JP6189279B2 - Etching equipment - Google Patents

Description

  The present invention relates to an etching apparatus. For example, the present invention relates to an etching apparatus used in an etching process during the manufacturing process of an electronic circuit board.

《Technical background》
For example, in a printed wiring board and other electronic circuit boards, typical manufacturing processes are as follows.
First, a photosensitive resist is applied or pasted on the outer surface of a substrate material made of a copper-clad laminate. Then, exposure is performed by applying a negative film of the circuit, and the resist other than the circuit forming portion is dissolved and removed by development. Therefore, after the copper foil other than the exposed circuit shape portion is dissolved and removed by etching, the resist in the circuit forming portion is dissolved and removed by peeling.
By following such a process, an electronic circuit is formed from the copper foil remaining on the outer surface of the substrate material, and an electronic circuit board is manufactured.
And in the etching apparatus of an etching process, etching liquid is sprayed from a spray nozzle with respect to the board | substrate material conveyed horizontally with a conveyor, and a board | substrate material is etched (refer FIG. 3 mentioned later).

<Conventional technology>
In the etching apparatus, the sprayed etching solution flows leftward or rightward (perpendicular to the front and rear transport directions) on the outer surface of the substrate material, and after flowing through the substrate material, flows down and is discharged from both the left and right sides. The Accordingly, the etching solution sprayed onto the substrate material is sequentially updated to a fresh solution.
On the other hand, if the etching liquid pools or stays on the outer surface of the substrate material, the renewal is hindered and the etching accuracy decreases. In particular, in the vicinity of the central portion of the upper surface of the substrate material, such liquid accumulation and stagnation are likely to occur.
Therefore, with the aim of promoting the renewal of the etching solution, elimination of the liquid pool, and elimination of the residence, the etching apparatus employs a spray nozzle inclined arrangement and a dam roll.
That is, in the representative example of the conventional etching apparatus 1, as shown in FIG. 3B, the jetted etching liquid A is prevented from flowing back and forth on the outer surface of the substrate material B and flows to the left and right. In order to achieve this, the spray nozzles 2 are alternately inclined in the left and right directions, or as shown in FIGS. 1 (4) and 2 (2), the dam roll 3 can be used as a partition roller. Was adopted.
These are usually employed on the upper side of the substrate material B (the lower surface of the substrate material B is sprayed without dropping or staying, and immediately falls spontaneously and falls by its own weight without being accumulated or retained. ).

Examples of such a conventional etching apparatus 1 include those shown in the following Patent Documents 1 and 2.
JP 2011-23378 A JP 2011-23379 A

By the way, the following subject was pointed out about the etching apparatus 1 of such a conventional board | substrate material B. As shown in FIG.
First, regarding the formed circuit C pattern, FIG. 4B shows an ideal example having a rectangular cross section. (3) The figure shows a good example of a cross section close to this. (4) The figure shows a bad example where the cross section forms a steeply trapezoidal shape. In the figure, L is a circuit width, T is a top surface width (top width), S is a space between circuits, and H is a circuit depth.
In order to obtain the good circuit C pattern shown in FIG. 4 (3), for example, in FIG. 1 (4) and FIG. 3, the spray pressure of the etching solution A sprayed from the spray nozzle 2 is It is necessary to raise. In view of miniaturization, high density, improvement in etching accuracy, etc. of the circuit C, the need for such high pressure has recently increased further. In the figure, 4 is a conveyor and 5 is the wheel.
In other words, when the pressure is low, for example, when the spray pressure is 0.18 MPa, the circuit C (circuit width L30 μm, top surface width T20 μm) having a bad cross section as shown in FIG. On the other hand, when the spray pressure is higher than 0.20 MPa, for example, at a spray pressure of 0.25 MPa, the circuit C has a good pattern close to the rectangle in FIG. 4 (3) (circuit width L30 μm, top surface width T25 μm). Will be formed.

However, in the conventional etching apparatus 11 shown in FIG. 1 (4) and FIG. 2 (2), when the spray pressure is increased and the etching process is performed with a stronger spray pressure and a stronger jet impact, It has been pointed out that there is a variation in the formed circuit C pattern. In particular, the upper surface of the substrate material B has been pointed out.
This problem will be further described in detail. When the spray pressure is increased, the etching solution A sprayed onto the substrate material B is scattered or overflowed over the dam roll 3.
That is, with respect to the upper surface of the substrate material B, when the spray pressure is less than 0.20 MPa, the reference water level of the etching liquid A stably maintained between the dam rolls 3 is higher than the reference water level by pressure reflection when the spray pressure is 0.20 MPa or more. It bounces up and scatters, or it overflows above the reference water level due to pressure waves.
As a result, the etchant A flows out in the front-rear direction E (see the solid line display in FIG. 1 (4)).

As a result, with respect to the substrate material B in the spray target area of the spray nozzle 2, the etching solution A for performing the etching process becomes insufficient. On the other hand, about the board | substrate material B of the spray object area of the spray nozzle 2 adjacent before and behind, it becomes a cause of the liquid pool and the generation | occurrence | production of retention of the etching liquid A.
In this way, the etching process is excessively insufficient or slow, and the formed circuit C pattern varies. (On the lower surface of the substrate material B, the etching liquid A spontaneously drops and falls under its own weight immediately after the etching process. So there are few such problems.)
Regarding the circuit C on the upper surface of the substrate material B, those having the bad pattern cross section shown in FIG. 4 (4) are mixed, and the etching rate and etching factor of the formation pattern are lowered, the standard deviation and the in-plane distribution are deteriorated. Was invited.
As described above, in the conventional etching apparatus 1 for the substrate material B, when the spray pressure is increased, the circuit C pattern varies, which causes a problem in etching accuracy.

<< About the present invention >>
In view of such circumstances, the etching apparatus of the present invention has been made to solve the problems of the conventional example.
A first object of the present invention is to propose an etching apparatus in which the etching accuracy is improved, and secondly, this can be realized easily and without any trouble.

<About Claim>
The technical means of the present invention for solving such a problem is as follows, as described in the claims.
About Claim 1, it is as follows.
This etching apparatus performs an etching process by spraying an etching solution from a spray nozzle onto a plate-like member conveyed by a conveyor. The etching apparatus has a dam roll and a liquid stopper.
The conveyor has upper and lower wheel groups and horizontally conveys the plate member.
A large number of the spray nozzles are provided around the conveyor, and at least a plurality of spray nozzles arranged above the conveyor are inclined obliquely toward the left or right direction with respect to the transport direction of the conveyor. Has been placed.
The dam roll is composed of a straight roller having a diameter smaller than that of the wheel, and is adjacent to the wheel in a pair with the front and rear end portions of the spray zone formed between the front and rear wheels arranged side by side in the conveying direction of the conveyor. Has been placed.
Accordingly, the dam roll regulates the etching solution sprayed from the spray nozzle onto the plate member so that the outer surface of the plate member flows in the left-right width direction.
The liquid stopper is disposed adjacent to and above each dam roll at a position where it does not interfere with the wheel.
Accordingly, the liquid stopper restricts the etching solution from flowing back and forth beyond the dam roll.
The dam roll and the liquid stopper are provided at least on the upper side of the conveyed plate-like member.
The liquid stopper is made of a bar-like material, and is arranged apart from the dam roll.

About Claim 2, it is as follows.
The etching apparatus according to claim 2, wherein the plurality of spray nozzles arranged at least on the upper side of the conveyor according to claim 1 are spray nozzles facing a left direction and sprays facing a right direction along a conveying direction of the conveyor. The nozzles are alternately arranged.

<About the action>
Since the present invention comprises such means, the following is achieved.
(1) In the etching apparatus, an etching solution is sprayed from a spray nozzle onto a plate-like member such as a substrate material conveyed by a conveyor to perform an etching process.
(2) The jetted etching solution flows leftward or rightward through a plate-like member such as a substrate material, and then flows down and is discharged from both the left and right sides.
(3) In order to support such a flow of the etching solution, a spray nozzle inclined arrangement and a dam roll are employed.
(4) By the way, in an etching apparatus, there is a strong need for increasing the spray pressure of an etching solution in order to improve etching accuracy.
(5) However, when the spray pressure is increased, the sprayed etching solution is likely to splash above the reference water level by the dam roll due to pressure reflection, or to overflow above the reference water level due to pressure waves.
As a result, the etching solution may flow back and forth beyond the dam roll, causing variations in circuit patterns.
(6) Therefore, the etching apparatus of the present invention employs a liquid stopper and regulates such scattering, overflow and outflow of the etching liquid.
(7) Therefore, even if the spray pressure of the etching solution is increased, these are surely regulated and avoided.
(8) Therefore, for example, occurrence of variations in circuit patterns is also prevented. That is, by increasing the spray pressure, a circuit close to a rectangular cross section is formed, and by using the liquid stopper, the generation and mixing of circuits having a steeply trapezoidal cross section are avoided.
(9) The liquid stopper has a simple configuration, and the above can be easily realized. Also, it can be used without any trouble, such as narrowing the spray zone, contact with the wheel, and interference.
(10) Now, the etching apparatus of the present invention exhibits the following effects.

<< First effect >>
First, the etching accuracy is improved. That is, in the etching apparatus of the present invention, the use of the liquid stopper prevents the etching liquid from scattering or overflowing beyond the dam roll even if the spray pressure is increased. In particular, the upper surface of a plate member such as a substrate material is reliably prevented.
Accordingly, by increasing the spray pressure of the etching solution, for example, a circuit pattern close to a rectangle can be obtained uniformly. As for the circuit pattern to be formed, when the spray pressure is increased as in this type of prior art, the occurrence of variations is prevented.
Even at a high spray pressure, for example, the etching rate and etching factor are improved, the standard deviation and the in-plane distribution are improved, and the etching accuracy is greatly improved.

<< Second effect >>
Secondly, this is easily and easily achieved without any problems. That is, the liquid stopper used in the etching apparatus of the present invention has a simple structure and is excellent in cost.
Moreover, the liquid stopper is disposed adjacent to the dam roll at a position where it does not interfere with the wheel, and the first effect described above can be easily realized. At the same time, the liquid stopper is employed without any trouble, such as not narrowing the spray zone, being excellent in space, and not contacting or interfering with the conveyor wheel.
That is, this liquid stopper has an advantage that the structure is simple and easy to install and mount, and an advantage that a stable function can be exhibited because it is fixedly installed. Further, there is an advantage that no heavy load is applied to the substrate material that is becoming extremely thin and flexible, and the circuit that is being miniaturized and densified.
As described above, the effects exerted by the present invention are remarkably large, such as all the problems existing in this type of prior art are solved.

FIGS. (1) and (2) are side views of the main part of the etching apparatus according to the present invention for explaining an embodiment for carrying out the invention. (1) shows a first example, and (2) shows a second example. (3) The figure is a side view of the main part for explaining a reference example not belonging to the present invention. (4) FIG. 4 is a side view of the main part for explaining an etching apparatus according to the prior art. (1) FIG. 1 is a plan view of the main part of the first example for explaining an embodiment for carrying out the invention of an etching apparatus according to the present invention. (2) FIG. 2 is a plan view of the main part for explaining an etching apparatus according to the prior art. For the description of the etching apparatus, (1) is a schematic side view, and (2) is a schematic front view. For explanation of the electronic circuit board, FIG. 1A is an enlarged plan view. (2), (3), and (4) are enlarged cross-sectional explanatory views of the formation circuit, (2) is an ideal example, (3) is a good example, and (4) is a diagram. Here is a bad example.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.
<< Electronic circuit board D etc. >>
The substrate material B etching apparatus 6 according to the present invention is used in the manufacturing process of the electronic circuit board D. First, the electronic circuit board D as a premise and the manufacturing method thereof will be generally described with reference to FIG.
Electronic circuit boards D such as printed wiring boards have made remarkable progress in miniaturization, weight reduction, ultra-thinness, and flexibility, and electronic circuits C to be formed are remarkably miniaturized and densified.
And the board | substrate material B used by the manufacturing process is 500 mm x 400 mm or 600 mm x 500 mm size, and the thing of thickness 0.06mm-1.6mm is typical.
The formed electronic circuit C has a circuit width (bottom width) L of about 5 μm to 80 μm, a space S between circuits of about 5 μm to 80 μm, and a circuit depth (circuit height) H of about 12 μm to 35 μm. Is common.

In the present invention, the ratio H / S or H / L of the circuit depth (circuit height) H and the inter-circuit space S or the circuit width L exceeds 0.5, that is, miniaturized and densified. The circuit C pattern is typically applied.
The electronic circuit board D manufactured using the board material B is divided into a rigid rigid board type and a film-like flexible board type. In addition, the double-sided board type in which the circuit C is formed on both the front and back surfaces is representative, but the single-sided board type in which the circuit C is formed only on one side is also conceivable, and the present invention is widely applied to various types such as multilayer boards. Is possible.
As a method for manufacturing such an electronic circuit board D, a subtractive method (wet process method) (see the prior art section of the background art described above), a semi-additive method, and other various manufacturing methods are known. The invention is applied to such various manufacturing methods.
The electronic circuit board D and the like are as described above.

<Etching device 6>
Next, the etching apparatus 6 will be generally described with reference to FIG.
The etching apparatus 6 according to the present invention is used in the etching process during the manufacturing process of the electronic circuit board D. Then, an etching solution A is sprayed from the spray nozzle 2 on the substrate material B conveyed by the conveyor 4 in the chamber 7 to perform an etching process.
The conveyor 4 includes a group of upper and lower wheels 5 and horizontally conveys the substrate material B in the front and rear conveyance direction E.
The spray nozzle 2 injects an etching solution A from above and below in the illustrated example to the substrate material B that is horizontally transported in this manner, and etches the front and back and upper and lower outer surfaces of the substrate material B. The exposed copper foil portion is dissolved and removed with an etching solution A (cupric chloride, ferric chloride, or other corrosive solution).

Accordingly, a large number of spray nozzles 2 are provided above and below the front-rear transport direction E, the left-right width direction F, and the up-down direction G. As shown in the figure, the upper spray nozzles 2 are alternately inclined obliquely in the left direction and the right direction.
The inclined arrangement of the spray nozzle 2 is employed to promote the renewal of the etching liquid A sprayed onto the substrate material B, to eliminate the liquid pool, and to eliminate the stay (refer to the prior art section of the background art described above). See also the above for the spray pressure of the spray nozzle 2 (see the problem column to be solved by the invention).
After the etching process, the etching liquid A flows down to the liquid tank 8, is collected and stored, and then is circulated and supplied to the spray nozzle 2 through the pump 9, the filter, the pipe 10, and the like for reuse.
The general description of the etching apparatus 6 is as described above.

<About Dam Roll 3>
Next, the dam roll 3 will be described with reference to FIGS.
In this etching apparatus 6, the dam rolls 3 are respectively disposed at the front and rear end portions of the spray zone 11 formed between the front and rear wheels 5, that is, the spray interval space of the etching solution A.
The dam roll 3 is provided for each spray zone 11 in pairs at the front end portion and the rear end portion, and rotates in contact with the substrate material B together with the wheel 5.
The dam roll 3 is made of a straight roller having a diameter smaller than that of the wheel 5 (for example, 32 mm in diameter) (for example, 16 mm in diameter).
The dam roll 3 is disposed adjacent to the front and rear of the wheel 5 before and after the spray zone 11, but is spaced apart from the wheel 5 with a front-rear gap.

The dam roll 3 is used as front and rear partition rollers. That is, the dam roll 3 prevents the etching solution A sprayed from the spray nozzle 2 onto the substrate material B from flowing in the forward and backward transport direction E along the outer surface of the substrate material B, particularly the upper surface. The outer surface of the plate material B, particularly the upper surface, is made to flow in the left-right width direction F.
Thus, the dam roll 3 is employed to promote the renewal of the etching solution A sprayed onto the substrate material B, to eliminate the accumulation of liquid, and to eliminate the retention (see the above-mentioned background art of the background art).
And the dam roll 3 is normally employ | adopted about the upper side of the board | substrate material B conveyed as shown in the figure (The etching liquid A sprayed on the lower surface falls naturally, and falls by its own weight).
About dam roll 3, it is as above.

<About the liquid stopper 12>
Next, the liquid stopper 12 will be described with reference to FIGS. 1A, 1B, 2A, and the like.
In this etching apparatus 6, the liquid stopper 12 is disposed adjacent to the dam roll 3 and is provided at a position where it does not interfere with the wheel 5. The liquid stoppers 12 are arranged adjacent to each other with respect to the dam rolls 3 provided in pairs at the front end portion and the rear end portion of the spray zone 11 as described above. Accordingly, the liquid stopper 12 also makes a pair.
Usually, as shown in the figure, the dam roll 3 is provided on the upper side of the substrate material B to be conveyed, and the liquid stopper 12 is disposed adjacent to the dam roll 3.
Further, the liquid stoppers 12 arranged adjacent to each other on the dam roll 3 in this way are spaced apart from the wheel 5 adjacent to the dam roll 3 as described above with a front-to-back gap.

The liquid stopper 12 has a vertical dimension capable of regulating the etching solution A that may be scattered or overflowed beyond the dam roll 3, and regulates the outflow of the etching solution A beyond the dam roll 3. To do.
That is, the liquid stopper 12 restricts the etching liquid A sprayed onto the substrate material B from being scattered or overflowing beyond the dam roll 3, and the height G in the vertical direction G sufficient to exhibit such a restriction function. The size is provided. That is, it has a height dimension that is added to the height dimension of the dam roll 3.
In this manner, the liquid stopper 12 restricts the etching liquid A sprayed onto the substrate material B from flowing back and forth, so that the etching liquid A is returned to the flow in the left-right width direction F by the dam roll 3 or the like. Let

<< Liquid stopper 12 in the illustrated example >>
The liquid stopper 12 in the illustrated example is as follows.
The first example is as follows. The liquid stopper 12 of the first example shown in FIGS. 1A and 1A is made of a bar-like material, and is disposed apart from the dam roll 3.
That is, the liquid stopper 12 of the first example is composed of a bar frame installed between the left and right frames of the chamber 7 of the etching apparatus 6, and is spaced apart from the upper dam roll 3 with a slight vertical gap. The dam roll 3 is entirely covered.
The second example is as follows. As in the first example, the liquid stopper 12 of the second example shown in (2) of FIG. 1 is constructed of a bar frame between the left and right frames of the chamber 7 and is spaced apart on the upper dam roll 3. However, the side adjacent to the wheel 5 is configured not to cover the dam roll.
Since the liquid stopper 12 of the second example employs such a configuration, when the distance dimension of the front-rear gap between the dam roll 3 and the adjacent wheel 5 is set narrow, interference with the wheel 5 is reliably prevented. There are advantages. The possibility that the liquid stopper 12 positioned on the dam roll 3 interferes with the wheel 5 due to the approaching arrangement of the dam roll 3 toward the wheel 5 is reliably avoided.

Reference examples are as follows. The liquid stopper 12 of the reference example which does not belong to the present invention shown in FIG. 1 (3) is made of a straight roller and is disposed in contact with the dam roll 3.
That is, the liquid stopper 12 of this reference example is made of a straight roller similar to the dam roll 3 and is pivotally supported between the left and right frames of the chamber 7. And although it adjoins and arranges on the dam roll 3, it consists of a structure which contacted the dam roll 3 up and down, without being spaced apart like the 1st example and the 2nd example of this invention.
On the other hand, the liquid stoppers 12 of the first and second examples, that is, the liquid stopper 12 of the present invention are simpler in construction and easier to install and mount than the liquid stopper 12 of the reference example. There is an advantage that a stable function can be exhibited because it is fixedly installed.
Further, the liquid stopper 12 of the first example and the second example, that is, the liquid stopper 12 of the present invention is about the substrate material B that is becoming extremely thin and flexible, and the circuit C that is being miniaturized and densified. There is also an advantage that no weight load is applied.
The liquid stopper 12 is as described above.

《Action etc.》
The etching apparatus 6 of the present invention is configured as described above. Therefore, it becomes as follows.
(1) In the etching apparatus 6, the etching liquid A is sprayed from the spray nozzles 2 arranged in large numbers in the front, rear, left and right directions on the substrate material B transported by the conveyor 4, thereby etching the outer surface of the substrate material B (See FIG. 3).

  (2) The jetted etching liquid A flows on the outer surface of the substrate material B in the left-right width direction F, that is, the left direction or the right direction, and then flows down and is discharged from both the left and right sides of the substrate material B.

(3) In order to support the flow of the etching liquid A on the outer surface of the substrate material B, particularly the flow on the upper surface of the substrate material B, an inclined arrangement of the spray nozzle 2 (see FIG. 3 (2)), A dam roll 3 (see FIGS. 1 and 2) is employed.
That is, the spray nozzle 2 inclination and the dam roll 3 are employed on the upper surface of the substrate material B in order to prevent the accumulation and retention of the etching solution A and to renew it with a fresh etching solution A.

(4) By the way, in the etching apparatus 6, in view of miniaturization, high density, improvement in etching accuracy, etc. of the circuit C, the need for increasing the spray pressure for the etching liquid A sprayed from the spray nozzle 2 has recently increased further. Yes.
That is, in order to obtain a circuit C pattern having a good cross section close to the rectangle shown in FIG. 4 (3), the spray pressure is increased to, for example, 0.20 MPa or more, and thus a stronger spray pressure and a stronger injection impact. Therefore, the needs for etching treatment are increasing.

(5) However, when the spray pressure is increased, the etching liquid A sprayed on the upper surface of the substrate material B is likely to be scattered or overflowed beyond the dam roll 2.
If it is as it is, there exists a possibility that the etching liquid A may bounce up and scatter from the reference water level on the substrate material B formed by the dam roll 3 by pressure reflection, or may overflow from the reference water level by pressure waves. There is a risk that the amount will flow beyond the dam roll 3 in the front-rear direction E (see the solid line display of the prior art in FIG. 4).
When the etching solution A flows back and forth, the etching solution A becomes insufficient in quantity than the set amount with respect to the substrate material B in the spray target area of the spray nozzle 2. On the other hand, with respect to the substrate material B in the spray target area of the spray nozzles 2 adjacent to each other in the front and rear, the liquid pool and the stagnation are generated by the inflowing etching A.
As a result, the formed circuit C pattern varies, and the steeply trapezoidal circuit C shown in FIG. 4 (4) is generated and mixed.

(6) Therefore, the etching apparatus 6 of the present invention employs the liquid stopper 12 (see FIG. 1 (1), FIG. 2 (2), FIG. 2 (1), etc.).
When the spray pressure is increased, the liquid stopper 12 regulates the etching liquid A that has scattered or overflowed beyond the dam roll 3, thereby returning the flow to the left and right by the dam roll 3 (see FIG. 1 ( 1) Figure, (2) Refer to the solid line display in the figure).

  (7) By adopting such a liquid stopper 12, according to this etching apparatus 6, even if the spray pressure of the etching liquid A is increased, the above-described insufficient amount of the etching liquid A, liquid accumulation, stagnation, etc. occur. Is avoided.

(8) Therefore, according to the etching apparatus 6, the occurrence of variations in the circuit C pattern formed based on the etching process is prevented.
That is, by increasing the spray pressure of the etching solution A, that is, with a strong spray pressure and a stronger impact, as shown in FIG. Become.
At the same time, the use of the liquid stopper 12 avoids the generation and mixing of the circuit C pattern having a trapezoidal trapezoidal cross section shown in FIG.
As a result, only the circuit C having a rectangular cross section can be obtained uniformly.

(9) Further, the liquid stopper 12 employed in the etching apparatus 6 is made of a bar-like material and has a simple configuration (FIG. 1 (1), FIG. 2 (2), FIG. 2 (1)). (See figure etc.)
Further, the liquid stopper 12 is disposed adjacent to the dam roll 3 at a position where it does not interfere with the wheel 5 of the conveyor 4. Therefore, the spray zone 11 is not narrowed, and can be employed without any trouble, such as not contacting or interfering with the wheel 5.
The operation of the present invention is as described above.

<< About JP-A-6-320094 >>
Here, JP-A-6-320094 will be described.
(A) In the same publication, two upper and lower dam rolls 85 are shown (see FIG. 5 and the like). First, when the spray pressure is low, the fluid 35 (etching solution) sprayed onto the processing member 11 (substrate material) is maintained at a predetermined reference water level 35 ′ by the dam roll 85 made of two straight upper and lower straight rollers. Dripping (the state of FIG. 5).
On the other hand, as described above, even in the reference example that does not belong to the present invention (the example in FIG. 1 (3)), when the spray pressure is low, the dam roll 3 made of a series (one piece) of straight rollers is used. The sprayed etching solution A is maintained at the reference water level (shown by a broken line in the figure).
Regardless of whether the dam roll 85 made of straight rollers is double (2 pieces) as in the above publication, or the dam roll 3 made of straight rollers is a series (1 piece) as in the above reference example, It is the same. When the spray pressure is low, the etching solution (35, A) is both kept at the reference water level.

(B) On the other hand, when the spray pressure is increased, according to the publication, the fluid 35 (etching liquid) flows back and forth beyond the two upper dam rolls 85 (illustrated in FIG. 5). Not).
That is, the fluid 35 (etching solution) exceeds the reference water level shown in the figure formed by the two dam rolls 85 and flows back and forth beyond the upper dam roll 85 due to bounce scattering due to pressure reflection and leakage due to pressure waves. . In this publication, the upper and lower straight rollers are both dam rolls 85, and the upper straight roller is also a dam roll 85.
On the other hand, in the above reference example, when the spray pressure is increased, the etching solution A which is rebounded and leaks in this way is regulated by the liquid stopper 12 on the dam roll 3 and flows out back and forth. None (see solid line display in (3) of FIG. 1).
In the above reference example, it is understood that the upper straight roller is the liquid stopper 12 and not the dam roll 3.

(C) In the publication, as described above, it is assumed that the first fluid 35 (etching solution) flows out back and forth. Therefore, the second fluid (for example, water) next jetted next is used to rinse and remove the first fluid that has flowed out in this manner (for example, paragraph number 0014 column, 0022). Column, 0029 column, etc.).
That is, in the same publication, the liquid stopper 12 is not provided as in the above reference example or the present invention, so that the first fluid 35 (etching liquid) is allowed to flow out before and after, and the above reference is taken as a countermeasure after the outflow. Unlike the example and the present invention, the second fluid is employed.
On the other hand, in the above reference example and the present invention, the front and rear outflow itself allowed in the publication is regulated. Therefore, there is no need for post-outflow measures such as the above publication.

(D) As described above, the technical idea, premise, action, and the like are different from the above publication, the above reference example, and the present invention. The upper dam roll 85 of the same publication and the liquid stopper 12 of the reference example are different from each other in many respects in terms of configuration, function, and the like, and the reference example is unique as described above. It has configuration and functions.
As for JP-A-6-320094, it is as described above.

<< Application of the Present Invention >>
By the way, the etching apparatus 6 according to the present invention and the etching process to which the etching apparatus 6 is applied are limited to the manufacturing apparatus and manufacturing process of the electronic circuit board D described and described as the embodiments. is not.
For example, it is also used for manufacturing metal parts by etching a metal plate, for example, a metal plate manufacturing apparatus or manufacturing process.
That is, the present invention is widely applied to etching of a general plate member.

1 Etching device (conventional example)
2 Spray nozzle 3 Dam roll 4 Conveyor 5 Wheel 6 Etching device (present invention)
7 Chamber 8 Liquid tank 9 Pump 10 Pipe 11 Spray zone 12 Liquid stopper A Etching solution B Substrate material C (Electronic) circuit D Electronic circuit board E Front-back direction (transport direction)
F Left-right direction (width direction)
G Vertical direction H Circuit depth L Circuit width S Space between circuits T Top surface width

Claims (2)

An etching apparatus that performs an etching process by spraying an etching liquid from a spray nozzle onto a plate-like member conveyed by a conveyor, the etching apparatus having a dam roll and a liquid stopper,
The conveyor has a group of upper and lower wheels, and horizontally conveys the plate member,
A large number of the spray nozzles are provided around the conveyor, and at least a plurality of spray nozzles arranged above the conveyor are inclined obliquely toward the left or right direction with respect to the transport direction of the conveyor. Has been placed,
The dam roll is composed of a straight roller having a diameter smaller than that of the wheel, and is adjacent to the wheel in a pair with the front and rear end portions of the spray zone formed between the front and rear wheels arranged side by side in the conveying direction of the conveyor. Has been placed,
Therefore, the dam roll regulates the etching liquid sprayed from the spray nozzle to the plate member so that the outer surface of the plate member flows in the left-right width direction,
The liquid stopper is disposed adjacent to above each dam roll at a position where it does not interfere with the wheel,
Accordingly, the liquid stopper restricts the etching liquid from flowing back and forth beyond the dam roll,
The dam roll and the liquid stopper are provided at least on the upper side of the plate member to be conveyed,
An etching apparatus according to claim 1, wherein the liquid stopper is made of a bar-like material and is spaced apart from the dam roll.   2. The spray nozzles facing leftward and spraying rightward are alternately arranged in the plurality of spray nozzles arranged at least above the conveyor according to claim 1 along the conveying direction of the conveyor. An etching apparatus characterized by that.

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