JP2000212774A - Chemical processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chemical processing device that the chemical processing uniformity is improved, the circuit width is uniformized thereby, the sectional shape of the circuit becomes square or rectangular, and any accident of circuit elimination can be prevented. SOLUTION: Firstly, relating to a chemical processing device, the spraying pressure of a chemical E against a printed circuit board B is successively higher toward a spray nozzle 2 on the center side in the right-to-left width direction G, and successively lower toward the spray nozzles 2 on the right and left sides. Secondly, relating to this chemical processing device, a direction changing device is built in between conveyors and the direction of the printed circuit board B to be carried is changed by 90 deg. along the horizontal plane on the way. Thirdly, in the chemical processing device, a regulation roller to regulate the flow of the chemical E sprayed against the printed circuit board B longitudinally along the carrying direction on an outer surface, is arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a chemical processing apparatus. That is, for example, the present invention relates to a chemical processing apparatus such as a developing apparatus or an etching apparatus, which is used in a manufacturing process of a printed wiring board and performs a chemical treatment by spraying a chemical such as a developer or a corrosive liquid on a printed wiring board material to be conveyed. Things.

[0002]

2. Description of the Related Art First, the technical background of a printed wiring board, which is a typical example of a thin substrate, will be described. Recently, the miniaturization, weight reduction, and high density of electronic equipment have been remarkably advanced, and the printed wiring board, which is an important component thereof, has recently been further reduced in size.
With the progress of finer and multi-layered products, for example, CSs related to semiconductor chips that are grasped as part of printed wiring boards
Ultra-miniaturization and ultra-fineness are being promoted with the appearance of P and PBGA. In particular, the circuit formed on the outer surface of such a printed wiring board has been extremely miniaturized, highly accurate, and highly densified. On the other hand, conventionally, in a general printed wiring board, the limit value of the circuit width is about 150 μm, and the CSP, PB
In the GA, the limit value of the circuit width (conductor width) is about 50 μm to 60 μm. However, recently, even a general printed circuit board is required to have a circuit width of 40 μm or less. I have. For example, even a circuit width of 20 μ and a space between circuits of about 30 μ may be required. Thus, for the circuit of the printed wiring board,
The circuit width is becoming finer, and the tolerance of such a circuit width is required to be within ± 5%. For example, the precision has been improved, and the cross-sectional shape of the formed circuit has been changed to a square or a rectangle. There is a remarkable progress in densification, for example, it is desirable to have something as close as possible, that is, not as a trapezoidal shape or a substantially Mt. Fuji shape, but as close as possible to a vertical convex shape.

[0003] By the way, such a printed wiring board is prepared by cutting a printed wiring board material in which a copper foil is adhered to an insulating base material → drilling, polishing and plating for through holes →
Manufacturing by sequentially and successively following many processes such as coating and drying of an etching resist or pasting → exposure by applying a negative film for circuit → development → etching → stripping of etching resist on circuit parts etc. Have been. In the process of developing or etching the printed wiring board material, in each processing chamber, the printed wiring board material is transported in a horizontal position by a conveyor, and a chemical solution such as a developing solution or a corrosive solution is supplied. By spraying from a number of spray nozzles disposed opposite to each other at a uniform spray pressure, a chemical treatment such as development or etching is performed, thereby forming a circuit. As described above, in a printed wiring board in which circuit miniaturization, high precision, and high density are progressing, such chemical processing such as development and etching is performed uniformly as a whole, for example, etching is performed. It is extremely important that the operation is performed with high accuracy and uniformity as a whole.

[0004]

By the way, the following problems have been pointed out with respect to a conventional chemical processing apparatus such as a developing apparatus or an etching apparatus for performing a chemical treatment such as development or etching. First, in this type of chemical processing apparatus, as described above, chemicals such as a developer and a corrosive liquid are pumped through a pump and then sent to the conveyor from a number of fixed or swing type spray nozzles. Is sprayed onto a printed wiring board material, which is a thin substrate transported in a horizontal posture.
Most of the chemicals such as the developing solution and the corrosive solution thus ejected hit the outer surface of the printed wiring board material, and then flow on the outer surface in the left and right width directions and flow out. In other words, the injected chemical liquid slightly turbulently flows on the outer surface of the printed wiring board material in the forward and backward transport directions and stays there, but most of the sprayed liquid flows along the outer surface of the printed wiring board material in the left-right width direction. It flows down and outflows from both left and right sides of the printed wiring board material.

[0005] Now, in this type of conventional chemical liquid processing apparatus,
It has been pointed out that the formation of such a flow of the chemical solution results in a loss of the overall uniformity of the chemical treatment. That is, when observing the printed wiring board material as a thin plate base material in the left and right width directions, the chemical processing such as development and etching is delayed or insufficient in speed toward the center side, while the left and right side sides are closer to the left and right side. In addition, chemical processing such as development and etching is speedy and accelerated. In other words, although the chemical is sprayed on the printed wiring board material with a uniform spray pressure as a whole, most of the chemical flows after the injection on the outer surface of the printed wiring board material in the left and right width directions. As a result, as for the printed wiring board material, the density of the chemical is lower and less at the center (only the chemical sprayed toward the center exists), and the density of the chemical is higher and more at the left and right sides. (The chemical liquid injected toward both sides and the chemical liquid flowing from the central side are added together).

Therefore, the chemical treatment of the printed wiring board material as a thin plate base material is delayed or insufficient at the center side, and the chemical treatment is accelerated or accelerated at the left and right sides. When both sides are considered standard, chemical processing such as development and etching on the center side is delayed or insufficient, whereas when considered on the center side, chemical processing on both sides is over or excessive. . In this way, in the conventional chemical liquid processing apparatus of this type, the uniformity of the chemical processing such as development and etching is impaired, and the unevenness phenomenon and the excess and deficiency portions occur, and the circuit formed thereby is formed. In addition, the circuit width becomes non-uniform, the trapezoidal shape, the shape of the cross section is substantially Mt. Fuji, and even the circuit disappears (based on over / excessive chemical treatment). This has been a fatal problem for printed wiring boards that have been increasing in density.

Second, as shown in the plan view of FIG. 7, a printed wiring board A (printed wiring board material B), which is a typical example of a thin substrate, has a vertical shape as shown in FIG. A type in which a circuit C is formed in a direction (longitudinal direction in the drawing). (2) As shown in FIG. (3) As shown in FIG. 3, a type in which the circuit C is formed, and a type in which the two are mixed, that is, a type in which the vertical circuit C and the horizontal circuit C are mixed, Etc. As described in the first point, the injected chemicals such as the developing solution and the corrosive liquid are considered to flow out of the outer surface of the printed wiring board material in the width direction of the left and right in the first place. However, as a secondary effect, the circuit C formed on the outer surface is also affected. In other words, the injected chemical is
The tendency of the circuits C to flow easily through the inter-circuit spaces D between the circuits C cannot be overlooked.

That is, in the conventional chemical liquid processing apparatus of this type, a printed circuit board material B of a type in which a circuit C is formed in a vertical direction shown in FIG. When the chemical is ejected while being conveyed, the chemical tends to be turbulent in a considerable part, and has a strong tendency to flow and stay on the outer surface of the printed wiring board material B through the vertical inter-circuit space D, To that extent, chemical processing such as development and etching of the circuit C is speeded up. On the other hand, when the liquid chemical is ejected while the printed wiring board material B of the type in which the circuit C is formed in the horizontal direction shown in FIG. Is
Flowing through the outer surface of the printed wiring board material B through the inter-circuit space D in the lateral direction, the flow in the left and right width directions described in the first point is further promoted, and the development and etching of the circuit C are performed. The chemical treatment such as (1) in FIG.
The speed is slower than in the case of FIG.

As described above, the chemical solution is used for the printed wiring board material B.
However, the chemical liquid after the injection is affected by the vertical and horizontal directions of the circuit C formed on the printed wiring board material B, so that the vertical circuit C and the horizontal circuit C The speeds of chemical treatments such as development and etching are different, and speed differences occur. Therefore, as shown in FIG. 7 (3),
For one printed wiring board A (printed wiring board material B), a type in which the vertical circuit C and the horizontal circuit C are mixedly formed (there are many such types in practice) If so, it has been pointed out that the uniformity of chemical treatment such as development and etching is impaired. Further, a similar problem also occurs in a double-sided type printed wiring board A (printed wiring board material B) in which a vertical circuit C is formed on one of the front and back surfaces and a horizontal circuit C is formed on the other. It was pointed out. That is, in the conventional chemical processing apparatus of this type, when the vertical circuit C is considered as a standard, chemical processing such as development and etching of the horizontal circuit C is delayed or insufficient. Considering the circuit C as a standard, the chemical treatment of the circuit C in the vertical direction would be over- or excessive.

As described above, in the conventional chemical liquid processing apparatus of this type, in addition to the above-described first point, the second point also indicates the overall uniformity of the chemical treatment such as development and etching. Was spoiled, and the unevenness phenomenon and the excess and deficiency points were likely to occur. As for the circuit C formed in advance, the circuit width becomes non-uniform, and a trapezoidal or substantially Mt. Fuji-shaped cross-sectional shape or even the disappearance of the circuit C occur (based on over / excessive chemical treatment). This has been a fatal problem for printed wiring boards that are becoming finer, more precise, and more dense.

In view of such circumstances, the present invention has been made as a result of intensive research efforts of the inventor in order to solve the above-mentioned problems of the conventional example. By setting the side to be higher and lowering to the side, in claims 3 and 4, the direction is changed by 90 degrees in the middle, and in claims 5 and 6, by restricting the flow to the front and back, In each case, the uniformity of the chemical treatment is improved, for example, the circuit width is made uniform, the cross-sectional shape of the circuit approaches a square or a rectangle, and the situation where the circuit disappears is prevented. It is an object of the present invention to propose a chemical treatment device.

[0012]

The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows. That is, this claim 1
The chemical liquid processing apparatus performs chemical processing by spraying a chemical liquid onto a thin substrate to be conveyed. The injection pressure of the chemical is set high at the center along the transport direction of the thin plate base material and set low at the side. Claim 2 is as follows. That is, in the chemical processing apparatus according to claim 2, in the chemical processing apparatus according to claim 1, the thin plate substrate is conveyed in a horizontal posture on a conveyor, and the chemical is
It is sprayed from a number of spray nozzles disposed opposite to the conveyed sheet substrate. Then, the injection pressure of the chemical solution is sequentially higher in the left and right width directions orthogonal to the front and rear transport directions of the thin plate base material toward the center of the spray nozzle,
The spray nozzles on both left and right sides are sequentially set lower.

Next, claim 3 is as follows. In other words, the chemical processing apparatus according to the third aspect performs a chemical treatment by spraying a chemical onto the conveyed thin plate substrate. And
The direction of the sheet base material to be conveyed is changed by 90 degrees along the conveyance surface on the way. Claim 4 is as follows. That is, in the chemical processing apparatus according to the fourth aspect, in the chemical processing apparatus according to the third aspect, the thin plate substrate is conveyed in a horizontal posture by a conveyor,
The chemical is sprayed from a number of spray nozzles disposed opposite to the thin substrate to be conveyed. A direction change device is incorporated between the front and rear conveyors, and the direction change device turns the direction of the conveyed thin sheet substrate 90 degrees along a horizontal plane, and the front and rear sides are turned to the left and right sides. The left and right sides are changed to the front and rear sides.

Next, claim 5 is as follows. In other words, the chemical processing apparatus according to the fifth aspect performs a chemical treatment by spraying a chemical onto the conveyed thin plate substrate. And
It is characterized in that a regulating roller for regulating that the chemical solution sprayed on the sheet base material afterward flows back and forth along the transport direction on the outer surface of the sheet base material is provided. Claim 6 is as follows. That is, in the chemical processing apparatus according to the fifth aspect, the thin plate base is transported in a horizontal posture, and the chemical is disposed in a large number of opposed to the thin base to be transported. Injected from a spray nozzle. The regulating rollers are arranged facing the outer surface of the thin plate base material along the left and right width directions orthogonal to the front and rear transport directions, and a large number of the regulating rollers are arranged at intervals in the front and rear directions. ing. In addition, a plurality of the spray nozzles are provided so as to face each other between the regulating rollers.

Next, claim 7 is as follows. That is, the chemical treatment apparatus of claim 7 is
The chemical processing apparatus described in 2, 3, 4, 5, or 6, wherein the chemical processing apparatus is used in a manufacturing process of a printed wiring board. And the thin plate base material is made of a printed wiring board material on which a circuit is formed on the outer surface, and as the chemical solution,
It is characterized in that a developer or a corrosive liquid is used.

The present invention is configured as described below. This chemical processing apparatus is used, for example, in a manufacturing process of a printed wiring board, and a chemical such as a developing solution or a corrosive solution is sprayed from a large number of spray nozzles onto a thin substrate such as a printed wiring board material conveyed by a conveyor. It is sprayed, and thus a chemical treatment such as development or etching is performed. First, in claims 1 and 2, the chemical liquid is injected at a higher injection pressure toward the center along the transport direction, and at a lower injection pressure toward both the left and right sides. In general, the injected chemical flows down the left and right width directions on the outer surface of the printed wiring board material or the like, and then flows down from both sides. The processing is performed uniformly from the center to both sides.

According to the third and fourth aspects, a direction changing device is incorporated between the conveyors, and the printed wiring board material or the like conveyed is turned by 90 degrees in a horizontal plane in the middle. In the case of a printed wiring board material or the like, a circuit may be formed in the horizontal direction as well as in the vertical direction (the horizontal direction is a direction different from the vertical direction by about 90 degrees on the same plane). In many cases, the injected chemical liquid easily flows through the space between the circuits, and the speed of the chemical treatment varies depending on the length and width of the circuit. So, like this, 90
The reversal of degrees eliminates the adverse effects of the speed difference and allows the chemical treatment to be uniform across the vertical and horizontal circuits.

Further, in the fifth and sixth aspects, a large number of regulating rollers are arranged at intervals in the front and rear transport direction along the left and right width direction, and the spray nozzle is disposed between such intervals. A plurality of them are arranged facing each other. In printed wiring board materials, etc., circuits are formed in the vertical direction and the horizontal direction, and the injected chemical liquid easily flows through the space between each circuit, and as it is, the chemical solution depends on the vertical and horizontal direction of the circuit. There is a speed difference in processing. Therefore, the fact that the injected chemical liquid flows in the front and rear transport directions,
This is prevented by the regulating roller, so that the chemical solution is forced to flow in the width direction on both sides without being affected by the vertical and horizontal directions of the circuit. It becomes uniform over the vertical and horizontal circuits.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments of the invention shown in the drawings. FIG. 1, FIG. 2,
3, 4, 5, 6, etc. are provided for describing an embodiment of the chemical solution treatment apparatus according to the present invention. 1 is a side view, FIG. 2 is a plan view, FIG. 3 is a side view of a main part, and FIG. 4 is a plan view of a main part. FIG. 5A is an explanatory side view of a main part of another part, and FIG. 5B is a plan explanatory view of the main part. FIG. 6 is a front view of the main part. FIG. 7
FIGS. 3A and 3B are plan explanatory views for explaining a printed wiring board (material). FIG. 1A is an example in which a circuit is formed in a longitudinal direction, and FIG. For example,
(3) The figure shows an example in which the circuit is formed in the longitudinal direction and the lateral direction. FIG. 8 is a cross-sectional view of a printed wiring board (material). FIG. 8A illustrates a circuit and a space between circuits, and FIG. 8B illustrates an example of a good circuit. The figure shows
Here is an example of a bad circuit.

This chemical processing apparatus is used in a manufacturing process, a processing process, and other various processing processes of a thin plate substrate.
Here, a case where the thin film substrate is used in a manufacturing process of a printed wiring board A, which is a typical example of a thin substrate, will be described in detail. First, the premise of the printed wiring board A will be described with reference to FIG. 7 and FIG.

The printed wiring board A may be used for various types of OA equipment, a mobile phone, a computer, a computer, a variety of other electronic equipment with the development of multimedia, etc. There is a great variety and the manufacturing process is also great. Printed circuit boards A can be classified into single-sided boards, double-sided boards, multilayer boards (including those based on the recent build-up method), flexible boards, and the like. , PBGA have also appeared.
In recent years, the printed circuit board A has been remarkably reduced in size, weight, extremely thin, flexible, multilayered, and the like, and in particular, the circuit C is becoming finer, more precise, and more dense. Then, such a printed wiring board A is manufactured, for example, as follows. That is, the printed wiring board A
Is for laminating, polishing, cutting → through hole drilling, polishing, plating, polishing → applying / drying / applying etching resist → exposing → developing → etching → circuit C portion of the printed wiring board material B in sequence. It is manufactured by continuously following many steps such as stripping of an etching resist.

These will be described in more detail. First, after copper foil is laminated and laminated on both surfaces of an insulating base material such as polyimide by hot pressing or the like, cleaning and polishing are performed. Then, a printed wiring board material B, for example, a double-sided copper foil-clad laminate obtained through such a pretreatment step,
After being cut to a short size of the work size, and then subjected to drilling for through holes, cleaning and double-side polishing are performed, and then plating is performed. As a result, the inner wall of the through hole is also plated so as to conduct the circuit C on the front surface and the circuit C on the back surface. (In addition to these, a single-sided copper foil-clad laminate in which copper foil is adhered to only one side of an insulating base material may be used as the printed wiring board material B,
In this case, the application of a photosensitive resist described below is performed on only one side, but the present invention is naturally applied to the printed wiring board material B for a single-sided board. ) A large number of through holes are formed in a single printed wiring board material B (printed wiring board A), such that hundreds or thousands of extremely small diameter holes are formed.

After that, the printed wiring board material B is again cleaned, polished, cleaned, dried, etc.
An etching resist, that is, a photosensitive resist serving as an alkali-resistant or acid-resistant protective film is applied and dried to form a coating film. Then, after exposing a circuit C photograph, which is a negative film of the circuit C, to the outer surface such as the upper surface and the lower surface on which the circuit C is formed, the photosensitive resist leaves the exposed and cured circuit C portion, Unnecessary portions are dissolved and removed by spraying the developing solution as the chemical solution E (see also FIGS. 1 and 5 described later). Thereafter, the printed wiring board material B is washed and dried, and then the photosensitive resist is hardened in this way, leaving the copper foil of the portion of the circuit C covered and protected, and the photosensitive resist is dissolved and removed as described above. The unnecessary portion of the copper foil is dissolved and removed and etched by spraying a corrosive solution as the chemical solution E (see also FIGS. 1 and 5 described later). Then, the remaining photosensitive resist in the above-described cured circuit C portion is dissolved and removed by spraying a stripping solution as a chemical solution E, and then washed and dried, so that the printed circuit board on which the predetermined circuit C is formed is formed. A is obtained.

The printed wiring board A has, for example,
50mm × 550mm, 500mm × 500mm, 50
It has a size of about 0 mm x 300 mm, and its thickness is
The portion of the insulating base material is, for example, about 0.06 mm, and the portion of the circuit C made of copper foil is extremely thin, for example, to about 0.018 mm. Even in the case of such a multilayer board in which the printed wiring board A is laminated in four layers or the like, the overall thickness is 1.
It is becoming extremely thin, from 0 mm to 0.8 mm, and further to about 0.4 mm. The circuit width F also tends to be reduced from 150 μ to 70 μ and further to 40 μ, and there is a need for a circuit width F of 20 μ and a space D between circuits of about 30 μ.

For the printed wiring board A manufactured by following these steps, a protective film of the formed circuit C is formed as a post-processing step as a part of the manufacturing process. That is, first, a photosensitive resist as a solder resist is applied to the entire outer surface of the printed circuit board A on which the circuit C is formed, on which the circuit C is formed, and dried to form a coating film. Then, exposure and development are carried out by applying a negative film, and only the photosensitive resist in a part mounting portion such as a through-hole portion, that is, a portion where soldering is performed afterward is dissolved and removed to expose (these processes are performed in Almost according to the above-mentioned steps). In this way, a protective film made of a photosensitive resist is formed on the printed wiring board A, and the circuit C is protected. That is, after that, the circuit C of the printed wiring board A is protected from, for example, the attachment of solder to the component mounting portion. The printed wiring board A is manufactured by following such a process.

Hereinafter, the chemical processing apparatus of the present invention will be described with reference to FIGS. 1, 2, 3, 4, 5, 6, and the like. The chemical processing apparatus such as the developing apparatus and the etching apparatus is used in, for example, a manufacturing process such as a developing process and an etching process of the printed wiring board A as described above, and is a thin sheet substrate which is conveyed in a horizontal posture by the conveyor 1. A chemical solution E such as a developing solution or a corrosive solution is sprayed from a large number of spray nozzles 2 disposed opposite to the printed wiring board material B, whereby chemical processing such as development and etching, and chemical liquid processing are performed.

These will be described in detail below. First, as shown in FIG. 1 (the conveyor 1 is not shown in FIG. 2), the conveyor 1 of the chemical solution processing apparatus is provided with a processing chamber 3 for a developing process or an etching process. In a developing chamber or an etching chamber, for example, the printed wiring board material B is transported in a horizontal posture. That is, the conveyor 1 has a plurality of shafts 4 arranged in a horizontal direction at a predetermined pitch in parallel with the left and right width directions G and in the front and rear conveyance directions H, and rollers 5 arranged on each of the shafts 4. Is provided. In the illustrated example, two processing chambers 3 are provided before and after via a later-described direction changing device 6 provided on the way, and in each of the two processing chambers 3, a shaft 4 and a roller 5 are printed. The wiring board material B is vertically opposed so as to sandwich the wiring board material B therebetween.
Normally, the lower shaft 4 and the roller 5 are driven to rotate and function as a carrier, and the upper shaft 4 and the roller 5 are driven in a free state. It functions for anti-snaking and meandering. The function of the roller 5 as the regulating roller J will be described later. In addition, for such transfer and holding
In view of the function for preventing meandering, a wheel can be used instead of the roller 5.

Next, as shown in FIGS. 1 and 2, the spray nozzles 2 of the chemical liquid processing apparatus are printed in the transporting direction H by the conveyor 1 in the front and rear processing chambers 3 respectively. A chemical solution E such as a developing solution or a corrosive solution is sprayed on the wiring board material B. That is, the spray nozzles 2 are arranged in a large number in the front and rear transport direction H and the left and right width direction G, and are also arranged vertically in the illustrated example, so that they are opposed to the printed wiring board material B from above and below. . In other words, a large number of spray nozzles 2 are arranged vertically at predetermined pitch intervals in the front, rear, left and right, over a wide area in the processing chamber 3 surrounded by the transport direction H and the width direction G perpendicular to the transport direction H. Have been. The chemical E, for example, a developer or a corrosive liquid, is stored in a liquid tank 7 below the processing chamber 3. Then, the chemical solution E in the liquid tank 7 is pumped through the pump and the spray pipes 8 arranged in parallel along the transport direction H, and then spray nozzles provided at predetermined pitch intervals in the spray pipes 8 are provided. In the example shown in the drawing, the ink is sprayed, sprayed, and diffused from above 2 toward the printed wiring board material B conveyed by the conveyor 1. Then, after the chemical solution E flows on the outer surface of the printed wiring board material B, that is, the circuit C forming surface,
It flows down to the lower liquid tank 7 again, is collected, and is recycled afterwards. The spray nozzles 2 may be of a fixed type or a swing type.

A chemical processing apparatus such as a developing apparatus or an etching apparatus includes such a conveyor 1 and a spray nozzle 2. And this chemical | medical solution processing apparatus is further provided with the following characteristic structures. First, FIG.
As shown in the figure, in this chemical processing apparatus, the injection pressure of the chemical E is controlled in the transport direction H of the printed wiring board material B as the thin base material.
The center along is high and the sides are low. That is, when viewed in the left and right width directions G orthogonal to the front and rear transport directions H of the printed wiring board material B, the spray pressure of the chemical solution E is gradually higher toward the center side of the spray nozzle 2 and is higher on both the left and right sides. The spray nozzle 2 is set to be lower sequentially.

The setting of the injection pressure of the chemical solution E is performed, for example, as follows. As described above, a plurality of spray pipes 8 are arranged in parallel along the transport direction H, so that the chemical solution E pumped through the pump is used.
Such adjustment is performed when the water is branched to each spray pipe 8. That is, each of the spray pipes 8 has a closed distal end and a proximal end connected to a pipe from a pump. Therefore, a valve and a pressure gauge are respectively provided at the base end for connection, and the opening and closing degree of the valve is adjusted while referring to the pressure of the chemical solution E detected by the pressure gauge, so that the spray pipe 8 on the center side becomes smaller. The pressure is high, and the pressure is adjusted to be lower for the spray pipes 8 on both sides.

Thus, the spray pipe 8 on the center side
The injection pressure of the chemical E by the spray nozzles 2 provided on the spray pipes 8 on both sides can be set high while the injection pressure of the chemical E by the spray nozzles 2 provided on both sides can be set low. Of course, the setting of the injection pressure of the chemical solution E is not limited to the method using the pressure gauge and the valve as described above, and various other known methods can be used. A method of adjusting the diameter is also conceivable. As described above, in this chemical processing apparatus, the injection pressure of the chemical E is set.

Next, as shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 4, in this chemical processing apparatus, the direction of the printed wiring board material B, which is the thin base material to be conveyed, is halfway, and Turn 90 degrees along the road. That is, the direction changing device 6 is incorporated between the front and rear conveyors 1. The direction changing device 6 turns the direction of the printed wiring board material B conveyed by 90 degrees along the horizontal plane, and turns the front and rear sides. The right and left sides are changed to the front and rear sides on the left and right sides.

These will be described in more detail. As described above, the conveyors 1 for transporting the printed wiring board material B in a horizontal posture are disposed in the front and rear two processing chambers 3, respectively, and a turn section is provided between the front and rear processing chambers 3. 9 and the direction changing device 6 is incorporated. Then, the direction changing device 6 conforms to each of the lower shafts 4 of the front and rear conveyors 1 and each of the shafts 10 disposed therebetween, and each such shaft 4 at a predetermined pitch in the width direction G. 2, and the shaft 11 and the wheel 11 are omitted in FIG.
Next cylinder 12, lower table 13, vertical guide 14,
It comprises a turntable shaft 15, a motor 16, a bevel gear 17, a turntable 18, an opening 19, and the like. In addition,
Each of the lower shafts 4 and the wheels 11 is driven to rotate and functions as a carrier.

That is, a cylinder 12 stands upright from the floor of the turn section 9.
2, the lower table 13 is
It can move up and down while being guided. A turntable shaft 15 is erected and fixed on the lower table 13. The turntable shaft 15 is mounted on a motor 16 such as a reversing motor disposed on the lower table 13.
, Via a bevel gear 17. A turntable 18 is horizontally fixed to the upper end of the turntable shaft 15. The turntable 18 has a size corresponding to the printed wiring board material B, and
As shown in (1), a large number of openings 19 are formed as a whole, and the openings 19 are formed with a size and a pitch that allow the wheel 11 to be freely inserted vertically or horizontally.

Therefore, in the direction changing device 6, the turntable 18 is, as shown in FIG.
2, can be moved up and down via the lower table 13 and the turntable shaft 15 and, as shown in FIG. 2, driven by the motor 16 via the bevel gear 17 and the turntable shaft 15. , Can be rotated by 90 degrees along a horizontal plane. The turntable 18
At the time of non-operation, as shown by the solid line in FIG. 1 and FIG. 3, each wheel 11 is lowered to a height level below the upper end. On the other hand, at the time of operation, after being transferred from the printed wiring board material B, that is, the conveyor 1 of the processing chamber 3 on the front side to a higher position,
When the rotational drive of the shaft 10 and the wheel 11 is temporarily stopped, the temporarily stopped printed wiring board material B is temporarily moved as shown by imaginary lines in FIGS. 1 and 3 by raising the turntable 18. lift. Then, the turntable 15 is turned by 90 degrees to change the direction of the printed wiring board material B being lifted by 90 degrees. Thereafter, the printed wiring board material B is placed on each wheel 11 again by descending, and further,
As shown by the solid line in FIGS. 1 and 3, it descends to its original non-operating position below and stops. Then, by rotating the shaft 10 and the wheel 11 again,
The printed wiring board material B is supplied to the conveyor 1 in the rear processing chamber 3.
Transported to

In the illustrated example, such a turntable 1
8 and the like, the direction changing device 6 is constituted,
(For example, a developing room or an etching room) between the conveyors 1. Then, the direction of the printed wiring board material B being transported is changed by 90 degrees along the horizontal plane, so that chemical processing such as development and etching is continued. The specific configuration of the direction changing device 6 serving as a turn conveyor may be various configurations other than the illustrated example. As described above, in this chemical processing apparatus, the printed wiring board material B is turned by 90 degrees.

Further, as shown in FIG. 5 and FIG.
In this chemical solution processing apparatus, the chemical solution E sprayed on the printed wiring board material B as the thin plate base material flows back and forth along the transport surface H along the outer surface of the printed wiring board material B as the thin plate base material as it is after the fact. However, a regulating roller J for regulating such a flow is provided. That is, the regulating roller J is disposed facing the outer surface of the printed wiring board material B along the left-right width direction G orthogonal to the front-back transport direction H, and has a spacing K in the front-back direction. Many books are arranged. Further, a plurality of spray nozzles 2 are respectively disposed so as to face each other at the interval K between the respective regulation rollers J.

The regulating roller J will be described in more detail. Chemical solution E sprayed from each spray nozzle 2
Most of the air flows on the outer surface of the printed wiring board material B in the left and right width directions G and flows down from both the left and right sides, but slightly flows as turbulence in the front and rear transport directions H and stays. In particular, when the circuit C is formed along the front and rear transport direction H, the chemical solution E tends to turbulently flow in the transport direction H through the inter-circuit space D and stay there. Therefore, in order to regulate the chemical solution E flowing and staying in the forward and backward transport directions H, a regulating roller J is provided as a so-called placing roller. And this regulation roller J
Are arranged in a horizontal direction at a predetermined pitch with a predetermined interval K at a predetermined interval K in parallel with the left and right width directions G and in the front and rear conveyance directions H, respectively, on the outer surface of the printed wiring board material B to be conveyed. It is pressed. Further, a plurality of spray nozzles 2 are arranged at positions behind the respective spacings K between the respective regulating rollers J, in the illustrated example, facing the center line in the width direction G of the respective spacings K. I have.

In the illustrated example, the above-described roller 5 of the conveyor 1 is also used as such a regulating roller J. That is, the regulating roller J has a unique function of regulating the flow of the chemical solution E in the transport direction H as described above, and may be disposed between the rollers 5 of the conveyor 1 as a stand-alone placing roller. It is possible. On the other hand, in the illustrated example, the roller 5 of the conveyor 1 is devised so as to be used as such a regulating roller J. That is, first, the rollers 5 which have been conventionally approaching the honey in the front and rear transport directions H are arranged so that a predetermined interval K exists between the rollers 5 and the spray nozzle 2 which has not been conventionally considered. The positional relationship is noted, and a plurality of spray nozzles 2 are arranged in rows facing the center line between the rollers 5 at the interval K. Thus, the roller 5 also functions as the regulating roller J. In the example of FIG. 1, the spray nozzles 2 are disposed so as to face all the intervals K between the regulating rollers J that also serve as the rollers 5. However, in the example of FIG.
They are arranged facing each other at every other interval K. Thus, it is not necessary to dispose the spray nozzles 2 corresponding to all the intervals K. In FIG. 2, reference numeral 20 denotes a conveyor frame. In this chemical treatment apparatus, such a regulating roller J is provided.

In this chemical processing apparatus, the injection pressure of the chemical E is set, the printed wiring board material B is turned 90 degrees, and the regulating roller J
Are arranged. And as shown in the illustrated example, the chemical solution treatment device may include all of these, but may include only one of,,, or, and may further include, for example,,, and. ,
And any two of them may be provided in combination.

The present invention is configured as described above. Then, it becomes as follows. This chemical treatment system
For example, it is used in a manufacturing process of the printed wiring board A, and is disposed in a horizontal position on the conveyor 1 and opposed to a thin base material such as a printed wiring board material B on which a circuit C is formed on the outer surface. A chemical solution E such as a developing solution or a corrosive solution is sprayed from the spray nozzle 2 to perform chemical processing such as development and etching.

First, in the chemical processing apparatus such as the developing apparatus and the etching apparatus, the chemical E such as the developing liquid and the corrosive liquid is sprayed at a higher injection pressure toward the center along the transport direction H and at a higher injection pressure toward the right and left sides. Spray nozzle 2 with low injection pressure
(See FIG. 6). The injected chemical E is
Generally, after flowing in the left and right width directions G on the outer surface of the printed wiring board material B, it flows down and out of the left and right sides.
The chemical treatment is performed uniformly from the center to both sides.

That is, if the chemical solution E is sprayed at a uniform spray pressure as a whole, most of the chemical solution E flows on the outer surface of the printed wiring board material B in the left and right width directions G. Processing becomes delayed or insufficient. On the other hand, in this chemical treatment apparatus, the injection pressure was set higher toward the center in this way, so that the
The deficiency is complemented by such injection pressure, and when viewed as a whole, a uniform chemical treatment is realized.

Second, in the chemical solution processing apparatus such as the developing apparatus and the etching apparatus, the direction changing device 6 is incorporated between the conveyors 1 so that the printed wiring board material B to be conveyed is partially turned. , 90 degrees in the horizontal plane (see FIGS. 1, 2, 3, 4 and the like). In the case of the printed wiring board material B, the horizontal direction is the horizontal direction as well as the vertical direction (the longitudinal direction in the drawing), which is about 90 degrees in the horizontal direction in the drawing, that is, the longitudinal direction and the vertical direction. The circuit C is often formed in a different direction). For example, for the same front surface or back surface as an outer surface (see FIG. 7 (3)), or for the front and back outer surface front and back surfaces (see FIGS. 7 (1) and (2)), Circuits C are often formed in both the vertical and horizontal directions. Then, the injected chemical solution E is filled in the space D between the respective circuits.
It is easy to flow through the circuit C, and there is a speed difference in the chemical processing depending on the vertical and horizontal directions of the circuit C. By turning 90 degrees in the middle in this way, the adverse effect of the speed difference is eliminated, and the chemical processing is performed over the vertical and horizontal circuits C. It becomes uniform.

That is, if the direction is not changed by 90 degrees in the middle in this way, for example, when the vertical direction of the circuit C is set to the front and rear transport direction H, the chemical processing speed of the vertical circuit C becomes high. Conversely, the chemical processing speed of the circuit C in the lateral direction on the same outer surface or the opposite surface is reduced, and the uniformity of the chemical processing is impaired. However, such a situation is avoided.

Thirdly, in the chemical liquid processing apparatus such as the developing apparatus and the etching apparatus, a large number of regulating rollers J are provided along the width direction G in the left and right direction and at intervals K in the front and rear transport direction H. A plurality of the spray nozzles 2 are disposed so as to face each other at the interval K (see FIGS. 1 and 5). As described in the second point described above, in the printed wiring board material B, the circuit C is often formed on the same surface or on the front and rear surfaces in the horizontal direction as well as in the vertical direction. And a chemical solution E such as a developing solution or a corrosive solution.
Flows easily through each inter-circuit space D, and as it is, a speed difference occurs in the chemical treatment depending on the vertical and horizontal directions of the circuit C. Therefore, the flow of the ejected chemical solution E in the front and rear transport direction H is regulated and prevented by the regulating roller J, so that the chemical solution E is forcibly left and right without being influenced by the vertical and horizontal directions of the circuit C. (In particular, see FIG. 5 (2)) by flowing along the width direction G of
The speed difference of the chemical processing is eliminated, and the chemical processing is performed vertically and horizontally.
Over time.

That is, if such a regulating roller J is not provided, for example, when the vertical direction of the circuit C is set to the front and rear transport directions, the chemical processing speed of the vertical circuit C is high. On the contrary, the chemical treatment speed of the circuit C in the horizontal direction on the same surface or the opposite surface on the front and back is reduced, and the uniformity of the chemical treatment is impaired. Is done.

Fourth, as in the first, second, and third embodiments, in the chemical liquid processing apparatus such as the developing apparatus and the etching apparatus, the chemical treatment of the printed wiring board material B is made uniform. As described above, in the manufacturing process of the printed wiring board A, chemical treatments such as development and etching and chemical liquid treatments are made uniform, and for the printed wiring board material B, a delay or a shortage of the chemical treatment or an excessive or excessive chemical treatment. No spots occur. First, the circuit width F of the circuit C to be formed (see FIG. 8) is made uniform overall. That is,
A situation where a wide portion or a narrow portion of the circuit width F occurs is avoided. Further, mainly because the over- or excessive chemical treatment does not occur, the cross-sectional shape of the formed circuit C is about 80% when the ideal circuit width F is 100%, that is, a square or rectangular shape. An object close to a vertical convex shape is obtained (see FIG. 8 (2)). That is, the ideal 55
A circuit width F of about% and a trapezoidal or substantially Mt. Fuji cross-sectional shape (see FIG. 8 (3)) are avoided.

[0049]

According to the present invention, there is provided a chemical processing apparatus such as a developing apparatus or an etching apparatus according to the present invention.
In the second aspect, the injection pressure is set higher toward the center and lower toward the side. In the third and fourth aspects, the direction is changed by 90 degrees in the middle. By doing so, the following effects are exhibited.

First, in the chemical liquid processing apparatus according to the first and second aspects, a chemical such as a developer or a corrosive liquid is sprayed onto a thin plate base material such as a printed wiring board material at a higher spray pressure toward the center and lower toward the side. Is done. The injected chemical generally flows on the outer surface of the printed wiring board material or the like in the left and right width directions and flows down and out of the left and right sides. Since the injection is performed at a higher injection pressure toward the center, chemical processing such as development and etching from the center to both sides is made uniform. That is, as in the above-described conventional example in which the injection was performed at a uniform injection pressure as a whole, the injected chemical liquid flows on the outer surface of the printed wiring board material and the like in the left and right width directions. The situation where the chemical treatment is delayed or insufficient at the center and the chemical treatment is accelerated or accelerated at both the left and right sides, and thus the uniformity of the chemical treatment is impaired, is surely avoided.

Secondly, in the chemical liquid processing apparatus according to the third and fourth aspects, the direction of the thin base material such as the printed wiring board material conveyed is changed by 90 degrees in the horizontal plane in the middle. In the case of printed wiring boards (materials), etc., circuits are formed in the vertical and horizontal directions (the horizontal direction is a direction different from the vertical direction by about 90 degrees on the same plane). Chemicals such as a developing solution and a corrosive solution are likely to flow on the outer surface of a printed wiring board or the like through the space between circuits. Speed difference easily occurs. Thus, by changing the direction of the printed wiring board material or the like by 90 degrees in the middle in this way, the adverse effect of the speed difference is eliminated, and the chemical processing such as development and etching is made uniform over the vertical and horizontal circuits. That is, as in the above-described conventional example in which the direction of the printed wiring board material or the like is not changed midway, for example, when the vertical direction is set to the front and rear transport directions, the chemical processing speed of the vertical circuit is increased, and The situation where the speed of the chemical treatment of the circuit in the direction is reduced and the uniformity of the chemical treatment is thus impaired is reliably avoided.

Thirdly, in the chemical processing apparatus according to the fifth and sixth aspects, the injected chemical such as a developing solution or a corrosive liquid flows on the outer surface of a thin substrate such as a printed wiring board material in the forward and backward transport directions. This is regulated and prevented by the regulating roller. In printed wiring boards (materials) and the like, circuits are often formed in the vertical and horizontal directions, and the injected chemical such as a developing solution or a corrosive liquid causes the outer surface of the printed wiring board or the like to be exposed. Since it is easy to flow through the space between the circuits, a speed difference occurs in chemical processing such as development and etching depending on the vertical and horizontal directions of the circuit as it is. Therefore, the regulation liquid is used to regulate and prevent the ejected chemical solution from flowing as a turbulent flow in the front and rear transport directions, so that the ejected chemical solution is forced without being affected by the vertical direction of the circuit. As a result, the chemical processing does not cause a speed difference, and the chemical processing is made uniform over the vertical and horizontal circuits. That is, as in the above-described conventional example in which such a regulating roller is not provided,
For example, when the vertical direction is set to the front and rear transport directions, the chemical processing speed of the vertical circuit is increased, and the chemical processing speed of the horizontal circuit is reduced, thereby deteriorating the uniformity of the chemical processing. The situation is definitely avoided.

Fourth, in the chemical liquid processing apparatus according to claims 1 and 2, the chemical liquid processing apparatus according to claims 3 and 4, and the chemical liquid processing apparatus according to claims 5 and 6, Chemical processing such as development and etching of the material is made uniform. Therefore, in the printed wiring board manufacturing process,
Regarding the circuit to be formed, even if the circuit has a fine circuit width, the circuit width is made uniform overall, and a cross section having a shape close to a square or a rectangle, that is, a vertical convex shape is obtained. Overheating is prevented and safety is improved. That is, as in the above-described conventional example, the uniformity of the chemical treatment is impaired, and the occurrence of unevenness and unevenness and the occurrence of excess / shortage are prevented. Occurrence of a cross-sectional shape, loss of a circuit, and the like is reliably avoided.

Fifth, in particular, printed wiring boards, including CSPs and PBGAs involving semiconductor chips, have made remarkable progress in miniaturization, high precision, and high density of circuits, and thus the chemical processing apparatus of the present invention has Even with a fine circuit width, a uniform circuit width is formed with an ideal cross-sectional shape, and there is a great significance that the limit value of the conventional circuit width can be largely changed. For example, according to the chemical processing apparatus of the present invention, the circuit width is 20 μm and the space between circuits is 30 μm.
A printed wiring board having a circuit of about μ can be easily manufactured. Recently, the thickness of copper foil for circuit formation has become extremely thin in response to the miniaturization, fineness, and multi-layering of printed wiring boards. In this situation, uniformity and circuit loss are likely to occur, and from this point of view, the significance of the chemical solution treatment apparatus of the present invention is particularly large. Further, as a means for responding to the miniaturization, high precision, and high density of such a circuit, only an electroplating method, which requires a very complicated process and is extremely costly, has been conventionally available. Thus, the significance of being able to respond by the so-called exposure / development / etching method is also significant. That is, according to the chemical solution processing apparatus of the present invention, it is possible to cope with miniaturization, high precision, and high density of a circuit of a printed wiring board by an extremely cost-effective exposure, development, and etching method. As described above, the effects exerted by the present invention are remarkable and large, for example, all the problems existing in this type of conventional example are solved.

[Brief description of the drawings]

FIG. 1 is a side view for explaining an embodiment of a chemical solution treatment apparatus according to the present invention.

FIG. 2 is an explanatory plan view for explaining the embodiment of the present invention;

FIG. 3 is an explanatory side view of a main part, used for describing the embodiment of the present invention.

FIG. 4 is an explanatory plan view of a main part, used for describing the embodiment of the present invention.

FIGS. 5A and 5B are views for explaining the embodiment of the present invention, in which FIG. 1A is a side view of another part of the main part, and FIG. 5B is a plan view of the same part.

FIG. 6 is a front view of a main part for describing the embodiment of the present invention.

FIGS. 7A and 7B are explanatory plan views for explaining a printed wiring board (material). FIG. 7A is an example in which a circuit is formed in a longitudinal direction, and FIG. The example
(3) The figure shows an example in which the circuit is formed in the longitudinal direction and the lateral direction.

FIG. 8 is a sectional view of a printed wiring board (material);
(1) The drawings are provided for explanation of circuits, spaces between circuits, etc.
FIG. 2B shows an example of a good circuit, and FIG. 3C shows an example of a bad circuit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conveyor 2 Spray nozzle 3 Processing chamber 4 Shaft 5 Roller 6 Direction change device 7 Liquid tank 8 Spray pipe 9 Turn section 10 Shaft 11 Wheel 12 Cylinder 13 Lower table 14 Vertical guide 15 Turntable shaft 16 Motor 17 Bevel gear 18 Turntable 19 Opening 20 Conveyor frame A Printed circuit board (thin plate) B Printed circuit board (thin plate) C Circuit D Inter-circuit space E Chemical solution F Circuit width G Width direction H Transport direction J Regulation roller K Interval

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[Procedure amendment]

[Submission date] March 27, 2000 (2003.
7)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

[Title of the Invention] Chemical treatment equipment

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a chemical processing apparatus. That is, the present invention relates to a chemical processing apparatus such as a developing apparatus or an etching apparatus for performing a chemical treatment by spraying a chemical solution such as a developing solution or a corrosive solution on a printed wiring board material used and transported in a manufacturing process of a printed wiring board. Things.

[0002]

2. Description of the Related Art First, a printed wiring board will be described. In recent years, the progress of miniaturization, weight reduction, and high density of electronic equipment has been remarkable, and printed wiring boards,
In recent years, miniaturization, fineness, and multi-layering have been further advanced. For example, CSPs and PBGAs related to a semiconductor chip, which are grasped as a part of a printed wiring board, have appeared. In particular, the progress of miniaturization, higher precision, and higher density of circuits formed on the outer surface of a printed wiring board has been remarkable. On the other hand, conventionally, in a general printed wiring board, the limit value of the circuit width is about 150 μm, and the CS value related to the semiconductor chip is
For P and PBGA, the limit value of the circuit width (conductor width) is about 50 μm to 60 μm. However, recently, even a general printed circuit board often requires a circuit width of 40 μm or less. It has become to. For example, if the circuit width is 2
Even a circuit having a space between circuits of about 0μ and about 30μ may be required. As described above, with respect to the circuit of the printed wiring board, the circuit width is becoming finer, and the tolerance of such a circuit width is required to be within about ± 5%. The density of the circuit has been remarkably increasing, for example, it is desired that the cross-sectional shape of the circuit to be formed is as close as possible to a square or a rectangle, that is, not a trapezoidal shape or a substantially Mt.

[0003] By the way, such a printed wiring board is prepared by cutting a printed wiring board material in which a copper foil is adhered to an insulating base material → drilling, polishing and plating for through holes →
It is manufactured by sequentially following many processes such as coating and drying or pasting of an etching resist → exposure to a negative film for a circuit → development → etching → stripping of an etching resist at a circuit portion and the like. . In the process of developing and etching the printed wiring board material, in each processing chamber, the printed wiring board material is conveyed by a conveyor in a horizontal posture.
By spraying a chemical solution such as a developing solution or a corrosive solution from a number of spray nozzles disposed opposite to each other at a uniform spray pressure, a chemical treatment such as development or etching is performed, thereby forming a circuit. . As described above, in a printed wiring board in which circuit miniaturization, high precision, and high density are progressing, such chemical treatments as development and etching are required.
It is extremely important that the etching be performed uniformly on the whole, for example, that the etching be performed uniformly and accurately on the whole.
It depends on the success or failure.

[0004]

As described above, the following problems have been pointed out with respect to a conventional chemical processing apparatus such as a developing apparatus or an etching apparatus for performing a chemical treatment such as development or etching. First, as described above, in this type of chemical liquid processing apparatus, chemical liquids such as a developer and a corrosive liquid are pumped through a pump and then sent to the conveyor from a number of fixed or oscillating spray nozzles. To the printed wiring board material conveyed in a horizontal position. Most of the chemicals such as the developing solution and the corrosive solution thus ejected hit the outer surface of the printed wiring board material, and then flow on the outer surface in the left and right width directions and flow out. That is, the injected chemical liquid is slightly turbulent, and flows on the outer surface of the printed wiring board material in the front and rear transport direction, but most of the liquid flows on the outer surface of the printed wiring board material in the left and right width directions, It flows down and out of the left and right sides of the printed wiring board material.

[0005] Now, in this type of conventional chemical liquid processing apparatus,
It has been pointed out that the formation of such a flow of the chemical solution results in a loss of the overall uniformity of the chemical treatment. That is, when observing the printed wiring board material in the left and right width directions, the chemical processing such as development and etching is slowed or insufficient in speed toward the center, whereas the development and etching are performed closer to the left and right sides. Etc. are accelerated and accelerated. In other words, although the chemical is sprayed on the printed wiring board material with a uniform spray pressure as a whole, most of the chemical flows after the injection on the outer surface of the printed wiring board material in the left and right width directions. As a result, with respect to the printed wiring board material, the density of the chemical is lower and the amount is smaller toward the center (only the chemical injected toward the center exists).
The density of the chemical solution is higher and the amount is greater on both left and right sides (the chemical solution injected toward both sides and the chemical solution flowing from the center side are added together).

Accordingly, the chemical treatment of the printed wiring board material is delayed or deficient toward the center, and the chemical treatment is accelerated or accelerated toward the left and right sides. When both sides are considered standard, chemical processing such as development and etching on the center side is delayed or insufficient, whereas when considered on the center side, chemical processing on both sides is over or excessive. . In this way, in the conventional chemical liquid processing apparatus of this type, the uniformity of the chemical processing such as development and etching is impaired, and the unevenness phenomenon and the excess and deficiency portions occur, and the circuit formed thereby is formed. In addition, the circuit width becomes non-uniform, the trapezoidal shape, the shape of the cross section is substantially Mt. Fuji, and even the circuit disappears (based on over / excessive chemical treatment). This has been a fatal problem for printed wiring boards that have been increasing in density.

Second, as shown in the plan view of FIG. 7, a printed wiring board A (printed wiring board material B), which is a typical example of a thin substrate, has a vertical shape as shown in FIG. A type in which a circuit C is formed in a direction (longitudinal direction in the drawing). (2) As shown in FIG. (3) As shown in FIG. 3, a type in which the circuit C is formed, and a type in which the two are mixed, that is, a type in which the vertical circuit C and the horizontal circuit C are mixed, Etc. As described in the first point, the injected chemicals such as the developing solution and the corrosive liquid are considered to flow out of the outer surface of the printed wiring board material in the width direction of the left and right in the first place. However, as a secondary effect, the circuit C formed on the outer surface is also affected. In other words, the injected chemical is
The tendency of the circuits C to flow easily through the inter-circuit spaces D between the circuits C cannot be overlooked.

In this type of conventional chemical processing apparatus, a printed circuit board material B of a type in which a circuit C is formed in a vertical direction shown in FIG. When a chemical solution is ejected while being conveyed as a liquid, a considerable portion of the chemical solution becomes turbulent, and the tendency to flow through the outer surface of the printed wiring board material B through the vertical inter-circuit space D increases. The chemical processing such as development and etching of the circuit C is speeded up. On the other hand, when the liquid chemical is ejected while the printed wiring board material B of the type in which the circuit C is formed in the horizontal direction shown in FIG. Flows through the outer surface of the printed wiring board material B through the inter-circuit space D in the horizontal direction, the flow in the left and right width directions described in the first point is further promoted, and the development of the circuit C is further improved. Chemical processing such as etching and etching is slower than the case of FIG. 7A described above.

As described above, the chemical solution is used for the printed wiring board material B.
However, the chemical liquid after the injection is affected by the vertical and horizontal directions of the circuit C formed on the printed wiring board material B, so that the vertical circuit C and the horizontal circuit C In addition, the speeds of chemical treatments such as development and etching are different, and a speed difference occurs. Therefore, as shown in FIG. 7 (3),
For one printed wiring board A (printed wiring board material B), a type in which the vertical circuit C and the horizontal circuit C are mixedly formed (there are many such types in practice) If so, it has been pointed out that the uniformity of chemical treatment such as development and etching is impaired. Further, a similar problem also occurs in a double-sided type printed wiring board A (printed wiring board material B) in which a vertical circuit C is formed on one of the front and back surfaces and a horizontal circuit C is formed on the other. It was pointed out. That is, in the conventional chemical processing apparatus of this type, when the vertical circuit C is considered as a standard, chemical processing such as development and etching of the horizontal circuit C is delayed or insufficient. Considering the circuit C as a standard, the chemical treatment of the circuit C in the vertical direction would be over- or excessive.

As described above, in the conventional chemical liquid processing apparatus of this type, in addition to the above-described first point, the second point also indicates the overall uniformity of the chemical treatment such as development and etching. Was spoiled, and the unevenness phenomenon and the excess and deficiency points were likely to occur. As for the circuit C formed in advance, the circuit width becomes non-uniform, and a trapezoidal or substantially Mt. Fuji-shaped cross-sectional shape or even the disappearance of the circuit C occur (based on over / excessive chemical treatment). This has been a fatal problem for printed wiring boards that are becoming finer, more precise, and more dense.

In view of such circumstances, the present invention has been made as a result of intense research efforts of the inventor in order to solve the above-mentioned problems of the conventional example. By adjusting the pressure gauge and valve at the base end, the injection pressure is set higher toward the center and lower toward the side, so that the density and amount of the chemical flowing in the left and right width direction of the printed wiring board material are made uniform. According to the second aspect of the present invention, the turntable, which is incorporated between the wheels of the drive shaft and has a large number of openings, is turned up and down and turned by 90 degrees, thereby turning the printed wiring board material 90 degrees in the middle. In this way, by eliminating the influence of the chemical solution flowing through the inter-circuit space for each of the vertical circuit and the horizontal circuit, the uniformity of the chemical treatment is improved. Circuit width Te is made uniform, the cross-sectional shape of the circuit is also approached square or rectangular, the situation of the circuit loss is also to be prevented, and an object thereof is to propose a chemical processing apparatus, such as a developing apparatus or an etching apparatus.

[0012]

The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows. That is, this claim 1
Is used in the manufacturing process of a printed wiring board in which a circuit is formed on the outer surface, and a number of spray nozzles disposed opposite to a printed wiring board material conveyed in a horizontal posture on a conveyor. A chemical solution comprising a developing solution or a corrosive solution is sprayed to perform a chemical treatment. The spray nozzles are provided at predetermined pitch intervals on a plurality of spray pipes arranged in parallel along the transport direction, and each of the spray pipes has a closed tip and a base end with the chemical solution. It is branched and connected to a pipe for pressure feeding, and a pressure gauge and a valve are provided at the base end. The opening / closing degree of the valve can be adjusted while referring to the pressure of the chemical solution detected by the pressure gauge. The spray pipe at the center in the left and right width direction has a higher pressure, and the left and right side sides have a higher pressure. The more the spray pipe is, the lower the pressure can be adjusted.

Therefore, the spray pressure of the chemical solution is set higher in the spray nozzles provided in the spray pipe on the center side, and lower in the spray nozzles provided in the spray pipes on the left and right sides. Is done. Therefore,
After the injected chemical flows on the outer surface of the printed wiring board material in the width direction on the left and right sides, and flows out and down from both left and right sides, the chemical liquid on the center side complemented by a high injection pressure is applied. The density / amount and the density / amount of the chemical on both the left and right sides are made uniform. Thus, the difference in the speed of the chemical treatment of the printed wiring board material is eliminated, and uniform chemical treatment is performed.

Next, claim 2 is as follows. That is, the chemical liquid treatment apparatus according to claim 2 is used in a manufacturing process of a printed wiring board on which a circuit is formed on an outer surface,
A chemical solution consisting of a developing solution or a corrosive solution is sprayed from a large number of spray nozzles disposed opposite to a printed wiring board material conveyed in a horizontal posture by a conveyor to perform a chemical treatment. A direction change device is incorporated between the front and rear conveyors, the direction change device includes a transport drive shaft with wheels, and a horizontal turntable incorporated between the wheels of the drive shaft. And comprising. The turntable has a size corresponding to the printed wiring board material, and is provided with a plurality of openings having dimensions and pitches which allow the wheels to be freely inserted in a vertical or horizontal direction. . The turntable is vertically movable and can be rotated by 90 degrees along a horizontal plane. When not in operation, the turntable is lowered to a level below the upper end of each wheel. The printed wiring board material conveyed on each wheel can be lifted from each wheel by ascending;
It is possible to drop after pivoting 0 degrees and rest on each of the wheels again, after which it drops to a non-operating height level.

[0015] The direction changing device then moves the printed wiring board material conveyed along the horizontal plane along the way.
The direction is changed by 0 degrees, and the front and rear sides are changed to the left and right sides, and the left and right sides are changed to the front and rear sides. Further, the printed wiring board material is of a type in which a vertical circuit and a horizontal circuit are mixedly formed on the same surface on the front surface and the back surface, or a vertical circuit is formed on one of the front surface and the back surface and the horizontal circuit is formed on the other. It is of the type in which a directional circuit is formed. Therefore, by the 90-degree change in direction, the effect of the injected chemical flowing through the vertical or horizontal inter-circuit space is eliminated, and thus the difference in the speed of the chemical treatment of the printed wiring board material is also eliminated. A uniform chemical treatment is performed.

The present invention is configured as described below. This chemical solution processing apparatus is used in a manufacturing process of a printed wiring board, and a chemical solution composed of a developing solution or a corrosive solution is jetted from a large number of spray nozzles to a printed wiring board material conveyed by a conveyor, so that development and Chemical treatment such as etching is performed. In claim 1, the pressure of the chemical solution in each spray pipe disposed in the transport direction is adjusted by a pressure gauge and a valve provided at the base end, and the pressure is increased toward the center of the spray pipe. Therefore, the chemical liquid is ejected from the spray nozzle at a higher injection pressure toward the center in the transport direction and at a lower injection pressure toward both the left and right sides. Generally, the injected chemical liquid flows down the left and right sides in the width direction on the outer surface of the printed wiring board material, and then flows down from both sides. In the process, the injection pressure becomes higher toward the center in this way. Therefore, the density and amount of the chemical solution flowing in the left and right width directions are made uniform between the center side and both side sides. That is, a. The density and amount of the chemical liquid on the central side complemented by injection at a high injection pressure; b. The density and amount of the chemical solution on both sides, where the chemical solution injected at a low injection pressure and the chemical solution flowing from the center side are added, are made uniform. Therefore, the chemical treatment is performed uniformly from the center to both sides without a speed difference.

According to the second aspect, the printed wiring board material conveyed by the front and rear conveyors and the wheels of the conveying drive shaft is turned 90 degrees in the middle by a turntable of a turning device. . That is, the turntable rises from the inactive position below the upper end of each wheel, lifts the printed wiring board material, lowers after rotating by 90 degrees, places it on each wheel, and then descends to the inactive position. A change in direction is performed. Further, the operation of such a turntable can be performed without any trouble by appropriately inserting each wheel through a large number of formed openings.

The chemical liquid sprayed on the printed wiring board mainly includes a. It flows in the left and right width directions. On the other hand, since a circuit is formed in the printed wiring board material in the vertical direction or the horizontal direction (a direction different from the vertical direction by about 90 degrees), the injected chemical liquid is b. There is also a tendency to easily flow through such inter-circuit spaces. Therefore, a. B. Are added, and a. B. In the case where the flow is not added, a speed difference occurs in the chemical treatment. That is, a speed difference occurs in the chemical treatment depending on the vertical and horizontal directions of the circuit. Therefore, by changing the direction by 90 degrees in the middle, the adverse effect of the speed difference is eliminated, and the chemical treatment is made uniform over the vertical and horizontal circuits.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments of the invention shown in the drawings. FIG. 1, FIG. 2,
FIG. 3, FIG. 4, FIG. 6, etc. are provided for describing an embodiment of the chemical solution treatment apparatus according to the present invention. And FIG. 1 is an explanatory side view,
2 is an explanatory plan view, FIG. 3 is an explanatory side view of an essential part, and FIG. 4 is an explanatory plan view of an essential part. FIG. 6 is a front view of the main part. FIG. 5 shows a reference example which does not belong to the present invention. FIG. 5 (1) is an explanatory side view of a main part in another place, and FIG. 5 (2).
The figure is an explanatory plan view of the essential part. FIG. 7 is an explanatory plan view for explaining a printed wiring board (material). FIG. 7A shows an example in which a circuit is formed in a longitudinal direction, and FIG. 7B shows an example in which a circuit is formed in a lateral direction. FIG. 3C shows an example in which the circuit is formed in the longitudinal direction and the lateral direction. FIG. 8 is a cross-sectional view of a printed wiring board (material). FIG. 8A illustrates a circuit and a space between circuits, and FIG. 8B illustrates an example of a good circuit. Shows an example of a bad circuit.

This chemical solution processing apparatus includes a printed circuit board A
Used in the manufacturing process. First, the premise of the printed wiring board A will be described with reference to FIG. 7 and FIG. The printed wiring board A is a board for various OA equipment, a board for a mobile phone, a board for a computer,
There are various types of substrates, such as a substrate for a computer and a substrate for various other electronic devices accompanying the development of multimedia, and the manufacturing process thereof is also various. Printed circuit boards A can be classified into single-sided boards, double-sided boards, multilayer boards (including those based on the recent build-up method), flexible boards, etc.
CSPs and PBGAs related to semiconductor chips have also appeared.

In recent years, the printed circuit board A has been remarkably reduced in size, weight, ultra-thinness, flexibility, multi-layering and the like. is there. Such a printed wiring board A is manufactured, for example, as follows. That is, the printed wiring board A is sequentially laminated, polished, cut → drilled for through holes, polished, plated, polished → etched resist coating / drying / pasting → exposure → development → etching for the printed wiring board material B as a material. → Manufactured by continuously following many steps such as stripping of the etching resist at the circuit C portion.

These will be described in more detail. First, after copper foil is laminated and laminated on both surfaces of an insulating base material such as polyimide by hot pressing or the like, cleaning and polishing are performed. Then, a printed wiring board material B, for example, a double-sided copper foil-clad laminate obtained through such a pretreatment step,
After being cut to a short size of the work size, and then subjected to drilling for through holes, cleaning and double-side polishing are performed, and then plating is performed. As a result, the inner wall of the through hole is also plated so as to conduct the circuit C on the front surface and the circuit C on the back surface. (In addition to these, a single-sided copper foil-clad laminate in which copper foil is adhered to only one side of an insulating base material may be used as the printed wiring board material B,
In this case, the application of a photosensitive resist described below is performed on only one side, but the present invention is naturally applied to the printed wiring board material B for a single-sided board. ) A large number of through holes are formed in a single printed wiring board material B (printed wiring board A), such that hundreds or thousands of extremely small diameter holes are formed.

Thereafter, the printed wiring board material B is again washed, polished, washed, dried, etc., and then coated with an etching resist, that is, a photosensitive resist serving as an alkali-resistant or acid-resistant protective film, and dried. Thereby, a process for forming a coating film is performed. Then, after exposing a circuit C photograph, which is a negative film of the circuit C, to the outer surface such as the upper surface and the lower surface on which the circuit C is formed, the photosensitive resist leaves the exposed and cured circuit C portion, Unnecessary portions are dissolved and removed by spraying the developing solution as the chemical solution E (see also FIG. 1 and the like described later). After a while, printed wiring board material B
After the washing and drying, the photosensitive resist is cured and the coated and protected copper foil of the circuit C portion is left, and the unnecessary portion of the copper foil in which the photosensitive resist is dissolved and removed as described above is removed. Then, it is dissolved and removed / etched by spraying a corrosive liquid as the chemical solution E (see also FIG. 1 and the like described later). Then, the remaining photosensitive resist in the above-described cured circuit C portion is dissolved and removed by spraying a stripping solution as a chemical solution E, and then washed and dried, so that the printed circuit board on which the predetermined circuit C is formed is formed. A is obtained.

The printed wiring board A has, for example,
50mm × 550mm, 500mm × 500mm, 50
It has a size of about 0 mm x 300 mm, and its thickness is
The portion of the insulating base material is, for example, about 0.06 mm, and the portion of the circuit C made of copper foil is extremely thin, for example, to about 0.018 mm. Even in the case of such a multilayer board in which the printed wiring board A is laminated in four layers or the like, the overall thickness is 1.
It is becoming extremely thin, from 0 mm to 0.8 mm, and further to about 0.4 mm. The circuit width F also tends to be reduced from 150 μ to 70 μ and further to 40 μ, and there is a need for a circuit width F of 20 μ and a space D between circuits of about 30 μ.

For the printed wiring board A manufactured by following these steps, a protective film of the formed circuit C is formed as a post-processing step as a part of the manufacturing process. That is, first, a photosensitive resist as a solder resist is applied to the entire outer surface of the printed circuit board A on which the circuit C is formed, on which the circuit C is formed, and dried to form a coating film. Then, exposure and development are carried out by applying a negative film, and only the photosensitive resist in a part mounting portion such as a through-hole portion, that is, a portion where soldering is performed afterward is dissolved and removed to expose (these processes are performed in Almost according to the above-mentioned steps). In this way, a protective film made of a photosensitive resist is formed on the printed wiring board A, and the circuit C is protected. That is, after that, the circuit C of the printed wiring board A is protected from, for example, the attachment of solder to the component mounting portion. The printed wiring board A is manufactured by following such a process. The printed wiring board material A is as described above.

Next, the chemical processing apparatus will be described. As shown in FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 6, etc., the chemical liquid processing apparatus such as the developing apparatus and the etching apparatus which is the object of the present invention A chemical solution E composed of a developing solution or a corrosive solution is sprayed from a large number of spray nozzles 2 disposed opposite to each other on a printed wiring board material B used in a manufacturing process such as a process and conveyed in a horizontal posture by a conveyor 1. Then, chemical treatment such as development and etching, and chemical treatment are performed.

These will be described in detail below. First, as shown in FIG. 1 (the conveyor 1 is not shown in FIG. 2), the conveyor 1 of the chemical solution processing apparatus is provided with a processing chamber 3 for a developing process or an etching process. In a developing chamber or an etching chamber, for example, the printed wiring board material B is transported in a horizontal posture. That is, the conveyor 1 has a plurality of shafts 4 arranged in a horizontal direction at a predetermined pitch in parallel with the left and right width directions G and in the front and rear conveyance directions H, and rollers 5 arranged on each of the shafts 4. Is provided. Further, two processing chambers 3 are provided before and after via a direction changing device 6 which will be described later, which is interposed in the middle. They are vertically opposed to each other so as to sandwich the plate material B. Normally, the lower shaft 4 and the roller 5 are driven to rotate and function as a carrier, and the upper shaft 4 and the roller 5 are driven in a free state. It functions for anti-snaking and meandering.
In view of such functions for carrying, holding, and preventing meandering, it is possible to use a wheel instead of the roller 5.

The spray nozzle 2 of the chemical solution processing apparatus is used to move a printed wiring board material B conveyed in a conveying direction H by a conveyor 1 in two front and rear processing chambers 3.
A chemical solution E such as a developing solution or a corrosive solution is jetted. That is, the spray nozzles 2 are arranged in a large number in the front and rear transport direction H and the left and right width direction G, and are also arranged vertically in the illustrated example, so that they are opposed to the printed wiring board material B from above and below. . In other words, a large number of spray nozzles 2 are arranged vertically at predetermined pitch intervals in the front, rear, left and right, over a wide area in the processing chamber 3 surrounded by the transport direction H and the width direction G perpendicular to the transport direction H. Have been. The chemical solution E, for example, a developing solution or a corrosive solution,
It is stored in. Then, the chemical solution E in the liquid tank 7 is pumped through the pump and the spray pipes 8 arranged in parallel along the transport direction H, and then spray nozzles provided at predetermined pitch intervals in the spray pipes 8 are provided. In the example shown in the drawing, the ink is sprayed, sprayed, and diffused from above 2 toward the printed wiring board material B conveyed by the conveyor 1. Then, the chemical solution E flows on the outer surface of the printed wiring board material B, that is, the surface on which the circuit C is formed, and then flows again into the lower liquid tank 7, is collected, and is circulated afterwards. The spray nozzles 2 may be of a fixed type or a swing type. A chemical processing apparatus such as a developing apparatus or an etching apparatus includes such a conveyor 1 and a spray nozzle 2. The chemical treatment apparatus is generally configured as described above.

Next, the chemical processing apparatus of the present invention will be described. The chemical processing apparatus of the present invention further has the following characteristic configuration. First, as shown in FIG. 6, in this chemical processing apparatus, the injection pressure of the chemical E is set high at the center of the printed wiring board material B in the transport direction H and low at the side. That is, when viewed in the left and right width directions G orthogonal to the front and rear transport directions H of the printed wiring board material B, the spray pressure of the chemical solution E is gradually higher toward the center side of the spray nozzle 2 and is higher on both the left and right sides. The spray nozzle 2 is set to be lower sequentially.

The setting of the injection pressure of the chemical solution E is performed as follows. As described above, since a plurality of spray pipes 8 are arranged in parallel along the transport direction H, when the chemical solution E pumped through the pump is branched into the respective spray pipes 8, such spray pipes 8 are used. Make appropriate adjustments. That is, each of the spray pipes 8 has a closed distal end and a proximal end connected to a pipe from a pump. Therefore, a valve and a pressure gauge are respectively provided at the base end for connection, and the opening and closing degree of the valve is adjusted while referring to the pressure of the chemical solution E detected by the pressure gauge, so that the spray pipe 8 on the center side becomes smaller. The pressure is high, and the pressure is adjusted to be lower for the spray pipes 8 on both sides.

Thus, the spray pipe 8 on the center side
The injection pressure of the chemical E by the spray nozzles 2 provided on the spray pipes 8 on both sides can be set high while the injection pressure of the chemical E by the spray nozzles 2 provided on both sides can be set low. The setting of the injection pressure of the chemical solution E is thus performed by the pressure gauge and the valve. As described above, in this chemical processing apparatus, the injection pressure of the chemical E is set.

Next, as shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 4, in this chemical processing apparatus, the direction of the printed wiring board material B to be conveyed is 90 Turned around. That is, the direction changing device 6 is incorporated between the front and rear conveyors 1, and the direction changing device 6
Turns the direction of the printed wiring board material B conveyed by 90 degrees along the horizontal plane, and turns the front and rear sides to the left and right sides and the left and right sides to the front and rear sides.

These will be described in more detail. As described above, the conveyors 1 for transporting the printed wiring board material B in a horizontal posture are disposed in the front and rear two processing chambers 3, respectively, and a turn section is provided between the front and rear processing chambers 3. 9 and the direction changing device 6 is incorporated. The direction changing device 6 is arranged at a predetermined pitch in the width direction G on each shaft 10 according to the shafts 4 on the lower side of the front and rear conveyors 1 and between them. 2, the following cylinder 12, lower table 13, vertical guide 14, turntable shaft 15, motor 16, bevel gear 17, turntable 18, An opening 19 and the like are provided. The lower shafts 4 and the wheels 11 are rotatably driven to function as conveyance.

That is, a cylinder 12 stands upright from the floor of the turn section 9.
2, the lower table 13 is
It can move up and down while being guided. A turntable shaft 15 is erected and fixed on the lower table 13. The turntable shaft 15 is mounted on a motor 16 such as a reversing motor disposed on the lower table 13.
, Via a bevel gear 17. A turntable 18 is horizontally fixed to the upper end of the turntable shaft 15. The turntable 18 has a size corresponding to the printed wiring board material B, and
As shown in (1), a large number of openings 19 are formed as a whole, and the openings 19 are formed with a size and a pitch that allow the wheel 11 to be freely inserted vertically or horizontally.

Therefore, in the direction changing device 6, the turntable 18 is, as shown in FIG.
2, can be moved up and down via the lower table 13 and the turntable shaft 15 and, as shown in FIG. 2, driven by the motor 16 via the bevel gear 17 and the turntable shaft 15. , Can be rotated by 90 degrees along a horizontal plane. The turntable 18
At the time of non-operation, as shown by the solid line in FIG. 1 and FIG. 3, each wheel 11 is lowered to a height level below the upper end. On the other hand, during operation, the printed wiring board which has been stopped by temporarily stopping the rotation drive of the shaft 10 and the wheel 11 after being conveyed from the conveyor 1 of the processing chamber 3 on the front side to a higher position. When the turntable 18 is lifted, the plate material B is once lifted as indicated by imaginary lines in FIGS. Then turntable 15 is 90
By rotating the printed wiring board material B by 90 degrees, the direction of the printed wiring board material B being lifted is changed by 90 degrees. Then, by lowering, the printed wiring board material B is returned to each wheel 1 again.
1 and further, as indicated by solid lines in FIGS. 1 and 3,
It descends to its lower non-operating position and stops.
Then, the printed wiring board material B is transported to the conveyor 1 of the processing chamber 3 on the rear side by rotating the shaft 10 and the wheel 11 again.

In the illustrated example, such a turntable 1
8 and the like, the direction changing device 6 is constituted,
(For example, a developing room or an etching room) between the conveyors 1. Then, the direction of the printed wiring board material B being transported is changed by 90 degrees along the horizontal plane, so that chemical processing such as development and etching is continued. As described above, in this chemical processing apparatus, the printed wiring board material B is turned by 90 degrees.

In the example shown in FIGS.
As shown in the figure, the chemical solution E injected to the printed wiring board material B may flow back and forth along the outer surface of the printed wiring board material B in the transport direction H after the fact. In the apparatus, a regulating roller J for regulating such a flow is provided. The regulating rollers J are arranged along the left and right width directions G orthogonal to the front and rear transport directions H, facing the outer surface of the printed wiring board material B, and are arranged in a large number with a spacing K in the front and rear directions. Are arranged. Further, a plurality of spray nozzles 2 are respectively disposed so as to face each other at the interval K between the respective regulation rollers J.

The regulating roller J will be described in more detail. Chemical solution E sprayed from each spray nozzle 2
, Most of each flows on the outer surface of the printed wiring board material B in the left and right width directions G and flows down from both the left and right sides. . In particular, when the circuit C is formed along the front and rear transport direction H, the chemical solution E tends to flow as a turbulent flow in the transport direction H through the inter-circuit space D. Therefore, in order to regulate the chemical solution E flowing in the forward and backward transport directions H, a regulating roller J is provided as a so-called placing roller. This regulating roller J
A large number of books are arranged in parallel in the left and right width direction G and in the front and rear transport direction H at predetermined intervals K and horizontally at predetermined pitches,
Each is pressed against the outer surface of the printed wiring board material B to be conveyed. Further, a plurality of spray nozzles 2 are arranged at positions behind the respective spacings K between the respective regulating rollers J, in the illustrated example, facing the center line in the width direction G of the respective spacings K. I have.

In the illustrated example, the above-described roller 5 of the conveyor 1 is also used as such a regulating roller J. That is, the regulating roller J has a unique function of regulating the flow of the chemical solution E in the transport direction H as described above, and may be disposed between the rollers 5 of the conveyor 1 as a stand-alone placing roller. Is possible. On the other hand, in the illustrated example, the roller 5 of the conveyor 1 is devised so as to be used as such a regulating roller J. That is, first, the rollers 5 which have conventionally been closely approached in the front and rear transport directions H are separated by a predetermined distance K from each other.
And a plurality of spray nozzles 2 are arranged in rows facing the center line between the gaps K of the rollers 5 while paying attention to the positional relationship with the spray nozzles 2 which has not been considered in the past. Do it. Thus, the roller 5 also functions as the regulating roller J. In the example of FIG. 1, the spray nozzles 2 are disposed so as to face all the intervals K between the regulating rollers J that also serve as the rollers 5. However, in the example of FIG. 5,
They are arranged facing each other at every other interval K. Thus, it is not necessary to dispose the spray nozzles 2 corresponding to all the intervals K. In FIG. 2, reference numeral 20 denotes a conveyor frame. In this chemical treatment apparatus, such a regulating roller J is provided.

In this chemical solution processing apparatus, the injection pressure of the chemical solution E is set as described above, the printed wiring board material B is turned by 90 degrees, and a regulating roller J is provided in the illustrated example. ing. And the chemical treatment device,
As shown in the illustrated example, all of these may be provided, but only one of may be provided alone, and any two may be combined as in, for example, It may be provided.

The present invention is configured as described above. Then, it becomes as follows. This chemical treatment system
Conveyor 1 used in the manufacturing process of printed wiring board A
A chemical solution E composed of a developing solution or a corrosive solution is sprayed from a large number of spray nozzles 2 disposed opposite to each other on a printed wiring board material B which is conveyed in a horizontal posture and a circuit C is formed on the outer surface. , Chemical processing such as development and etching are performed.

First, in the chemical processing apparatus such as the developing apparatus and the etching apparatus, a chemical E such as a developing solution or a corrosive liquid is transferred in the transport direction H by a pressure gauge and a valve at the base end of the spray pipe 8. Injection is performed from the spray nozzle 2 at a higher injection pressure toward the center and a lower injection pressure toward both the left and right sides (see FIG. 6). In general, the injected chemical solution E moves the outer surface of the printed wiring board material B in the left and right width directions G.
After flowing down, the liquid flows down and out of both the left and right sides. Since the injection pressure becomes higher toward the center, the chemical treatment is performed uniformly from the center to both sides.

That is, assuming that the chemical solution E is injected at a uniform injection pressure as a whole, most of the chemical solution E flows on the outer surface of the printed wiring board material B in the width direction G on the left and right sides, and the width of such a solution is increased. Observing the flow in the direction G,
a. The density and amount of the chemical solution E at the center side are b. Less than the density / amount on both sides, a. The chemical treatment is delayed or insufficient at the center. On the other hand, in this chemical treatment apparatus, a. By setting the injection pressure to be higher toward the center, delays and shortages in the chemical treatment are complemented by such injection pressures. Density / amount of the chemical solution E flowing in the center side; b. The density and amount of the chemical solution E flowing on both sides are made uniform, and uniform chemical treatment is realized.

Second, in the chemical solution processing apparatus such as the developing apparatus and the etching apparatus, the direction changing device 6 is incorporated between the conveyors 1 so that the printed wiring board material B to be conveyed is partially turned. , 90 degrees in the horizontal plane (see FIGS. 1, 2, 3, 4 and the like). That is,
The direction of the turntable 18 incorporated between the wheels 11 of the driven shaft 10 for conveyance is changed by ascending, rotating 90 degrees, and descending. In the case of the printed wiring board material B, the horizontal direction is the horizontal direction as well as the vertical direction (the longitudinal direction in the drawing), which is about 90 degrees in the horizontal direction in the drawing, that is, the longitudinal direction and the vertical direction. The circuit C is often formed in a different direction). For example, for the same front surface or back surface as an outer surface (see FIG. 7 (3)), or for the front and back outer surface front and back surfaces (see FIGS. 7 (1) and (2)), Circuits C are often formed in both the vertical and horizontal directions. Then, the injected chemical solution E is filled in the space D between the respective circuits.
It is easy to flow through the circuit C, and there is a speed difference in the chemical processing depending on the vertical and horizontal directions of the circuit C. By turning 90 degrees in the middle in this way, the adverse effect of the speed difference is eliminated, and the chemical processing is performed over the vertical and horizontal circuits C. It becomes uniform.

That is, if the direction is not changed by 90 degrees in the middle in this way, for example, when the vertical direction of the circuit C is set to the front and rear transport direction H, the chemical processing speed of the vertical circuit C becomes high. Conversely, the chemical processing speed of the circuit C in the lateral direction on the same outer surface or the opposite surface is reduced, and the uniformity of the chemical processing is impaired. However, such a situation is avoided.

Third, in the illustrated example, in the chemical liquid processing apparatus such as the developing apparatus and the etching apparatus, the regulating roller J is further arranged such that the regulating roller J extends along the left and right width direction G and has a space K in the front and rear transport direction H. Many spray nozzles are installed.
Are arranged in opposition to each other at the interval K (see FIGS. 1 and 5). The second mentioned above
As described above, in the printed wiring board material B, the circuit C is often formed on the same surface or the front and back surfaces in the horizontal direction as well as the vertical direction. The chemical solution E such as a developing solution or a corrosive solution easily flows through the space D between the circuits. As it is, a difference in the speed of the chemical treatment occurs in the vertical and horizontal directions of the circuit C. Therefore, the flow of the injected chemical solution E in the front and rear transport direction H is controlled by the regulating roller J.
The liquid chemical E is forcibly prevented from being affected by the vertical and horizontal directions of the circuit C, and is completely forcibly stopped in the left and right width directions G.
(Particularly, see FIG. 5 (2)), the difference in the speed of the chemical treatment is eliminated, and the chemical treatment is made uniform over the vertical and horizontal circuits C.

That is, if such a regulating roller J is not provided, for example, when the vertical direction of the circuit C is set to the front and rear transport directions, the chemical processing speed of the vertical circuit C is high. On the contrary, the chemical treatment speed of the circuit C in the horizontal direction on the same surface or the opposite surface on the front and back is reduced, and the uniformity of the chemical treatment is impaired. Is done. Of course, the second
By just turning the point 90 degrees, the solution of the adverse effect of the circuit C and the uniformization of the chemical treatment can be substantially realized.

Fourth, as in the first and second embodiments, in the chemical liquid processing apparatus such as the developing apparatus and the etching apparatus, the chemical treatment of the printed wiring board material B is made uniform.
In the manufacturing process of the printed wiring board A, chemical and chemical treatments such as development and etching are made uniform, and the printed wiring board material B may have a delayed or insufficient chemical treatment or an over or excessive chemical treatment. Disappears. First, the circuit width F of the circuit C to be formed (see FIG. 8) is
Overall uniform. That is, a situation where a wide portion or a narrow portion of the circuit width F occurs is avoided. Further, mainly because the over- or excessive chemical treatment does not occur, the cross-sectional shape of the formed circuit C is about 80% when the ideal circuit width F is 100%, that is, a square or rectangular shape. An object close to a vertical convex shape is obtained ((2) in FIG. 8).
See figure). In other words, a circuit width F of about 55% of the ideal and a trapezoidal or substantially Mt. Fuji cross-sectional shape (see FIG. 8 (3)) is avoided.

[0049]

As described above, according to the first aspect of the present invention, the pressure of each spray pipe is adjusted by the pressure gauge and the valve at the base end. The injection pressure is set higher toward the center and lower toward the side, so that the density and amount of the chemical solution flowing in the printed wiring board material in the left and right width directions are made uniform. By turning up and down and turning each 90 degrees of the turntable in which a number of openings are perforated incorporated between each wheel, the printed wiring board material is turned 90 degrees in the middle, so that the vertical circuit and The following effects are exhibited by eliminating the influence of the chemical solution flowing through the inter-circuit space for each of the horizontal circuits.

First, in the chemical liquid processing apparatus according to the first aspect, by adjusting the pressure gauge and the valve at the base end of the spray pipe, the chemical liquid such as the developer or the corrosive liquid is injected at a higher injection pressure toward the center and a lower injection pressure toward the side. Is sprayed on the printed wiring board material. In general, the injected chemical flows on the outer surface of the printed wiring board material in the left and right width directions and flows down and out from both the left and right sides. Since the injection is performed at a high injection pressure, the density and amount of the flowing chemical solution are made uniform from the center to both sides, and the chemical treatment such as development and etching is made uniform. That is, as in the above-described conventional example in which the injection was performed at a uniform injection pressure as a whole, the injected chemical liquid flows on the outer surface of the printed wiring board material in the left and right width directions, The situation where the chemical treatment is delayed or insufficient at the center and the chemical treatment is accelerated or accelerated at the left and right sides, and thus the uniformity of the chemical treatment is impaired, is surely avoided.

Second, in the chemical liquid processing apparatus according to the second aspect, the direction of the printed wiring board material conveyed is changed by 90 degrees on a horizontal plane in the middle of the course by raising, turning and lowering the turntable by 90 degrees. . Printed wiring board (material)
In many cases, a circuit is formed in the vertical direction or the horizontal direction (the horizontal direction is a direction different from the vertical direction by about 90 degrees on the same plane). A chemical solution such as a solution or a corrosive solution easily flows on the outer surface of the printed wiring board material through the spaces between the circuits, and as it is, a speed difference is likely to occur in chemical processing such as development and etching depending on the vertical and horizontal directions of the circuit. Thus, by changing the direction of the printed wiring board material by 90 degrees in the middle in this way, the adverse effect of the speed difference is eliminated, and the chemical treatment such as development and etching is made uniform in the vertical and horizontal circuits. That is,
As in the above-described conventional example in which the direction of the printed wiring board material is not changed midway, for example, when the vertical direction is set to the front and rear transport directions, the chemical processing speed of the vertical circuit is increased, and the horizontal circuit is changed. A situation in which the speed of the chemical treatment is reduced and the uniformity of the chemical treatment is impaired is surely avoided.

Third, in the chemical liquid processing apparatus according to the first and second aspects, the chemical treatment such as development and etching is made uniform for the printed wiring board material. Therefore, in the process of manufacturing a printed wiring board, a circuit formed is:
Even with a fine circuit width, the circuit width is made uniform throughout and a cross-sectional shape that is close to a square or a rectangle, that is, a vertical convex shape is obtained. The performance is improved. That is, as in the above-described conventional example, the uniformity of the chemical treatment is impaired, and the unevenness and the excess and deficiency are prevented from occurring.
Non-uniform circuit width, trapezoidal or substantially Mt. Fuji-shaped cross-sectional shapes, and disappearance of circuits are reliably avoided.

Fourth, in the case of a printed wiring board, in particular, CSPs and PBGAs involving semiconductor chips have been remarkably progressing in circuit miniaturization, high precision, and high density. With this, even a circuit with a fine circuit width can be formed with a uniform circuit width and an ideal cross-sectional shape.
The significance of being able to greatly change the limit value of the conventional circuit width is significant. For example, according to the chemical processing apparatus of the present invention, it is possible to easily manufacture a printed wiring board having a circuit having a circuit width of about 20 μm and a space between circuits of about 30 μm. Recently, the thickness of copper foil for circuit formation has become extremely thin in response to the miniaturization, fineness, and multi-layering of printed wiring boards. In a situation where uniformity or loss of circuit is likely to occur,
From this point of view, the significance of the chemical solution treatment apparatus of the present invention is particularly large. Furthermore, such circuit miniaturization,
Conventionally, as a means for responding to high precision and high density, there has been only an electroplating method which requires a very complicated process and is extremely costly.
The significance of being able to respond by the development / etching method is also significant. That is, according to the chemical processing apparatus of the present invention,
Exposure, development and etching methods, which are extremely cost-effective, make it possible to cope with finer, higher-precision, higher-density circuits on printed wiring boards. As described above, the effects exerted by the present invention are remarkable and large, for example, all the problems existing in this type of conventional example are solved.

[Brief description of the drawings]

FIG. 1 is a side view for explaining an embodiment of a chemical solution treatment apparatus according to the present invention.

FIG. 2 is an explanatory plan view for explaining the embodiment of the present invention;

FIG. 3 is an explanatory side view of a main part, used for describing the embodiment of the present invention.

FIG. 4 is an explanatory plan view of a main part, used for describing the embodiment of the present invention.

FIG. 5 provides a description of a reference example not belonging to the present invention,
FIG. 1A is an explanatory side view of an essential part in another place, and FIG. 2B is an explanatory plan view of the essential part.

FIG. 6 is a front view of a main part, used for describing an embodiment of the present invention.

FIGS. 7A and 7B are explanatory plan views for explaining a printed wiring board (material). FIG. 7A is an example in which a circuit is formed in a longitudinal direction, and FIG. The example
(3) The figure shows an example in which the circuit is formed in the longitudinal direction and the lateral direction.

FIG. 8 is a sectional view of a printed wiring board (material);
(1) The drawings are provided for explanation of circuits, spaces between circuits, etc.
FIG. 2B shows an example of a good circuit, and FIG. 3C shows an example of a bad circuit.

[Description of Signs] 1 Conveyor 2 Spray nozzle 3 Processing chamber 4 Shaft 5 Roller 6 Direction change device 7 Liquid tank 8 Spray pipe 9 Turn section 10 Shaft 11 Wheel 12 Cylinder 13 Lower table 14 Vertical guide 15 Turntable shaft 16 Motor 17 Umbrella Gear 18 Turntable 19 Opening 20 Conveyor frame A Printed circuit board (thin plate) B Printed circuit board (thin plate) C Circuit D Inter-circuit space E Chemical liquid F Circuit width G Width direction H Transport direction J Regulation roller K Interval

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/06 H05K 3/06 D 5E339 F Term (Reference) 4F033 AA14 BA03 CA01 DA01 EA06 LA01 LA12 NA01 4F035 AA04 CA02 CA05 CB04 CB13 CB14 CC01 CC04 4F042 AA07 BA07 BA08 CB10 DE01 DF19 DF26 DF32 4K026 DA06 DA09 4K057 WA11 WG08 WM04 WM06 WM18 WN01 5E339 AB02 AD01 BE13 CC02 CF07 EE04

Claims (7)

[Claims] 1. A chemical treatment apparatus for performing chemical treatment by injecting a chemical solution onto a thin substrate to be conveyed, wherein the injection pressure of the chemical solution is high at a center along a conveying direction of the thin substrate, and at a side thereof. A chemical treatment apparatus characterized by being set low. 2. The chemical liquid treatment apparatus according to claim 1, wherein the thin plate substrate is transported in a horizontal posture by a conveyor,
The chemical solution is sprayed from a number of spray nozzles disposed opposite to the thin substrate to be conveyed, and the injection pressure of the chemical solution is in the left and right width directions orthogonal to the front and rear transport directions of the thin substrate. , The spray nozzles on the center side are sequentially set higher, and the spray nozzles on both the left and right sides are set lower sequentially. 3. A chemical processing apparatus for performing chemical treatment by injecting a chemical solution onto a conveyed thin plate base material, wherein the direction of the conveyed thin plate base material is changed by 90 degrees along the conveying surface on the way. A chemical solution treatment device. 4. The chemical processing apparatus according to claim 3, wherein the thin plate substrate is transported in a horizontal posture by a conveyor,
The chemical solution is sprayed from a number of spray nozzles disposed opposite to the thin substrate to be conveyed, and a direction changing device is incorporated between the front and rear conveyors, and the direction changing device is conveyed. A chemical liquid treatment apparatus characterized in that the direction of the thin substrate is changed by 90 degrees along a horizontal plane, and the front and rear sides are changed to left and right sides and the left and right sides are changed to front and rear sides. 5. A chemical treatment apparatus for performing chemical treatment by injecting a chemical solution onto a thin substrate to be conveyed, wherein the chemical solution sprayed on the thin substrate subsequently moves the outer surface of the thin substrate in the transport direction. And a regulating roller that regulates the flow of the liquid medicine back and forth. 6. The chemical processing apparatus according to claim 5, wherein the thin substrate is conveyed in a horizontal posture, and the chemical is supplied from a number of spray nozzles disposed opposite to the conveyed thin substrate. The regulating rollers are arranged facing the outer surface of the thin plate base material along the left and right width directions orthogonal to the front and rear transport directions, and a large number of the regulating rollers are arranged at intervals in the front and rear directions. A plurality of the spray nozzles, each of which is provided so as to face the gap between the regulating rollers. 7. The chemical processing apparatus according to claim 1, wherein the chemical processing apparatus is used in a manufacturing process of a printed wiring board, and the thin plate base material is A chemical processing apparatus comprising a printed wiring board material having a circuit formed on an outer surface thereof, wherein a developer or a corrosive liquid is used as the chemical.