CN101403132A - Ejection apparatus for electroplating assembly line - Google Patents

Ejection apparatus for electroplating assembly line Download PDF

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Publication number
CN101403132A
CN101403132A CNA2007101348498A CN200710134849A CN101403132A CN 101403132 A CN101403132 A CN 101403132A CN A2007101348498 A CNA2007101348498 A CN A2007101348498A CN 200710134849 A CN200710134849 A CN 200710134849A CN 101403132 A CN101403132 A CN 101403132A
Authority
CN
China
Prior art keywords
cell body
nozzle
assembly line
workpiece
electroplating assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101348498A
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Chinese (zh)
Inventor
匡优新
Original Assignee
匡优新
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 匡优新 filed Critical 匡优新
Priority to CNA2007101348498A priority Critical patent/CN101403132A/en
Publication of CN101403132A publication Critical patent/CN101403132A/en
Pending legal-status Critical Current

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Abstract

The invention relates to an ejector device used for an electroplating production line. The device can not only discharge the gas effectively, but also can mix the electroplating solution uniformly so as to ensure uniform coating on the surface of the workpiece and qualified rate of the workpiece. The device comprises a groove body and is characterized in that the groove body is internally provided with a spraying nozzle which is positioned below the liquid level in the groove body, the spraying nozzle is connected with a self-sucking pump which is arranged outside the groove, and the self-sucking pump is communicated with the groove body.

Description

A kind of electroplating assembly line jet apparatus
(1) technical field
The present invention relates to electroplating assembly line electroplate liquid spraying technology field, be specially a kind of electroplating assembly line jet apparatus.
(2) background technology
Along with the development of electroplating industry, the profile of plated item is more and more diversified, and some workpiece can have air when putting into electroplate liquid, workpiece can't be mixed with plating bath fully, thereby produce blind plating district, causes waste product.This problem generally all solves by the installation site of workpiece, if workpiece when mounted can't head it off, have only by the vibrations workpiece and solve, but it is bigger generally will to shake distance, and vibration frequency is high could to be solved, otherwise effect is bad, utilizes limited.
(3) summary of the invention
At the problems referred to above, the invention provides a kind of electroplating assembly line jet apparatus, this device can not only effectively be discharged gas, and plating bath can be stirred, and makes workpiece surface coating even, guarantees the qualification rate of workpiece.
Its technical scheme is such: it comprises cell body, it is characterized in that: be provided with nozzle in the described cell body, described nozzle is in the cell body below the liquid level, described nozzle be arranged at groove vacuum primingpump outward and be connected, described vacuum primingpump is connected with cell body and communicates.
It is further characterized in that: described nozzle is installed on the conveying arm, and described conveying arm has two, and described two conveying arms also gather with house steward respectively step by step up and down along the direction parallel with described cell body bottom and are connected, and described house steward is connected with the described pump housing.
The present invention adopts after the said structure, being provided with of pump can will spray to workpiece through nozzle after the tank liquor pressurization again, gas in the workpiece is sprayed, thereby reach the expeling air, strengthen the purpose of spraying effect, and the circulation that has pressure can realize the abundant stirring to masking liquid, makes masking liquid even, guarantees the even of coating.
(4) description of drawings
Fig. 1 is the main structural representation of looking of the present invention; Fig. 2 is the left view of Fig. 1.
(5) embodiment
See Fig. 1 Fig. 2, the present invention includes cell body 1, be provided with nozzle 2 in the cell body 1, nozzle 2 is installed on carries arm 3, (can have many, how much relevant specifically look the workpiece that needs spraying, carries arms 3 to distribute up and down along the direction parallel with cell body 1 bottom for two to carry arm 3 to have two, and gather with house steward 4 respectively and be connected, house steward 4 is connected with the pump housing 5.Guarantee during use that nozzle 2 is in below the cell body 1 interior liquid level.

Claims (2)

1, a kind of electroplating assembly line jet apparatus, it comprises cell body, it is characterized in that: be provided with nozzle in the described cell body, described nozzle is in the cell body below the liquid level, described nozzle be arranged at groove vacuum primingpump outward and be connected, described vacuum primingpump is connected with cell body and communicates.
2, according to the described a kind of electroplating assembly line jet apparatus of claim 1, it is characterized in that: described nozzle is installed on the conveying arm, described conveying arm has two, described two conveying arms also gather with house steward respectively step by step up and down along the direction parallel with described cell body bottom and are connected, and described house steward is connected with the described pump housing.
CNA2007101348498A 2007-11-08 2007-11-08 Ejection apparatus for electroplating assembly line Pending CN101403132A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2007101348498A CN101403132A (en) 2007-11-08 2007-11-08 Ejection apparatus for electroplating assembly line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007101348498A CN101403132A (en) 2007-11-08 2007-11-08 Ejection apparatus for electroplating assembly line

Publications (1)

Publication Number Publication Date
CN101403132A true CN101403132A (en) 2009-04-08

Family

ID=40537287

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101348498A Pending CN101403132A (en) 2007-11-08 2007-11-08 Ejection apparatus for electroplating assembly line

Country Status (1)

Country Link
CN (1) CN101403132A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102586826A (en) * 2011-01-17 2012-07-18 欣兴电子股份有限公司 Gold plating method and gold plating device for connector
CN105256366A (en) * 2015-11-30 2016-01-20 成都市天目电子设备有限公司 Copper plating device
CN105350047A (en) * 2015-11-30 2016-02-24 成都市天目电子设备有限公司 PCB electroplating tank having efficient stirring effect
CN108441932A (en) * 2018-05-03 2018-08-24 杨煜海 A kind of plating processing unit (plant) easy to use
CN111118588A (en) * 2020-01-13 2020-05-08 深圳市晟达真空钎焊技术有限公司 System capable of circularly plating nickel inside liquid cooling plate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102586826A (en) * 2011-01-17 2012-07-18 欣兴电子股份有限公司 Gold plating method and gold plating device for connector
CN105256366A (en) * 2015-11-30 2016-01-20 成都市天目电子设备有限公司 Copper plating device
CN105350047A (en) * 2015-11-30 2016-02-24 成都市天目电子设备有限公司 PCB electroplating tank having efficient stirring effect
CN108441932A (en) * 2018-05-03 2018-08-24 杨煜海 A kind of plating processing unit (plant) easy to use
CN111118588A (en) * 2020-01-13 2020-05-08 深圳市晟达真空钎焊技术有限公司 System capable of circularly plating nickel inside liquid cooling plate
CN111118588B (en) * 2020-01-13 2020-10-16 深圳市晟达真空钎焊技术有限公司 System capable of circularly plating nickel inside liquid cooling plate

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Application publication date: 20090408