CN101113522A - Spraying device for printed circuit board etching - Google Patents
Spraying device for printed circuit board etching Download PDFInfo
- Publication number
- CN101113522A CN101113522A CNA2006100618584A CN200610061858A CN101113522A CN 101113522 A CN101113522 A CN 101113522A CN A2006100618584 A CNA2006100618584 A CN A2006100618584A CN 200610061858 A CN200610061858 A CN 200610061858A CN 101113522 A CN101113522 A CN 101113522A
- Authority
- CN
- China
- Prior art keywords
- nozzle section
- circuit board
- printed circuit
- nozzle
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
- B05B1/205—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor characterised by the longitudinal shape of the elongated body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Abstract
The invention relates to a gunning and eroding device which is provided with a plurality of nozzles and used for the etching of printing circuit board. Each nozzle comprises two first nozzle sections, a second nozzle section and two transition nozzle sections. The two first nozzle sections are respectively positioned at two ends of the nozzles; the second nozzle section is positioned between the two first nozzles, and the two transition nozzle sections are used for connecting the first nozzle sections and the second nozzle section. The position of the second nozzle section is lower than that of the first nozzle sections, and a plurality of nozzle heads facing towards the printing circuit board are arranged on the first nozzle sections and the second nozzle section. The gunning and etching device can regulate the spraying pressure of the etching liquid by changing the structure of nozzle, so as to ensure that the flux that sprays at the center area of the printing circuit board is larger than that of at the peripheral part, thus effectively decreasing the occurrence of puddle effect and improving the etching uniformity of the printing circuit board.
Description
Technical field
The present invention relates in particular to a kind of spraying device that is used for spraying to printed circuit board (PCB) etching solution about a kind of etched device of printed circuit board (PCB) that is used for.
Background technology
Etching process is one of basic step in the printed circuit board (PCB) production process, is copper and the etching solution do not protected by resist layer on the printed circuit board base board are reacted, thus etched, finally form the process of designed lines figure.
Printed circuit board (PCB) is when carrying out etching, and etching solution is ejected into substrate surface from the spraying device of substrate top.The general employed spraying device of printed circuit board (PCB) etching comprises the many isometric linear jet pipes that are arranged in parallel and are provided with; every jet pipe is provided with a plurality of nozzles; can spray etching solution towards printed circuit board surface by nozzle; with the Etched Printed Circuit base board, the copper of not protected by resist layer on the printed circuit board base board is removed.
But, when the spraying device of use linear jet pipe carries out the printed circuit board (PCB) etching, because the spray of each nozzle is pressed consistent, can make submarginal part on the printed circuit board (PCB), outside the easier outflow plate of etching solution, and on printed circuit board (PCB) central authorities the position, than being easier to accumulate more etching solution, form in " pond ", thereby produce " pool effect ".Occurring " pool effect " in the printed circuit board (PCB) etching process can make the etching solution of printed circuit board (PCB) middle section upgrade slower, the etching liquid film that accumulates can reduce the erosion amount of stinging to circuit, the circuit etching deficiency takes place easily, and the etching solution velocity of flow of the submarginal part of printed circuit board (PCB) is fast, upgrade comparatively fast, circuit takes place easily cross erosion.Therefore, the appearance of " pool effect " finally can cause on the printed circuit board (PCB) etching inhomogeneous, makes the circuit line of printed circuit board (PCB) middle section especially easily, thereby causes short circuit.
Therefore, be necessary to provide a kind of etched spraying device of printed circuit board (PCB) that is used for,, improve the etched homogeneity of spraying device with the influence of effective minimizing " pool effect ".
Summary of the invention
Below with embodiment a kind of etched spraying device of printed circuit board (PCB) that is used for is described.
The described etched spraying device of printed circuit board (PCB) that is used for comprises many jet pipes.Every jet pipe comprises two first nozzle sections, second nozzle section and two transition nozzle sections.These two first nozzle sections lay respectively at the jet pipe two ends, and this second nozzle section is between two first nozzle sections, and these two transition nozzle sections are used to connect first nozzle section and second nozzle section.The setting of this second nozzle section position is lower than this first nozzle section.This first nozzle section and second nozzle section are provided with a plurality of shower nozzles.
The described etched spraying device of printed circuit board (PCB) that is used for comprises many jet pipes.Every jet pipe comprises two first nozzle sections, second nozzle section and two transition nozzle sections.These two first nozzle sections lay respectively at the jet pipe two ends, and this second nozzle section is between two first nozzle sections, and these two transition nozzle sections are used to connect first nozzle section and second nozzle section.This second nozzle section to the distance of printed circuit board (PCB) etched surfaces less than the distance of this first nozzle section to the printed circuit board (PCB) etched surfaces.This first nozzle section and second nozzle section are provided with a plurality of shower nozzles towards printed circuit board (PCB).
With respect to prior art, the described advantage that is used for the etched spraying device of printed circuit board (PCB) is: adjust the pressure that is sprayed onto printed circuit board (PCB) erosion surface of etching solution by changing nozzle structure, thereby adjust the amount of the etching solution that is sprayed onto printed circuit board (PCB) erosion surface, make the flow that is ejected into the printed circuit board (PCB) middle section greater than the flow that is ejected into the edge section, quicken the renewal of printed circuit board (PCB) middle section etching solution, make printed circuit board surface form the uniform etching solution of thickness, effectively reduce pool effect and take place, improve the etched homogeneity of printed circuit board (PCB).
Description of drawings
Fig. 1 is the synoptic diagram of embodiment one spraying device.
Fig. 2 is the structural representation of the jet pipe of embodiment one spraying device with respect to the printed circuit board (PCB) etched surfaces.
Fig. 3 is the synoptic diagram of embodiment two spraying devices.
Fig. 4 is the structural representation of the jet pipe of embodiment two spraying devices with respect to the printed circuit board (PCB) etched surfaces.
Embodiment
Below embodiment is illustrated a kind of etched spraying device of printed circuit board (PCB) that is used for.
See also Fig. 1 and Fig. 2, embodiment one provides is used for the etched spraying device 100 of printed circuit board (PCB), and it comprises many jet pipes 40.
These many jet pipes 40 are and are arranged in parallel.Every jet pipe 40 comprises two first nozzle sections 401, second nozzle section 402 and two transition nozzle sections 403.These two first nozzle sections 401 lay respectively at the two ends of jet pipe 40, and this second nozzle section 402 is positioned at jet pipe 40 middle bodies between two first nozzle sections 401.The setting of these second nozzle section, 402 positions is lower than this two first nozzle sections 401.These two transition nozzle sections 403 are used to connect first nozzle section 401 and second nozzle section 402.Transition nozzle section 403 and first nozzle section 401 and 402 vertical connections of second nozzle section.
This first nozzle section 401 and second nozzle section 402 are provided with a plurality of shower nozzles 45 towards printed circuit board (PCB) 30.This is located at, and a plurality of shower nozzles 45 are for equidistantly arranging on first nozzle section 401 and second nozzle section 402, and the spray orifice of this shower nozzle 45 is circular or oval.In order better to improve etched homogeneity, reduce pool effect, alternatively, the spacing of being located at a plurality of shower nozzles 45 on second nozzle section 402 is less than the spacing of being located at a plurality of shower nozzles on first nozzle section 401.
Two first nozzle sections 401 at the two ends of every jet pipe 40 are connected with catheter 48 respectively, to form the etching solution path.Etching solution enters by catheter 48 and leads in the many jet pipes 40, is sprayed out by the shower nozzle on each nozzle section 45 again.
Because jet pipe 40 pressure unanimity everywhere, and second nozzle section 402 that is positioned at middle body arrives printed circuit board (PCB) 30 etched surfaces 301 close together, therefore, the pressure that etching solution is sprayed onto printed circuit board (PCB) 30 etched surfaces 301 is bigger, the etching liquid measure that is sprayed onto printed circuit board (PCB) 30 etched surfaces 301 central authorities is also corresponding bigger, like this, renewal speed at the etching solution of etched surfaces 301 middle sections is accelerated, thereby reduce etching solution accumulating at etched surfaces 301 middle sections, the etching liquid film thickness that etched surfaces 301 middle sections and fringe region are formed is even, to strengthen etch capabilities, reduce the influence of pool effect to printed circuit board (PCB) 30 middle section circuits.In addition, owing to shower nozzle 45 spacings on second nozzle section 402 that is positioned at middle body are less, number is more, just can increase the etching liquid measure that is ejected into printed circuit board (PCB) 30 etched surfaces 301 central authorities, further quicken renewal speed at the etching solution of etched surfaces 301 middle sections, increase the pressure that is sprayed onto printed circuit board (PCB) 30 etched surfaces 301 of etching solution, the etching liquid film thickness that etched surfaces 301 middle sections and fringe region are formed is even, to strengthen etch capabilities, reduce the influence of pool effect to printed circuit board (PCB) 30 middle section circuits.
See also Fig. 3 and Fig. 4, embodiment two provides is used for the etched spraying device 200 of printed circuit board (PCB), and it comprises many jet pipes 50.
It is roughly the same with the structure that is used for the etched spraying device 100 of printed circuit board (PCB) to be used for the etched spraying device 200 of printed circuit board (PCB).
These many jet pipes 50 are and are arranged in parallel.Every jet pipe 50 comprises two first nozzle sections 501, second nozzle section 502 and two transition nozzle sections 503.These two first nozzle sections 501 lay respectively at the two ends of jet pipe 50, and this second nozzle section 502 is positioned at jet pipe 50 middle bodies between two first nozzle sections 501.The setting of these second nozzle section, 502 positions is lower than this two first nozzle sections 501.These two transition nozzle sections 503 are used to connect first nozzle section 501 and second nozzle section 502.
Compare with first embodiment, difference is that this transition nozzle section 503 is being connected with second nozzle section 502 with first nozzle section 501 of inclination, the angle of the transition nozzle section 503 and first nozzle section 501 and second nozzle section, 502 extended lines is an acute angle, and the angle of angle can be 45～60 degree.In addition, also can further be provided with a plurality of shower nozzles 55 towards printed circuit board (PCB) 30 on this transition nozzle section 503, these a plurality of shower nozzles 55 reduce to the end near second nozzle section 502 from the end near first nozzle section 501 gradually to the distance of printed circuit board (PCB) 30 etched surfaces 301.
Two first nozzle sections 501 at the two ends of every jet pipe 50 are connected with catheter 58 respectively, to form the etching solution path.Etching solution enters by catheter 58 and leads in the many jet pipes 50, is sprayed out by the shower nozzle on each nozzle section 55 again.
Spraying device 200 is when being used for printed circuit board (PCB) 30 etchings, and the orientation of these many jet pipes 50 is consistent with the direct of travel A of printed circuit board (PCB) 30, and these two first nozzle sections 501 are far away to the distance of printed circuit board (PCB) 30 etched surfaces 301.Preferably, these two first nozzle sections 501 can equate with the distance of printed circuit board (PCB) 30 etched surfaces 301.This second nozzle section 502 its to printed circuit board (PCB) 30 etched surfaces 301 close together, and less than the distance of this first nozzle section 501 to printed circuit board (PCB) 30 etched surfaces 301.Second nozzle section 502 is about first nozzle section 501 to 30%～50% of the distance of printed circuit board (PCB) 30 etched surfaces 301 to printed circuit board (PCB) 30 etched surfaces 301 distance.
The advantage of above-mentioned spraying device is: the seal that is sprayed onto of adjusting etching solution by changing nozzle structure The pressure on printed circuit board erosion surface, thus the amount that is sprayed onto the surperficial etching solution of printed circuit board (PCB) erosion adjusted, Make the flow that is ejected into the printed circuit board (PCB) middle section greater than the flow that is ejected into the marginal portion, accelerate printing The renewal of circuit board middle section etching solution makes printed circuit board surface form the etching solution of even thickness, Effectively reduce pool effect and take place, improve the etched uniformity of printed circuit board (PCB).
Claims (15)
1. one kind is used for the etched spraying device of printed circuit board (PCB), comprise many jet pipes, it is characterized in that, every jet pipe comprises two first nozzle sections, second nozzle section and two transition nozzle sections, these two first nozzle sections lay respectively at the two ends of jet pipe, this second nozzle section is between two first nozzle sections, the setting of its position is lower than this first nozzle section, these two transition nozzle sections are used to connect first nozzle section and second nozzle section, and this first nozzle section and second nozzle section are provided with a plurality of shower nozzles.
2. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 1 is characterized in that described transition nozzle section is vertical with second nozzle section with first nozzle section respectively.
3. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 1 is characterized in that, described transition nozzle section is an acute angle with the angle of first nozzle section and the second nozzle section extended line respectively.
4. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 3 is characterized in that, the angle of the described transition nozzle section and first nozzle section and the second nozzle section extended line is 45～60 degree.
5. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 4 is characterized in that described transition nozzle section is provided with a plurality of shower nozzles.
6. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 1 is characterized in that, describedly is located on first nozzle section and second nozzle section a plurality of shower nozzles for equidistantly arranging.
7. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 1 is characterized in that, the described spacing of a plurality of shower nozzles on second nozzle section of being located at is less than the spacing of being located at a plurality of shower nozzles on first nozzle section.
8. one kind is used for the etched spraying device of printed circuit board (PCB), comprise many jet pipes, it is characterized in that, every jet pipe comprises two first nozzle sections, one second nozzle section and two transition nozzle sections, these two first nozzle sections lay respectively at the two ends of jet pipe, this second nozzle section is between two first nozzle sections, these two transition nozzle sections are used to connect first nozzle section and second nozzle section, less than the distance of this first nozzle section to the printed circuit board (PCB) etched surfaces, this first nozzle section and second nozzle section are provided with a plurality of shower nozzles towards printed circuit board (PCB) to this second nozzle section to the distance of printed circuit board (PCB) etched surfaces.
9. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 8 is characterized in that, described two first nozzle sections equate to the distance of printed circuit board (PCB) etched surfaces.
10. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 8 is characterized in that, described second nozzle section is described first nozzle section to 30%～50% of the distance of printed circuit board (PCB) etched surfaces to the distance of printed circuit board (PCB) etched surfaces.
11. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 8 is characterized in that described many jet pipes are arranged in parallel, its orientation is consistent with the direct of travel of printed circuit board (PCB).
12. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 8 is characterized in that described transition nozzle section is vertical with second nozzle section with first nozzle section respectively.
13. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 8 is characterized in that, described transition nozzle section is an acute angle with the angle of first nozzle section and the second nozzle section extended line respectively.
14. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 13 is characterized in that, the angle of the described transition nozzle section and first nozzle section and the second nozzle section extended line is 45～60 degree.
15. the etched spraying device of printed circuit board (PCB) that is used for as claimed in claim 13 is characterized in that described transition nozzle section is provided with a plurality of shower nozzles.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100618584A CN101113522A (en) | 2006-07-28 | 2006-07-28 | Spraying device for printed circuit board etching |
| US11/610,642 US7758716B2 (en) | 2006-07-28 | 2006-12-14 | Apparatus for spraying etchant solution onto preformed printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100618584A CN101113522A (en) | 2006-07-28 | 2006-07-28 | Spraying device for printed circuit board etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101113522A true CN101113522A (en) | 2008-01-30 |
Family
ID=39022045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100618584A Pending CN101113522A (en) | 2006-07-28 | 2006-07-28 | Spraying device for printed circuit board etching |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7758716B2 (en) |
| CN (1) | CN101113522A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102256447A (en) * | 2010-05-20 | 2011-11-23 | 富葵精密组件(深圳)有限公司 | Etching device and circuit board etching method |
| CN102560494A (en) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| CN105986269A (en) * | 2014-11-14 | 2016-10-05 | 新光电气工业株式会社 | Etching apparatus |
| CN117320298A (en) * | 2023-11-28 | 2023-12-29 | 圆周率半导体(南通)有限公司 | Etching equipment and method for improving PCB (printed circuit board) lotion exchange effect |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010013909A1 (en) * | 2010-04-01 | 2011-10-06 | Lp Vermarktungs Gmbh & Co. Kg | Apparatus and method for spraying a surface of a substrate |
| GB201102614D0 (en) * | 2011-02-15 | 2011-03-30 | Oxford Instr Nanotechnology Tools Ltd | Material identification using multiple images |
| CN103909105B (en) * | 2014-03-28 | 2016-10-05 | 宝山钢铁股份有限公司 | The inner wall of metal tube mixing jet descaling device of one axially eccentric arrangement |
| CN105195381A (en) * | 2015-10-28 | 2015-12-30 | 深圳市华星光电技术有限公司 | Spray apparatus and method thereof |
| SE543267C2 (en) * | 2019-03-14 | 2020-11-10 | Camfil Ab | Aerosol distribution in filter testing systems |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4174261A (en) | 1976-07-16 | 1979-11-13 | Pellegrino Peter P | Apparatus for electroplating, deplating or etching |
| US4227938A (en) * | 1978-06-13 | 1980-10-14 | Country Pride Foods Ltd. | Method of washing egg incubating and/or hatching trays and buggies therefor |
| US4231806A (en) * | 1978-08-25 | 1980-11-04 | Caterpillar Tractor Co. | Fluid barrier means for parts washer apparatus |
| US4221228A (en) * | 1978-09-15 | 1980-09-09 | Advanced Curing Systems, Inc. | Piece part washer |
| JPH0290600A (en) | 1988-09-28 | 1990-03-30 | Hitachi Ltd | Printed board surface treating device |
| US4997000A (en) * | 1989-11-29 | 1991-03-05 | Feast Vance C | Wetsuit washing and drying assembly and method |
| US5205307A (en) * | 1992-02-28 | 1993-04-27 | American Polychemical Manufacturing Corp. | System for cleaning contaminants from parts |
| US5782252A (en) * | 1994-06-30 | 1998-07-21 | The Mart Corporation | Parts washer |
| US5638843A (en) * | 1995-10-30 | 1997-06-17 | Strickland; Johnnie | Portable collapsible car wash shower |
| US5759289A (en) * | 1996-11-01 | 1998-06-02 | Steris Corporation | Central header for liquid cleaning units |
-
2006
- 2006-07-28 CN CNA2006100618584A patent/CN101113522A/en active Pending
- 2006-12-14 US US11/610,642 patent/US7758716B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102256447A (en) * | 2010-05-20 | 2011-11-23 | 富葵精密组件(深圳)有限公司 | Etching device and circuit board etching method |
| CN102256447B (en) * | 2010-05-20 | 2013-08-07 | 富葵精密组件(深圳)有限公司 | Etching device and circuit board etching method |
| CN102560494A (en) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Etching device and etching method |
| CN105986269A (en) * | 2014-11-14 | 2016-10-05 | 新光电气工业株式会社 | Etching apparatus |
| CN117320298A (en) * | 2023-11-28 | 2023-12-29 | 圆周率半导体(南通)有限公司 | Etching equipment and method for improving PCB (printed circuit board) lotion exchange effect |
| CN117320298B (en) * | 2023-11-28 | 2024-04-12 | 圆周率半导体(南通)有限公司 | Etching equipment and method for improving PCB (printed circuit board) lotion exchange effect |
Also Published As
| Publication number | Publication date |
|---|---|
| US7758716B2 (en) | 2010-07-20 |
| US20080029219A1 (en) | 2008-02-07 |
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