JP2014175326A - Method of manufacturing printed wiring board and chemical processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chemical processing apparatus in which the problem of processing delay due to puddles in the center on the upper surface of a substrate, conveyed in a process using a horizontal conveyance device performing chemical processing by jetting chemical by means of a spray nozzle, is solved in the method of manufacturing a printed wiring board, and to provide a method of manufacturing a printed wiring board by a horizontal conveyance device including the chemical processing apparatus.SOLUTION: In a method of manufacturing a printed wiring board using a horizontal conveyance processing device performing chemical processing by jetting chemical by means of a spray nozzle, the horizontal conveyance processing device includes a chemical processing device having an effect of reducing variation of chemical processing in the width direction, by producing an outward main flow to the right and left, and discharging the chemical easily from the center without generating a puddle.

Description

  The present invention relates to a method of manufacturing a printed wiring board and a chemical processing apparatus used for the manufacturing, and in particular, a horizontal provided with a chemical processing apparatus that performs chemical processing by spraying a chemical with a spray nozzle on the printed wiring board. The present invention relates to a manufacturing method using a transport type apparatus.

  In the production of a printed wiring board, a process of injecting a chemical solution from a spray nozzle onto an object is generally incorporated using a horizontal conveyance type apparatus. In this conventional horizontal conveyance type apparatus, the upper surface of a substrate is incorporated. There is a problem of processing delay due to liquid pooling in the center, and there is a demand for uniform chemical processing associated with higher density of printed wiring boards.

A specific example of such a horizontal conveyance type apparatus is a process for reducing the copper thickness as a surface treatment in the manufacturing process of a printed wiring board.
For example, in a build-up substrate, via filling plating that fills a laser via with copper plating is used, but in order to fill a laser via with copper plating, the copper plating often needs to be thickened. If the copper thickness is still too high, it will not be possible to etch high-definition wiring in circuit formation or the total thickness will be too thick to meet the recent high density requirements. An etching process for reducing the copper thickness may be performed.

  This process is generally performed by a horizontal transfer type apparatus that sprays the etchant with a spray nozzle. However, if a liquid pool is generated at the center of the upper surface of the substrate, the etching process is delayed from the peripheral part. As a result, the copper thickness remains thick.

As another example, wiring circuit formation of a printed wiring board is performed by a method using an etching solution (ferric chloride, cupric chloride, etc.).
For example, “drilling”, “copper plating”, “etching resist formation (liquid resist, dry film resist, etc.)” and “exposure” are performed in order on the substrate material to which the copper foil is attached, and then the chemical solution is applied from the spray nozzle. This is a horizontal transport type device that performs spraying, and development and etching are performed to form a wiring circuit.

  In this etching process, if a liquid pool is generated at the center of the upper surface of the substrate, the etching process is delayed from the peripheral part of the liquid pool part, resulting in a thick circuit width.

  Therefore, Patent Document 1 discloses a method for promoting liquid flow by tilting a spray nozzle in the left-right direction as a method for reducing liquid accumulation at the center of the upper surface of the substrate. Further, Patent Document 2 discloses a method of urging the chemical liquid to the left and right by placing restriction rollers that hinder the flow of the chemical liquid before and after the spray nozzle.

  Although this technique has the effect of reducing the processing delay due to the liquid pool in the center of the upper surface, the problem remains that the processing delay in the center of the upper surface cannot be completely eliminated when the width of the substrate to be transported is large. It had been.

Japanese Patent No. 3518676 Japanese Patent No. 3566900

  The present invention solves the problem of processing delay due to liquid pooling at the center of the upper surface of a substrate to be transported in a process using a horizontal transport type apparatus that performs chemical processing by spraying a chemical solution with a spray nozzle in a method of manufacturing a printed wiring board. There are provided a chemical processing apparatus that prevents a liquid pool from being generated by encouraging the flow of a chemical in both the left and right directions of the substrate, and a method of manufacturing a printed wiring board by a horizontal conveyance type apparatus including the chemical processing apparatus.

  1st invention of this invention is a manufacturing method of the printed wiring board using the horizontal conveyance type processing apparatus which injects a chemical | medical solution with a spray nozzle, and performs a chemical processing, Comprising: The said horizontal conveyance type processing apparatus is a liquid of a chemical | medical solution. A chemical treatment apparatus having an effect of reducing variation in accuracy in the width direction of the chemical treatment by the chemical solution without generating a reservoir, and the chemical treatment devices are arranged in the width direction of the substrate to be transported, toward the substrate A spray unit having a plurality of spray tubes each having a plurality of spray nozzles for ejecting a chemical liquid is arranged, and the plurality of spray nozzles are spray nozzles for spraying the chemical liquid in a fan-shaped spray pattern, and the substrate with respect to the transport direction. The spray nozzles arranged on the left and right sides in the width direction of the spray nozzle are arranged at an angle so that the spray nozzles arranged on the left side eject the chemical liquid substantially in the left direction. The spray nozzle is arranged at an angle so as to eject the chemical solution substantially in the right direction, and the spray tube shows an injection pattern in a direction range of more than −90 degrees and less than 90 degrees with respect to the transport direction. When the spray tube has a spray nozzle, a regulating roller is provided on the reverse conveyance direction side from the trailing edge of the spray pattern to inhibit the chemical liquid flow to the center of the substrate. When the spray tube has a spray nozzle that shows a spray pattern in a direction range exceeding 270 degrees and less than 270 degrees, a regulating roller that inhibits the flow of the chemical liquid to the center of the substrate from the trailing edge of the spray pattern toward the conveyance direction By providing the flow, the flow to the left and right outside becomes the main flow, the chemical liquid is easily discharged from the central part, does not generate a liquid pool, and reduces the variation in the width direction of the chemical liquid processing A method for manufacturing a printed wiring board, characterized in that it comprises a chemical treatment apparatus having a fruit.

  The second invention of the present invention is arranged in the width direction of the substrate in the plurality of spray nozzles arranged in the width direction of the substrate to be conveyed in the first invention and ejecting the chemical liquid toward the substrate. The printed wiring board manufacturing method is characterized in that the amount of the chemical liquid ejected from the spray nozzles arranged at the substantially left end and the substantially right end is smaller than the chemical liquid ejected amount of the spray nozzle ejecting the chemical liquid near the center of the substrate.

  According to a third aspect of the present invention, the width direction of the substrate with respect to the substrate conveyance direction in a plurality of spray nozzles arranged in the width direction of the substrate to be conveyed in the first invention and ejecting a chemical toward the substrate. The printed circuit board manufacturing method is characterized in that the chemical liquid jetting pressure of the spray nozzles arranged at substantially the left end and the rightmost edge of the nozzle is smaller than the chemical liquid jetting pressure of the spray nozzle for jetting the chemical liquid in the vicinity of the center of the substrate.

  According to a fourth aspect of the present invention, there is provided a chemical processing apparatus for performing chemical processing in a horizontal transport type processing apparatus for manufacturing a printed wiring board by performing chemical processing by spraying chemical liquid onto a substrate by a spray nozzle. A spray section in which a plurality of spray tubes arranged with a plurality of spray nozzles arranged in the width direction of the substrate and ejecting the chemical solution toward the substrate are arranged, the plurality of spray nozzles fan-shaped the chemical solution A spray nozzle that sprays the spray pattern. The spray angle of the spray nozzles arranged on the left and right sides of the substrate width direction with respect to the substrate transport direction is sprayed. The spray nozzle arranged on the right side is arranged at an angle that ejects the chemical solution substantially in the right direction, and the spray tube is arranged in the substrate transport direction. When the spray tube has a spray nozzle showing a spray pattern in a direction range of more than -90 degrees and less than 90 degrees, the chemical liquid flow to the center of the substrate is directed to the reverse transport direction side from the rear edge of the spray pattern. When the spray tube is a spray tube having a spray nozzle showing a spray pattern in a direction range of more than 90 degrees and less than 270 degrees with respect to the substrate transport direction, a blocking roller is provided. By providing a regulating roller that hinders the flow of the chemical liquid to the center of the substrate from the trailing edge to the conveyance direction side, the flow to the left and right outer sides becomes the main flow, and the chemical liquid is easily discharged from the central part and does not generate a liquid pool, A chemical processing apparatus having an effect of reducing variations in the width direction of chemical processing.

  In a method of manufacturing a printed wiring board using a horizontal conveyance type apparatus that performs chemical treatment by spraying a chemical solution with a spray nozzle, the spray nozzle is arranged in a direction perpendicular to the substrate conveyance direction, By changing the angle on the left and right sides of the width direction of the substrate, the liquid flow is promoted to the left and right outside in one of the transport directions, and the liquid flow is promoted to the inside in the other direction, but only on the side that is promoted in the inside. By providing a chemical treatment device that performs chemical treatment with a chemical solution provided with a restriction roller that inhibits the liquid flow, the flow to the left and right outside becomes the main flow, the chemical solution is smoothly discharged from the center, and no liquid pool occurs, It is possible to reduce the variation in the width direction of the chemical treatment.

  Moreover, the flow to the left-right outer side can be made still smoother by using the type with little injection amount with respect to the spray nozzle of the center vicinity for the right-and-left outer spray nozzle in the chemical | medical solution processing apparatus of this invention. Furthermore, the flow to the left and right outer sides can be made smoother by lowering the pressure of the left and right spray nozzles and increasing the spray nozzle near the center.

It is a top view of the chemical | medical solution processing apparatus 10 in a horizontal conveyance type processing apparatus. It is a right view of the chemical processing apparatus 10 with respect to the substrate transport direction. It is a schematic diagram which shows arrangement | positioning of the spray nozzle in a chemical | medical solution processing apparatus. It is a schematic diagram which shows the other example of arrangement | positioning of a spray nozzle. It is a schematic diagram which shows the example of arrangement | positioning different from arrangement | positioning of the spray nozzle shown in FIG.3 and FIG.4.

  The printed wiring board manufacturing method of the present invention is characterized in that a chemical treatment is performed by spraying a chemical solution from above and below the substrate with a spray nozzle in order to form a conductive layer or the like provided on a conventional substrate in a wiring circuit. In a method for manufacturing a printed wiring board using a conveyance type processing apparatus, the horizontal conveyance type processing apparatus has an effect of reducing variation in accuracy in the width direction of the chemical treatment by the chemical liquid without generating a liquid pool of the chemical liquid. A device is provided.

Therefore, first, the chemical processing apparatus provided in the horizontal conveyance type processing apparatus which is also characteristic in the manufacturing method of the present invention will be described in detail with reference to FIGS.
FIG. 1 is a partial plan view of a chemical processing apparatus 10 in a horizontal transport type processing apparatus, and FIG. 2 is a partial right side view of the chemical processing apparatus 10 in the substrate transport direction.
1 and 2, 1 is a substrate, 2F and 2B are upper surface regulating rollers, 3 is an upper surface conveying roller, 4 is an upper surface spray nozzle (fan type), 5 is an upper surface spray tube, 6 is a lower surface conveying roller, and 7 is a lower surface spray. Nozzle, 8 is a lower surface spray pipe, 21L, 21R, 22L, 22R are upper surface spray nozzle spray patterns (fan-shaped patterns), 21a is a rear edge of the spray patterns 21L, 21R, 22a is a rear edge of the spray patterns 22L, 22R It is.

As shown in FIGS. 1 and 2, the chemical processing apparatus according to the present invention transports a substrate for forming a printed wiring board in a horizontal posture on a conveyor, and injects chemicals from spray nozzles arranged vertically. By doing so, it is used for surface treatment for reducing the copper thickness of the printed wiring board and etching for circuit formation.
In addition, since the chemical treatment performed by this chemical treatment apparatus uses a highly harmful chemical solution, the chemical solution is disposed in a treatment tank that forms a closed space so that the chemical solution is not scattered, and a predetermined chemical treatment is performed.

The structure and mechanism inside the processing tank (not shown) will be described with reference to FIGS.
The substrate 1 to be processed is transported in a horizontal posture by the rotation of the lower surface transport roller 6 and the upper surface transport roller 3.
On the other hand, the chemical solution for chemical treatment is sprayed from the upper and lower spray nozzles (FIG. 2, reference numerals 4 and 7) to perform the chemical treatment of the substrate 1.

Since the present invention relates to the chemical treatment of the upper surface of the substrate, the action state on the upper surface of the substrate will be specifically described.
The upper surface spray nozzle 4 is mounted side by side on the spray pipe 5 that conveys the chemical liquid at a position above the substrate 1 where the chemical liquid sprayed onto the upper surface transport roller 3 is not applied. Furthermore, a so-called spray shape uses a type in which a chemical solution is sprayed in a fan-shaped pattern, and the left side in the width direction of the substrate 1 as in the spray patterns 21R, 21L, 22R, and 22L of the top spray nozzle as shown in FIG. On the right side, it is installed so that the chemical injection angle (left side: θ _L , right side θ _R ) is changed.
As shown in FIG. 1, the spray pattern of the upper surface spray nozzle at this time is preferably about θ _R is 60 degrees to 80 degrees and θ _L is about −80 degrees to −60 degrees with respect to the substrate transport direction. .

By arranging the upper surface spray nozzle in the form as shown in FIG. 1, the liquid flow can be guided to the left and right outside on the substrate transport direction side. In addition, a liquid flow occurs in the center on the opposite side of the substrate transport direction. In this case, a restriction roller 2 that inhibits the liquid flow is provided to suppress the liquid flow to the center.
As a result, the flow to the left and right outer sides becomes the mainstream, and the injected chemical liquid is smoothly discharged from the central part to both the left and right sides, and it is possible to suppress the occurrence of a liquid pool in the central part of the substrate 1. This shows the effect of suppressing the processing delay.

  As shown in FIGS. 1 and 2, the relationship between the direction in which the top spray nozzle 4 is inclined and the arrangement position of the regulating roller 2 (2F, 2B) is opposite to the arrangement in which the liquid flow is in the same direction as the substrate conveyance direction and the substrate conveyance direction. It is desirable from the viewpoint of reducing the variation in the chemical solution processing that the orientations are alternately arranged.

Specifically, the plurality of upper surface spray nozzles are the liquid injection angles of the spray nozzles disposed on the left and right sides of the substrate width direction with respect to the substrate transport direction, and the spray nozzles disposed on the left are substantially leftward The spray nozzle disposed on the right side is disposed at an angle at which the chemical solution is ejected (angles indicated by the ejection patterns 21L and 22L in FIG. 1). (Angles indicated by the patterns 21R and 22R).
Further, the arrangement position of the regulating roller is such that the spray tube 5 including the spray nozzle has a direction range in which the spray angles θ _L and θ _R are more than −90 degrees and less than 90 degrees with respect to the transport direction of the substrate 1 (so-called substrate). When the spray tube has an upper surface spray nozzle showing the spray patterns 21L and 21R on the transport direction side), the flow of the chemical liquid to the center of the substrate is inhibited from the spray pattern trailing edge 21a in the direction opposite to the substrate transport direction. A restriction roller 2F is provided.

On the other hand, the spray tube 5 has a spray pattern 22L in a direction range (so-called reverse direction to the substrate transport direction) in which the spray angles θ _L and θ _R exceed 90 degrees with respect to the transport direction of the substrate 1 and less than 270 degrees. , 22R is provided with a regulating roller 2B that inhibits the flow of the chemical liquid to the center of the substrate on the substrate transport direction side of the spray pattern trailing edge 22a.
With the arrangement of the regulation rollers 2F and 2B, the flow to the left and right outer sides becomes the mainstream, and the chemical liquid is easily discharged from the central portion of the substrate and does not generate a liquid pool, thereby reducing the variation in the width direction of the chemical liquid processing. It expresses.

  In particular, in circuit formation etching, wiring close to parallel to the direction of liquid flow tends to be thin, and wiring close to vertical to the liquid flow tends to be thicker.Therefore, changing the direction of liquid flow causes variations in the finish of the wiring. It is important to make it smaller.

As for the arrangement of the spray nozzles in the whole chemical treatment tank, it is desirable to dispose the spray nozzles evenly with respect to the substrate flow direction as shown in FIG.
FIG. 3 is a schematic diagram showing the arrangement of spray nozzles in the chemical processing apparatus, 31 is the center in the width direction of the substrate 1 to be transported, and the notation of [left side] and [right side] is relative to the “substrate transport direction”. It shows the position in the width direction of the substrate. 4 and 5 are the same.

  When the spray nozzles 4 are arranged in a straight line in the substrate conveyance direction, the chemical solution processing is accelerated on the line with the spray nozzles 4. Further, since the chemical liquid tends to be processed faster because the chemical liquid flows immediately to the left and right sides at the central portion in the width direction where the angle of the spray nozzle 4 changes, the portion where the angle of the spray nozzle 4 changes is transferred to the substrate. It is desirable not to concentrate on the center 31 in the width direction of 1 but to shift evenly as shown in FIG.

Furthermore, even in this arrangement, when the processing delay due to the liquid pool in the center of the substrate is not sufficiently eliminated, the spray nozzles 4 _L and 4 _R on the left and right outer sides are sprayed onto the spray nozzle 4 near the center as shown in FIG. By using a type with a small amount, it is possible to further smooth the flow to the left and right outer sides, to suppress liquid accumulation and to reduce variation in the width direction of the chemical solution treatment.
FIG. 4 is a schematic view showing another example of the arrangement of spray nozzles.

Alternatively, as shown in FIG. 5, the upper spray tube 5a is arranged with a shallow angle α with respect to the substrate transport direction. The angle α of the spray tube 5a is set so that the spray nozzles 4 are evenly distributed with respect to the substrate transport direction.
By increasing the pressure of the spray tube at the center and decreasing the pressure of the spray tube toward the outside, the pressure of the chemical sprayed from the spray nozzle at the center increases and the chemical sprayed toward the outside Since the amount is reduced, it is possible to further smooth the flow to the left and right outer sides to suppress liquid accumulation and reduce the variation in the width direction of the chemical treatment.
FIG. 5 is a schematic view showing an arrangement example different from the arrangement of the spray nozzles shown in FIGS. 3 and 4, wherein 41 is an injection pressure control valve, and 42 is an injection pressure gauge.
Hereinafter, the present invention will be described in more detail with reference to examples.

Table 1 (Example of the present invention, method of FIG. 3) and Table 2 (Invention of the present invention) are compared with conventional types of lines for performing etching processing to reduce the copper thickness as surface treatment in the manufacturing process of the printed wiring board. The method was carried out under the conditions shown in Table 3 (conventional example).
The spray tube and spray nozzle arrangement were the same between the conventional method and the method of the present invention, and the comparison was made by changing the angle of the spray nozzle and the arrangement of the regulating roller.

In the test, a substrate for a printed wiring board having a copper foil of 35 μm was subjected to the “thickness of the case of 15 μm etching with a sulfuric acid-hydrogen peroxide etching solution under the line conditions of the present invention and the conventional line conditions. We compared "variation". The substrate size is 515 mm wide × 410 mm long.
The copper thickness was measured at 11 × 9 = 99 points equally inside the substrate edge 10 mm.

As a result of the test, the conventional method has a tendency that the etching of the central portion of the upper surface tends to be slow, and the standard deviation is 0.80 μm.
On the other hand, the method of FIG. 3 improved the tendency of slow etching at the center of the upper surface, and obtained a standard deviation of 0.40 μm.
Furthermore, when a type with a small flow rate is used for the left and right outer spray nozzles as shown in FIG. 4, the standard deviation is 0.31 μm.
From the above comparative tests, the effectiveness of the present invention could be confirmed.

In the etching for forming the circuit pattern of the printed wiring board manufacturing process, Table 4 (the embodiment of the present invention, the method of FIG. 3) and Table 5 (the other embodiment of the present invention, FIG. 4) and under the conditions shown in Table 6 (conventional example).
The spray tube and spray nozzle arrangement were the same between the conventional method and the method of the present invention, and the comparison was made by changing the angle of the spray nozzle and the arrangement of the regulating roller.

For the test, a printed wiring board substrate having a copper foil of 18 μm was etched to a thickness of 0.2 to 0.5 μm by pretreatment using a sulfuric acid-hydrogen peroxide-based chemical solution. Asahi Kasei E-Materials The dry film resist “AQ1559” manufactured was laminated on the etched surface.
Next, the glass mask on which the test pattern was drawn was contact-exposed with a parallel light type exposure machine. Thereafter, development processing was performed, and circuit formation was performed by etching with ferric chloride under the line conditions of the present invention and the conventional line conditions.

  The circuit width is measured by measuring 30 points of 6 × 5 evenly on the inner side of the substrate edge 10 mm from the finish of the line width of the portion where the glass mask pattern line width 55 μm and space width 25 μm are continuously arranged. The comparison was made with the standard deviation.

As a result of the test, the conventional method has a tendency of slow etching of the central portion of the upper surface, and the standard deviation is 3.7 μm.
On the other hand, in the method of FIG. 3 which is an embodiment of the present invention, the tendency of slow etching at the center of the upper surface was improved, and a result with a standard deviation of 2.8 μm was obtained.
As shown in FIG. 4, which is another example, a standard deviation of 2.5 [mu] m was obtained when a type having a small flow rate was used for the right and left outer spray nozzles.
From the above comparative tests, the effectiveness of the present invention could be confirmed.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2F, 2B Control roller 3 Upper surface conveyance roller 4 Upper surface spray nozzle 4 The upper surface spray nozzle of the right side with respect to _R board | substrate conveyance direction, and the injection quantity is smaller than the spray nozzle 4. 4 Left side upper surface spray with respect to _L board | substrate conveyance direction Nozzle, less spraying amount than spray nozzle 4 5, 5a Upper surface spray tube 6 Lower surface transport roller 7 Lower surface spray nozzle 8 Lower surface spray tube 10 Chemical treatment device 21R, 21L, 22R, 22L Spray pattern 21a, 22a Spray pattern trailing edge 31 Center line 41 in the width direction of the substrate 1 Injection pressure control valve 42 Injection pressure gauge

Claims (4)

A method of manufacturing a printed wiring board using a horizontal conveyance type processing apparatus that performs chemical treatment by spraying a chemical solution with a spray nozzle,
The horizontal conveyance type processing apparatus includes a chemical treatment apparatus having an effect of reducing variation in accuracy in the width direction of chemical treatment with a chemical without causing a liquid pool of the chemical,
The chemical solution processing apparatus has a spray unit in which a plurality of spray tubes arranged with a plurality of spray nozzles arranged in the width direction of the substrate to be conveyed and ejecting the chemical solution toward the substrate are arranged,
The plurality of spray nozzles are spray nozzles that spray a chemical liquid in a fan-shaped spray pattern, and the chemical liquid spray angles of the spray nozzles disposed on the left and right sides in the width direction of the substrate with respect to the transport direction are disposed on the left side. The spray nozzle is arranged at an angle so as to inject the chemical liquid substantially in the left direction, and the spray nozzle arranged on the right side is arranged at an angle so as to inject the chemical liquid in the substantially right direction,
When the spray tube is a spray tube having a spray nozzle that exhibits a spray pattern in a direction range of more than −90 degrees and less than 90 degrees with respect to the transport direction, the spray tube is located on the reverse transport direction side from the trailing edge of the spray pattern. , A restriction roller is provided to inhibit the chemical flow to the center of the substrate,
When the spray tube is a spray tube having a spray nozzle that exhibits a spray pattern in a direction range of more than 90 degrees and less than 270 degrees with respect to the transport direction, the substrate is disposed on the transport direction side from the trailing edge of the spray pattern. By providing a regulating roller that blocks the flow of chemicals to the center, the flow to the left and right sides becomes the mainstream, and the chemicals are easily drained from the center and do not cause liquid accumulation, reducing variations in the width direction of chemicals processing. A method of manufacturing a printed wiring board, comprising: a chemical processing apparatus having an effect of:   Spray nozzles arranged in a substantially left end and a substantially right end in the width direction of the substrate with respect to the transport direction of the substrate in a plurality of spray nozzles arranged in the width direction of the transported substrate and ejecting a chemical toward the substrate. The method for manufacturing a printed wiring board according to claim 1, wherein a chemical liquid ejection amount is smaller than a chemical liquid ejection amount of a spray nozzle that ejects a chemical liquid in the vicinity of the center of the substrate.   Spray nozzles arranged in a substantially left end and a substantially right end in the width direction of the substrate with respect to the transport direction of the substrate in a plurality of spray nozzles arranged in the width direction of the transported substrate and ejecting a chemical toward the substrate. The method for manufacturing a printed wiring board according to claim 1, wherein a chemical liquid ejection pressure is smaller than a chemical liquid ejection pressure of a spray nozzle that ejects a chemical liquid in the vicinity of the center of the substrate. A chemical treatment apparatus that performs chemical treatment by spraying a chemical liquid onto a substrate with a spray nozzle and performs the chemical treatment in a horizontal conveyance type processing apparatus that manufactures a printed wiring board,
Having a spray unit in which a plurality of spray tubes arranged with a plurality of spray nozzles arranged in the width direction of the substrate to be conveyed and spraying a chemical solution toward the substrate are arranged;
The plurality of spray nozzles are spray nozzles for spraying chemical liquid in a fan-shaped spray pattern, and the chemical liquid spray angles of the spray nozzles disposed on the left and right sides of the substrate width direction with respect to the substrate transport direction are disposed on the left side. The spray nozzle is arranged at an angle that ejects the chemical liquid substantially in the left direction, and the spray nozzle arranged on the right side is arranged at an angle that ejects the chemical liquid substantially in the right direction,
When the spray tube is a spray tube having a spray nozzle showing a spray pattern in a direction range of more than −90 degrees and less than 90 degrees with respect to the substrate transport direction, the reverse transport direction side of the rear edge of the spray pattern In addition, a restriction roller that inhibits the flow of the chemical liquid to the center of the substrate is provided,
When the spray tube is a spray tube having a spray nozzle showing a spray pattern in a direction range of more than 90 degrees and less than 270 degrees with respect to the substrate transport direction, it is closer to the transport direction side than the trailing edge of the spray pattern. By providing a restriction roller that inhibits the flow of chemicals to the center of the substrate, the flow to the left and right sides becomes the mainstream, and the chemicals are easily discharged from the central part and do not generate liquid pools. A chemical processing apparatus characterized by having an effect of reducing water.

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