CN202700856U - Cleaning atomization spray device - Google Patents
Cleaning atomization spray device Download PDFInfo
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- CN202700856U CN202700856U CN 201220186692 CN201220186692U CN202700856U CN 202700856 U CN202700856 U CN 202700856U CN 201220186692 CN201220186692 CN 201220186692 CN 201220186692 U CN201220186692 U CN 201220186692U CN 202700856 U CN202700856 U CN 202700856U
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- shell body
- jetting device
- coupling layer
- cleaning
- atomization jetting
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Abstract
The utility model relates to the field of semiconductor chip process technology, in particular to a cleaning atomization spray device. The cleaning atomization spray device comprises an upper shell body and a lower shell body connected with the upper shell body. The upper shell body is in a two-step cylindrical shape and comprises a first-step shell body and a second-step shell body. The cross section of the first-step shell body is smaller than that of the second-step shell body. The first-step shell body is provided with a cable connector which can be connected with a power amplifier. The second-step shell body is provided with an energy converter. Ventilation holes are arranged on two sidewalls of the lower shell body. An atomization spray through hole is disposed at the center of the lower shell body. The ventilation holes and the atomization spray through hole are communicated with each other and form an included angle. The cleaning atomization spray device is simple in structure and high in integration level, can effectively achieve spraying ultramicro atomized liquid drops, and can effectively clean chips and save water resources to the maximum on the premise of not damaging surface patterns of the chips.
Description
Technical field
The utility model relates to semiconductor wafer technology field, particularly a kind of cleaning atomization jetting device.
Background technology
Have hundreds of roads matting in the manufacturing process of integrated circuit, in order to guarantee the cleanliness factor on wafer material surface, matting has accounted for 30% of whole manufacture process.Wherein, this wafer refers to the silicon chip of pure silicon substrate and with the silicon chip of copper interconnection structure.According to statistics, the bulk silicon die of every 200mm diameter needs to consume 5 tons of high purity deionized water in whole manufacturing, adds the expense of other various consumptive materials in the cleaning, will be a very high numeral.
And statistics shows further, and the loss amount above 50% in the whole semiconductor devices manufacturing is not all thoroughly caused by surface contamination, cleaning.Can make the loose contact of photoresist and mask such as particle contamination, aim at exposure process in damage glued membrane and mask, cause that resolution ratio descends, and causes the graphic defects such as pin hole, island.In exposure process, if adhered particles on mask or the photoresist film behind graph transfer printing, will cause the damaged or bridging of figure, cause respectively circuit breaker or short circuit.
Cleaning equipment for the copper-connection chip is main mainly with rotary jet type at present, and namely chip is fixed on the rotary chuck of cleaning machine, with the chuck high-speed motion, has shower nozzle jet cleaning liquid and deionized water above chuck.The cleaning fluid that sprays will produce a physical force during with very high flow attack silicon chip.The centrifugal force that the use of spraying and chip rotation produce has guaranteed to reduce the effective cleaning under the consumption of chemical reagent and deionized water.
But along with developing rapidly of integrated circuit, especially the live width of copper interconnecting line further reduces, and is more and more higher to the requirement of cleaning technique, the cleaning that causes copper interconnect surfaces along with live width to reduce its difficulty increasing.And traditional cleaning spray spraying technique exists large scale drop or injection stream, and more aobvious serious to the damage of the figure of the chip surface of 65 nanometers and following technique thereof, the utilization rate of cleaning fluid and deionized water is lower simultaneously, causes the profligacy of resource.
The utility model content
The technical problem that (one) will solve
The technical problems to be solved in the utility model provides a kind of simple in structure, cleaning atomization jetting device of realize spraying the ultra micro atomized drop, produce large scale drop or injection stream to overcome simple atomization mechanism, the chip surface figure of 65 nanometers and following technique thereof is caused the defectives such as the utilization rate of major injury, cleaning fluid and deionized water is low.
(2) technical scheme
For solving the problems of the technologies described above, the utility model provides one one kinds to clean atomization jetting device, it is characterized in that, comprising: upper shell, the lower house that is connected with upper shell; Described upper shell is that second order is cylindric, comprises the first rank housing and second-order housing, and the cross-sectional area of the first rank housing is provided with transducer less than the cross-sectional area of second-order housing in the described second-order housing; The two side of described lower house is provided with the second passage, and the center of described lower house is provided with the atomized spray through hole, and described the second passage communicates with the atomized spray through hole and has angle.
Further, described transducer comprises and is cylindric and its surperficial transducer main body and coupling layer that is provided with a plurality of the first passages that described coupling layer is fixed on the transducer body interior by the coupling layer support component.
Further, described coupling layer comprises piezo-electric crystal and coupling piece, and described piezo-electric crystal is connected with coupling piece by conducting resinl.
Further, described coupling piece is made by Single Medium or medium, and its thickness is the integral multiple of 1/4 wavelength.
Further, also comprise sealing ring, described sealing ring is arranged at the lower surface of coupling layer, is used for sealing coupling layer and coupling layer support component.
Further, a side of described the first rank housing is provided with air admission hole, and a side of described second-order housing is provided with inlet opening.
Further, the angle between described the second passage and the atomized spray through hole is 20-70 °.
Further, the vertical range between described coupling layer lower surface and the lower house atomized spray through hole upper surface is 1mm-10mm.
Further, the sidewall of described transducer main body to the second-order inner walls distance in the described upper shell is 1mm-10mm.
Further, the aperture of described the first passage is 1-3mm, and it from top to bottom is sequentially arranged on the described transducer main body by circumference tangent plane direction.
(3) beneficial effect
The cleaning atomization jetting device that the utility model provides, simple in structure, integrated level is high, can effectively realize spraying the ultra micro atomized drop, under the prerequisite of damage wafers picture on surface not, wafer is effectively cleaned, and maximum saving water resource.
Description of drawings
Fig. 1 is that the utility model embodiment cleans the atomization jetting device structural representation;
Fig. 2 is that the utility model embodiment cleans the atomization jetting device top view;
Fig. 3 is that the utility model embodiment cleans atomization jetting device assembling schematic diagram;
Fig. 4 is that the utility model embodiment cleans transducer architecture schematic diagram in the atomization jetting device;
Fig. 5 is that the utility model embodiment cleans transducer profile in the atomization jetting device.
Among the figure:
1: cable connector; 2: upper shell; 21: the first rank housings; 22: the second-order housing; 3: connecting hole; 4: the transducer main body; 5: the coupling layer support component; 6: the first passages; 7: piezo-electric crystal; 8: coupling layer; 9: the second passages; 10: lower house; 11: the atomized spray through hole; 12: sealing ring; 13: inlet; 14: air inlet; 15: screw hole.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
Shown in Fig. 1-5, the utility model cleans atomization jetting device and comprises: upper shell 2 and the lower house 10 that links together by screw thread or other connected modes, this upper shell 2 by PVDF or other corrosion resistance height and intensity preferably nonmetallic materials make.Upper shell 2 is that second order is cylindric, comprises that the cross-sectional area of the first rank housing 21 and second-order housing 22, the first rank housings 21 is less than the cross-sectional area of second-order housing 22; This first rank housing 21 is provided with the cable connector 1 that can be connected with the power amplifier (not shown), and this first rank housing 21 is provided with air inlet 14, and second-order housing 22 is provided with inlet opening 13.
The upper surface of second-order housing 22 is provided with connecting hole 3, be used for fixing transducer main body 4 by modes such as bolt, connected nails, this transducer main body 4 is cylindric, and evenly be provided with a plurality of the first passages 6 on its surperficial sidewall, this first passage 6 from top to bottom is sequentially arranged on the transducer main body 4 by circumference tangent plane direction.The aperture of this first passage 6 is 1mm-3mm, and its shape is more excellent to be circular, fan-shaped or triangle.The first passage 6 can protect million sound system inner transducer that pneumatic nebulization desired gas source is provided, and makes the liquid that passes into upper shell by there being laminar flow to be converted into continuous turbulent flow, and the effect of refrigerating function and the inner purge drying of atomization jetting device is provided for million sound systems.These transducer main body 4 inside are provided with coupling layer 8, and this coupling layer 8 is fixed in transducer main body 4 inside by coupling layer support component 5.Such as Fig. 1, Fig. 4 and shown in Figure 5.Wherein, the sidewall of transducer main body 4 is 1mm-10mm to the second-order housing 22 inwalls distance in the upper shell 2, and this distance can guarantee under the prerequisite of injection flow, makes liquid become film as far as possible, more is conducive to be split under million sound oscillations less drop.
Wherein, this coupling layer 8 comprises: piezo-electric crystal 7 and coupling piece; These piezo-electric crystal 7 common used materials are the lead zirconate titanate of processing through hyperpolarization, it by conducting resinl and coupling piece tight bond together, wherein coupling piece is made by Single Medium or multimedium, and its thickness is the integral multiple of 1/4 wavelength, and its upper surface can pass through screw line ball stube cable.In addition, this injection apparatus also comprises sealing ring 12, and sealing circle 12 is located on the lower surface of coupling layer, is used for coupling layer and coupling layer support component 5 are sealed.
The two side of lower house 10 is provided with the second passage 9, the center of this lower house 10 is provided with atomized spray through hole 11, as shown in figures 1 and 3, to communicate and have certain angle, this angle be that 20 degree are to 70 degree to the atomized spray through hole 11 of above-mentioned the second passage 9 that is positioned at sidewall and center.Angle between this second passage 9 and the atomized spray through hole 11 provides the effect of two aspects for the gas that sprays, and accelerates atomized liquid from the speed of nozzle ejection on the one hand, on the other hand, accelerates the effect of atomizing, makes the drop of atomizing less.
Wherein, atomized spray through hole 11 length and equivalent diameter ratio are 10: 1-30: 1, and the drop division that can guarantee like this to atomize more thorough, more even.For example: the distance of atomized drop process in the through hole of fixed diameter is longer, division more thorough more even.The second passage 9 is used for providing the sprayer unit desired gas, accelerates drop and further divides, and strengthens atomizing effect.In addition, the sidewall of this atomization jetting device lower house 10 is with certain angle tangent plane, and this tangent plane provides support face for the second passage 9 made from certain angle of inclination.Wherein, coupling layer 8 lower surfaces are 1mm-10mm to the vertical range of lower house center atomized spray through hole 11 upper surfaces.Like this, can guarantee under the prerequisite of injection flow, make liquid become film as far as possible, more be conducive under million sound oscillations, be split into less drop.
The below has the operation principle of explanation cleaning atomization jetting device:
Gas enters in the transducer main body 4 by air inlet 14, is ejected in the passage between transducer main body 4 and the upper shell 2 by the first passage 6 on the transducer main body 4.Liquid enters in the passage between transducer main body 4 and the upper shell 2 by inlet 13, the gas that the first passage from transducer main body 4 ejects is ejected into the liquid in the above-mentioned passage, make liquid under the effect of capillary and gas injection, produce certain minute rip current, when this minute, rip current was flowed through between coupling layer 8 and the lower house 10 passage, under million effect, further be split into the ultra micro stream of liquid droplets.
Be connected with power amplifier by cable connector 1 piezo-electric crystal 7 is applied alternating voltage, piezo-electric crystal 7 produces vibration and forms mega sonic wave under the effect of alternating voltage, and mega sonic wave is propagated by coupling layer 8 and lower house 10.The atomized spray through hole 11 that passes through injection apparatus lower house 10 through the ultra micro stream of liquid droplets that produces after million effects ejects, before ejecting, in the atomized spray through hole 11 of lower house 10, be subject to the gas effect of the second passage 9 in the lower house 10, accelerate the ultra micro stream of liquid droplets and be decomposed into single ultra micro drop.
The cleaning atomization jetting device that the utility model provides, simple in structure, integrated level is high, can effectively realize spraying the ultra micro atomized drop, under the prerequisite of damage wafers picture on surface not, wafer is effectively cleaned, and maximum saving water resource.
The above only is preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection domain of the present utility model.
Claims (10)
1. one kind is cleaned atomization jetting device, it is characterized in that, comprising: upper shell, the lower house that is connected with upper shell; Described upper shell is that second order is cylindric, comprises the first rank housing and second-order housing, and the cross-sectional area of the first rank housing is provided with transducer less than the cross-sectional area of second-order housing in the described second-order housing; The two side of described lower house is provided with the second passage, and the center of described lower house is provided with the atomized spray through hole, and described the second passage communicates with the atomized spray through hole and has angle.
2. cleaning atomization jetting device as claimed in claim 1, it is characterized in that, described transducer comprises and is cylindric and its surperficial transducer main body and coupling layer that is provided with a plurality of the first passages that described coupling layer is fixed on the transducer body interior by the coupling layer support component.
3. cleaning atomization jetting device as claimed in claim 2 is characterized in that, described coupling layer comprises piezo-electric crystal and coupling piece, and described piezo-electric crystal is connected with coupling piece by conducting resinl.
4. cleaning atomization jetting device as claimed in claim 3 is characterized in that, described coupling piece is made by Single Medium or medium, and its thickness is the integral multiple of 1/4 wavelength.
5. cleaning atomization jetting device as claimed in claim 3 is characterized in that, also comprises sealing ring, and described sealing ring is arranged at the lower surface of coupling layer, is used for sealing coupling layer and coupling layer support component.
6. cleaning atomization jetting device as claimed in claim 1 is characterized in that, a side of described the first rank housing is provided with air admission hole, and a side of described second-order housing is provided with inlet opening.
7. cleaning atomization jetting device as claimed in claim 1 is characterized in that, the angle between described the second passage and the atomized spray through hole is 20-70 °.
8. cleaning atomization jetting device as claimed in claim 2 is characterized in that, the vertical range between described coupling layer lower surface and the lower house atomized spray through hole upper surface is 1mm-10mm.
9. cleaning atomization jetting device as claimed in claim 1 is characterized in that, the sidewall of described transducer main body to the second-order inner walls distance in the described upper shell is 1mm-10mm.
10. cleaning atomization jetting device as claimed in claim 2 is characterized in that, the aperture of described the first passage is 1-3mm, and it from top to bottom is sequentially arranged on the described transducer main body by circumference tangent plane direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220186692 CN202700856U (en) | 2012-04-26 | 2012-04-26 | Cleaning atomization spray device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220186692 CN202700856U (en) | 2012-04-26 | 2012-04-26 | Cleaning atomization spray device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202700856U true CN202700856U (en) | 2013-01-30 |
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ID=47581196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220186692 Expired - Fee Related CN202700856U (en) | 2012-04-26 | 2012-04-26 | Cleaning atomization spray device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202700856U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102641865A (en) * | 2012-04-26 | 2012-08-22 | 北京七星华创电子股份有限公司 | Atomizing jet device for cleaning |
| CN111229688A (en) * | 2020-01-19 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Cleaning spray head in wafer cleaning equipment, wafer cleaning method and equipment |
-
2012
- 2012-04-26 CN CN 201220186692 patent/CN202700856U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102641865A (en) * | 2012-04-26 | 2012-08-22 | 北京七星华创电子股份有限公司 | Atomizing jet device for cleaning |
| CN102641865B (en) * | 2012-04-26 | 2014-03-05 | 北京七星华创电子股份有限公司 | Atomizing jet device for cleaning |
| CN111229688A (en) * | 2020-01-19 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Cleaning spray head in wafer cleaning equipment, wafer cleaning method and equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130130 Termination date: 20180426 |