1315168 九、發明說明： '【發明所屬之技術領域】 - 本發明關於一種用於印刷電路板蝕刻之裝置，尤其涉 及一種用於向印刷電路板喷灑蝕刻液之噴敍裝置。 【先前技術】 颠刻過程係印刷電路板生産過程中基本步驟之一，係 使印刷電路板基板上沒有被抗钱層保護之銅與钱刻液發生 鲁反應而被蝕刻掉，最終形成設計線路圖形之過程。 印刷電路板於進行蝕刻時，蝕刻液由基板上方之嘴银 裝置喷射到基板表面。一般印刷電路板蝕刻所用噴蝕裝置 包括複數根等長平行排列設置之直線形喷管，每根喷管上 設有複數個喷嘴，通過喷嘴可朝印刷電路板表面喷灑钱刻 液’以银刻印刷電路板基板，將印刷電路板基板上未被抗 蝕層保護之銅去除。 馨 惟’使用直線形喷管之喷蝕裝置進行印刷電路板蝕刻 時’由於各個喷嘴之喷壓一致，會使印刷電路板上靠近邊 緣部分’蝕刻液更容易流出板外，而於印刷電路板上中央 位置’比較容易積留較多蝕刻液，形成“水池”，從而産 生“水池效應”。印刷電路板蝕刻過程中出現“水池效 應”會使印刷電路板中央區域之蝕刻液更新較慢，積留之 餘刻液膜會降低對線路之咬蝕量，容易發生線路蝕刻不 足’而印刷電路板靠近邊緣部分之蝕刻液流動速度快，更 新較快’容易發生線路過蝕。因此，“水池效應”最終會 1315168 導致印刷電路板上蝕刻不均勻，特別容易使印刷電路板中 央區域之線路連線，從而造成短路。 有鑑於此，提供一種用於印刷電路板蝕刻之喷蝕裝 置’以有效減少、“水池效應”之影響，改善噴钕裝置茲刻 之均勻性實屬必要。 / 【發明内容】 以下以實施例說明一種用於印刷電路板蝕刻之噴蝕裝 置。 、 所述用於印刷電路板蝕刻之喷蝕裝置，包括複數根喷 管'。每根噴管包括兩個第—噴管段、—個第二噴管段及兩 個過渡噴官段。該兩個第—喷管段分別位於嘴管兩端，該 第二噴管段位於兩個第一噴管段之間，該兩個過渡喷管^ 用於連接第-噴管段與第二喷管段。該第二嘴管段位置之 口又置低於該第一喷管段。辞笛ΊΖ ^ * ^ 该第一喷官段及第二喷管段上設 有複數個喷頭。 ，总，述用於印刷電路板钱刻之喷钱裝置，包括複數根哨 括兩個第—噴管段、—個第二喷管段及兩 ^ °該兩個第-喷管段分職於喷管兩端，該 兩個第一噴管段之間，該兩個過渡喷管段 電路板仙矣喷官&與第二。該第二喷Μ到印刷 ㈣表面之距離小於該第—喷管㈣㈣電路板姓 it離。該第—噴管段及第二喷管段上設有複數個 朝向印刷電路板之喷頭。 ^對於先别技術，通過改變喷管結構來調整餘刻液喷 .1315168 灑到印刷電路板蝕表面之壓力，從而調整喷灑到印刷電路 板蝕表面之蝕刻液量，使喷射到印刷電路板中央區域之流 •量大於喷射到邊緣部分之流量，加速印刷電路板中央區域 -蝕刻液更新，使印刷電路板表面形成厚度均勻之蝕刻液， 有效減少水池效應發生，改善印刷電路板蝕刻之均勻性。 【實施方式】 以下將實施例說明一種用於印刷電路板蝕刻之喷蝕裝 置。 _ 請參閱圖1與圖2，實施例一提供之用於印刷電路板蝕 刻之喷蝕裝置100，其包括複數根喷管40。 該複數根喷管40呈平行排列。每根喷管40包括兩個第 一喷管段401、一個第二喷管段402及兩個過渡喷管段403。 '該兩個第一喷管段401分別位於喷管40之兩端，該第二喷管 段402位於兩個第一喷管段401之間，位於喷管40中央部 分。該第二喷管段402位置之設置低於該兩個第一喷管段 401。該兩個過渡喷管段403用於連接第一喷管段401與第二 ®喷管段402。過渡喷管段403與第一喷管段401與第二喷管段 402垂直連接。 該第一喷管段401及第二喷管段402上設有複數個朝向 印刷電路板30之喷頭45。該設于第一喷管段401及第二喷管 段402上複數個喷頭45爲等間距排列，該喷頭45之喷孔爲圓 形或橢圓形。爲更好提高蝕刻均勻性，減少水池效應，可 選地，設于第二喷管段402上之複數個喷頭45之間距小於設 于第一喷管段401上之複數個喷頭45之間距。 1315168 每根喷管40兩端之兩個第一喷管段401分別與導液管 48相連通，以形成钱刻液通路。钱刻液通過導液管48進入 -導複數根喷管40中，再由各個喷管段上之喷頭45喷灑出來。 喷蝕裝置100用於印刷電路板30蝕刻時，該複數根喷管 40之排列方向與印刷電路板30之行進方向A—致，該兩個 第一喷管段401到印刷電路板30蝕刻表面301之距離較遠。 優選地，該兩個第一喷管段401與印刷電路板30蝕刻表面 301之距離可以相等。該第二喷管段402到印刷電路板30蝕 ❿刻表面301距離較近，且小於該第一喷管段401到印刷電路 板30蝕刻表面301之距離。第二喷管段402到印刷電路板30 蝕刻表面301距離約爲第一喷管段401到印刷電路板30蝕刻 表面301距離之30%〜50%。 ' 由於喷管40各處之壓力一致，而位於中央部分之第二 ~喷管段402到印刷電路板30蝕刻表面301距離較近，因此， 蝕刻液喷灑到印刷電路板30蝕刻表面301之壓力較大，喷灑 到印刷電路板30蝕刻表面301中央之蝕刻液量亦相應較 *大，這樣，蝕刻表面301中央區域之蝕刻液之更新速度加 快，從而減少蝕刻液於蝕刻表面301中央區域之蓄積，使蝕 刻表面301中央區域與邊緣區域形成之蝕刻液膜厚度均 勻，以增強對印刷電路板30中央區域線路之蝕刻能力，減 少水池效應之影響。另外，由於位於中央部分之第二喷管 段402上之喷頭45間距較小，個數較多，就可增加喷射到印 刷電路板30蝕刻表面301中央之蝕刻液量，進一步加速蝕刻 表面301中央區域之蝕刻液更新速度，增加蝕刻液之喷灑到 1315168 ‘印刷電路板30蝕刻表面301之壓力，使蝕刻表面301中央區 域與邊緣區域形成之蝕刻液膜厚度均勻，以增強對印刷電 '路板30中央區域線路之蝕刻能力，減少水池效應之影響。 - 請參閱圖3與圖4，實施例二提供之用於印刷電路板蝕 刻之喷蝕裝置200，其包括複數根喷管50。 用於印刷電路板蝕刻之喷蝕裝置200與用於印刷電路 板蝕刻之喷蝕裝置100之結構大致相同。 該複數根喷管50呈平行排列。每根喷管50包括兩個第 φ —喷管段501、一個第二喷管段502及兩個過渡喷管段503。 該兩個第一喷管段501分別位於喷管50之兩端，該第二喷管 段502位於兩個第一喷管段501之間，位於喷管50中央部 分。該第二喷管段502位置之設置低於該兩個第一喷管段 、501。該兩個過渡喷管段503用於連接第一喷管段501與第二 '喷管段502。 與第一實施例相比，區別在於該過渡喷管段503係傾斜 之與第一喷管段501與第二喷管段502連接，過渡喷管段503 *與第一喷管段501與第二喷管段502延長線之夾角爲銳角， 夾角之角度可爲45〜60度。另外，該過渡喷管段503上亦可 進一步設有複數個朝向印刷電路板30之喷頭55，該複數個 喷頭55到印刷電路板30蝕刻表面301之距離從靠近第一喷 管段501—端到靠近第二喷管段502—端逐漸減小。 每根喷管50兩端之兩個第一喷管段501分別與導液管 58相連通，以形成蝕刻液通路。蝕刻液通過導液管58進入 導複數根喷管50中，再由各個喷管段上之喷頭55喷灑出來。 1315168 喷餘裴置200在用於印刷電路板30蝕刻時，該複數根喷 管50之排列方向與印刷電路板30之行進方向A—致，該兩 '摘第一噴管段501到印刷電路板30蝕刻表面301之距離較 运。優選地’該兩個第一喷管段501與印刷電路板30#刻表 面301之距離可以相等。該第二喷管段502其到印刷電路板 30蝕刻表面301距離較近，且小於該第一噴管段501到印刷 電路板30蝕刻表面3〇1之距離。第二噴管段5〇2到印刷電路 板30蝕刻表面3〇1距離約爲第一喷管段5〇1到印刷電路板如 ’银刻表面3〇1距離之30%〜50%。 上述噴蝕裝置之優點在於：通過改變喷管处槿 嫌喷麗到印刷電路板钱表面之壓力，從 ^刷電路板钱表面之㈣液量’使嘴射到印刷電路板中央 .區域之流量大於噴射到邊緣部分之流量，加速印刷電路板 中央區域钱刻液之更新，使印刷電路板表面形成厚度均勻 有效減少水池效應發生’改善印刷電路板蝕刻 刹申^ 2述、’本發明符合發明專利要件，爰依法提出專 I明I ’卩上料者僅為本發％之較佳實施方式，本 發2範圍並不以上述實施方式為限，舉凡熟悉本案㈣ ί包含於2依本案發明精神所作之等效修飾或變化，皆 應已3於Μ下之申請專利範圍内。 【圖式簡單說明】 圖1係實施例一喷蝕裝置之示意圖。 圖2係實施例一喷钱裝置之噴管相對於印刷電路板韻刻 11 1315168 表面之結構示意圖。 ' 圖3係實施例二喷蝕裝置之示意圖。 ' 圖4係實施例二喷蝕裝置之喷管相對於印刷電路板蝕刻 表面之結構示意圖。 【主要元件符號說明】 喷蝕裝置 100 ' 200 喷管 40、50 第一喷管段 401 > 501 第二喷管段 402 ' 502 過渡噴管段 403 > 503 喷頭 45 ' 55 導液管 48 > 58 印刷電路板 30 钱刻表面 3011315168 IX. Description of the invention: '[Technical field to which the invention pertains] - The present invention relates to a device for etching a printed circuit board, and more particularly to a device for spraying an etchant onto a printed circuit board. [Prior Art] One of the basic steps in the production process of a printed circuit board is that the copper on the printed circuit board substrate that is not protected by the anti-money layer is etched away from the money engraving solution, and finally forms a design line. The process of graphics. When the printed circuit board is etched, the etchant is ejected from the nozzle silver device above the substrate to the surface of the substrate. Generally, the etching device used for etching the printed circuit board comprises a plurality of linear nozzles arranged in parallel and arranged in parallel, each nozzle is provided with a plurality of nozzles through which the money engraving liquid can be sprayed toward the surface of the printed circuit board. The printed circuit board substrate is engraved to remove copper that is not protected by the resist layer on the printed circuit board substrate. Xin Wei's use of a linear nozzle to etch the printed circuit board. 'Because the spray pressure of each nozzle is the same, the etchant will flow out of the board more easily on the printed circuit board near the edge, and on the printed circuit board. In the upper central position, it is easier to accumulate more etching liquid to form a "pool", resulting in a "pool effect." The "pool effect" in the etching process of the printed circuit board will make the etching liquid in the central area of the printed circuit board renew slowly, and the remaining liquid film will reduce the amount of bite on the line, and the line etching is prone to occur. The etchant near the edge of the plate has a fast flow rate and a fast update, which is prone to line over-corrosion. Therefore, the "pool effect" will eventually lead to uneven etching on the printed circuit board, which is particularly easy to wire the wiring in the central area of the printed circuit board, thereby causing a short circuit. In view of this, it is necessary to provide an etching apparatus for printed circuit board etching to effectively reduce the effect of "pool effect" and to improve the uniformity of the sneezing apparatus. / SUMMARY OF THE INVENTION An etching apparatus for printed circuit board etching will be described below by way of embodiments. The etching device for etching a printed circuit board includes a plurality of nozzles'. Each nozzle includes two first nozzle sections, one second nozzle section and two transitional spray sections. The two first nozzle sections are respectively located at two ends of the nozzle tube, and the second nozzle section is located between the two first nozzle sections, and the two transition nozzles are used for connecting the first nozzle section and the second nozzle section. The mouth of the second nozzle section is again lower than the first nozzle section. Cigarette ΊΖ ^ * ^ There are a plurality of nozzles on the first spray section and the second nozzle section. , in general, the money-spraying device for printing circuit board money, including a plurality of squadrons including two first-nozzle segments, one second nozzle segment and two ^ ° the two first-nozzle segments are assigned to the nozzle At both ends, between the two first nozzle segments, the two transition nozzle segments of the circuit board are squirting && second. The distance from the second sneeze to the printing (4) surface is smaller than that of the first nozzle (four) (four). The first nozzle section and the second nozzle section are provided with a plurality of nozzles facing the printed circuit board. ^ For the prior art, by changing the nozzle structure to adjust the pressure of the 1310168 sprinkling onto the etched surface of the printed circuit board, thereby adjusting the amount of etching liquid sprayed onto the etched surface of the printed circuit board to be ejected onto the printed circuit board. The flow in the central area is greater than the flow rate from the spray to the edge portion, accelerating the central area of the printed circuit board - the etching liquid is renewed, and the etching liquid is formed on the surface of the printed circuit board to effectively reduce the pool effect and improve the uniform etching of the printed circuit board. Sex. [Embodiment] Hereinafter, an embodiment will be described to describe an etching apparatus for printed circuit board etching. Referring to Figures 1 and 2, an erosion apparatus 100 for printed circuit board etching is provided in the first embodiment, which includes a plurality of nozzles 40. The plurality of nozzles 40 are arranged in parallel. Each nozzle 40 includes two first nozzle segments 401, a second nozzle segment 402, and two transition nozzle segments 403. The two first nozzle segments 401 are respectively located at opposite ends of the nozzle 40, and the second nozzle segment 402 is located between the two first nozzle segments 401 at the central portion of the nozzle 40. The second nozzle segment 402 is positioned lower than the two first nozzle segments 401. The two transition nozzle segments 403 are used to connect the first nozzle segment 401 with the second ® nozzle segment 402. The transition nozzle segment 403 is vertically connected to the first nozzle segment 401 and the second nozzle segment 402. The first nozzle segment 401 and the second nozzle segment 402 are provided with a plurality of nozzles 45 facing the printed circuit board 30. The plurality of nozzles 45 disposed on the first nozzle segment 401 and the second nozzle segment 402 are arranged at equal intervals, and the nozzle holes of the nozzle 45 are circular or elliptical. In order to improve the etching uniformity and reduce the pool effect, the distance between the plurality of nozzles 45 disposed on the second nozzle segment 402 is less than the distance between the plurality of nozzles 45 disposed on the first nozzle segment 401. 1315168 Two first nozzle segments 401 at each end of each nozzle 40 are in communication with the liquid guiding tube 48 to form a money engraving passage. The money engraving liquid enters through the catheter 48 to guide the plurality of nozzles 40, and is sprayed from the nozzles 45 on the respective nozzle segments. When the etching device 100 is used for etching the printed circuit board 30, the arrangement direction of the plurality of nozzles 40 is aligned with the traveling direction A of the printed circuit board 30, and the two first nozzle segments 401 to the etching surface 301 of the printed circuit board 30. The distance is far. Preferably, the distance between the two first nozzle segments 401 and the etched surface 301 of the printed circuit board 30 may be equal. The second nozzle segment 402 is closer to the etched surface 301 of the printed circuit board 30 and less than the distance from the first nozzle segment 401 to the etched surface 301 of the printed circuit board 30. The distance from the second nozzle segment 402 to the printed circuit board 30 etched surface 301 is from about 30% to about 50% of the distance from the first nozzle segment 401 to the etched surface 301 of the printed circuit board 30. Since the pressures across the nozzles 40 are uniform, and the second to the nozzle segments 402 at the central portion are closer to the etched surface 301 of the printed circuit board 30, the pressure of the etchant is applied to the etched surface 301 of the printed circuit board 30. Larger, the amount of etching liquid sprayed to the center of the etching surface 301 of the printed circuit board 30 is also relatively larger, so that the refreshing speed of the etching liquid in the central portion of the etching surface 301 is accelerated, thereby reducing the etching liquid in the central region of the etching surface 301. The accumulation causes the thickness of the etching liquid film formed in the central region and the edge region of the etching surface 301 to be uniform to enhance the etching ability to the wiring in the central region of the printed circuit board 30, and to reduce the influence of the pool effect. In addition, since the distance between the heads 45 on the second nozzle segment 402 of the central portion is small and the number is large, the amount of etching liquid sprayed to the center of the etching surface 301 of the printed circuit board 30 can be increased, and the center of the etching surface 301 is further accelerated. The etchant update rate of the region increases the pressure of the etchant sprayed onto the etched surface 301 of the 1315168' printed circuit board 30, so that the thickness of the etched liquid film formed in the central region and the edge region of the etched surface 301 is uniform to enhance the printed circuit. The etching capability of the central region of the board 30 reduces the effects of the pool effect. Referring to Figures 3 and 4, the etching apparatus 200 for printed circuit board etching provided in the second embodiment includes a plurality of nozzles 50. The etching apparatus 200 for printed circuit board etching is substantially the same as the etching apparatus 100 for printed circuit board etching. The plurality of nozzles 50 are arranged in parallel. Each nozzle 50 includes two first φ-nozzle segments 501, one second nozzle segment 502, and two transition nozzle segments 503. The two first nozzle segments 501 are respectively located at opposite ends of the nozzle 50, and the second nozzle segment 502 is located between the two first nozzle segments 501 at a central portion of the nozzle 50. The second nozzle segment 502 is positioned lower than the two first nozzle segments 501. The two transition nozzle segments 503 are used to connect the first nozzle segment 501 with the second 'nozzle segment 502. Compared with the first embodiment, the difference is that the transition nozzle section 503 is inclined to be connected with the first nozzle section 501 and the second nozzle section 502, and the transition nozzle section 503* is extended with the first nozzle section 501 and the second nozzle section 502. The angle between the lines is an acute angle, and the angle of the angle can be 45 to 60 degrees. In addition, the transition nozzle segment 503 may further be provided with a plurality of nozzles 55 facing the printed circuit board 30. The distance from the plurality of nozzles 55 to the etched surface 301 of the printed circuit board 30 is close to the first nozzle segment 501 - the end To the second nozzle segment 502 - the end gradually decreases. Two first nozzle segments 501 at each end of each nozzle 50 are in communication with a liquid conduit 58 to form an etchant passage. The etchant enters the plurality of nozzles 50 through the liquid conduit 58, and is sprayed from the nozzles 55 on the respective nozzle segments. 1315168 When the squeezing device 200 is used for etching the printed circuit board 30, the arrangement direction of the plurality of nozzles 50 is aligned with the traveling direction A of the printed circuit board 30, and the two nozzles 501 are attached to the printed circuit board. The distance of the etched surface 301 is relatively high. Preferably, the distance between the two first nozzle segments 501 and the printed circuit board 30# surface 301 may be equal. The second nozzle segment 502 is closer to the etched surface 301 of the printed circuit board 30 and less than the distance from the first nozzle segment 501 to the etched surface 3〇1 of the printed circuit board 30. The second nozzle segment 5〇2 to the printed circuit board 30 etches the surface 3〇1 by a distance of about 30% to 50% of the distance between the first nozzle segment 5〇1 and the printed circuit board such as the silver-engraved surface. The advantage of the above-mentioned blasting device is that: by changing the pressure at the nozzle to the surface of the printed circuit board, the flow rate of the liquid surface of the circuit board is swept to the center of the printed circuit board. It is larger than the flow rate of the injection to the edge portion, accelerating the renewal of the money engraving in the central area of the printed circuit board, forming a uniform thickness on the surface of the printed circuit board, effectively reducing the occurrence of the pool effect. 'Improving the printed circuit board etching brakes, the invention is in accordance with the invention. Patent requirements, 提出 提出 提出 I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I Equivalent modifications or changes made by the spirit shall be within the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of an embodiment of an erosion device. Figure 2 is a schematic view showing the structure of the nozzle of the first embodiment of the money spraying device with respect to the surface of the printed circuit board. Figure 3 is a schematic view of the second embodiment of the erosion device. Figure 4 is a schematic view showing the structure of the nozzle of the second embodiment of the etching apparatus with respect to the etching surface of the printed circuit board. [Main component symbol description] Corrosion device 100 '200 Nozzle 40, 50 First nozzle segment 401 > 501 Second nozzle segment 402 ' 502 Transition nozzle segment 403 > 503 Nozzle 45 ' 55 Depot 48 > 58 printed circuit board 30 money engraved surface 301
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