CN105195381A - Spray apparatus and method thereof - Google Patents

Spray apparatus and method thereof Download PDF

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Publication number
CN105195381A
CN105195381A CN201510714007.4A CN201510714007A CN105195381A CN 105195381 A CN105195381 A CN 105195381A CN 201510714007 A CN201510714007 A CN 201510714007A CN 105195381 A CN105195381 A CN 105195381A
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CN
China
Prior art keywords
nozzle
spray
spray pressure
substrate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510714007.4A
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Chinese (zh)
Inventor
武岳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to CN201510714007.4A priority Critical patent/CN105195381A/en
Publication of CN105195381A publication Critical patent/CN105195381A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a spray apparatus and a method thereof. The spray apparatus comprises: a conveying device for conveying a substrate; and a spray assembly positioned above the conveying device and comprising a liquid inlet tube and a plurality of spray tubes, wherein the liquid inlet tube is used for conveying an etching liquid, the spray tubes are connected with the liquid inlet tube, the liquid outlet of each of the spray tubes is provided with a nozzle, the nozzle is used for spraying the etching liquid to the surface of the substrate at an adjustable spray pressure, the spray assembly adjusts the spray pressures of nozzles, and the spray pressures of the nozzles in different positions are incompletely same. The apparatus and the method can improve the panel homogeneity in the wet etching process.

Description

Spray equipment and method
Technical field
The present invention relates to technical field of liquid crystal display, particularly relate to a kind of spray equipment and method.
Background technology
The production technology of liquid crystal panel comprises cleaning-film forming (physical vapour deposition (PVD)/chemical vapour deposition (CVD), PVD/CVD)-exposure-development-etching-stripping-inspection.Wherein etching comprises wet etching (WET) and dry etching (DRY), and the effect of wet etching has a great impact for the fine degree of wiring and the quality of final panel.For example, for second layer metal, if etch uneven, also namely subregion wire is wider, and that second layer metal and first layer metal between pixel can be caused to hand over capping long-pending is different, that is, produce different capacitance coupling effects, make the quality off-design value of panel.
In wet etch process to graphical Accuracy larger have pool effect, ditch effect, cross the effect of holes etc.
In etching process, pool effect refers to that liquid will form water membrane on panel, hinders fresh liquor and the contact needing etched part.The liquid exchange capacity of substrate center is little, and the liquid exchange capacity of substrate edges is large.Such as, in the etching process of copper base, use the etching solution of hydrogen peroxide system.When copper ion concentration in liquid raises, the etching speed of liquid can be accelerated.Center diffusion is slow, and etching speed height substrate center completes prior to edge etch.
Ditch effect refers to that the tack of liquid makes liquid stick to gap between circuit.Namely line close quarters liquid is more difficult is replaced by new liquid, and liquid renewal speed is slow, and non-densified regions liquid renewal speed is fast.We observe in an experiment, and when being the etching solution etch copper substrate with hydrogen peroxide system, for the product of 4K and the product of 8K, due to the difference of live width/line density, the etching period that reaching same etch index needs also is not quite similar.
Cross the effect of holes and refer to that etching liquid flows down along via hole, the liquid renewal speed around hole is accelerated.
Various effect (pool effect, ditch effect cross the effect of holes) is all because the renewal speed difference at substrate diverse location liquid causes above.Wish to have a kind of method that the large position of liquid renewal amount is inhibited, the position that liquid renewal amount is little is compensated, and can improve the homogeneity of panel.
Summary of the invention
Embodiments provide a kind of spray equipment and method, panel homogeneity in wet etch process can be improved.
The invention provides a kind of spray equipment, comprise; Conveyer, for transmitting substrate; Spray assemblies, is positioned at the top of conveyer, comprises a feed tube and multiple shower, feed tube is for transmitting etching solution, multiple shower is connected with feed tube, and each shower liquid outlet place arranges nozzle, and nozzle is used for spraying etching solution on the surface of substrate with adjustable spray pressure; Wherein, spray assemblies regulates the spray pressure of nozzle, and the spray pressure of diverse location place nozzle is incomplete same.
Wherein, the internal diameter of nozzle is adjustable.
Wherein, nozzle fluid pore size is adjustable.
Wherein, spray equipment also comprises multiple pressure sensor, and each nozzle arranges at least one pressure sensor, and pressure sensor is for sensing the spray pressure of nozzle, and spray assemblies regulates described spray pressure according to the spray pressure of sensing and the etch effect of substrate.
Wherein, the internal diameter of the nozzle corresponding with substrate center is less, and the internal diameter of nozzle becomes large gradually from substrate center to edge.
The present invention also provides a kind of spraying method, comprising: substrate is with the speed transmission preset; Etching solution transfers to multiple shower by feed tube, and each shower liquid outlet place arranges a nozzle; Etching solution sprays on the surface of substrate with adjustable spray pressure by nozzle; Wherein, the spray pressure of diverse location place nozzle is incomplete same.
Wherein, the internal diameter of nozzle is adjustable, and method comprises: regulate spray pressure by regulating the internal diameter of nozzle.
Wherein, the internal diameter of the nozzle corresponding with substrate center is less, and the internal diameter of nozzle becomes large gradually from substrate center to edge.
Wherein, nozzle fluid pore size is adjustable, and method comprises: by regulating the fluid aperture adjustment spray pressure of nozzle.
Wherein, each nozzle arranges at least one pressure sensor, etching solution spray comprises in the step on the surface of substrate with adjustable spray pressure by nozzle, by the spray pressure of pressure sensor senses nozzle, regulates spray pressure according to the spray pressure of sensing and the etch effect of substrate.
Pass through such scheme, the invention has the beneficial effects as follows: the present invention transmits substrate by conveyer, spray assemblies comprises a feed tube and multiple shower, etching solution sprays on the surface of substrate with adjustable spray pressure by nozzle, wherein spray assemblies regulates the spray pressure of nozzle, the spray pressure of diverse location place nozzle is incomplete same, can improve panel homogeneity in wet etch process.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.Wherein:
Fig. 1 is the structural representation of the spray equipment of the embodiment of the present invention;
Fig. 2 is the structural representation of the nozzle of the first embodiment in Fig. 1;
Fig. 3 is the structural representation of the nozzle of the second embodiment in Fig. 1;
Fig. 4 is the schematic flow sheet of the spraying method of the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under performing creative labour prerequisite, belong to the scope of protection of the invention.
Shown in Figure 1, Fig. 1 is the structural representation of the spray equipment of first embodiment of the invention.As shown in Figure 1, spray equipment 10 comprises: conveyer 11 and spray assemblies 12.Conveyer 11 is for transmitting substrate (not shown).Spray assemblies 12 is positioned at the top of conveyer 11, comprises a feed tube 121 and multiple shower 122.Feed tube 121 is for transmitting etching solution.Multiple shower 122 is connected with feed tube 121.Each shower 122 liquid outlet place arranges nozzle 123.Nozzle 123 is for spraying etching solution on the surface of substrate with adjustable spray pressure.Wherein, spray assemblies 12 regulates the spray pressure of nozzle 123, and the spray pressure of diverse location place nozzle 123 is incomplete same.
In embodiments of the present invention, multiple shower 122 can parallel and spaced set.Nozzle 123 can be arranged to that internal diameter is adjustable or fluid pore size is adjustable.Accordingly, the internal diameter of nozzle 123 or fluid pore size can be regulated to regulate the spray pressure of nozzle 123, particularly see Fig. 2 and Fig. 3 by automatic or manual.As shown in Figure 2, figure a represents the cross sectional representation of nozzle 123, and there is an internal diameter nozzle 123 inside along the hole 1231 gradually changed clockwise.Certainly in other embodiments of the present invention, the internal diameter of nozzle 123 inner void 1231 also can gradually change along counterclockwise or otherwise, figure b represents the interface diagram of shower 122 and nozzle 123, and shower 122 is closed with an interface part for nozzle 123.Figure c represent nozzle 123 and shower 122 with the use of schematic diagram, now nozzle 123 inner void 1231 part is closed partial occlusion, can not spray etching liquid, only has the part not being closed partial occlusion of hole 1231 can spray etching liquid.So in use can manually swivel nozzle 123 or shower 122, the relative position of enclosure portion and hole 1231 is changed, can the part size of hole 1231 of spray etching liquid change.Due to can the part of hole 1231 of spray etching liquid larger, the spray pressure of nozzle 123 is less, and then can regulate the spray pressure of nozzle 123.
Preferably, as shown in Figure 3, figure a, figure b, figure c represent the state that nozzle 123 is different respectively.The similar of nozzle 123, in camera shutter, can regulate the size in the inner aperture of nozzle 123 automatically, and then regulates the spray pressure of nozzle 123.
Alternatively, see Fig. 1, spray equipment 10 also comprises multiple pressure sensor 13, and each nozzle 123 arranges at least one pressure sensor 13.Pressure sensor 13 can be arranged on the optional position of nozzle 123.The spray pressure of the nozzle 123 that spray assemblies 12 senses according to pressure sensor 13 and actual production demand, regulate the spray pressure of corresponding nozzle 123, reduce unwanted effect, make substrate etch more homogeneous.Particularly, the spray pressure of nozzle 123 sensed according to pressure sensor 13 and the etch effect of this spray pressure infrabasal plate combine expects that the etch effect reached determines to increase or reduce the spray pressure of nozzle 123, and need how much to regulate, more homogeneous with substrate etch.
For pool effect, when the etching solution wet etching copper with hydrogen peroxide system, the internal diameter that can be designed as the nozzle 123 corresponding with substrate center is less, and the internal diameter of nozzle 123 becomes large gradually from substrate center to edge, such design can make the spray pressure of the nozzle 123 corresponding with substrate center region large compared with periphery, accelerates the fluid exchange in substrate center region, finely tunes in actual production again, can pool effect be reduced, improve panel homogeneity.
Fig. 4 is the schematic flow sheet of the spraying method of the embodiment of the present invention.As shown in Figure 4, spraying method comprises:
Step S10: substrate is with the speed transmission preset.
The speed preset is the transfer rate according to the substrate of need of production setting in wet etching.
Step S11: etching solution transfers to multiple shower by feed tube, each shower liquid outlet place arranges a nozzle.
Etching solution transfers to multiple shower by feed tube, etching solution is sprayed substrate surface by nozzle.Multiple shower can parallel and spaced set.
Step S12: etching solution sprays on the surface of substrate with adjustable spray pressure by nozzle; Wherein, the spray pressure of diverse location place nozzle is incomplete same.
In step s 12, can by automatically to regulate or manual adjustments regulates the spray pressure of nozzle.In embodiments of the present invention, it is adjustable that nozzle can be arranged to internal diameter, or fluid pore size is adjustable, accordingly, by regulating internal diameter or the fluid aperture adjustment spray pressure of nozzle.
Particularly, the cross section of nozzle can be arranged to internal diameter along gradually changing clockwise, certainly in other embodiments of the present invention, the internal diameter of nozzle also can gradually change along counterclockwise or otherwise.And an interface part for shower and nozzle is closed accordingly.During use, an inner void part for nozzle is closed partial occlusion, can not spray etching liquid, and only the pertusate part not being closed partial occlusion can spray etching liquid.So in use can manually swivel nozzle or shower, the relative position of enclosure portion and hole is changed, can the part size of hole of spray etching liquid change.Due to can the part of hole of spray etching liquid larger, the spray pressure of nozzle is less, and then can regulate the spray pressure of nozzle.
Preferably, the structure of nozzle can be arranged to be similar to camera shutter, automatically can regulate the size in nozzle interior aperture, and then regulates the spray pressure of nozzle.
In embodiments of the present invention, each nozzle arranges at least one pressure sensor, before step S12, by the spray pressure of pressure sensor senses nozzle.In step s 12, according to spray pressure and the actual production demand of the nozzle of pressure sensor senses, regulate the spray pressure of corresponding nozzle, reduce unwanted effect, make substrate etch more homogeneous.Also namely spray pressure is regulated according to the spray pressure of sensing and the etch effect of substrate.Particularly, combine according to the spray pressure of the nozzle of pressure sensor senses and the etch effect of this spray pressure infrabasal plate and expect that the etch effect reached determines to increase or reduce the spray pressure of nozzle, and need how much to regulate, more homogeneous with substrate etch.
For pool effect, when the etching solution wet etching copper with hydrogen peroxide system, the internal diameter that can be designed as the nozzle corresponding with substrate center is less, and the internal diameter of nozzle becomes large gradually from substrate center to edge, such design can make the spray pressure of the nozzle 123 corresponding with substrate center region large compared with periphery, accelerates the fluid exchange in substrate center region, finely tunes in actual production again, can pool effect be reduced, improve panel homogeneity.
In sum, the present invention transmits substrate by conveyer, spray assemblies comprises a feed tube and multiple shower, etching solution sprays on the surface of substrate with adjustable spray pressure by nozzle, wherein spray assemblies regulates the spray pressure of nozzle, the spray pressure of diverse location place nozzle is incomplete same, can improve panel homogeneity in wet etch process.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (10)

1. a spray equipment, is characterized in that, described device comprises;
Conveyer, for transmitting substrate;
Spray assemblies, be positioned at the top of described conveyer, comprise a feed tube and multiple shower, described feed tube is for transmitting etching solution, described multiple shower is connected with described feed tube, each described shower liquid outlet place arranges nozzle, and described nozzle is used for spraying described etching solution on the surface of described substrate with adjustable spray pressure;
Wherein, described spray assemblies regulates the spray pressure of described nozzle, and described in diverse location place, the spray pressure of nozzle is incomplete same.
2. device according to claim 1, is characterized in that, the internal diameter of described nozzle is adjustable.
3. device according to claim 1, is characterized in that, described nozzle fluid pore size is adjustable.
4. device according to claim 1, it is characterized in that, described spray equipment also comprises multiple pressure sensor, each described nozzle arranges at least one described pressure sensor, described pressure sensor is for sensing the spray pressure of described nozzle, and described spray assemblies regulates described spray pressure according to the etch effect of the spray pressure of described sensing and described substrate.
5. circuit according to claim 1, is characterized in that, the internal diameter of the described nozzle corresponding with described substrate center is less, and the internal diameter of described nozzle becomes large gradually from described substrate center to edge.
6. a spraying method, is characterized in that, described method comprises:
Substrate is with the speed transmission preset;
Etching solution transfers to multiple shower by feed tube, and each described shower liquid outlet place arranges a nozzle;
Described etching solution sprays on the surface of described substrate with adjustable spray pressure by described nozzle; Wherein, described in diverse location place, the spray pressure of nozzle is incomplete same.
7. method according to claim 1, is characterized in that, the internal diameter of described nozzle is adjustable, and described method comprises: regulate described spray pressure by regulating the internal diameter of described nozzle.
8. method according to claim 7, is characterized in that, the internal diameter of the described nozzle corresponding with described substrate center is less, and the internal diameter of described nozzle becomes large gradually from described substrate center to edge.
9. method according to claim 1, is characterized in that, described nozzle fluid pore size is adjustable, and described method comprises: by spray pressure described in the fluid aperture adjustment that regulates described nozzle.
10. method according to claim 1, it is characterized in that, each described nozzle arranges at least one pressure sensor, described etching solution spray comprises in the step on the surface of described substrate with adjustable spray pressure by described nozzle: by the spray pressure of nozzle described in described pressure sensor senses, regulate described spray pressure according to the spray pressure of described sensing and the etch effect of described substrate.
CN201510714007.4A 2015-10-28 2015-10-28 Spray apparatus and method thereof Pending CN105195381A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201510714007.4A CN105195381A (en) 2015-10-28 2015-10-28 Spray apparatus and method thereof

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Publication Number Publication Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109381719A (en) * 2018-12-25 2019-02-26 王伟 Clinical care chemical spraying device
CN112756310A (en) * 2019-11-06 2021-05-07 宁波方太厨具有限公司 Cleaning machine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2344091Y (en) * 1998-09-22 1999-10-20 马锦明 Adjustable sprayer
CN2420062Y (en) * 1999-11-20 2001-02-21 徐奎 Adjustable water saving sprinkler
US20080029219A1 (en) * 2006-07-28 2008-02-07 Foxconn Advanced Technology Inc. Apparatus for spraying etchant solution onto preformed printed circuit board
CN101962774A (en) * 2009-07-24 2011-02-02 富葵精密组件(深圳)有限公司 Etching device and etching method
CN104958817A (en) * 2015-07-15 2015-10-07 深圳市安保科技有限公司 Air and oxygen mixing device and method for respirator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2344091Y (en) * 1998-09-22 1999-10-20 马锦明 Adjustable sprayer
CN2420062Y (en) * 1999-11-20 2001-02-21 徐奎 Adjustable water saving sprinkler
US20080029219A1 (en) * 2006-07-28 2008-02-07 Foxconn Advanced Technology Inc. Apparatus for spraying etchant solution onto preformed printed circuit board
CN101962774A (en) * 2009-07-24 2011-02-02 富葵精密组件(深圳)有限公司 Etching device and etching method
CN104958817A (en) * 2015-07-15 2015-10-07 深圳市安保科技有限公司 Air and oxygen mixing device and method for respirator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109381719A (en) * 2018-12-25 2019-02-26 王伟 Clinical care chemical spraying device
CN109381719B (en) * 2018-12-25 2021-01-29 王伟 Medicine spraying device for clinical nursing
CN112756310A (en) * 2019-11-06 2021-05-07 宁波方太厨具有限公司 Cleaning machine

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Application publication date: 20151230