WO2012011727A3 - Dispositif destiné à une galvanoplastie - Google Patents

Dispositif destiné à une galvanoplastie Download PDF

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Publication number
WO2012011727A3
WO2012011727A3 PCT/KR2011/005321 KR2011005321W WO2012011727A3 WO 2012011727 A3 WO2012011727 A3 WO 2012011727A3 KR 2011005321 W KR2011005321 W KR 2011005321W WO 2012011727 A3 WO2012011727 A3 WO 2012011727A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrolyte
spraying part
electroplating apparatus
plated
spraying
Prior art date
Application number
PCT/KR2011/005321
Other languages
English (en)
Korean (ko)
Other versions
WO2012011727A2 (fr
Inventor
김윤용
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Priority to CN201180035366.7A priority Critical patent/CN103025922B/zh
Publication of WO2012011727A2 publication Critical patent/WO2012011727A2/fr
Publication of WO2012011727A3 publication Critical patent/WO2012011727A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La présente invention a trait à un dispositif destiné à une galvanoplastie, lequel dispositif comprend : une cuve de galvanisation qui contient une solution électrolytique contenant des ions du métal devant être plaqué ; une partie de pulvérisation de solution électrolytique, qui reçoit la solution électrolytique et pulvérise cette dernière sur une zone prédéterminée de l'objet devant être plaqué à l'aide au moins une buse de pulvérisation ; et une pompe de circulation, qui aspire la solution électrolytique dans la cuve de galvanisation et qui fournit celle-ci à la partie de pulvérisation de solution électrolytique avec une pression prédéterminée, de sorte que la solution électrolytique peut être pulvérisée à partir de la partie de pulvérisation de solution électrolytique.
PCT/KR2011/005321 2010-07-20 2011-07-20 Dispositif destiné à une galvanoplastie WO2012011727A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180035366.7A CN103025922B (zh) 2010-07-20 2011-07-20 电镀设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0070226 2010-07-20
KR1020100070226A KR101693217B1 (ko) 2010-07-20 2010-07-20 전기도금 장치

Publications (2)

Publication Number Publication Date
WO2012011727A2 WO2012011727A2 (fr) 2012-01-26
WO2012011727A3 true WO2012011727A3 (fr) 2012-05-03

Family

ID=45497291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005321 WO2012011727A2 (fr) 2010-07-20 2011-07-20 Dispositif destiné à une galvanoplastie

Country Status (3)

Country Link
KR (1) KR101693217B1 (fr)
CN (1) CN103025922B (fr)
WO (1) WO2012011727A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101704615B1 (ko) * 2016-04-19 2017-02-08 (주)아이케이텍 도금 장치
AU2017295870B2 (en) 2016-07-13 2022-04-28 Iontra Inc Electrochemical methods, devices and compositions
CN106757226B (zh) * 2017-01-11 2018-10-30 吉林大学 一种防止电镀件上定位孔漏镀的仿形射流装置及其用途
CN106917132B (zh) * 2017-04-27 2018-12-07 北京纽堡科技有限公司 一种电镀装置
TWI663294B (zh) 2017-12-15 2019-06-21 Chipbond Technology Corporation 電鍍裝置及其壓力艙
KR102674416B1 (ko) * 2018-12-10 2024-06-12 주식회사 케이엠더블유 전기도금 장치, 이를 이용한 전기도금 방법 및 이를 이용해 제조된 캐비티필터
EP3872236B1 (fr) * 2020-02-28 2022-02-16 Semsysco GmbH Système de distribution d'un fluide de traitement pour traitement de surface chimique et/ou électrolytique d'un substrat
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808084B (zh) * 2021-01-29 2024-07-02 泰科电子(上海)有限公司 电镀装置和电镀系统
KR102666303B1 (ko) * 2021-12-31 2024-05-20 주식회사 세광주얼리 기포제거 효율성이 향상된 도금장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267304A (ja) * 1992-03-18 1993-10-15 Fujitsu Ltd メッキ装置及びメッキ方法
KR100325974B1 (ko) * 1999-06-24 2002-03-07 한수철 반도체용 웨이퍼의 니켈 도금장치
JP2005097732A (ja) * 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2006118019A (ja) * 2004-10-25 2006-05-11 Almex Inc 平板形状物の表面処理方法および表面処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330380B2 (ja) * 2003-05-29 2009-09-16 株式会社荏原製作所 めっき装置及びめっき方法
JP4805141B2 (ja) * 2003-03-11 2011-11-02 株式会社荏原製作所 電気めっき装置
CN101255594B (zh) * 2007-12-07 2010-06-23 东莞洲亮通讯科技有限公司 电镀生产工艺及设备
KR101693223B1 (ko) * 2009-04-17 2017-01-05 주식회사 케이엠더블유 전기도금 장치
CN101665965B (zh) * 2009-10-13 2011-06-01 广州杰赛科技股份有限公司 一种石墨粉镀铜的电镀装置及工艺

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267304A (ja) * 1992-03-18 1993-10-15 Fujitsu Ltd メッキ装置及びメッキ方法
KR100325974B1 (ko) * 1999-06-24 2002-03-07 한수철 반도체용 웨이퍼의 니켈 도금장치
JP2005097732A (ja) * 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2006118019A (ja) * 2004-10-25 2006-05-11 Almex Inc 平板形状物の表面処理方法および表面処理装置

Also Published As

Publication number Publication date
CN103025922A (zh) 2013-04-03
KR20120008891A (ko) 2012-02-01
CN103025922B (zh) 2016-06-01
KR101693217B1 (ko) 2017-01-05
WO2012011727A2 (fr) 2012-01-26

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