JP2015084407A - Surface treatment device of substrate material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface treatment device of a substrate material, capable of improving processing accuracy, such as improvement of uniformity and preventing the variation of circuit width from being generated and advantageously achieved in a cost.SOLUTION: A surface treatment device 1 is formed by combining various kinds of arrangement position settings, etc., of the spray nozzles 5. The spray nozzles 5 uniformly treat a substrate material A by treatment liquids injected from the spray nozzles 5 on the basis of the combination of: setting of a positional relationship sequentially laterally shifted by a lateral shift interval K without forming a row before/after by an interval between the spray nozzles located before/after; setting of a vertical interval between the spray nozzle 5 and the substrate material A; and setting of a lateral pitch interval N between the spray nozzles 5 on the basis on the setting of the vertical interval. The lateral shift interval K is 5-25 mm, the vertical interval is 30-150 mm, especially 50-100 mm, and the lateral pitch interval N is 30-120 mm.

Description

  The present invention relates to a substrate material surface treatment apparatus. That is, the present invention relates to a substrate material surface treatment apparatus used in an electronic circuit board manufacturing process.

《Technical background》
Circuit boards used in electronic devices are making remarkable progress in miniaturization, weight reduction, ultrathinning, and flexibility, and electronic circuits to be formed are remarkably miniaturized and densified.
In such an electronic circuit board manufacturing process, a surface treatment apparatus is used, and a substrate material is surface-treated by spraying a processing liquid, thereby forming an electronic circuit and manufacturing a circuit board.

<Conventional technology>
The typical manufacturing process of such a printed wiring board and other electronic circuit boards is as follows.
First, a liquid or dry film photosensitive resist is applied or pasted on the outer surface of a substrate material made of a copper-clad laminate.
→ Then, after exposing and exposing the negative film of the circuit, → The resist other than the circuit forming portion is dissolved and removed by development, → The copper foil other than the exposed circuit shape portion is dissolved and removed by etching, → The resist at the circuit forming part is dissolved and removed by peeling.
→ By following such a process, an electronic circuit is formed from the copper foil remaining on the outer surface of the substrate material, and an electronic circuit board is manufactured.

The development process, the etching process (circuit formation process), the peeling process, and the half etching process (copper foil surface shape processing process) and the soft etching process (surface roughening process) in the preparation process are respectively developed. In a surface treatment apparatus such as an apparatus, an etching apparatus, or a peeling apparatus, a processing liquid such as a developer, an etching liquid, or a peeling liquid is sprayed from a spray nozzle onto a substrate material that is horizontally conveyed by a conveyor. Accordingly, surface treatment such as development, etching, and peeling is sequentially performed on the substrate material.
The spray nozzles for injecting the processing liquid are positioned directly above or directly below the horizontally conveyed substrate material, and a large number of spray nozzles are arranged at predetermined pitch intervals in the front-rear and left-right directions.

Examples of such a surface treatment apparatus include those shown in the following Patent Document 1 and Patent Document 2.
JP 2002-68435 A JP 2006-222117 A

By the way, the following subject was pointed out about such a conventional substrate material surface treatment apparatus.
<First problem>
First, a problem has been pointed out in the processing accuracy of the substrate material. That is, according to the conventional surface treatment apparatus, the circuit width is likely to vary in the formed circuit. In particular, with regard to etching, there is a problem in uniformity, that is, uniformity in etching depth (circuit depth), and uniformity is poor and circuit width varies.
For example, as shown in FIGS. 6 (2) and 6 (3), for the circuit B formed on the substrate material A, the etching process is delayed / insufficient, the circuit depth C becomes shallow, and the circuit width ( It was pointed out that there were places where the bottom width L was excessive, and conversely, the etching process was excessive, the circuit depth C was deep, and the circuit width L was narrow and thin. .
With respect to conventional surface treatment apparatuses, such deterioration in uniformity and variation in circuit width L have been a major problem for substrates where circuit B is becoming finer and higher in density. The current-carrying capacity, resistance value, and the like of the circuit B fluctuated with respect to the standard value, causing a failure.

<< About the cause of the first problem >>
As the cause of such a first problem, the following (a) and (b) can be considered.
(A) In the substrate processing apparatus, the workpiece size of the substrate material A to be processed is typically 600 mm × 500 mm or 500 mm × 400 mm. That is, in view of the manufacturing cost, the substrate material A several times larger than the actual substrate is used, and a plurality of small substrates can be obtained from the large substrate material A.
Thus, the large workpiece size of the substrate material A also causes, for example, deterioration of uniformity between the central portion and the peripheral portion and variations in the circuit width L.
(B) As a cause of the larger variation, in the surface treatment apparatus, a large number of spray nozzles are arranged on the front and rear sides, and on the left and right sides. They were arranged in rows in the transport direction. In other words, the spray nozzles are arranged in a plurality of rows in the front and rear transport directions with a gap in the left and right width direction.
The place where the circuit B formed there is located immediately below or just above the spray nozzle row (formed by a parallel line-like or striped locus in the front-rear transport direction) always has a strong spray pressure and injection. Due to the impact, the etching process becomes excessive, and the circuit width L becomes excessively small.
On the other hand, the spray pressure and jetting impact are weak and the liquid pool is located at the position located directly below or directly above the spray nozzle row (formed with parallel lines and striped trajectories in the front and rear transport direction). The circuit width L becomes excessive because the etching process is insufficient.
As described above, the arrangement of the spray nozzles is a cause of the deterioration of the uniformity of the substrate material A and the variation of the circuit width L.

<< Second problem >>
Secondly, the following problems (b) and (b) were also pointed out in terms of cost.
(B) As described above, the circuit B is remarkably miniaturized and densified as described above. However, in view of the occurrence of the above-described variation problem, the fine circuit (etching) is relatively simple and the manufacturing cost is reduced. It was considered difficult to manufacture with an excellent tenting method.
Therefore, a substrate of a fine circuit has been conventionally manufactured by a complicated advanced SAP method (Semi-Additive-process) or MSAP method (Modified-Semi-Additive-process), and the problem that the manufacturing cost increases is pointed out. It was.
For example, in the board material A having a copper foil thickness of 18 μm, the circuit width L and the inter-circuit space S are 40 μm to 50 μm, which is the limit of application of the tenting method. 6 (D) and FIG. 3 (D) in FIG. 6 indicates the top surface width (top width) of the circuit B.
As for (b), various technical developments have conventionally been carried out for liquid pooling and retention measures that contribute to deterioration of uniformity, variation in circuit width L, and insufficient processing such as etching. (For example, see Japanese Patent No. 4015667 and Japanese Patent No. 4117135).
However, these technologies employ a dedicated mechanism such as a swing oscillation mechanism, a horizontal swing mechanism, an oblique arrangement mechanism, a liquid reservoir vacuum mechanism, etc. for the shower tube of the spray nozzle. The problem of increasing was pointed out. In addition, although it is effective as a countermeasure against liquid accumulation and retention, it has been pointed out that it is insufficient as a countermeasure against the above-mentioned variation and the like, and in the case of an extremely thin substrate material, it sticks to a vacuum mechanism.

<< About the present invention >>
In view of such a situation, the substrate material surface treatment apparatus of the present invention has been made to solve the above-described problems of the prior art.
The first aspect of the present invention is that the processing accuracy is improved such as improvement of uniformity and the occurrence of variation in circuit width is prevented, and secondly, this is realized in an excellent cost aspect. The object is to propose a surface treatment apparatus.

<About each claim>
The technical means of the present invention for solving such a problem is as follows, as described in the claims.
About Claim 1, it is as follows.
The surface treatment apparatus for a substrate material according to claim 1 is used in a manufacturing process of an electronic circuit board. Then, the substrate material conveyed by the conveyor is subjected to surface treatment by spraying a treatment liquid from a spray nozzle. A large number of the spray nozzles are arranged on the front, rear, left and right, and are opposed to the substrate material to be conveyed.
The spray nozzle is configured to have a positional relationship in which the positions of the front and rear positions are sequentially shifted to the left and right without forming a line in the front and rear direction, the vertical distance between the spray nozzle and the substrate material, and the vertical distance The substrate material is uniformly processed with the processing liquid sprayed from the spray nozzle based on a combination with the setting of the left and right pitch interval between the spray nozzles based on the setting.

About Claim 2, it is as follows.
In the substrate material surface treatment apparatus according to claim 2, in claim 1, the surface treatment apparatus includes a development process, an etching process, a half etching process, a soft etching process, a quick etching process, or a quick etching process during the manufacturing process of the electronic circuit board. Used in the peeling process.
Therefore, the surface treatment device is used as a developing device, an etching device, or a peeling device, and the spray nozzle ejects the developer, the etching solution, or the peeling solution as the processing solution.
About Claim 3, it is as follows.
The surface treatment apparatus for a substrate material according to claim 3 is characterized in that, in claim 2, the left-right displacement interval between the front and rear positions of the spray nozzle is set to 5 mm to 25 mm. To do.
About Claim 4, it is as follows.
The substrate material surface treatment apparatus according to claim 4 is characterized in that, in claim 3, the vertical distance between the spray nozzle and the substrate material is set to 30 mm or more and 150 mm or less.

About Claim 5, it is as follows.
The substrate material surface treatment apparatus according to claim 5 is characterized in that, in claim 4, the left-right pitch interval between the spray nozzles is set to 30 mm to 120 mm.
About Claim 6, it is as follows.
In the substrate material surface treatment apparatus according to claim 6, in claim 5, the spray nozzle is of a flat type, and is provided in the horizontal direction in the horizontal direction in the development step or the etching step. It is characterized by.
About Claim 7, it is as follows.
In the substrate material surface treatment apparatus according to claim 7, in claim 5, the spray nozzle is of a flat type, and in the half etching process, the soft etching process, the quick etching process, or the peeling process, the left and right in the horizontal plane. It is characterized by being provided at a nozzle angle inclined by 4 ° or more and 10 ° or less in the front and rear conveyance directions with respect to the width direction.
About Claim 8, it is as follows.
In the surface treatment apparatus for substrate material according to claim 8, in claim 6 or 7, a plurality of shower tubes for supplying the treatment liquid are arranged in rows at predetermined left and right pitch intervals along the front-rear transport direction, or A plurality of lines are arranged at predetermined pitch intervals along the left and right width directions.
A plurality of spray nozzles are provided in the shower tube at predetermined pitch intervals.

<About the action>
Since the present invention comprises such means, the following is achieved.
(1) This surface treatment apparatus is used in an electronic circuit board manufacturing process, for example, an etching process.
(2) Thus, the processing liquid is sprayed from the spray nozzle to surface-treat the substrate material.
(3) The spray nozzle is characterized by adopting various combinations of arrangement positions and the like.
(4) That is, the spray nozzles are first set in a positional relationship in which the positions of the front and rear positions are sequentially shifted from side to side without forming a line. This left-right displacement interval is set to 5 mm to 25 mm.
(5) In addition, the height of the spray nozzle, that is, the vertical distance between the spray nozzles, is set to 30 mm to 150 mm, preferably 50 mm to 100 mm.
(6) Further, in the spray nozzle, the left-right pitch interval between them is set to 30 mm to 120 mm.
(7) The spray nozzle is typically of a flat type, and is provided at a nozzle angle inclined at 0 ° or around 0 ° in the left-right width direction, or at a nozzle angle inclined at 4 ° to 10 °. .

(8) This surface treatment apparatus employs a combination of the arrangement position setting and the like for the spray nozzle, thereby improving the processing accuracy of the substrate material and realizing uniform processing.
(9) That is, the occurrence of strong and weak portions of the treatment liquid spray impact is avoided for the substrate material, and the entire surface, average, and uniform surface treatment is performed, and the variation in the formed circuit width is eliminated. . Especially in the etching process, the uniformity of the etching depth, that is, the uniformity is improved.
(10) These can be easily realized by a simple configuration by combining the arrangement positions of the spray nozzles and the like.
(11) Further, with the elimination of variations in the formed circuit width and improvement in uniformity, a fine circuit can be manufactured by a tenting method.
(12) Although circuit width variation and uniformity can be improved, it is a matter of course that liquid accumulation and stagnation are suppressed in the process. This eliminates the need for a dedicated mechanism for preventing liquid accumulation.
(13) Then, the substrate material surface treatment apparatus of the present invention exhibits the following effects.

<< First effect >>
First, processing accuracy is improved, such as improvement in uniformity, and variations in circuit width are prevented.
In the surface treatment apparatus for a substrate material according to the present invention, the substrate material is uniformly processed by a combination of the arrangement position of the spray nozzle and the like. As in the above-described prior art, the substrate material suppresses a portion where the circuit width is excessive or a portion where the circuit width is narrow and narrow and is too small, thereby reducing variations in the circuit width. In particular, with respect to etching, uniformity is improved and variations in circuit width are reduced.
The significance of exhibiting such effects of the present invention is significant for a substrate whose circuit is becoming finer and higher in density. For example, it is avoided that the current carrying capacity, the resistance value, etc. of the circuit fluctuate with respect to the standard value as in this type of prior art, and reduction of the substrate defect is expected.

<< Second effect >>
Second, the first effect is realized with excellent cost.
In the substrate material surface treatment apparatus of the present invention, the above-described first effect can be easily realized with a simple structure and excellent cost by combining the spray nozzle arrangement position setting and the like.
In addition, according to this surface treatment apparatus, fine circuit (etching) can be manufactured by a tenting method excellent in manufacturing cost in accordance with improvement of uniformity and prevention of variation in circuit width. The necessity of the SAP method and the MSAP method, which are complicated and high in production cost, is reduced. Therefore, from this aspect, it is excellent in cost.
In addition, along with improvement of uniformity and prevention of circuit width variation, this surface treatment device may adopt a dedicated mechanism for countermeasures against liquid stagnation and stagnation that increase initial costs, as in this type of prior art. It becomes unnecessary. Therefore, it is excellent in cost from this aspect.
As described above, the effects exerted by the present invention are remarkably large, such as all the problems existing in this type of prior art are solved.

It is a top view of the principal part of a surface treatment apparatus which uses for description of the form for inventing about the surface treatment apparatus of the substrate material which concerns on this invention. An example of a surface treatment apparatus is shown for explanation of an embodiment for carrying out the invention. And (1) figure is a side view, (2) figure is a top view. It uses for description of the form for implementing this invention, and shows the other example of a surface treatment apparatus. And (1) figure is a side view, (2) figure is a top view. For explanation of the mode for carrying out the invention, (1) FIG. 3 is a side view of the main part of the example of FIG. 3, and (2) is a plan view of the main part. It serves for description of the form for implementing this invention. And (1) figure is the top view to which the principal part of the example of FIG. 3 was expanded. (2) The figure shows the measurement points of the example and is a plane explanatory view. This will be used to explain the substrate material (electronic circuit board). And (1) is a plane explanatory view of the example. (2) The figure shows an example of the formed circuit and is a cross-sectional explanatory view. (3) The figure shows another example of the formed circuit and is an explanatory front sectional view.

Hereinafter, embodiments for carrying out the present invention will be described in detail.
<< Electronic circuit board E etc. >>
The surface treatment apparatus for the substrate material A according to the present invention is used in the manufacturing process of the electronic circuit board E. First, the electronic circuit board E and the like as a premise will be generally described with reference to FIG.
The electric circuit board E is used for the electrical connection that forms the basis of AV equipment, personal computers, mobile terminals, mobile phones, digital cameras, other various electronic devices, and IT-related devices, and connects between semiconductor components. A circuit pattern is formed on the outer surface or inside of the insulating layer.
The electronic circuit board E can be divided into a single-sided board and a double-sided board, a multilayer board (including a build-up method), and other various types. It can also be divided into a rigid rigid substrate and a film-like flexible substrate.
As part of such an electronic circuit board E, a module board (semiconductor integrated package board) in which semiconductor parts such as ICs, LSI elements, passive parts, driving parts, capacitors and the like are integrated with the circuit B, Further, a glass substrate in which a semiconductor component is embedded together with a circuit B in a glass base, that is, a glass substrate for a liquid crystal LCD, CSP, PBGA, a touch panel, and the like have also appeared. In the present specification, the electronic circuit board (which may be simply referred to as a board in the present specification) E includes such a board in addition to the conventional printed wiring board.

The electronic circuit board E has made remarkable progress such as miniaturization, weight reduction, ultrathinning, and flexibility. The formed electronic circuit B (which may be simply referred to as a circuit in this specification) B is also miniaturized, Density is remarkable. The substrate material A used in the manufacturing process is typically 600 mm × 500 mm, 500 mm × 400 mm, 500 mm × 330 mm in size and about 0.06 mm to 1.6 mm in thickness.
As a method for manufacturing such an electronic circuit board E, a subtractive method (wet process method) is typical (see the above-mentioned background art section), but a semi-additive method (SAP method), and other various methods. The manufacturing method is known, and of course, the present invention is applied to the steps of such various manufacturing methods.
The electronic circuit board E and the like are as described above.

<< About the surface treatment apparatus 1 >>
Next, the surface treatment apparatus 1 will be generally described with reference to FIGS.
The surface treatment apparatus 1 is used in the manufacturing process of such an electronic circuit board E. In the processing chamber 2, the substrate material A is surface-treated by spraying the processing liquid G from the spray nozzle 5 while horizontally transporting the substrate material A in the forward and backward transport direction F on the conveyor 3.
The conveyor 3 in the illustrated example is composed of a group of wheels 4 that are vertically paired and arranged in large numbers on the front, back, left, and right. In the illustrated example, the diameter of the wheel 4 is 30 mm, the pitch between the wheels 4 is 25 mm, and the wheel 4 is partially overlapped in the transport direction F.
A large number of spray nozzles 5 are arranged in the front-rear transport direction F and the left-right width direction H, and spray the processing liquid G so as to face the substrate material A transported from above and below. In the illustrated example, the substrate material A to be conveyed is arranged in the upper and lower sides, and the front and back surfaces of the substrate material A are surface-treated.

The surface treatment apparatus 1 is used in a development process, an etching process, a half etching process, a soft etching process, a quick etching process, a peeling process, or the like during the manufacturing process of the electronic circuit board E.
In the half-etching process, as a preparation process for the substrate material A, the copper foil surface shape is processed so as to slice the copper foil thickness thinly. In the soft etching step, the copper foil surface is roughened in advance as a pretreatment step for the substrate material A. The quick etching process is performed as a post-treatment of a semi-additive method (SAP method).
The surface treatment apparatus 1 is used as a developing device, an etching device, a half etching device, a soft etching device, a quick etching device, a peeling device, or the like. The spray nozzle 5 injects a developing solution, an etching solution, a half etching solution, a soft etching solution, a quick etching solution, a stripping solution, or the like as the processing solution G.

The processing liquid G is sprayed from the spray nozzle 5, → surface-treats the substrate material A, then flows down to the liquid tank 6 below the processing chamber 2, and is collected and stored. → After that, it is circulated and reused again through the pump 7, the filter (not shown), the pipe 8, the shower pipe 9, etc. → to the spray nozzle 5. In FIG. 2 (1), FIG. 3 (1), and FIG. 4, J indicates the vertical direction.
A plurality of spray nozzles 5 are provided in the shower tube 9 at predetermined pitch intervals. The shower tube 9 for supplying the treatment liquid G to the spray nozzle 5 is arranged as in the example shown in FIG. 2, the example shown in FIGS. 3, 4, and (1) in FIG. .
In the example shown in FIG. 2, a plurality of shower tubes 9 are arranged in parallel in the front and rear transport direction F, and a predetermined left-right pitch interval exists between them. In the example shown in FIG. 3 and the like, a plurality of shower tubes 9 are arranged in parallel along the left-right width direction H perpendicular to the transport direction F, and there is a predetermined front-rear interval between them. .
The processing in the processing chamber 2 of the surface processing apparatus 1 is generally performed in an atmosphere as shown in the example of the drawing, but can be performed in a liquid regardless of this.
The surface treatment apparatus 1 is as described above.

<< Outline of the Invention >>
Hereinafter, a surface treatment apparatus 1 for a substrate material A according to the present invention will be described with reference to FIGS.
First, the outline is as follows. The surface treatment apparatus 1 has a feature in the combination of the arrangement positions of the spray nozzles 5.
In other words, the spray nozzles 5 are placed in a positional relationship in which the positions of the spray nozzles 5 are sequentially shifted to the left and right by the left-right displacement interval K without forming a row in the front-rear direction, and the vertical interval M between the spray nozzle 5 and the substrate material A. And the setting of the left and right pitch interval N between the spray nozzles 5 based on the setting of the vertical interval M, the substrate material A is uniformly processed with the processing liquid G sprayed from the spray nozzle 5.
The outline of the present invention is as described above. Hereinafter, the surface treatment apparatus 1 for the substrate material A according to the present invention will be described in more detail.

<< Regarding the Left-Right Interval K between the Front and Rear Spray Nozzles 5 >>
First, as shown in FIG. 1, a number of spray nozzles 5 are arranged in the front-rear and left-right directions. When observed in the front-rear transport direction F, the left and right lateral width directions H are slightly shifted so that the spray nozzles 5 positioned in the front-rear direction do not form a row facing the front-rear transport direction F. Is located.
That is, the positioning is set such that the left and right spray nozzles 5 are overlapped in the conveying direction F so as not to overlap and overlap each other in one row.
Note that the spray nozzles 5 that are opposed to each other in the front-rear direction need only be shifted to the left and right, and the spray nozzles 5 that are in the same left-right position may exist in the transport direction F, for example, every 5 to 10 rows or more.

Such setting of the left-right displacement interval K of the spray nozzle 5 is realized by the arrangement of the shower tube 9.
First, the example shown in FIG. 2 is as follows. In the example of FIG. 2, the shower tubes 9 are arranged in the front and rear transport direction F, but the shower tubes 9 are accurately directed in the transport direction F as shown in FIG. 2 (2). However, it is slightly inclined toward the left and right width direction H.
In the example of FIG. 2, the setting of the left-right displacement interval K between the front and rear spray nozzles 5 is realized in this way.
On the other hand, the examples shown in FIGS. 3, 4 and 5 (1) are as follows. In this example, the shower tubes 9 are arranged along the left-right width direction H. As shown in FIGS. 3 (2) and 4 (2), the shower tubes 9 are arranged as shown in FIG. The positions of the spray nozzles 5 provided at predetermined pitch intervals are arranged so as to be sequentially shifted left and right.
That is, in the example of FIG. 3 and the like, each shower tube 9 is arranged by shifting the left and right positions of the spray nozzles 5 so that the positions of the spray nozzles 5 provided in the shower tubes 9 are shifted to the left and right when observed in the front and rear. It is installed. In the example of FIG. 3 etc., the setting of the left-right displacement interval K between the front and rear spray nozzles 5 is realized in this way.

The function of setting the left / right gap K is as follows. The processing liquid G sprayed from the spray nozzle 5 is subjected to a surface treatment with a strong spray pressure and spray impact at the portion of the substrate material A located immediately below or directly above. In the etching process, the portion of the substrate material A located directly above or below the spray nozzle 5 is subjected to strong spray pressure and spray impact by the sprayed etching solution, and etching is promoted.
On the other hand, with respect to the substrate material A, the spray impact is weak at portions located directly above or below the spray nozzle 5, and as such, there is a possibility of insufficient etching and insufficient processing.
Therefore, in the present invention, the spray nozzles 5 positioned in the front-rear direction are sequentially positioned with a left-right displacement interval K.
Thereby, about the board | substrate material A, the location which receives a strong spray pressure and injection impact does not overlap on a locus | trajectory, but comes to be disperse | distributed. The part to be surface-treated, such as being etched under a strong jet impact, gradually shifts and eventually the substrate material A is surface-treated, such as being etched overall, average, and uniformly. Become. The setting of the left-right displacement interval K between the front and rear spray nozzles 5 exhibits such a function.

Now, the gap K between the spray nozzles 5 positioned at the front and rear is set to 5 mm to 25 mm.
When the left-right displacement interval K is less than 5 mm, the displacement is too small, and the above-described displacement function is difficult to exhibit. That is, in the same manner as the above-described prior art, that is, according to the case where the spray nozzles 5 are arranged in the front and rear transport direction F, strong and weak impact points are generated on the substrate material A, and parallel lines are formed in the front and rear transport direction F. Surface-insufficient portions such as an etching-insufficient portion are formed in stripes.
Even when the left-right displacement interval K exceeds 25 mm, it is difficult to exert the shifting function. That is, in the substrate material A, strong and weak impact spots that cannot be covered with the setting of the left / right deviation interval K are generated in a gap, and areas with insufficient surface treatment such as areas with insufficient etching are formed in parallel lines and stripes.
In FIG. 1, FIG. 2 (2), FIG. 3 (2), and FIG. 4 (2), the illustrated representation of the left-right displacement interval K is schematic. That is, illustrations such as how to draw the dimension lines are schematic, exaggerated, and explanatory.
The left-right gap interval K between the front and rear spray nozzles 5 is as described above.

<< About the vertical interval M between the spray nozzle 5 and the substrate material A >>
In the present invention, for the spray nozzle 5, the height interval between the spray nozzle 5 and the substrate material A, that is, the vertical interval M is set to 30 mm or more and 150 mm or less, along with the above-described setting of the lateral displacement interval K between the front and rear. .
That is, surface treatment such as uniform etching can be realized by setting the left-right displacement interval K described above. It is avoided that the strong and weak jet impact portions and the portions with insufficient surface treatment such as etching are formed in the shape of parallel lines or stripes in the front and rear transport direction F. These were also confirmed experimentally.
However, as a result of the experiment, it was formed in parallel lines and stripes in the width direction H on the left and right, although it was slightly. While leaving an interval in the front-rear transport direction F, a portion where the surface treatment was insufficient such as a portion where etching was insufficient was slightly formed.

Such deficient portions are the vertical distance between the spray nozzle 5 and the substrate material A as shown in FIG. 2 (1), FIG. 3 (1), FIG. 4 (1), etc. This is solved by setting M to 30 mm to 150 mm. Therefore, the surface treatment such as an overall, average, and uniform etching process can be reliably realized for the substrate material A.
In particular, when the vertical distance M was set to 50 mm or more and 100 mm or less, the best results were obtained experimentally, and higher uniformity could be obtained. The vertical distance M setting between the spray nozzle 5 and the substrate material A functions in this way.
By the way, there is a strong need for enhancing the impact of spraying the processing liquid G onto the substrate material A by the spray nozzle 5 for reasons such as improving the etching factor during pattern etching. Therefore, the vertical interval M between the spray nozzle 5 and the substrate material A is also set short and close as described above.
When the vertical distance M is less than 30 mm, the spray nozzle 5 and the substrate material A are too close to each other, and the above-described shift function of the horizontal shift distance K is difficult to exhibit. That is, with respect to the substrate material A, the spray pressure and spray impact at a location located directly above or directly below the spray nozzle 5 are strong, and the spray pressure and spray impact at a location positioned directly above or directly below are weakened, resulting in insufficient etching. Insufficient processing occurs.
On the other hand, when the vertical distance M exceeds 150 mm, the distance between the spray nozzle 5 and the substrate material A becomes too far, resulting in insufficient etching and processing as a whole. That is, with respect to the substrate material A, the overall jet impact is weak, and the processing rate such as the etching rate is lowered.
The vertical interval M between the spray nozzle 5 and the substrate material A is as described above.

<Regarding the pitch interval N between the spray nozzles 5>
For the overall, average, and uniform etching and surface treatment of the substrate material A, consideration for the left and right pitch interval N between the spray nozzles 5 is also a point.
That is, for the spray nozzle 5, in addition to the above-described setting of the left-right gap K between the front and rear and the setting of the vertical gap M between the spray nozzle 5 and the substrate material A, in combination with these from the support surface, It is advisable to consider the left-right pitch interval N between the nozzles 5 as well.
1 and FIG. 2, (2), FIG. 3 (2), FIG. 4 (2), FIG. 5 (1), etc. In principle, the interval N is set to 30 mm or more and 120 mm or less. In particular, when the vertical distance M is set to 50 mm to 100 mm, it is set to 30 mm to 120 mm. In particular, when it was set to 30 mm or more and 60 mm or less, the best result was obtained experimentally.
That is, there is a strong need for enhancing the impact of spraying the substrate material A treatment liquid G by the spray nozzle 5 for reasons such as improving the etching factor during pattern etching. Therefore, a spray nozzle 5 having a narrow spray angle is selected and used. This tendency is remarkable. In other words, a spray angle of 40 ° to 90 ° is often selected and used in the left and right width direction H, and the range of spraying the processing liquid G onto the substrate material A is narrowed. The left and right pitch interval N is also set relatively narrow as described above.
When the left-right pitch interval N is less than 30 mm, the spray nozzles 5 are too close to each other on the left and right, and the above-described shifting function of the left-right displacement interval K becomes difficult to exhibit.
On the other hand, when the left / right pitch interval N exceeds 120 mm, the spray nozzles 5 are too far left and right, and also in this case, the shifting function of the left / right displacement interval K is difficult to exhibit. With respect to the substrate material A, the strength and weakness of spray pressure and spray impact are generated.
Incidentally, in designing the surface treatment apparatus 1 of the example shown in FIG. 3 and the like, first, the value of the left-right displacement interval K is determined, and then the value of the left-right pitch interval N is determined as an integral multiple thereof. As a result, the required number of shower tubes 9 can be obtained as an integer value.
The left / right pitch interval N between the spray nozzles 5 is as described above.

<< Nozzle angle θ of spray nozzle 5 >>
In the surface treatment apparatus 1, the spray nozzle 5 having various settings described above is a flat type (fan type) having an elliptical spray pattern as shown in FIGS. 4 (2) and 5 (1). ) Are typically used.
The spray nozzle 5 is provided at a nozzle angle θ that is inclined by 10 ° or less in the front-rear transport direction F, including 0 ° that is accurately directed in the horizontal width direction H on the horizontal plane and a nozzle angle θ that is about 0 °. ing.
These will be described in detail. First, in the developing process and the etching process, which are circuit forming processes, when the nozzle angle θ is other than 0 ° or around 0 °, the circuit width formed in parallel with the left-right width direction H (Y direction) A difference occurs in the thickness of the circuit width formed in parallel to the transport direction F (X direction), which is not preferable.
Therefore, in the developing process and the etching process, the nozzle angle θ is typically set to 0 °, and further to around 0 °, that is, a width of ± 1 ° or 2 °.
That is, the nozzle angle θ is typically 0 °, but the nozzle angle θ is inclined from 0 ° to ˜0 ° plus 1 ° or less, or from 0 ° to ˜0 ° minus 1 ° toward the front and rear conveyance direction F. But it ’s okay. Furthermore, a nozzle angle θ inclined from 0 ° to ˜2 ° or less, or from 0 ° to ˜2 ° is also possible.
On the other hand, in a half etching process, a soft etching process, a quick etching process, a peeling process, etc. that are not directly involved in circuit formation, it is effective to provide a nozzle angle θ because the processing speed is increased. Therefore, in each of these steps, the nozzle angle θ is set to 4 ° to 10 °.
However, if the nozzle angle θ at that time is less than 4 °, mutual interference of the sprayed processing liquid G occurs between the spray nozzles 5, which is not preferable. When the nozzle angle θ exceeds 10 °, the treatment liquid G is sprayed on the wheels 4 of the conveyor 3 positioned at the front and rear, which is not preferable. In the illustrated example, the area where the spray nozzles 5 are provided lacks the arrangement of the wheels 4 of the conveyor 3 by 20 mm in the transport direction F, for example.
Further, the spray nozzle 5 has a nozzle performance of an injection angle of 40 ° to 90 ° and an injection amount of 0.3 MPa and about 2 L / min to 5 L / min. In FIG. 4 (2) and FIG. 5 (1), reference numeral 10 denotes a conveyor shaft 10 of the wheel 4.
The nozzle angle θ of the spray nozzle 5 is as described above.

《Action etc.》
The surface treatment apparatus 1 for the substrate material A of the present invention is configured as described above. Therefore, it becomes as follows.
(1) The surface treatment apparatus 1 is used in the manufacturing process of the electronic circuit board E. In other words, it is used as various etching equipment, developing equipment, and peeling equipment in the etching process, which is the core of the manufacturing process, in the development process, the peeling process, and in the half etching process, soft etching process, quick etching process, etc. The

(2) And the surface treatment apparatus 1 injects the process liquid G from the spray nozzle 5 arrange | positioned many front and rear, right and left with respect to the board | substrate material A conveyed by the conveyor 3, and surface-treats the board | substrate material A by it. (See FIG. 2, FIG. 3, etc.).
That is, a processing solution G such as an etching solution, a developing solution, and a stripping solution is sprayed from the spray nozzle 5, so that the substrate material A is surface-treated such as etching, developing, and stripping.

  (3) The surface treatment apparatus 1 according to the present invention is characterized in that the spray nozzle 5 is employed in various combinations of the arrangement position setting and the like.

(4) That is, first, the spray nozzle 5 is set in a positional relationship in which the positions of the front and rear positions are sequentially shifted left and right without forming a line in the front and rear direction (FIG. 1, (2) FIG. (See Fig. 3 (2), Fig. 4 (2), etc.).
That is, the spray nozzle 5 is set to have a left-right displacement interval K of 5 mm to 25 mm, and is disposed so as to be slightly displaced in the left-right width direction H without wrapping in the front-rear transport direction F and facing the opposite direction. Yes.

  (5) In addition to this, the spray nozzle 5 has a vertical distance M between the substrate material A and 30 mm to 150 mm, preferably 50 mm to 100 mm (FIG. 2 (1), FIG. (See Fig. 3 (1), Fig. 4 (1), etc.).

  (6) Further, in the spray nozzle 5, the left and right pitch interval N is set to 30 mm to 120 mm (FIG. 1, (2), FIG. 3 (2), and FIG. 4 (2)). ) (See Fig. 5, Fig. 5 (1)).

  (7) As the spray nozzle 5, a flat type is typically used, and the nozzle angle θ is inclined by 0 ° or 0 ° in the front-rear transport direction F, or is inclined by 4 ° to 10 °. The nozzle angle θ is directed in the left-right width direction H (see FIG. 4 (2) and FIG. 5 (1)).

  (8) As described above, the surface treatment apparatus for the substrate material A according to the present invention employs various combinations of configurations such as the arrangement position of the spray nozzle 5. Accordingly, the processing accuracy of the substrate material A is improved, and the substrate material A is uniformly processed.

(9) That is, the situation where the substrate material A is treated with a treatment liquid G having a strong spray pressure and injection impact and a place where the spray pressure and the injection impact of the treatment liquid G are weak and the treatment is insufficient. Avoided.
Of course, in the process, the pooling or retention of the sprayed processing liquid G on the substrate material A is reduced.
Therefore, the substrate material A is surface-treated as a whole, average and uniformly. The circuit width (bottom width) L formed due to excessive processing is not narrow, thin, and excessively small, and the circuit width L formed due to insufficient processing does not occur. (See (2) and (3) in FIG. 6).
Particularly in the etching process, the uniformity of the etching depth and circuit depth C, that is, uniformity (Min etching amount / Max etching amount × 100%) is improved, and uniform etching without unevenness is realized.

(10) These are easily realized by a simple configuration. That is, in the surface treatment apparatus 1 for the substrate material A, the above-described place is realized by combining the arrangement position setting of the spray nozzle 5 and the like.
That is, with respect to the spray nozzle 5, a predetermined configuration such as predetermined left-right displacement interval K, vertical interval M, left-right pitch interval N, etc., is set and combined, so that it is easy in terms of cost and improved processing accuracy and circuit width. Variation prevention is realized.

(11) When this surface treatment apparatus 1 is used, a fine circuit (etching) in which the circuit width L of the formed circuit B is narrow is reduced in terms of cost as the uniformity is improved and the variation in the circuit width L is eliminated. It becomes possible to manufacture by an excellent tenting method.
Substrate material A having a copper foil thickness of 18 μm or less and a circuit width L or inter-circuit space S of 40 μm or less can also be manufactured by the tenting method. Further, the substrate material A having a copper foil thickness of 12 μm and a circuit width L and an inter-circuit space S of about 20 to 30 μm is a target value that can be manufactured by the tenting method ((2 in FIG. 6). ) See also Fig. (3).

(12) Furthermore, according to the surface treatment apparatus 1, improvement of uniformity and prevention of variation in the circuit width L are realized, but naturally, in the process, the occurrence of liquid pool and stagnation of the treatment liquid G is suppressed, There is no need to use a dedicated mechanism for preventing liquid accumulation or for retention.
It is not necessary to incorporate a swing oscillation mechanism, a horizontal swing mechanism, an oblique arrangement mechanism, a liquid reservoir vacuum mechanism, and the like for the shower tube 9 as in the above-described conventional technology.
The operation of the present invention is as described above.

Hereinafter, experimental data of the embodiment of the present invention will be described.
That is, as a result of experiments on uniformity, experimental data obtained for the examples of the present invention and experimental data obtained for the conventional example (comparative example) will be described.

《Experimental method》
First, the experimental method that is the premise of the experiment will be described. Regarding the etching apparatus which is a representative example of the surface treatment apparatus 1, as a method for evaluating the uniformity of the etching depth (circuit depth C), that is, as a method for evaluating uniformity, the following (A) and (B) are first given. Conceivable.
(A) The circuit B is formed by actually carrying out the development, etching, and peeling processes using a resist, and the circuit B obtained as a result is verified for variations in the circuit width L.
(B) Only etching is performed. That is, the copper foil is etched, and the copper thickness (corresponding to the circuit depth C) of the remaining copper obtained as a result is verified.
A comparison of the methods (a) and (b) is as follows. The method (a) affects the uniformity evaluation depending on the performance of the etching apparatus itself, the elements of production technology, the type of resist used, the type of etching solution, and the like.
On the other hand, the method (b) relates to an etching apparatus and can perform uniformity evaluation only for the etching performance itself for the copper foil. Therefore, an experiment was conducted by the method (b).

<< Test Conditions for Examples of the Present Invention >>
The test conditions of the embodiment of the present invention are as shown in Table 1 below. In Table 1, the liquid temperature, specific gravity, etc. relate to cupric chloride CuCl ₂ used as an etching liquid. In Table 1, the effective length is a length dimension in the transport direction F of the processing chamber 2 of the surface treatment apparatus 1.

<< Test Results of Examples of the Present Invention >>
The test results of the examples of the present invention are as shown in Tables 2 to 5 below.
In Tables 2 and 4, A to I and 1 to 7 indicate the vertical and horizontal axes of the respective measurement points of the substrate material A, as shown in FIG. did.
Then, at each measurement point of the substrate material A, the copper thickness of the remaining copper (circuit depth C) was measured for the copper foil having a copper thickness of 67.3 μm as in the test conditions of Table 1 above when the experiment was started. Corresponded). As a result, the measurement result of Table 2 was obtained for the upper surface (front surface) of the substrate material A, and the measurement result of Table 4 was obtained for the lower surface (back surface).
Therefore, based on this, the uniformity (Min copper thickness / Max copper thickness × 100% of remaining copper in Table 2 or Table 4) was calculated. Then, as shown in Table 3, the upper surface (surface) was 94.12%. The lower surface (back surface) was 94.21% as shown in Table 5 (note that 100% is the highest rating).
Thus, according to the Example of this invention, the extremely high uniformity was obtained.

<< Test conditions of conventional example (comparative example) >>
The test conditions of the conventional example (comparative example) are as shown in Table 6 below. Table 6 relates to test conditions for the upper surface (front surface) and the lower surface (back surface) of the substrate material A. In both cases, the conditions were similar to the test conditions of the above-described embodiment of the present invention.
In Table 6, the liquid temperature, specific gravity, etc. relate to cupric chloride CuCl ₂ used as an etching liquid. In Table 6, the effective length is a length dimension in the transport direction of the treatment chamber of the used surface treatment apparatus.
In addition, as a conventional example (comparative example), the surface treatment apparatus described in the background art column mentioned above in this specification was used.

<< Test results of conventional example (comparative example) >>
The test results of the conventional examples (comparative examples) are as shown in Tables 7 to 10 below.
In Tables 7 and 9, S1 to S6 and 1 to 9 indicate the vertical and horizontal axes of the respective measurement points of the substrate material A, and the intersections of the two are used as measurement points.
At each measurement point of the substrate material A, the copper thickness of the remaining copper (circuit depth C) was measured for the copper foil having a copper thickness of 64.0 μm at the start of the experiment as in the test conditions of Table 6 above. Corresponded). As a result, the measurement results in Table 7 were obtained for the upper surface (front surface) of the substrate material A, and the measurement results in Table 9 were obtained for the lower surface (back surface).
Therefore, based on this, the uniformity (Min copper thickness / Max copper thickness × 100% of remaining copper in Table 7 and Table 9) was calculated. Then, as shown in Table 8, the upper surface (front surface) was 76.99%, and the lower surface (back surface) was 77.63%.
As described above, according to the conventional example (comparative example), the uniformity was inferior to that of the above-described embodiment of the present invention. In the embodiment of the present invention, high uniformity of 94.12% of the upper surface (front surface) and 94.21% of the lower surface (back surface) was obtained as described above, and the variation of the circuit B was almost eliminated.
Thus, the superiority of the uniformity of the present invention was confirmed also from the experimental data.

本発明の実施例の実験データ等については、以上のとおり。

The experimental data of the example of the present invention is as described above.

A Substrate material B Electronic circuit (circuit)
C Circuit depth (circuit height)
D Top width (top width)
E Electronic circuit board (board)
F Conveying direction G Processing liquid H Width direction J Vertical direction K Left-right displacement L Circuit width (bottom width)
M Vertical spacing N Left-right pitch spacing S Inter-circuit space θ Nozzle angle 1 Surface treatment device 2 Processing chamber 3 Conveyor 4 Wheel
5 Spray nozzle 6 Liquid tank 7 Pump 8 Piping 9 Shower pipe 10 Conveyor shaft

Claims (8)

A substrate material surface treatment apparatus for performing surface treatment by spraying a treatment liquid from a spray nozzle on a substrate material used in a manufacturing process of an electronic circuit board and conveyed by a conveyor,
A number of the spray nozzles are arranged on the front, rear, left and right, and are opposed to the substrate material to be conveyed,
The spray nozzle is configured to have a positional relationship in which the positions of the front and rear positions are shifted to the left and right without forming a line in the front and rear direction, the setting of the vertical distance between the spray nozzle and the substrate material, and the setting of the vertical distance. Based on the combination with the setting of the left and right pitch interval between the spray nozzles based on
A surface treatment apparatus for a substrate material, wherein the substrate material is uniformly treated with the treatment liquid sprayed from the spray nozzle. In claim 1, the surface treatment apparatus is used in a development process, an etching process, a half etching process, a soft etching process, a quick etching process, or a peeling process during the manufacturing process of an electronic circuit board.
Accordingly, the surface treatment apparatus is used as a developing apparatus, an etching apparatus, or a peeling apparatus, and the spray nozzle ejects a developer, an etching liquid, or a peeling liquid as the processing liquid. Surface treatment equipment.   3. The surface treatment apparatus for a substrate material according to claim 2, wherein the left-right displacement interval between the front and rear positions of the spray nozzle is set to 5 mm to 25 mm.   4. The surface treatment apparatus for a substrate material according to claim 3, wherein the vertical distance between the spray nozzle and the substrate material is set to 30 mm to 150 mm.   5. The surface treatment apparatus for a substrate material according to claim 4, wherein the left-right pitch interval between the spray nozzles is set to 30 mm to 120 mm.   6. The surface treatment apparatus for a substrate material according to claim 5, wherein the spray nozzle is of a flat type and is provided in the horizontal direction in the horizontal direction in the developing step or the etching step.   6. The spray nozzle according to claim 5, wherein the spray nozzle is of a flat type, and in the half etching process, the soft etching process, the quick etching process, or the peeling process, the spray nozzle is 4 ° in the horizontal direction on the front and rear in the horizontal direction. A surface treatment apparatus for a substrate material, characterized in that the apparatus is provided at a nozzle angle inclined at 10 to 10 °. In Claim 6 or 7, a plurality of shower tubes for supplying the processing liquid are arranged in rows in the front-rear transport direction at a predetermined left-right pitch interval, or a plurality of shower tubes are disposed in a front-rear width direction at a predetermined front-rear pitch interval. This line,
A surface treatment apparatus for a substrate material, wherein a plurality of the spray nozzles are provided in the shower tube at predetermined pitch intervals.

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