provided with overfall, the inlet of the attached groove is connected with overfall, and the attached groove goes out
Liquid mouthful is connected with the inlet of filter, and the liquid outlet of filter is connected with the inlet of fluidic device, and the solution is in filtering
In device in the presence of pump, passage is sprayed into by fluidic device after filter, then attached groove is returned to by overfall.
As a kind of preferred scheme of above-mentioned electroplanting device, it is provided between the anode and negative electrode for reducing anode four
The current density anode baffle in week；
The anode baffle is frame-like structures, and the maximum surface of both the anode baffle and anode is oppositely arranged.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the width of the anode baffle is 80-100mm.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the anode includes anode titanium basket, and the titanium basket flatness is missed
Difference is not more than 5mm.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the anode and negative electrode are arranged on cell body by electrode seat and copper bar
It is interior, and spacing between anode and negative electrode is adjustable.
Used as a kind of preferred scheme of above-mentioned electroplanting device, the spacing between the negative electrode and anode is 100-150mm.
(3) beneficial effect
The beneficial effects of the invention are as follows：The electroplanting device that the present invention is provided, by the setting of fluidic device, can make solution
Circulate between a cathode and an anode, it is ensured that various ion concentrations in the temperature uniformity and solution of all coating contact surfaces
Uniformity.By the isolation of anode baffle, it can be ensured that the uniformity consistency of current density on coating, and then plating can be improved
The uniformity of layer.
Brief description of the drawings
The side of the electroplanting device that Fig. 1 is provided for the specific embodiment of the invention is intended to；
The top view of the electroplanting device that Fig. 2 is provided for the specific embodiment of the invention；
The structural representation of the liquid barrier that Fig. 3 is provided for the specific embodiment of the invention；
The structural representation of the anode baffle that Fig. 4 is provided for the specific embodiment of the invention.
【Description of reference numerals】
1：Cell body；2：Anode；3：Negative electrode；4：Fluidic device；5：Attached groove；6：Anode baffle；7：Electrode seat；8：Negative electrode copper bar；
9：Anode copper bar；10：Filter；
41：Jet nozzle；42：Liquid barrier；
421：Plate body；422：Strip hole.
Specific embodiment
In order to preferably explain the present invention, in order to understand, below in conjunction with the accompanying drawings, by specific embodiment, to this hair
It is bright to be described in detail.
As shown in Figures 1 to 4, present embodiments provide for a kind of electroplanting device, it includes cell body 1, and is arranged on groove
Solution, anode 2 and negative electrode 3 in body 1, wherein, the passage for solution circulation is formed between negative electrode 2 and anode 3, positioned at cell body
1 bottom is provided with the fluidic device 4 for controlling solution to be flowed through from passage.
In the present embodiment, by the setting of fluidic device 4, solution can be made to be circulated between negative electrode 3 and anode 2,
Various ion concentration uniformities in the temperature uniformity and solution of all coating contact surfaces can be ensured.By anode baffle
Isolation, it can be ensured that the uniformity consistency of current density on coating, and then the uniformity of coating can be improved.
Specifically, fluidic device 4 includes jet nozzle 41, jet nozzle 41 is located at the lower section of passage.Jet nozzle 41 is wrapped
Body is included, and is arranged on the multiple fluid apertures on body, multiple fluid apertures are oppositely arranged with the entrance point of passage.As preferred,
Multiple fluid apertures are evenly distributed on body, by body, and are uniformly distributed the setting of fluid apertures, can be improved into passage
The uniformity of liquid.As preferred, two jet nozzles 41 being arranged side by side are provided with below passage, by two jets
The setting of jet pipe 41, it is ensured that the flow of solution in jet to cell body 1.The quantity of certain jet nozzle 41 can be according to cell body
1 and/or the size of passage be configured.
Fluidic device also includes being arranged on the liquid barrier 42 of the top of jet nozzle 41, negative electrode 3 and the lower section of anode 2.Reference picture
3, liquid barrier 42 includes plate body 421, and is arranged on plate body 421 for adjusting what the solution sprayed by jet nozzle 41 was flowed to
Strip hole 422.This has the plate body 421 of strip hole 422, and the solution that can be sprayed to jet nozzle 41 has the effect being oriented to.
Can further ensure that the solution sprayed by jet nozzle 41 is passed through by the passage between anode 2 and negative electrode 3.The bottom of cell body 1
Support protrusion and limiting card are provided with, liquid barrier 42 is overlapped in support protrusion, and are locked by limiting card.Thus, it is possible to real
The existing dismountable bottom for being arranged on cell body 1 of liquid barrier 42, is easy to the cleaning of liquid barrier 42.
Body is spindle rotationally arranged on cell body 1, and the junction of body and cell body 1 is provided with sealing device.It is logical
Cross that body is rotary to be arranged on cell body 1, solution spray angle that can be according to actual needs to jet nozzle 41 is carried out
Adjustment.
Electroplanting device also includes attached groove 5, and the filter 10 connected with attached groove 5, and the top of cell body 1 is provided with overflow
Mouthful.The inlet of attached groove 5 is connected with overfall, the liquid outlet of attached groove 5 is connected with the inlet of filter 10, and filter 10 goes out
Liquid mouthful is connected with the inlet of fluidic device, i.e., the liquid outlet of filter 10 is connected with the inlet of jet nozzle 41.
Solution sprays into passage after filter in the presence of pump in filter 10 by fluidic device, then by overflow
Mouth returns to attached groove 5.Thus, it is possible to make solution form closed cycle between cell body 1 and attached groove 5, it is necessary to illustrate, in attached groove
Heater is additionally provided with 5, thus, it is possible to be adjusted to the temperature of solution.The specific course of work of heater is：It is attached
Temperature-detecting device is provided with groove 5, heater and temperature-detecting device are electrically connected with control device, control device according to
The temperature detection value of temperature-detecting device, and the set value calculation heater of temperature operation.Regulation to solution temperature,
In addition to controlling the work of heater, control device can also turning according to the temperature detection value controlling pump of temperature-detecting device
Speed adjusts solution temperature.
The anode baffle 6 of the current density for reducing the surrounding of anode 2 is provided between anode 2 and negative electrode 3.Reference picture 4,
Anode baffle 6 is frame-like structures, and anode baffle 6 and both the maximum surfaces of anode 2 are oppositely arranged.Specifically, anode 2 includes
Titanium basket, the maximum surface of both anode baffle 6 and titanium basket is oppositely arranged.By the setting of anode baffle 6, it is possible to reduce titanium basket four
The current density in week, prevents the surrounding thickness of coating blocked up, reduces the edge effect of electric current.
The width of anode baffle 6 is 80-100mm, specifically, the width of anode baffle 6 is 90mm or 95mm.
Titanium basket flatness error is not more than 5mm.Titanium basket flatness error is 4mm, 3mm or 2mm.By ensureing titanium basket table
The flatness in face, it is ensured that it does not have warpage, the problem of deformation, thus, it is possible to improve the uniformity of electric current distribution.
Titanium basket includes multiple titanium basket units, and titanium basket is spliced to form by between multiple titanium basket units.
Anode 2 and negative electrode 3 are arranged in cell body 1 by electrode seat 7 and copper bar, and spacing between anode 2 and negative electrode 3 can
Adjust.Spacing between negative electrode 3 and anode 2 is 100-150mm.Specifically, spacing between negative electrode 3 and anode 2 be 110mm,
120mm, 130mm or 140mm.Spacing between negative electrode 3 and anode 2 can be determined according to the size of plating piece, by the moon
The adjustment of size between pole 3 and anode 2, it is ensured that the uniformity of coating.
Specifically, cell body 1 is made up of the plastic plate of corrosion resistance, electrode seat 7 is made up of isolation material, and electrode seat includes negative electrode
Seat and anode seat, cathode block and anode are U-shape structure and are fixed on the upper end of cell body 1, wherein, it is provided with use on cell body 1
In the long waist shaped hole for installing cathode block, by adjusting the rigging position of cathode block and long waist shaped hole, negative electrode 3 and anode can be adjusted
Spacing between 2.Negative electrode copper bar 8 and anode copper bar 9, negative electrode copper bar 8 and anode copper are respectively arranged with anode seat and cathode block
Row 9 is connected in the U-shaped opening of cathode block or anode seat respectively.Negative electrode copper bar 8 hangs printing stencil for hanging negative electrode.Sun
Pole copper bar 9 hangs titanium basket for hanging anode, and nickel plate or nickel beans are filled with titanium basket.Electroplanting device also includes rectifier, uses
In being that negative electrode 3 and anode 2 provide electroplating power supply by negative electrode copper bar 8 and anode copper bar 9.
Know-why of the invention is described above in association with specific embodiment, these descriptions are intended merely to explain of the invention
Principle, it is impossible to be construed to limiting the scope of the invention by any way.Based on explaining herein, those skilled in the art
Other specific embodiments of the invention are associated by would not require any inventive effort, these modes fall within this hair
Within bright protection domain.
Claims (10)
1. a kind of electroplanting device, including cell body (1), and solution in cell body (1), anode (2) and negative electrode (3) are arranged on, its
It is characterised by：The passage for solution circulation is formed between the negative electrode (3) and anode (2), positioned at the bottom of the cell body (1)
It is provided with the fluidic device (4) for controlling solution to be flowed through from passage.
2. electroplanting device according to claim 1, it is characterised in that the fluidic device (4) includes jet nozzle (41),
The jet nozzle (41) is positioned at the lower section of passage；
The jet nozzle (41) is including body, and is arranged on the multiple fluid apertures on body；The multiple fluid apertures and passage
Entrance point is oppositely arranged.
3. electroplanting device according to claim 2, it is characterised in that the fluidic device (4) also includes being arranged on jet
Jet pipe (41) top, the liquid barrier (42) below negative electrode (3) and anode (2)；
The liquid barrier (42) includes plate body (421), and is arranged on plate body (421) for adjusting by jet nozzle (41) spray
The strip hole (422) of the liquid flow direction for going out.
4. electroplanting device according to claim 2, it is characterised in that the body is spindle rotationally arranged on cell body (1),
And the junction of body and cell body (1) is provided with sealing device.
5. electroplanting device according to claim 1, it is characterised in that also including attached groove (5), and with the attached groove (1)
The filter (10) of connection；
The top of the cell body (1) is provided with overfall, and the inlet of the attached groove (5) is connected with overfall, the attached groove (5)
Liquid outlet connected with the inlet of filter (10), the liquid outlet of filter (10) is connected with the inlet of fluidic device (4),
The solution sprays into passage after filter in the presence of pump in filter (10) by fluidic device (4), then by overfall
Return to attached groove (5).
6. electroplanting device according to claim 1, it is characterised in that be provided with use between the anode (2) and negative electrode (3)
In the current density anode baffle (6) for reducing anode (2) surrounding；
The anode baffle (6) is frame-like structures, and the maximum surface of both the anode baffle (6) and anode (2) is relative to be set
Put.
7. electroplanting device according to claim 1, it is characterised in that the width of the anode baffle (6) is 80-
100mm。
8. electroplanting device according to claim 1, it is characterised in that the anode (2) including anode titanium basket, the titanium basket
Flatness error is not more than 5mm.
9. electroplanting device according to claim 1, it is characterised in that the anode (2) and negative electrode (3) are by electrode seat (7)
It is arranged in cell body (1) with copper bar, and spacing between anode (2) and negative electrode (3) is adjustable.
10. the electroplanting device according to claim 1 or 9, it is characterised in that between the negative electrode (3) and anode (2)
Away from being 100-150mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710289002.0A CN106917132B (en) | 2017-04-27 | 2017-04-27 | A kind of electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710289002.0A CN106917132B (en) | 2017-04-27 | 2017-04-27 | A kind of electroplanting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106917132A true CN106917132A (en) | 2017-07-04 |
| CN106917132B CN106917132B (en) | 2018-12-07 |
Family
ID=59567712
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710289002.0A Active CN106917132B (en) | 2017-04-27 | 2017-04-27 | A kind of electroplanting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN106917132B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111304720A (en) * | 2018-12-12 | 2020-06-19 | 欣兴电子股份有限公司 | Electroplating device and electroplating method |
| CN112410851A (en) * | 2019-08-23 | 2021-02-26 | 盛美半导体设备(上海)股份有限公司 | Cathode cavity |
| CN112626599A (en) * | 2020-12-08 | 2021-04-09 | 南京鸿音工程技术有限公司 | Electroplating equipment with impurity removal function |
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| CN111304720A (en) * | 2018-12-12 | 2020-06-19 | 欣兴电子股份有限公司 | Electroplating device and electroplating method |
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| CN112410851A (en) * | 2019-08-23 | 2021-02-26 | 盛美半导体设备(上海)股份有限公司 | Cathode cavity |
| CN112626599A (en) * | 2020-12-08 | 2021-04-09 | 南京鸿音工程技术有限公司 | Electroplating equipment with impurity removal function |
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| Publication number | Publication date |
|---|---|
| CN106917132B (en) | 2018-12-07 |
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Effective date of registration: 20210511 Address after: 301914 No.3 standard workshop, 32 Jiyunhe street, Tianjin special purpose vehicle industrial park, Jizhou District, Tianjin Patentee after: Newcastle Technology (Tianjin) Co.,Ltd. Address before: No.248 waiying, Taihu Town, Tongzhou District, Beijing Patentee before: BEIJING NEWPOWER TECHNOLOGY Co.,Ltd. |