CN203355935U - Two-fluid spray pipe component and two-fluid etching device using two-fluid nozzle component - Google Patents
Two-fluid spray pipe component and two-fluid etching device using two-fluid nozzle component Download PDFInfo
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- CN203355935U CN203355935U CN201320425911XU CN201320425911U CN203355935U CN 203355935 U CN203355935 U CN 203355935U CN 201320425911X U CN201320425911X U CN 201320425911XU CN 201320425911 U CN201320425911 U CN 201320425911U CN 203355935 U CN203355935 U CN 203355935U
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Abstract
The utility model relates to the technical field of cleaning and etching process equipment, and discloses a two-fluid spray pipe component and a two-fluid etching device using the two-fluid nozzle component, wherein the two-fluid nozzle component comprises an air inlet pipe and a spray pipe, the air inlet pipe is used to convey compressed air, the spray pipe is used to convey liquid medicine and is arranged parallel to the air inlet pipe, a plurality of nozzles which are used to mix the compressed air and the liquid medicine to form two fluids and spray are arranged on the spray pipe at intervals, and the nozzles and the air inlet pipe are communicated through air ducts. The two-fluid spray pipe component and the two-fluid etching device using the two-fluid nozzle component mix the compressed air and the liquid medicine to form the two fluids and spray and etch substrates based on spraying of the liquid medicine, thereby improving micronization degree of liquid medicine spraying, increasing etching factors of lines, improving etching ability to the substrates, and further improving process capability for making precision lines of the substrates.
Description
Technical field
The utility model relates to the technical field of cleaning, etch process equipment, relates in particular to a kind of compressed air to be sneaked into to the two fluid Etaching devices that liquid generates micronized two fluids and substrate is carried out two fluid nozzle components of spray etching and uses this assembly.
Background technology
Semiconductor device or display unit are by using semiconductor wafer or flat-panel monitor, through evaporation, etching.The multiple manufacturing process such as photoetching, Implantation and manufacturing.
Etching (etching) is by materials'use chemical reaction or physical shock effect and the technology removed.Etching technique can be divided into wet etching (wet etching) and dry ecthing (dry etching) two classes.Usually the indication etching also claims photochemical etching (photochemical etching); after referring to make a plate, to develop by exposure, diaphragm removal that will etching area contacts chemical solution when etching; reach the effect of dissolved corrosion, form effect concavo-convex or the hollow out moulding.
Usually, etching machine spray is larger at on-chip etching drop, and lateral erosion is more serious, and lateral erosion can have a strong impact on the precision of printed conductor on substrate, serious lateral erosion will make to make meticulous printed circuit board become impossible.When lateral erosion reduces, etching coefficient just raises, and high etching coefficient means that the ability that keeps thin wire is arranged, and makes the wire after etching approach former figure size.
The etched part of traditional etching machine only has the spray structure of spray liquid liquid medicine, and the nozzle in this structure makes the smallest particles of liquid particle, can only reach average grain diameter 50um, and this diameter of particle is obviously bigger than normal; When on-chip circuit distance between centers of tracks is less than 50um(2.0mil) time, existing spray liquid medicine particle is difficult to the root of circuit is carried out to etching, can cause like this circuit side etching quantity larger, reduces the etching factor of circuit.Along with pcb board is made to " height ", " essence ", " point " future development, traditional etching machine can not meet the production that high-quality requires.
The utility model content
The purpose of this utility model is to provide a kind of compressed air is sneaked into to the two fluid Etaching devices that liquid generates micronized two fluids and substrate is carried out two fluid nozzle components of spray etching and uses this assembly; be intended to solve Etaching device in prior art substrate is carried out to the liquid spray etching; exist drop micronize degree inadequate; so that bigger than normal to substrate circuit side etching quantity, cause substrate circuit precision defect on the low side.
The utility model is to realize like this, a kind of two fluid nozzle components, comprise for delivery of compressed-air actuated air inlet pipe, and for delivery of liquid and the jet pipe that is set up in parallel with described air inlet pipe, be interval with a plurality of nozzles that form two fluids and spray for mixing described compressed air and described liquid on described jet pipe, described nozzle is communicated with by wireway with described air inlet pipe.
Further, described nozzle comprises the body of hollow, and the shower nozzle that is arranged on described body one end, and the other end of described body is provided with the air inlet be communicated with described wireway, one side of described body is provided with the inlet be communicated with described jet pipe, and described shower nozzle is provided with mouth spray.
Further, be provided with the mixing groove in described body, the two ends of described mixing groove are communicated with described air inlet and mouth spray respectively, and the side direction of described mixing groove is communicated with described inlet.
Further, the outer wall of described air inlet pipe is extended with the probe of connection, and described probe is communicated with an end of described wireway by adaptor, and the other end of described wireway is communicated with the air inlet of described nozzle by described adaptor.
Further, described adaptor comprises the right angle adapter of hollow, and the upper shield of being located at adapter outer end, described right angle.
A kind of two fluid Etaching devices, comprise fuselage, be located at described back for transmitting the conveying roller of substrate, with the two fluid nozzle components that are transmitted the corresponding setting of substrate, and the provisioning component that is communicated with described nozzle component.
Further, the upside of described conveying roller, downside or upper and lower sides are provided with described two fluid nozzle components.
Compared with prior art; the two fluid nozzle components that the utility model proposes and the two fluid Etaching devices that use this assembly; by two fluid nozzle components, compressed air and liquid are mixed to form to two fluids on the basis of liquid spray substrate is carried out to spray etching; improved the micronize degree of spray droplet; improved the etching factor of circuit; improve the etch capabilities to substrate, and then promoted the process capability of substrate being made to accurate circuit.
The accompanying drawing explanation
The schematic cross-section of the two fluid Etaching devices that Fig. 1 provides for the utility model embodiment;
The schematic top plan view that Fig. 2 is two fluid Etaching devices shown in Fig. 1;
The schematic cross-section of nozzle component in the two fluid Etaching devices that Fig. 3 provides for the utility model embodiment;
The schematic diagram of nozzle section in the two fluid Etaching devices that Fig. 4 provides for the utility model embodiment.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Below in conjunction with concrete accompanying drawing, realization of the present utility model is described in detail.
As shown in Fig. 1～4, the preferred embodiment provided for the utility model.
The etched part of tradition etching machine only has the spray structure of spray liquid, the two fluid nozzle components that the present embodiment proposes and the two fluid Etaching devices that use this assembly are by two fluid nozzle components, compressed air and liquid to be mixed to form to two fluids that particle diameter is small substrate is carried out to spray etching on the basis of liquid spray.
In the present embodiment, two fluid Etaching devices comprise fuselage 1, the top of fuselage 1 is workspace 2, in workspace, 2 middle part is provided with conveying roller 3, conveying roller 3 waits to spray etched substrate 4 for transmitting, facing the upper of substrate 4, downside is provided with many groups two fluid nozzle components 5, this two fluids nozzle component 5 is connected with the provisioning component of supply compressed air and etching liquid, wherein, two fluid nozzle components 5 comprise be arranged near fuselage 1 sidewall for transmitting compressed-air actuated air inlet pipe 51, be set up in parallel the jet pipe 52 that is useful on the transmission liquid in air inlet pipe 51 1 sides, be interval with a plurality of nozzles 53 on jet pipe 52, and, nozzle 53 is communicated with by wireway 54 with air inlet pipe 51, the effect of nozzle 53 is that mixing compressed air and liquid form two fluids and spray this two fluid.
Above-mentioned substrate 4 is after through existing etching machine etching, circuit above substrate 4 is shaped substantially, but circuit etching is complete not, root at circuit has more residual materials simultaneously, and existing etching is larger because of the drop particle of spray liquid, to the root etch capabilities of the circuit below the 50um distance between centers of tracks a little less than.
Utilize two fluid nozzle components in the present embodiment to carry out further spray etching to substrate, there is following characteristics:
By two fluid nozzle components 5, compressed air is sneaked into to the etching liquid and form two fluids, particle diameter through nozzle 53 sprays two fluid particulates out can arrive below 10um, can carry out abundant etching to the root of the circuit on substrate 4, and minimizing is to the etching of circuit sidewall, reduced the side etching of circuit, improve the etching factor of circuit, thereby improved the etch capabilities of fine and closely woven circuit, also just improved the process capability of making fine and closely woven circuit.
In the present embodiment, said nozzle 53 comprises the body 531 of hollow, and the lower end of body 531 is provided with shower nozzle 532, and the bottom of this shower nozzle offers the mouth spray 535 of spray two fluids; The upper end of body 531 also offers air inlet 533, and this air inlet is communicated with an end of wireway 54, for importing compressed air; Simultaneously, offer inlet 534 on the sidewall of body 531, this inlet is communicated with jet pipe 52, for importing the etching liquid.
Particularly, in the body 531 of hollow, also offer for mixing the mixing groove 536 of compressed air and etching liquid, these two ends of mixing groove are communicated with air inlet 533 and mouth spray 535 respectively, and the side direction of mixing groove 536 is communicated with inlet 534.
The effect of said nozzle 53 is to mix compressed air and etching liquid, by liquid drop micronize, and is ejected into the road etching of the enterprising line of substrate 4 by mouth spray 535, and certainly, according to actual needs, the concrete structure of nozzle 53 also can be designed to other forms.
Air-tightness for assurance device, the two ends of wireway 54 are communicated with air inlet pipe 51 and nozzle 53 respectively by adaptor 7, particularly, the outer wall of air inlet pipe 51 is extended with the probe 6 be communicated with it, the outer end of this probe is communicated with an end of wireway 54 by adaptor 7, and the other end of wireway 54 is communicated with the air inlet 533 of nozzle 53 by same adaptor.
Above-mentioned adaptor 7 comprises the right angle adapter 71 of hollow, and the upper shield 72 that is arranged on this adapter outer end, right angle, one end of right angle adapter 71 stretches in probe 6, the other end is connected with wireway 54, and is locked by upper shield 72, similarly, the other end of wireway 54 connects in the above described manner, certainly, according to actual needs, wireway 54 two ends also can be communicated with air inlet 533 sealings of probe 6 and nozzle 53 by other means.
In the concrete structure of the present embodiment, arranged on left and right sides above conveying roller 3 and below arranged on left and right sides be equipped with the sprinkling irrigation assembly 5, nozzle 53 in sprinkling irrigation assembly 5 faces substrate to be etched 4, certainly, according to actual needs, also can two fluid sprinkling irrigation assemblies 5 be installed at the diverse location of substrate 4.
In the present embodiment, the groundwork process of two fluid Etaching devices is, substrate 4 is after existing etching machine spray etching, circuit above substrate 4 is shaped substantially, but circuit etching is not thorough, the root of circuit has more residual materials, and etching is unclean, then, substrate 4 is placed on conveying roller 3 again, conveying roller 3 is asking substrate 4 to move, process faces nozzle 53 spray two fluids of each position of substrate 4, because the particle diameter of two fluid drops that spray out can arrive below 10um, thereby etch away the residual materials on substrate 4 circuit roots, and then obtain required substrate circuit.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (7)
1. a fluid nozzle component, it is characterized in that, comprise for delivery of compressed-air actuated air inlet pipe, and for delivery of liquid and the jet pipe that is set up in parallel with described air inlet pipe, be interval with a plurality of nozzles that form two fluids and spray for mixing described compressed air and described liquid on described jet pipe, described nozzle is communicated with by wireway with described air inlet pipe.
2. two fluid nozzle components as claimed in claim 1, it is characterized in that, described nozzle comprises the body of hollow, and the shower nozzle that is arranged on described body one end, the other end of described body is provided with the air inlet be communicated with described wireway, one side of described body is provided with the inlet be communicated with described jet pipe, and described shower nozzle is provided with mouth spray.
3. two fluid nozzle components as claimed in claim 2, is characterized in that, be provided with the mixing groove in described body, the two ends of described mixing groove are communicated with described air inlet and mouth spray respectively, and the side direction of described mixing groove is communicated with described inlet.
4. two fluid nozzle components as claimed in claim 1, it is characterized in that, the outer wall of described air inlet pipe is extended with the probe of connection, and described probe is communicated with an end of described wireway by adaptor, and the other end of described wireway is communicated with the air inlet of described nozzle by described adaptor.
5. two fluid nozzle components as claimed in claim 4, is characterized in that, described adaptor comprises the right angle adapter of hollow, and the upper shield of being located at adapter outer end, described right angle.
6. a fluid Etaching device, it is characterized in that, comprise fuselage, be located at described back for transmitting the conveying roller of substrate, with the two fluid nozzle components as described as claim 1 to 5 any one that are transmitted the corresponding setting of substrate, and the provisioning component that is communicated with described nozzle component.
7. two fluid Etaching devices as claimed in claim 6, is characterized in that, the upside of described conveying roller, downside or upper and lower sides are provided with described two fluid nozzle components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320425911XU CN203355935U (en) | 2013-07-17 | 2013-07-17 | Two-fluid spray pipe component and two-fluid etching device using two-fluid nozzle component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320425911XU CN203355935U (en) | 2013-07-17 | 2013-07-17 | Two-fluid spray pipe component and two-fluid etching device using two-fluid nozzle component |
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| CN203355935U true CN203355935U (en) | 2013-12-25 |
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| CN201320425911XU Expired - Lifetime CN203355935U (en) | 2013-07-17 | 2013-07-17 | Two-fluid spray pipe component and two-fluid etching device using two-fluid nozzle component |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103909039A (en) * | 2014-03-25 | 2014-07-09 | 京东方科技集团股份有限公司 | Alignment layer coating device |
| TWI580474B (en) * | 2016-03-28 | 2017-05-01 | 盟立自動化股份有限公司 | Etching spraying module and wet etching device using the etching spraying module |
| CN107597687A (en) * | 2017-10-26 | 2018-01-19 | 武汉华星光电技术有限公司 | The water knife cleaning device and method of a kind of wet etcher |
| CN107958856A (en) * | 2017-11-24 | 2018-04-24 | 江阴江化微电子材料股份有限公司 | A kind of use for laboratory vaporizes etching machines |
| CN108511374A (en) * | 2018-05-10 | 2018-09-07 | 安徽宏实自动化装备有限公司 | A kind of wet process equipment dynamic etch medicine liquid spray device |
| CN118050959A (en) * | 2024-04-11 | 2024-05-17 | 广州市巨龙印制板设备有限公司 | Two-fluid developing etching spraying device and method |
-
2013
- 2013-07-17 CN CN201320425911XU patent/CN203355935U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103909039A (en) * | 2014-03-25 | 2014-07-09 | 京东方科技集团股份有限公司 | Alignment layer coating device |
| CN103909039B (en) * | 2014-03-25 | 2016-04-06 | 京东方科技集团股份有限公司 | A kind of alignment films apparatus for coating |
| TWI580474B (en) * | 2016-03-28 | 2017-05-01 | 盟立自動化股份有限公司 | Etching spraying module and wet etching device using the etching spraying module |
| CN107597687A (en) * | 2017-10-26 | 2018-01-19 | 武汉华星光电技术有限公司 | The water knife cleaning device and method of a kind of wet etcher |
| CN107597687B (en) * | 2017-10-26 | 2020-04-14 | 武汉华星光电技术有限公司 | Water jet cutter cleaning device and method of wet etching machine |
| CN107958856A (en) * | 2017-11-24 | 2018-04-24 | 江阴江化微电子材料股份有限公司 | A kind of use for laboratory vaporizes etching machines |
| CN108511374A (en) * | 2018-05-10 | 2018-09-07 | 安徽宏实自动化装备有限公司 | A kind of wet process equipment dynamic etch medicine liquid spray device |
| CN118050959A (en) * | 2024-04-11 | 2024-05-17 | 广州市巨龙印制板设备有限公司 | Two-fluid developing etching spraying device and method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |