1293651 九、發明說明·· • τ發明所屬之技術領域】 - 本發明涉及一種蝕刻液喷射裝置及一種蝕刻方法，尤 其涉及一種用於蝕刻水平放置之基板之蝕刻液噴射裝置及 一種蝕刻方法。 【先前技術】 印刷電路板(Printed Circuit Board, PCB)作爲各種電子 元件之載體廣泛應用於各種電子産品之封裝。出於對撓性 Φ之需求，近年來柔性電路板(Flexible Printed Circuit Board， FPCB)發展迅速。相較於PCB，FPCB採用可撓曲基材，然 FPCB之生産制程與PCB大體相似。 蝕刻製程係PCB製造之一個基本生産步驟：首先採用 抗蝕劑蓋住覆銅板上需保留之導線及元器件引腳，利用蝕 刻液去除未被抗蝕劑覆蓋部分之銅層，生成需要之導電線 路。而目前由於電子技術之飛速發展，對於電路板集成度 要求越來越高，電路板上之導電線路寬度也越來越小，同 ⑩一電路板上導電線路之尺寸公差也要盡可能之小。這要求 蝕刻製程中之蝕刻效果盡可能保持一致。 水平濕製程生產線自動化程度較高’因而成本較低’ PCB製造商在生産中使用較多。此種製程中採用水平滾輪 帶動電路板，利用喷管陣列上之喷嘴向電路板上下表面上 同時喷灑餘刻液，其中每個喷管上可安裝複數喷嘴。但濕 製程之蚀刻過程中無法避免水坑效應（Puddle Effect)。 所謂水坑效應，係指電路板上板面上餘刻效果不同’ 1293651 、明確之說，電路板中央部位之姓刻速率要比邊緣部分之餘 刻速率要慢。此係由於水平濕製程蝕刻線路時，利用喷嘴 同時向整個板面上喷射姓刻液。現有之㈣設備中，藉由 ，改變喷射角度以及在噴射時旋轉喷嘴等手段使得噴射時整 個電路板面上可以得到均勻量之蝕刻液。但對於電路板上 表面其邊緣處之蝕刻液容易流走，從而電路板邊緣部分 之蝕刻液更新速度快，蝕刻速度快。而電路板中央部位之 蝕刻液不易流走，這部分蝕刻液會形成一個“水坑”，從 而阻擋電路板中央部位處蝕刻液之更新，線路板之銅層接 觸蝕刻液係已反應過，蝕刻能力較低，相較於電路板邊緣 部分，蝕刻速度低。電路板表面上不同地方蝕刻速度之差 異會導致線路寬度之不均勻。爲了保護足夠之線寬，不得 不對電路板邊緣部分之線路預留多餘之線寬，從而降低了 電路板中之線路密度。 以上僅以電路板爲例說明水坑效應，然對水平放置之 鲁基板進行蝕刻時都存在水坑效應。 有鑒於此，有必要提供一種可克服水坑效應，從而可 提高餘刻均勻性，進而提高水平板蝕刻精度之蝕刻液喷射 裝置。 【發明内容】 以下以實施例說明一種可克服水坑效應之蝕刻液喷射 裝置’從而提高蝕刻均勻性，進而可提高蝕刻精度之蝕刻 液喷射裝置，及一種蝕刻方法。 該蝕刻液喷射裝置包括複數根喷管、複數個安裝在該 1293651 喷管上之喷嘴及增壓裝置，該增壓裝置增加該喷管中之喷 射壓力使得用于向待㈣電路板中央部分噴射㈣液之喷 嘴喷射壓力高於向待射彳電路板邊緣部分喷射㈣液之喷 嘴之喷射壓力。 該蝕刻方法使用複數個安裝於複數噴管上之喷嘴向電 ，板表面上喷射蝕刻液，並使用增壓裝置增加該喷管内之 壓力’使向電路板中央部位喷射姓刻液之噴嘴之喷射壓力 大於用於向電路板邊緣處喷射蝕刻液之嘴嘴之喷射壓力。 該蝕刻液喷射裝置及蝕刻方法中，可利用增壓裝置使 用于白待钱刻基板中央部分喷射韻刻液之喷嘴之喷射壓力 增高，因此⑽m喷射速度^，絲巾央部分之關液更 新較慢高速度快，可平衡由於水坑效應對基板中央 部分影響，可得到整個板面蝕刻效果均句之基板，從而蝕 刻精度得以提高。 【實施方式】 參閱圖1，第一實施例之蝕刻液噴射裝置包括泵iia、 ^lb’閥門12a、12b，多根噴管13及增壓裝置16。每個喷 管13上安裝有複數喷嘴14。各喷管13之間可相互平行設 田然噴官13之間也可成一定角度設置。增壓裝置16 β爲+泵，每個喷官13中央部位上設有注液孔b。增壓裝置 Μ藉由注液孔15向喷管13内注入蝕刻液，從而提高喷管 生中央部位之噴射壓力。還可藉由注液孔15向喷管13内 吾入二氣、氧氣等可促進蝕刻反應進行之氣體，從而中央 邛位噴射出之含有上述氣體之蝕刻液與兩端之蝕刻液相 1293651 .比，具有更強之蝕刻能力，蝕刻速度更快，可抵消中央部 也之水坑效應對蝕刻之影響。 、° '使用本實施例之蝕刻液喷射裝置蝕刻水平放置之基板 時，本實施例中以電路板爲例進行說明，電路板17沿^工 中箭頭所示方向前進，其與喷管13垂直或成一定角度。打 開閥門12a、m及果lla、llb、泵lla、m向各喷又管^ 兩側向其中輸送㈣液。對於電路板，常用之刻液爲氯 化亞銅溶液。當然根據所要蝕刻之材質之不同，可以選擇 相應之餘刻液’餘刻液-般選擇爲待姓刻材質之高價形離 溶液，例如蝕刻鐵可選擇氯化鐵溶液，此種選擇之優點: 於不引入其他雜質。泵16向藉由注液孔15向喷管U中央 部位輸送蝕刻液。 、 、 可藉由調整增壓裝置16,使得喷管13中央部位喷BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching liquid ejecting apparatus and an etching method, and more particularly to an etching liquid ejecting apparatus for etching a horizontally placed substrate and an etching method. [Prior Art] Printed Circuit Board (PCB) is widely used as a carrier for various electronic components in various electronic product packages. In recent years, the Flexible Printed Circuit Board (FPCB) has developed rapidly due to the demand for flexibility Φ. Compared to PCBs, FPCBs use flexible substrates, but FPCB production processes are similar to PCBs. Etching process is a basic production step of PCB manufacturing: firstly, the resist is used to cover the wires and component leads to be retained on the copper clad plate, and the copper layer not covered by the resist is removed by the etching solution to generate the required conductive line. At present, due to the rapid development of electronic technology, the integration requirements of the circuit board are getting higher and higher, the width of the conductive line on the circuit board is getting smaller and smaller, and the dimensional tolerance of the conductive line on the same circuit board is as small as possible. . This requires that the etching effect in the etching process be as uniform as possible. Horizontal wet process lines are more automated and therefore less expensive. PCB manufacturers use more in production. In this process, a horizontal roller is used to drive the circuit board, and the nozzles on the nozzle array are used to simultaneously spray the residual liquid onto the lower surface of the circuit board, wherein a plurality of nozzles can be mounted on each nozzle. However, the Puddle Effect cannot be avoided during the etching process of the wet process. The so-called puddle effect refers to the difference in the effect of the remaining surface on the board. ' 1293651. Specifically, the rate of the last part of the board is slower than the margin of the edge. This is because the horizontal wet process etches the line, and the nozzle is simultaneously sprayed onto the entire surface by the nozzle. In the conventional (4) apparatus, a uniform amount of etching liquid can be obtained on the entire circuit board surface by means of changing the injection angle and rotating the nozzle during spraying. However, the etching liquid at the edge of the surface of the circuit board easily flows away, so that the etching liquid at the edge portion of the circuit board is refreshed at a high speed and the etching speed is fast. The etching liquid in the central part of the circuit board is not easy to flow away. This part of the etching liquid forms a "puddle", thereby blocking the renewal of the etching liquid at the central portion of the circuit board. The copper layer of the circuit board contacts the etching liquid system and has been etched. The ability is lower, and the etching speed is lower than the edge portion of the board. Differences in etch rate at different locations on the surface of the board can result in uneven line widths. In order to protect enough line width, extra line width must be reserved for the line at the edge of the board, which reduces the line density in the board. The above only uses the circuit board as an example to illustrate the puddle effect, but there is a puddle effect when etching the horizontally placed Lu substrate. In view of the above, it is necessary to provide an etching liquid ejecting apparatus which can overcome the puddle effect, thereby improving the uniformity of the residual surface and thereby improving the etching precision of the horizontal plate. SUMMARY OF THE INVENTION An etching liquid ejecting apparatus which can improve the etching uniformity and improve the etching precision, and an etching method, will be described below by way of an embodiment. The etchant injection device includes a plurality of nozzles, a plurality of nozzles mounted on the 1293651 nozzle, and a pressurizing device that increases an injection pressure in the nozzle for injecting into a central portion of the circuit board to be (four) (4) The nozzle pressure of the liquid nozzle is higher than the injection pressure of the nozzle which sprays the liquid to the edge portion of the circuit board to be fired. The etching method uses a plurality of nozzles mounted on a plurality of nozzles to eject an etchant onto the surface of the board, and uses a pressurizing device to increase the pressure in the nozzle to eject a nozzle of a nozzle of a surname to the central portion of the board. The pressure is greater than the injection pressure of the nozzle for ejecting the etchant to the edge of the board. In the etching liquid spraying device and the etching method, the injection pressure of the nozzle for jetting the rhyme liquid in the central portion of the white plate can be increased by using the supercharging device, so that the (10) m injection speed ^, the liquid closing of the central portion of the silk scarf is improved. The slow and high speed is fast, and the influence of the puddle effect on the central portion of the substrate can be balanced, and the substrate of the entire plate surface etching effect can be obtained, so that the etching precision is improved. [Embodiment] Referring to Fig. 1, an etching liquid spraying device of a first embodiment includes a pump iia, a valve 11a, 12b, a plurality of nozzles 13, and a supercharging device 16. A plurality of nozzles 14 are mounted on each of the nozzles 13. The nozzles 13 can be arranged in parallel with each other. The field nozzles 13 can also be disposed at a certain angle. The pressurizing device 16 β is a + pump, and a liquid injection hole b is provided in a central portion of each of the spray nozzles 13 . The supercharging device 注入 injects the etching liquid into the nozzle 13 through the liquid injection hole 15, thereby increasing the injection pressure at the center portion of the nozzle. It is also possible to introduce a gas which can promote the etching reaction into the nozzle 13 through the liquid injection hole 15, so that the etching liquid containing the gas and the etching liquid phase at the both ends which are ejected by the central enthalpy can be 129365. Compared with the stronger etching ability, the etching speed is faster, which can offset the influence of the puddle effect in the central part on the etching. When the substrate placed horizontally is etched by using the etching liquid ejecting apparatus of the present embodiment, the circuit board is taken as an example in the embodiment, and the circuit board 17 is advanced in the direction indicated by the arrow in the middle, which is perpendicular to the nozzle 13. Or at a certain angle. The valves 12a, m and the fruits 11a, 11b, and the pumps 11a, m are opened to the respective sides of the spray tubes to deliver the (four) liquid thereto. For the circuit board, the commonly used engraving solution is a cuprous chloride solution. Of course, depending on the material to be etched, the corresponding residual liquid 'removal liquid' can be selected as the high-priced dissolving solution of the material to be engraved, for example, the iron can be selected from the etched iron. The advantages of this choice are as follows: Do not introduce other impurities. The pump 16 supplies the etching liquid to the central portion of the nozzle U through the liquid injection hole 15. , the central portion of the nozzle 13 can be sprayed by adjusting the supercharging device 16
喷=噴管兩側喷嘴之倾高。從而噴管13中央部位 :喷鳴噴出之蝕刻液對電路板17表面之 電路Π央部分之刪更新率提高，其银刻速度提高， 刻速度之提高可抵消電路板16中央部分之水坑 =應如=在電純17整個上表面上得到均勻之钱刻效 反庫之ϋί人空亂或者減，由於氧氣之存在可加速钱刻 抵消水坑效應。具體地，可調整增壓裝 :力:=管13令央部位之遷力比喷管兩側之 屢力回5%〜20%。以喷管13中央部位之 平方釐米（lcgf/cm2)爲例，嗔管 π *、、、Spray = the height of the nozzle on both sides of the nozzle. Therefore, the central portion of the nozzle 13 is etched by the squirting liquid, and the erection rate of the circuit portion of the surface of the circuit board 17 is increased, and the stencil speed is increased, and the etch rate is increased to offset the puddle of the central portion of the circuit board 16 = Should be as = on the entire surface of the electric pure 17 to get a uniform amount of money, anti-library ϋ 人 people empty or reduced, due to the presence of oxygen can accelerate the money to offset the puddle effect. Specifically, the pressurization device can be adjusted: force: = tube 13 makes the relocation force of the central portion more than 5% to 20% of the force on both sides of the nozzle. Taking the square centimeter (lcgf/cm2) of the central portion of the nozzle 13 as an example, the fistula π *, ,,
kgf/cm2。 嘴“3兩側之壓力可冑L6W 1293651 參閱圖2’第二實施例之蝕刻液喷射裝置包括閥門21、 襄 22 及喷管 23a、24b、24c、24d、24e、24f、24g、24h。 每根喷管上安裝有複數個喷嘴24及壓力計25。壓力計25 用於監視喷管内之壓力。喷管23d、23e上還安裝有增壓裝 置26，增壓裝置26可爲泵，用於給喷管23d、23e增加喷 射壓力。當然每根噴管上都可設有增壓裝置，從而可對每 根喷管内之壓力進行調節。 使用本實施例之蝕刻液喷射裝置蝕刻電路板時，電路 板27 圖2中箭頭所示方向前進，其與喷管平行或成一定 角度。打開閥門22及泵21、泵21向各喷管中輸送蝕刻液。 增壓裝置26用於給喷管23d、23e增加喷射壓力。具體地， 可调整增壓裝置26之輸出功率使喷管23d、23e内之壓力 比喷管兩侧之壓力高5%〜2〇%。對於每根喷管上都設有增壓 裝置26之情形，喷管24e、24f、24g、24h中之壓力可依次 降低5%〜20%，喷管24d、24c、⑽、23a中之壓力可依次 降低5%〜20%。 參閱圖3,第三實施例之儀刻液喷射裝置與第一實施例 之，刻液喷射裝置相似，不同之處在於縣裝置％爲設於 ，官33中央部位之加熱裝置，加熱裝置可由電阻絲纏繞喷 g 33而成，當喷官33内流過蝕刻液時，加熱裝置可對其 中之餘刻液進行加熱’從而噴管33中央部狀⑽液受熱 膨脹壓力增高，喷管33中央部位之嘴対射速度較快，相 應的，電路板表面上之_液更新率加快，㈣速度增加， 可抵消水坑效應。另外由於餘刻液溫度之增加，㈣反應 1293651 之速度也加快。對於化學反應，根據粗略之估計，反應溫 皮增加ίο攝氏度，則反應速度大約增加一倍。中央部分反 應速度之增加可進一步抵消水坑效應。 參閱圖4,第四實施例之蝕刻液喷射裝置與第二實施例 之蝕刻液喷射裝置相似，不同之處在於增壓裝置46爲設置 在噴管43d、43e上之加熱裝置，此處之加熱裝置之結構與 作用均與第三實施例中之加熱裝置相似。 > 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係第一實施例之蝕刻液噴射裝置示意圖。 圖2係第二實施例之姓刻液喷射裝置示意圖。 | 圖3係第二實施例之钱刻液喷射裝置示意圖。 圖4係第四實施例之蝕刻液喷射裝置示意圖。 【主要元件符號說明】Kgf/cm2. The pressure on both sides of the mouth can be 胄L6W 1293651. Referring to Fig. 2', the etching liquid spraying device of the second embodiment includes a valve 21, a weir 22 and nozzles 23a, 24b, 24c, 24d, 24e, 24f, 24g, 24h. A plurality of nozzles 24 and a pressure gauge 25 are mounted on the root nozzle. The pressure gauge 25 is used to monitor the pressure in the nozzle. The nozzles 23d, 23e are also provided with a pressurizing device 26, which may be a pump for The injection pressure is increased to the nozzles 23d, 23e. Of course, a supercharging device can be provided on each of the nozzles, so that the pressure in each nozzle can be adjusted. When the circuit board is etched by using the etching liquid spraying device of the embodiment, The circuit board 27 is advanced in the direction indicated by the arrow in Fig. 2, which is parallel or at an angle to the nozzle. The valve 22 and the pump 21 and the pump 21 are opened to deliver the etching liquid to each of the nozzles. The supercharging device 26 is used for the nozzle 23d. 23e increases the injection pressure. Specifically, the output of the supercharging device 26 can be adjusted so that the pressure in the nozzles 23d, 23e is 5% to 2% higher than the pressure on both sides of the nozzle. For each nozzle In the case of the supercharging device 26, the pressure in the nozzles 24e, 24f, 24g, 24h can be sequentially 5%~20% lower, the pressure in the nozzles 24d, 24c, (10), 23a can be reduced by 5%~20% in turn. Referring to Fig. 3, the priming apparatus of the third embodiment is inscribed with the first embodiment. The liquid ejecting device is similar, except that the county device % is a heating device located at the central part of the official 33, and the heating device can be formed by winding the electric resistance wire g 33. When the etching liquid flows through the spray nozzle 33, the heating device can be The remaining liquid is heated, so that the central portion (10) of the nozzle 33 is heated and the pressure is increased, and the nozzle at the center of the nozzle 33 is faster, and accordingly, the liquid renewal rate on the surface of the circuit board is increased. (4) The speed increases, which can offset the puddle effect. In addition, due to the increase of the temperature of the residual liquid, (4) the speed of the reaction 1293651 is also accelerated. For the chemical reaction, according to the rough estimate, the reaction temperature increases by ίο ° C, the reaction speed is approximately doubled. The increase of the central portion reaction speed can further offset the puddle effect. Referring to Fig. 4, the etching liquid ejecting apparatus of the fourth embodiment is similar to the etching liquid ejecting apparatus of the second embodiment, except that the pressurizing device is installed. 46 is a heating device disposed on the nozzles 43d, 43e, and the structure and function of the heating device herein are similar to those of the third embodiment. > In summary, the present invention has indeed met the invention patent The patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, which is not intended to limit the scope of the patent application of the present invention. Those who are familiar with the art of the present invention will be assisted by the spirit of the present invention. The following is a description of the etching liquid ejecting apparatus of the first embodiment. Fig. 2 is a schematic view of the surname ejecting apparatus of the second embodiment. Fig. 3 is a schematic view showing the money injecting device of the second embodiment. Fig. 4 is a view showing the etching liquid ejecting apparatus of the fourth embodiment. [Main component symbol description]
噴管 13, 23a，23b，23c，23d，23e，23f，23g，23h， 33,43d，43e 果 11a，11b，21 閥門 12a，12b，22 S主液孔 15 增壓裝置 16, 26, 36, 46 電路板 流量計 17, 27 25 喷嘴 14, 24 11Nozzles 13, 23a, 23b, 23c, 23d, 23e, 23f, 23g, 23h, 33, 43d, 43e 11a, 11b, 21 Valves 12a, 12b, 22 S Main orifice 15 Booster 16 , 26 , 36 , 46 Circuit Board Flowmeters 17, 27 25 Nozzles 14, 24 11