200808141 九、發明說明： 气 【發明所屬之技術領域】 本發明關於一種用於印刷電路板蝕刻之裝置，尤其涉 及一種用於向印刷電路板喷灑钱刻液之喷餃裝置。 【先前技術】 蝕刻過程係印刷電路板生産過程中基本步驟之一，係 使印刷電路板基板上沒有被抗蝕層保護之銅與蝕刻液發生 反應而被钱刻掉，最終形成設計線路圖形之過程。 印刷電路板於進行蝕刻時，蝕刻液由基板上方之喷钱 裝置喷射到基板表面。一般印刷電路板蝕刻所用喷蝕裝置 包括複數根等長平行排列設置之直線形喷管，每根喷管上 設有複數個喷嘴，通過喷嘴可朝印刷電路板表面喷灑钱刻 液，以钱刻印刷電路板基板，將印刷電路板基板上未被抗 蝕層保護之銅去除。 惟，使用直線形喷管之喷蝕裝置進行印刷電路板蝕刻 時，由於各個喷嘴之喷壓一致，會使印刷電路板上靠近邊 緣部分，蝕刻液更容易流出板外，而於印刷電路板上中央 位置，比較容易積留較多蝕刻液，形成“水池”，從而產 生“水池效應”。印刷電路板蝕刻過程中出現“水池效 應會使印刷電路板中央區域之钱刻液更新較慢，積留之 姓刻液膜會降低對線路之咬姓量，容易發生線路钱刻不 足’而印刷電路板靠近邊緣部分之蝕刻液流動速度快，更 新較快，容易發生線路過蝕。因此，“水池效應，，最終會 200808141 導致印刷電路板上姓刻不均勻，特別容易使印刷電路板中 矣區域之線路連線，從而造成短路。 有鑑於此，提供一種用於印刷電路板蝕刻之喷蝕裝 置，以有效減少‘‘水池效應，，之影響，改善喷蝕裝置蝕刻 之均勻性實屬必要。 【發明内容】 以下以實施例說明一種用於印刷電路板蝕刻之噴蝕弟 置。 、、 所述用於印刷電路板蝕刻之噴蝕裝置，包括複數根^ 管。每根喷管包括兩個第一噴管段、一個第二噴管段及两 個過渡，管段。該兩個第一喷管段分別位於喷管兩端，謂 第一喷官段位於兩個第一喷管段之間，該兩個過渡喷管甚 用於連接第-喷管段與第二噴管段。該第二喷管段位置之 設置低於該第-喷管段。該第一喷管段及第二喷管段上毅 有複數個喷頭。 所述用於印刷電路板钱刻之喷姓裝置，包括複數根喷 管。每根噴管包括兩個第—喷管段、—個第二噴管段及兩 ，過渡？管段。該兩個第—噴管段分別位於喷管兩端，該 第一噴官段位於兩個第—噴管段之間，該兩個過渡喷管段 =於連接第-喷管段與第二喷管段。該第二喷管段到印刷 電，板㈣表面之距離小於該第—喷管段到印刷電路板姓 刻表面之距離。該第—衫段及第二喷管段 朝向印刷電路板之噴頭。 线致個 相對於先前技術，通過改變喷管結構來調整兹刻液喷 7 200808141 之壓力，從而調整喷灑到印刷電路 使噴射到印刷電路板中央區域之流 之流量，加速印刷電路板中央區域 路板表面形成厚度均勻之蝕刻液， ’改善印刷電路板钱刻之均勻性。 一種用於印刷電路板蝕刻之喷钕裝 灑到印刷電路板蝕表面 板蝕表面之蝕刻液量， 畺大於喷射到邊緣部分 姓刻液更新，使印刷電 有效減少水池效應發生 【實施方式】 以下將實施例說明 置。 請參閲圖1與圖2，實施例一提供之用於印刷電路板蝕 刻之喷蝕裝置1〇〇，其包括複數根喷管40。 複數根噴管40呈平行排列。每根噴管4〇包括兩個第 實& ^又401 個弟_喷管段402及兩個過渡喷管段4〇3。 該兩個第一喷管段401分別位於喷管4〇之兩端，該第二喷管 段402位於兩個第一喷管段4〇1之間，位於噴管中央部 刀該第一噴官段402位置之設置低於該兩個第一喷管段 401。該兩個過渡噴管段·用於連接第—噴管段術盘第二 喷管段402。過渡噴管段與第一噴管段々 二嘖 402垂直連接。 只s千又 該第一喷管段401及第二喷管段4〇2上設有複數個朝向 印刷電路板默喷頭45。該設于第—噴管段概及第二喷管 段402上複數個喷頭45爲等間距排列，該喷頭“之噴孔爲圓 形或橢圓形。爲更好提高_均勻性，減少水池效應，可 選地’没于第二喷管段402上之複數個噴頭45之間距小於設 于第一喷管段401上之複數個喷頭45之間距。 、° 200808141 每根噴管40兩端之兩個第一喷管段4〇1分別與導液管 48相連通，以形成ϋ刻液通路。银刻液通過導液管48進入 導複數根噴管40中，再由各個噴管段上之噴頭45噴灑出來。 喷姓裝置100用於印刷電路板30姓刻時，該複數根喷管 40之排列方向與印刷電路板30之行進方向a —致，該兩個 第一喷管段401到印刷電路板30蝕刻表面301之距離較遠。 優選地，該兩個第一喷管段4〇1與印刷電路板3〇蝕刻表面 301之距離可以相等。該第二噴管段4〇2到印刷電路板如蝕 ⑩刻表面301距離較近，且小於該第一喷管段4〇1到印刷電路 板30儀刻表面3〇1之距離。第二喷管段4〇2到印刷電路板3〇 蝕刻表面301距離約爲第一喷管段4〇1到印刷電路板3〇蝕刻 表面301距離之30%〜50%。 由於喷官40各處之壓力一致，而位於中央部分之第二 噴管段402到印刷電路板3〇蝕刻表面3〇1距離較近，因此， 蝕刻液喷灑到印刷電路板3〇蝕刻表面3〇1之壓力較大，喷灑 書到印刷電路板30蝕刻表面301中央之蝕刻液量亦相應較 大，這樣’餞刻表面3〇1中央區域之钱刻液之更新速度加 陕，從而減少钱刻液於敍刻表面中央區域之蓄積，使钱 刻表面301中央區域與邊緣區域形成之蝕刻液膜厚度均 勻，以增強對印刷電路板3〇中央區域線路之蝕刻能力，減 夕水池效應之影響。另外，由於位於中央部分之第二喷管 #又402上之喷頭45間距較小，個數較多，就可增加喷射到印 刷電路板30蝕刻表面301中央之蝕刻液量，進一步加速蝕刻 表面301中央區域之蝕刻液更新速度，增加蝕刻液之噴灑到 9 200808141 印刷電路板30蚀刻表面逝之壓力，使钱刻I面皿中央區 威與邊緣區域形成之蝕刻液膜厚度均勻，以增強對印刷電 路板30中央區域線路之蝕刻能力，減少水池效應之影響。 請參閱圖3與圖4，實施例二提供之用於印刷電路^ 刻之贺姓裝置200 ’其包括複數根噴管％。 用於印刷電路板蝕刻之噴蝕裝置200與用於印刷電路 板姓刻之喷姓裝置100之結構大致相同。 j複數根喷管5G呈平行排列。每根噴管5G包括兩個第 一喷管段501、一個第二喷管段5〇2及兩個過渡喷管段5〇3。 該兩個第一喷管段501分別位於噴管5〇之兩端，該第二噴管 段502位於兩個第一喷管段5〇1之間，位於噴管5〇中央部 刀該弟一喷ΐ 4又502位置之設置低於該兩個第一喷管段 501。該兩個過渡喷管段503用於連接第一噴管段5〇1與第二 喷管段502 〇 與第一實施例相比，區別在於該過渡噴管段5〇3係傾斜 之與第一喷管段501與第二噴管段5〇2連接，過渡喷管段5〇3 與第-喷管段谢與第二喷管段5〇2延長線之夾角爲銳角， 夾角之角度可爲45〜60度。另外，該過渡噴管段5〇3上亦可 進一步設有複數個朝向印刷電路板3〇之喷頭55，該複數個 喷頭55到印刷電路板3〇蝕刻表面3〇1之距離從靠近第一喷 管段501 —端到靠近第二噴管段5〇2 一端逐漸減小。 每根噴管50兩端之兩個第一噴管段5〇1分別與導液管 58相連通，以形成蝕刻液通路。蝕刻液通過導液管％進入 導複數根喷管50中，再由各個喷管段上之喷頭55噴灑出來。 200808141 _喷蝕裝置200在用於印刷電路板3〇蝕刻時，該複數根喷 管50之排列方向與印刷電路板3〇之行進方向a一致，該兩 摘第一喷官段501到印刷電路板30蝕刻表面301之距離較 遠。優選地，該兩個第一喷管段5〇1與印刷電路板3〇蝕刻表 面301之距離可以相等。該第二喷管段502其到印刷電路板 匕〇勉刻表面3〇1距離較近’且小於該第一嘴管段則到印刷 電路板30蝕刻表面3〇1之距離。第二噴管段到印刷電路 _ f3:刻表面301距離約爲第一喷管段5_|]印刷電路板30 餘刻表面3〇 1距離之3〇%〜5〇%。 二述噴蝕裝置之優點在於：通過改變喷管結構來調整 印刷電路板餘表面之壓力，從 之崎量，使喷射到印刷電路= 大於喷射到邊緣部分之流量，加速印刷電路板 中央區域蝕刻液之f靳，# < 疋I剕电路扳 •之均句性。 政應發生，改善印刷電路板蝕刻 士综上所述’本發明符合 担 利申請。惟，以上所述者利要#没依法&出專 發明之範圍並不以上明之較佳實施方式，本 之人士，在援依本荦發明^ ’舉凡熟悉本案技藝 應包含於以下之申精神所作之等效修倚或變化，皆 【圖式簡單說專利範圍内。 圖1係實施例一噴蝕裝 圖2係實施例一嗔財置置之^圖。 Χ置之噴管相對於印刷電路板蝕刻 11 200808141 表面之結構示意圖。 ‘ 圖3係實施例二喷蝕裝置之示意圖。 ^ 圖4係實施例二喷蝕裝置之喷管相對於印刷電路板蝕刻 表面之結構不意圖。 【主要元件符號說明】 喷蝕裝置 100 > 200 喷管 40、50 第一喷管段 401 、 501 第二喷管段 402 ^ 502 過渡喷管段 403 ^ 503 喷頭 45、55 導液管 48 > 58 印刷電路板 30 钱刻表面 301200808141 IX. INSTRUCTION DESCRIPTION: GAS FIELD OF THE INVENTION The present invention relates to an apparatus for etching a printed circuit board, and more particularly to a dumpling apparatus for spraying money engraving liquid onto a printed circuit board. [Prior Art] The etching process is one of the basic steps in the production process of a printed circuit board. The copper which is not protected by the resist layer on the printed circuit board substrate is reacted with the etching liquid to be engraved, and finally the design line pattern is formed. process. When the printed circuit board is etched, the etchant is ejected onto the substrate surface by a money ejecting device above the substrate. Generally, the etching device used for etching the printed circuit board comprises a plurality of linear nozzles arranged in parallel and arranged in parallel, each nozzle is provided with a plurality of nozzles, and the nozzle can spray money engraving on the surface of the printed circuit board to the money. The printed circuit board substrate is engraved to remove copper that is not protected by the resist layer on the printed circuit board substrate. However, when the printed circuit board is etched by using the etching device of the linear nozzle, since the spray pressure of each nozzle is uniform, the printed circuit board is close to the edge portion, and the etching liquid is more likely to flow out of the board, and on the printed circuit board. In the central position, it is easier to accumulate more etching liquid to form a "pool", resulting in a "pool effect." During the etching process of the printed circuit board, "the pool effect will make the money engraving in the central area of the printed circuit board update slower. The accumulated engraved film will reduce the bite of the line, and it is easy to occur." The etchant near the edge of the board has a fast flow rate and a fast update, which is prone to line over-corrosion. Therefore, the "pool effect, eventually 200808141 leads to unevenness on the printed circuit board, which is particularly easy to make printed circuit boards The line of the area is connected, causing a short circuit. In view of this, it is necessary to provide an etching apparatus for printed circuit board etching to effectively reduce the 'water pool effect, and to improve the uniformity of etching of the etching apparatus. SUMMARY OF THE INVENTION An etching method for printed circuit board etching will be described below by way of example. The etching device for etching a printed circuit board includes a plurality of tubes. Each nozzle includes two first nozzle segments, one second nozzle segment, and two transitions, pipe segments. The two first nozzle segments are respectively located at two ends of the nozzle, that is, the first nozzle section is located between the two first nozzle sections, and the two transition nozzles are even used to connect the first nozzle section and the second nozzle section. The second nozzle segment position is set lower than the first nozzle segment. The first nozzle section and the second nozzle section have a plurality of nozzles. The device for printing a circuit board, including a plurality of nozzles. Each nozzle includes two first nozzle sections, one second nozzle section and two transitions? Pipe section. The two first nozzle sections are respectively located at two ends of the nozzle, and the first spray section is located between the two first nozzle sections, and the two transition nozzle sections are connected to the first nozzle section and the second nozzle section. The second nozzle segment is printed to the surface of the board (4) at a distance less than the distance from the first nozzle segment to the surface of the printed circuit board. The first shirt segment and the second nozzle segment face the showerhead of the printed circuit board. Compared with the prior art, the line adjusts the pressure of the liquid jet 7 200808141 by changing the nozzle structure, thereby adjusting the flow rate of the flow sprayed onto the printed circuit to the central area of the printed circuit board, and accelerating the central area of the printed circuit board. An etchant with a uniform thickness is formed on the surface of the board, which improves the uniformity of the printed circuit board. An etchant for etching a printed circuit board onto the etched surface of the printed circuit board, the etchant is larger than the squirting of the squirting surface of the printed circuit board, so that the printed electricity effectively reduces the pool effect [Embodiment] The description of the examples is set. Referring to Figures 1 and 2, an erosion apparatus 1 for etching a printed circuit board is provided in the first embodiment, which includes a plurality of nozzles 40. The plurality of nozzles 40 are arranged in parallel. Each nozzle 4〇 includes two first real & ^ 401 _ _ spout segments 402 and two transition spout segments 4 〇 3 . The two first nozzle segments 401 are respectively located at two ends of the nozzle 4〇, and the second nozzle segment 402 is located between the two first nozzle segments 4〇1, and the first nozzle segment 402 is located at the central portion of the nozzle. The position is set lower than the two first nozzle segments 401. The two transition nozzle segments are used to connect the second nozzle segment 402 of the first nozzle segment. The transition nozzle segment is vertically connected to the first nozzle segment 々 啧 402. Only the first nozzle segment 401 and the second nozzle segment 4〇2 are provided with a plurality of silent nozzles 45 facing the printed circuit board. The plurality of nozzles 45 disposed on the first nozzle section and the second nozzle section 402 are arranged at equal intervals. The nozzles of the nozzles are circular or elliptical. To improve the uniformity and reduce the pool effect. Optionally, the distance between the plurality of nozzles 45 that are not on the second nozzle segment 402 is less than the distance between the plurality of nozzles 45 disposed on the first nozzle segment 401. °, 200808141 Two ends of each nozzle 40 The first nozzle segments 4〇1 are respectively communicated with the liquid guiding tube 48 to form a etch liquid passage. The silver etch liquid enters the plurality of nozzles 40 through the liquid guiding tube 48, and then the nozzles 45 on the respective nozzle segments When the spray device 100 is used for the printed circuit board 30, the arrangement direction of the plurality of nozzles 40 is aligned with the traveling direction a of the printed circuit board 30, and the two first nozzle segments 401 are printed on the printed circuit board. The distance between the etched surface 301 is 30. Preferably, the distance between the two first nozzle segments 4〇1 and the etched surface 301 of the printed circuit board 3 may be equal. The second nozzle segment 4〇2 to the printed circuit board is etched. 10 engraved surface 301 is closer, and smaller than the first nozzle segment 4〇1 to the printed circuit 30 etches the distance of the surface 3〇1. The second nozzle segment 4〇2 to the printed circuit board 3〇 etching surface 301 is about 30% of the distance from the first nozzle segment 4〇1 to the printed circuit board 3〇 etching surface 301~ 50%. Since the pressures of the spray booths 40 are uniform, the second nozzle section 402 located at the central portion is closer to the printed circuit board 3 〇 etched surface 3〇1, so the etchant is sprayed onto the printed circuit board 3〇 The pressure of etching the surface 3〇1 is relatively large, and the amount of etching liquid which sprays the book to the center of the etching surface 301 of the printed circuit board 30 is also relatively large, so that the updating speed of the money engraving liquid in the central region of the engraving surface is increased. , thereby reducing the accumulation of money in the central region of the surface of the engraved surface, so that the thickness of the etching liquid film formed in the central region and the edge region of the surface 301 of the money engraving is uniform, so as to enhance the etching ability of the circuit in the central region of the printed circuit board 3 The effect of the pool effect. In addition, since the nozzles 45 on the second nozzle #402 on the central portion have a smaller pitch and a larger number, the amount of etching liquid sprayed into the center of the etching surface 301 of the printed circuit board 30 can be increased. Further accelerated etching The etchant refresh rate in the central region of the surface 301 increases the pressure of the etchant sprayed onto the etched surface of the printed circuit board 30, so that the thickness of the etchant film formed in the central region and the edge region of the I-side dish is uniform to enhance The etching ability of the circuit in the central area of the printed circuit board 30 reduces the influence of the pool effect. Referring to FIG. 3 and FIG. 4, the device for the printing circuit is provided in the second embodiment, which includes a plurality of nozzles. The etching device 200 for printed circuit board etching is substantially the same as the structure of the surname device 100 for the printed circuit board. j The plurality of nozzles 5G are arranged in parallel. Each nozzle 5G includes two firsts. The nozzle section 501, a second nozzle section 5〇2 and two transition nozzle sections 5〇3. The two first nozzle segments 501 are respectively located at two ends of the nozzle 5〇, and the second nozzle segment 502 is located between the two first nozzle segments 5〇1, and is located at the central portion of the nozzle 5〇. The position of the 4 and 502 positions is lower than the two first nozzle segments 501. The two transition nozzle segments 503 are used to connect the first nozzle segment 5〇1 with the second nozzle segment 502 〇 compared to the first embodiment, except that the transition nozzle segment 5〇3 is inclined with the first nozzle segment 501 Connected to the second nozzle section 5〇2, the angle between the transition nozzle section 5〇3 and the extension line of the first nozzle section and the second nozzle section 5〇2 is an acute angle, and the angle of the angle may be 45 to 60 degrees. In addition, the transition nozzle segment 5〇3 may further be provided with a plurality of nozzles 55 facing the printed circuit board 3, and the distance from the plurality of nozzles 55 to the printed circuit board 3 etched surface 3〇1 is close to the first A nozzle section 501 is gradually reduced from the end to the end of the second nozzle section 5〇2. Two first nozzle segments 5〇1 at each end of each nozzle 50 are in communication with a liquid conduit 58 to form an etchant passage. The etchant enters the plurality of nozzles 50 through the conduits %, and is sprayed from the nozzles 55 on the respective nozzle segments. 200808141 _ eroding device 200 is used for printing circuit board 3 〇 etching, the arrangement direction of the plurality of nozzles 50 is consistent with the traveling direction a of the printed circuit board 3 ,, the two first nozzle segments 501 to the printed circuit The plate 30 etches the surface 301 a distance away. Preferably, the distance between the two first nozzle segments 5〇1 and the printed circuit board 3 etched surface 301 may be equal. The second nozzle segment 502 is closer to the printed circuit board engraved surface 3〇1 and smaller than the distance from the first nozzle segment to the etched surface 3〇1 of the printed circuit board 30. The second nozzle segment to the printed circuit _f3: the engraved surface 301 is about 3〇%~5〇% of the distance between the first nozzle segment 5_|] and the surface of the printed circuit board 30. The advantage of the second etching device is that the pressure of the remaining surface of the printed circuit board is adjusted by changing the structure of the nozzle, so that the amount of ink jetted to the printed circuit = greater than the flow rate from the edge to the edge portion, and the central portion of the printed circuit board is etched. The liquid f靳,# < 疋I剕 circuit board • the uniformity of the sentence. The politician has occurred to improve the printed circuit board etching. The present invention is in compliance with the application. However, the above-mentioned ones are not in accordance with the law and the scope of the invention is not the preferred embodiment of the above, the person of this person, in the aid of the invention of the invention ^ 'Familiar with the skills of this case should be included in the following spirit Equivalent repairs or changes made are all within the scope of the patent. Figure 1 is a first embodiment of the etched device. The nozzle of the device is etched relative to the printed circuit board. 11 200808141 Surface structure diagram. ‘ Figure 3 is a schematic view of the second embodiment of the erosion device. Figure 4 is a schematic view of the structure of the nozzle of the second embodiment of the erosion apparatus relative to the etched surface of the printed circuit board. [Main component symbol description] Corrosion device 100 > 200 Nozzle 40, 50 First nozzle segment 401, 501 Second nozzle segment 402 ^ 502 Transition nozzle segment 403 ^ 503 Nozzle 45, 55 Depot 48 > 58 Printed circuit board 30 money engraved surface 301
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