TWI404473B - Apparatus for spraying etchant - Google Patents

Abstract

An apparatus for spraying etchant to a printed circuit board includes a plurality of spraying tubes, a plurality of first connecting pipes, a plurality of spraying members, a plurality of suction members and a plurality of second connecting pipes. Each of the spraying tubes is connected with a plurality of first connecting pipes. An end of each of the first connecting pipes is in connected with a spraying member, which is arranged far away from the spraying tube. The plurality of spraying members are adapted for spraying etchant to a surface of the printed circuit board. The plurality of suction members are in one-to-one correspondence with the plurality of spraying members. Each of the second connecting pipes is between one of the first connecting pipes and one of the suction members. The plurality of suction members is closed to the surface of the printed circuit board. The first connecting pipe is configured for producing a negative pressure at the joint between the first connecting pipe and the second connecting pipe when the spraying member is spraying etchant, thereby unwanted etchant is suctioned off from the surface of the printed circuit board.

Description

Erosion device

The present invention relates to an erosion device, and more particularly to an erosion device for etching a circuit board.

Printed Circuit Board (PCB) is widely used as a carrier for various electronic components in various electronic products.

The etch process is a basic step in the production process of the printed circuit board. The copper on the printed circuit board circuit board that is not protected by the resist layer reacts with the etchant to be etched away, and finally forms a process for designing the circuit pattern. Wet process lines are widely used in PCB production due to their high degree of automation and low cost. The process uses a roller to drive the circuit board, and the nozzle on the nozzle array is used to simultaneously spray the etching liquid on the lower surface of the circuit board, and each nozzle can be mounted with a plurality of nozzles. However, when the printed circuit board is etched by using the etching device of the linear nozzle, since the spray pressure of each nozzle is uniform, the portion of the printed circuit board near the edge, the etching liquid is more likely to flow out of the board, and is printed. At the center of the board, it is easy to accumulate more etchant to form a "pool", resulting in a "pool effect." The "pool effect" in the printed circuit board etching process will make the etching liquid in the central area of the printed circuit board renew slowly. The accumulated etching liquid film will reduce the amount of bite on the line, and the line etching will be insufficient. The etchant on the printed circuit board near the edge has a fast flow rate, a fast update, and is prone to line over-etching. Therefore, the appearance of the "pool effect" will eventually lead to uneven etching on the printed circuit board, and it is particularly easy to connect the lines in the central area of the printed circuit board, thereby causing a short circuit.

The above only uses the circuit board as an example to illustrate the pool effect. However, as long as the substrate is placed on the level, there is a pool effect.

In view of the above, it is necessary to provide an etching apparatus which can overcome the pool effect, thereby improving the etching uniformity and thereby improving the etching precision of the horizontal plate.

An etching device for spraying an etchant to etch a circuit board. The blasting device comprises a plurality of nozzles, a plurality of first connecting tubes and a plurality of nozzles. Each nozzle is connected to a plurality of first connecting tubes. Each of the first connecting tubes is connected to a nozzle at one end of the nozzle. The plurality of showerheads are used to eject an etchant onto the surface of the board. The blasting device further includes a plurality of nozzles corresponding to the plurality of nozzles, and a plurality of nozzles connected to a plurality of first connecting tubes and a nozzle. The plurality of nozzles are adjacent to the surface of the circuit board. The first connecting tube is configured to generate a negative pressure at a connection between the first connecting tube and the second connecting tube when the nozzle ejects the etching liquid, so that the nozzle sucks excess etching liquid on the surface of the circuit board.

The blasting device provided by the technical solution has a plurality of nozzles corresponding to the plurality of nozzles, and adopts a special first connecting tube, so that the first connecting tube generates a negative pressure while the nozzle ejects the etching liquid, and the nozzle can be utilized. This negative pressure draws excess etchant. The etching of the circuit board by using the etching device provided by the technical solution can overcome the pool effect, improve the etching uniformity, and improve the utilization rate of the etching liquid.

The etching device provided by the technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 and FIG. 2 together, an embodiment of the technical solution provides an etching apparatus 10 for spraying an etching solution to etch a circuit board. The etching apparatus 10 includes a conveying member 11, an etching liquid ejecting member 12, an etching liquid suction member 13, and a connecting member 14.

The transport element 11 is used to transport a circuit board on which the level is placed. In this embodiment, the conveying element 11 includes a plurality of conveying shafts 110 and a plurality of rollers 111 sleeved on the conveying shaft 110. The central axis of the plurality of transfer shafts 110 is perpendicular to the direction of transport of the circuit board. The plurality of transfer shafts 110 can be mechanically coupled to the same drive by gears or belts to be synchronously rotated by the drive. Each of the transfer shafts 110 corresponds to a plurality of rollers 111. The plurality of rollers 111 are used to be in contact with the circuit board to roll the transfer circuit board as the transfer shaft 110 rotates.

The etchant ejecting member 12 is disposed opposite to the circuit board. The etching liquid ejecting element 12 includes a plurality of nozzles 120 and a plurality of nozzles 121, and each of the nozzles 120 can correspond to the plurality of nozzles 121. The nozzle 120 is used to supply an etchant to the showerhead 121. In this embodiment, the plurality of nozzles 120 are disposed perpendicular to the conveying direction of the circuit board. Of course, the plurality of nozzles 120 can also be disposed parallel to the conveying direction of the circuit board. The showerhead 121 is configured to eject an etchant to the circuit board, and includes an opposite end portion 122 and a discharge end portion 123. The joint end 122 is connected to the connecting element 14. The ejection end portion 123 is opposite to the surface of the circuit board, and has a cross-sectional area larger than a cross-sectional area of the bonding end portion 122. The discharge end portion 123 has an orifice opposite the conveying member 11. The etching liquid ejected from the ejection end portion 123 may be fan-shaped or tapered as viewed from the side. In this embodiment, the plurality of nozzles 121 are arranged at equal intervals in the extending direction of the nozzle 120.

The etchant suction element 13 is also disposed opposite the transfer element 11. The etchant suction member 13 includes a plurality of nozzles 130, and the plurality of nozzles 130 are in one-to-one correspondence with the plurality of nozzles 121. Preferably, each of the nozzles 130 is located on one side of the corresponding nozzle head 121 near the center of the surface of the circuit board due to the relatively easy accumulation of etchant at the center of the surface of the board. The nozzle 130 is configured to absorb excess etching liquid on the surface of the circuit board. The distance between the nozzle 130 and the surface of the circuit board is 0.3 mm - 0.6 mm, so that damage to the surface of the circuit board can be avoided. The nozzle 130 includes a body portion 131 and a suction portion 132 that are connected to each other, wherein the body portion 131 is coupled to the connecting member 14. The suction portion 132 is adjacent to the conveying member 11. The cross-sectional area of the suction portion 132 is smaller than the cross-sectional area of the main body portion 131. In this embodiment, the main body portion 131 is cylindrical. The suction portion 132 has a truncated cone shape, and its straight passage gradually decreases from the main body portion 131 toward the main body portion 131. Of course, the nozzle 130 can also be cylindrical, duckbill or other shape that facilitates suction. The distance between the nozzle 130 and the conveying element 11 can be adjusted to accommodate different thicknesses of the circuit board. Preferably, the suction portion 132 is made of a soft material such as a rubber material. In this way, damage to the surface of the board can be further avoided.

The connecting component 14 is configured to transport an etchant to the showerhead 121, and generate a negative pressure when the ejector liquid 121 ejects the etchant, so that the nozzle 130 absorbs excess etchant on the surface of the circuit board. The connecting element 14 comprises a plurality of connecting tubes 140. Each connecting pipe 140 includes a first connecting pipe 141 and a second connecting pipe 142 that are connected.

The first connecting pipe 141 is connected between the nozzle 120 and the head 121. In this embodiment, the first connecting pipe 141 is vertically connected to the nozzle 120. . The first connecting pipe 141 may be a venturi, and includes a first pipe section 143, a second pipe section 144 and a third pipe section 145 which are sequentially connected. The inner diameter of the first pipe section 143 gradually decreases from the second pipe section 144 toward the second pipe section 144. The second pipe section 144 is a hollow cylindrical shape having a constant inner diameter. The inner diameter of the third pipe section 145 gradually increases from the second pipe section 144 toward the second pipe section 144. When an etchant flows through the first tube section 143, the second tube section 144 and the third tube section 145 of the first connecting tube 141 in sequence, the flow rate increases at the second tube section 144 having a smaller inner diameter due to the constant flow rate of the etching liquid, thereby A negative pressure is generated. The end of the first pipe section 143 away from the second pipe section 144 is connected to the nozzle 120. The end of the third pipe section 145 away from the first pipe section 143 is connected to the spray head 121.

The second connecting pipe 142 is connected between the first connecting pipe 141 and the suction nozzle 130. Each of the second connecting tubes 142 is connected to one side of the first connecting tube 141 near the center of the surface of the circuit board to ensure that the suction nozzle 130 is located near the center of the surface of the circuit board. In this embodiment, the plurality of second connecting tubes 142 corresponding to the same nozzle 120 are disposed in the same direction. The second connecting pipe 142 includes a fourth pipe section 146 and a fifth pipe section 147. The fourth pipe section 146 is connected between the second pipe section 142 and the fifth pipe section 147 , and the fifth pipe section 147 is connected between the suction nozzle 130 and the fourth pipe section 146 . The central axis of the fourth pipe section 146 intersects the central axis of the second pipe section 142 and also intersects the central axis of the fifth pipe section 147. In this embodiment, the central axis of the fourth pipe section 146 intersects perpendicularly with the central axis of the second pipe section 142 and perpendicularly intersects the central axis of the fifth pipe section 147 such that the second pipe section 142 is parallel to the fifth pipe section 147. When the etchant flows through the showerhead 121, a negative pressure is generated at the second pipe section 144, so that The suction portion 132 of the suction nozzle 130 can suck the etching liquid in the vicinity thereof.

Of course, the first connecting pipe 141 may also include only the first pipe section 143 and the third pipe section 145 that are connected. The inner diameter of the first pipe section 143 gradually decreases from the third pipe section 145 toward the third pipe section 145, and the inner diameter of the third pipe section 145 gradually increases from the first pipe section 143 toward the first pipe section 143. Big. Correspondingly, the fourth pipe segment 146 of the second connecting pipe 142 is connected to the connection between the first pipe segment 143 and the third pipe segment 145. Thus, the first connecting pipe 141 can also generate a negative pressure when the nozzle 121 sprays the etching liquid. Thereby, the nozzle 130 absorbs excess etching liquid on the surface of the circuit board.

It can be understood that the connecting tube 140 located at the center of the surface of the circuit board can include a first connecting tube 141 and a plurality of second connecting tubes 142. The plurality of second connecting tubes 142 may be disposed in a plurality of different directions around the first connecting tube 141. The nozzles 130 can also be correspondingly increased according to the number of the second connecting tubes 142, so that the etchant distribution throughout the center of the surface of the board can be more uniform.

Referring to Figures 1 and 3 together, a circuit board 100 having a surface 101 to be etched is provided. When the circuit board 100 is etched by using the above-described etching device 10, the surface 101 is lifted upward, and the circuit board 100 is transferred by the friction between the roller 111 of the transmitting member 11 and the circuit board 100 to make the surface 101 is opposed to the etching liquid ejecting member 12. The etching liquid reaches the shower head 121 through the nozzle 120, and is ejected from the ejection end portion 123 through the joint end portion 122. When the etchant passes through the bonding end portion 122, a negative pressure is generated at the second tube segment 144 of the first connecting tube 141, so that the suction portion 132 of the nozzle 130 can absorb the etching liquid in the vicinity thereof. It can be understood that if for some reason, no etchant flows through a certain nozzle 121, no When the etching liquid is ejected, since the negative pressure is not generated at the second pipe section 144, the suction nozzle 130 corresponding to the shower head 121 cannot be sucked, so that the surface of the circuit board 101 can be sufficiently etched. In addition, since the distance between the nozzle 130 and the surface of the board is 0.3 mm to 0.6 mm, it is ensured that the surface of the board is not damaged. The etching liquid sucked by the suction nozzle 130 can be ejected again by the head 121, so that the reuse of the etching liquid can be achieved. In this way, not only the pool effect can be overcome, the etching uniformity can be improved, and the utilization rate of the etching liquid can be improved.

The etching device 10 provided by the technical solution has a plurality of nozzles 130 corresponding to the plurality of nozzles 121, and a special first connecting tube 141 is adopted, so that the first connecting tube 141 generates a negative while the nozzle 121 ejects the etching liquid. Pressure, the nozzle 130 can use the negative pressure to absorb excess etching liquid. The etching of the circuit board by using the etching device 10 provided by the technical solution can overcome the pool effect, improve the etching uniformity, and improve the utilization rate of the etching liquid.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Abrasion device

12‧‧‧etching liquid ejection element

14‧‧‧Connecting components

111‧‧‧Roller

121‧‧‧Spray

123‧‧‧Spray end

131‧‧‧ Main body

140‧‧‧Connecting tube

142‧‧‧Second connection tube

144‧‧‧Second section

146‧‧‧fourth pipe section

100‧‧‧ boards

11‧‧‧Transmission components

13‧‧‧etching fluid extraction components

110‧‧‧Transport axis

120‧‧‧ nozzle

122‧‧‧Bound end

130‧‧ ‧ nozzle

132‧‧‧Drawing Department

141‧‧‧First connecting pipe

143‧‧‧First pipe section

145‧‧‧ third pipe section

147‧‧‧ fifth pipe section

101‧‧‧ surface

FIG. 1 is a schematic structural view of an erosion device provided by an embodiment of the present technical solution.

FIG. 2 is a schematic structural view of another perspective view of the etching apparatus provided by the embodiment of the present technical solution.

3 is a circuit board provided by using the etching device provided by the embodiment of the technical solution. Schematic diagram of row etching.

10‧‧‧Abrasion device

12‧‧‧etching liquid ejection element

14‧‧‧Connecting components

111‧‧‧Roller

121‧‧‧Spray

140‧‧‧Connecting tube

142‧‧‧Second connection tube

11‧‧‧Transmission components

13‧‧‧etching fluid extraction components

110‧‧‧Transport axis

120‧‧‧ nozzle

130‧‧ ‧ nozzle

141‧‧‧First connecting pipe

Claims (9)

An blasting device for spraying an etchant to etch a circuit board, the blasting device comprising a plurality of nozzles, a plurality of first connecting tubes and a plurality of nozzles, each nozzle being connected to the plurality of first connecting tubes, each A first connecting tube is connected to a nozzle at one end of the nozzle, and the plurality of nozzles are configured to eject an etchant liquid to the surface of the circuit board, wherein the blasting device further comprises a plurality of nozzles corresponding to the plurality of nozzles a second connecting pipe connected between the first connecting pipe and the suction nozzle, wherein the first connecting pipe includes a first pipe segment, a second pipe segment and a third pipe segment connected in sequence, the first pipe The inner diameter of a pipe section gradually decreases from the second pipe section toward the second pipe section, the inner diameter of the second pipe section is constant, and the inner diameter of the third pipe section gradually decreases from the second pipe section toward the second pipe section. Incidentally, the second connecting pipe is connected to the second pipe segment of the first connecting pipe, the plurality of nozzles are close to the surface of the circuit board, and the first connecting pipe is used for the first connecting pipe when the nozzle sprays the etching liquid With the second connecting tube Then at a negative pressure, so that the suction nozzle of the excess etchant surface of the board. The eroding device of claim 1, wherein the second connecting pipe comprises a fourth pipe segment and a fifth pipe segment, and the fourth pipe segment is connected between the second pipe segment and the fifth pipe segment, The fifth pipe segment is connected between the suction nozzle and the fourth pipe segment, and the central axis of the fourth pipe segment intersects with the central axis of the second pipe segment and also intersects the central axis of the fifth pipe segment. The eroding device according to claim 1, wherein the distance between the nozzle and the surface of the circuit board is 0.3 mm to 0.6 mm. The eroding device according to claim 1, wherein the suction nozzle includes a body portion and a suction portion that are connected to each other, and the body portion is connected to the first a connecting tube, the suction portion is close to the surface of the circuit board, and a cross-sectional area of the suction portion is smaller than a cross-sectional area of the main body portion. The blasting apparatus of claim 4, wherein the material of the suction portion is rubber. The blasting apparatus according to claim 1, wherein the spray head includes an opposite joint end and a discharge end, and the joint end is connected to the second joint pipe, and the spray end is The cross-sectional area is larger than the cross-sectional area of the bonding end, and the ejection end has an orifice opposite the surface of the circuit board to eject the etching liquid. The eroding device of claim 1, further comprising a conveying member, the conveying member comprising a plurality of conveying shafts and a plurality of rollers sleeved on the conveying shaft, the plurality of rollers being used for the circuit board Contacting to roll the transfer circuit board as the transfer shaft rotates, the center axis of the plurality of transfer shafts being perpendicular to the transfer direction of the circuit board. The eroding device of claim 7, wherein the central axis of the plurality of nozzles is parallel or perpendicular to the conveying direction of the circuit board. An blasting device for spraying an etchant to etch a circuit board, the blasting device comprising a plurality of nozzles, a plurality of first connecting tubes and a plurality of nozzles, each nozzle being connected to the plurality of first connecting tubes, each A first connecting tube is connected to a nozzle at one end of the nozzle, and the plurality of nozzles are configured to eject an etchant liquid to the surface of the circuit board, wherein the blasting device further comprises a plurality of nozzles corresponding to the plurality of nozzles a second connecting pipe connected between the first connecting pipe and the suction nozzle, wherein the first connecting pipe comprises a first pipe segment and a third pipe segment connected, and the inner diameter of the first pipe segment is Gradually decreasing away from the third pipe segment toward the third pipe segment, the inner diameter of the third pipe segment gradually increasing from the first pipe segment toward the first pipe segment, the plural The nozzle is adjacent to the surface of the circuit board, and the first connecting tube is configured to generate a negative pressure at the junction of the first connecting tube and the second connecting tube when the nozzle discharges the etching liquid, so that the nozzle absorbs excess etching on the surface of the circuit board. liquid.