JP2009206392A - Surface treating apparatus, surface treating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface treating apparatus and a surface treating method enabling smooth discharge of the liquid pool of chemicals from the substrate surface without depending on a swing mechanism of a chemical injection part. <P>SOLUTION: The surface treating apparatus comprises a conveyance mechanism for conveying a base 1 in a first direction (X direction), a plurality of chemical injection parts 101R, 101C, 101L disposed in a second direction (Y direction) orthogonal to the first direction, facing the conveyance mechanism, and an injection control part for controlling the chemical injection from the plurality of chemical injection parts 101R, 101C, 101L. The injection control part allows the plurality of chemical injection parts 101R, 101C, 101L to inject a chemical, changing the chemical injection conditions successively in the order of arrangement in the second direction. The injection conditions include injection pressure, an injection flow rate and injection timing. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface treatment apparatus and a surface treatment method for manufacturing a wiring board.

As a method for manufacturing a wiring board, an etching method and an etching apparatus in which an etching solution is sprayed onto a printed wiring board manufacturing board using a spray method are known (for example, Patent Document 1).
The etching apparatus sprays an etching solution from a plurality of spray heads, and reciprocates (swings) the spray head in a direction orthogonal to the transport direction of the printed wiring board manufacturing substrate.
Further, the printed wiring board manufacturing substrate is carried on the conveyor roll while being pressed from above by a pressing roller, and the pressing roller cannot pass the etching liquid on the upper surface of the printed wiring board manufacturing substrate in the transport direction. It is in form.
As a result, a waste liquid carry-out path is formed between the spray area where the etching liquid reaches and the pressing roller.

JP 2002-76572 A (pages 4 and 6)

The conventional etching apparatus has a problem that the apparatus becomes large because the spray head is reciprocated (oscillated).
Further, the etching solution sprayed from the spray head includes a conductive film component etched as the etching progresses, and the etching function is lowered. If the etching solution (old solution) having a reduced etching function is not smoothly discharged from the substrate, there is a problem in that the etching speed is reduced at the portion where the etching solution stays on the substrate, resulting in variation in etching. Needless to say, the etching variation has a problem of causing variations in wiring width and short-circuiting between wirings.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented by the following forms or application examples.

  Application Example 1 The surface treatment apparatus of this application example is a surface treatment apparatus that performs surface treatment of a substrate surface by spraying a chemical solution toward the substrate, and transports the substrate in a first direction. A mechanism, a plurality of chemical injection units arranged in a second direction opposite to the first direction, and an injection control for controlling injection of the chemical from the plurality of chemical injection units And the injection control unit sequentially changes the injection conditions of the chemical solutions of the plurality of chemical solution injection units in the arrangement order in the second direction.

According to this configuration, since the injection conditions of the chemical solution are sequentially changed in the order of arrangement in the second direction in the plurality of chemical solution injection units, the chemical solution sprayed on the substrate surface is the second solution arranged by the chemical solution injection unit. Flows along the direction. Therefore, it is difficult for the chemical liquid to stay on the surface of the substrate, and the old chemical liquid having a lowered processing function can be smoothly discharged along the second direction. Therefore, it is possible to reduce the variation in the surface treatment due to the remaining old chemical solution.
Furthermore, in order to smoothly discharge the old chemical liquid, a mechanism for swinging the plurality of chemical liquid injection units in the second direction can be eliminated. That is, it is possible to provide a surface treatment apparatus that can realize a simplified apparatus structure and enables stable surface treatment.

Application Example 2 In the surface treatment apparatus of the above application example, the injection condition is an injection pressure or an injection flow rate of the chemical liquid.
According to this configuration, since the injection pressure or the injection flow rate of the chemical solution is sequentially changed in the plurality of chemical injection units, the chemical solution sprayed on the substrate surface with a low pressure or a low flow rate is sprayed with a high pressure or a high flow rate. It is pushed away in the second direction by the applied chemical. Therefore, it is difficult for the chemical liquid to stay on the surface of the substrate, and the old chemical liquid having a lowered processing function can be smoothly discharged along the second direction.

Application Example 3 In the surface treatment device of the application example, the injection condition may be an injection timing of the chemical liquid.
According to this configuration, since the injection timing of the chemical solution is sequentially changed in the plurality of chemical solution injection units, the chemical solution sprayed first on the substrate surface is pushed away in the second direction by the chemical solution sprayed later. . Therefore, it is difficult for the chemical liquid to stay on the surface of the substrate, and the old chemical liquid having a lowered processing function can be smoothly discharged along the second direction.

Application Example 4 In the surface treatment apparatus according to the application example, the chemical solution ejecting unit includes a spray nozzle for ejecting the chemical solution in a predetermined direction, and the spray nozzle is directed in the second direction. Preferably it is.
According to this structure, since the chemical injection unit includes the spray nozzle directed in the second direction, it is possible to more smoothly discharge the old chemical with a reduced processing function along the second direction. .

Application Example 5 In the surface treatment apparatus according to the application example described above, the chemical solution ejecting unit may include at least two spray nozzles attached in directions opposite to each other in the second direction.
According to this structure, the chemical | medical solution injected from the spray nozzle of the direction which opposes is discharged | emitted in the mutually opposing direction in a 2nd direction on a substrate surface. Therefore, it is possible to quickly discharge the sprayed chemical solution rather than discharging it in a certain direction. Therefore, the retention of the old chemical solution on the substrate surface can be further suppressed.

Application Example 6 In the surface treatment apparatus according to the application example described above, the substrate has a conductive film on the substrate surface and a resist film coated with the conductive film, and the chemical solution is a developer for the resist film. It is characterized by that.
According to this configuration, it is possible to provide a developing device as a surface treatment apparatus that can stably develop a resist film and can manufacture a substrate having a resist film having stable patterning accuracy.

Application Example 7 In the surface treatment apparatus of the application example, the substrate has a conductive film on the substrate surface and a resist film formed in a predetermined pattern by covering the conductive film, and the chemical solution is It may be an etching solution for the conductive film.
According to this configuration, it is possible to provide an etching apparatus as a surface treatment apparatus that can stably etch a conductive film and can manufacture a substrate provided with a conductive film having stable patterning accuracy.

  Application Example 8 In the surface treatment method of this application example, a plurality of substrates are arranged in a second direction that faces the moving substrate and intersects the first direction while moving the substrate in the first direction. A surface treatment step of performing a surface treatment by injecting a chemical solution toward the substrate surface from the chemical solution injection unit, wherein the surface treatment step sets the injection pressure or the injection flow rate of the chemical solution in the plurality of chemical solution injection units. It is characterized in that the chemical solution is ejected by sequentially changing the arrangement order in the direction of 2.

According to this method, the injection pressure or the injection flow rate of the chemical solution is sequentially changed in the order of arrangement of the plurality of chemical solution injection units in the second direction, and the chemical solution is injected from the plurality of chemical solution injection units toward the substrate surface. The sprayed chemical liquid flows along the second direction, and it is difficult for the chemical liquid to stay on the substrate surface. Therefore, it is possible to smoothly discharge the old chemical solution having a deteriorated processing function along the second direction. Therefore, variation in surface treatment due to stagnation of old chemicals can be reduced.
That is, it is possible to provide a surface treatment method that can smoothly discharge old chemical liquid without swinging a plurality of chemical liquid ejecting portions in the second direction and that enables stable surface treatment.

  Application Example 9 In another surface treatment method of this application example, the substrate is moved in the first direction, and is opposed to the moving substrate and arranged in a second direction intersecting the first direction. A surface treatment step of performing a surface treatment by injecting a chemical solution toward the substrate surface from the plurality of chemical solution ejecting units, wherein the surface treatment step sets the timing of ejecting the chemical solution of the plurality of chemical solution ejecting units to the second The medicinal solutions are ejected in such a manner that they are sequentially changed in the order of arrangement in the direction.

According to this method, the injection timing is sequentially changed from the plurality of chemical solution injection units arranged in the second direction in the order of arrangement in the second direction, and the chemical solution is injected toward the substrate surface. The chemical liquid sprayed first is pushed away in the second direction by the chemical liquid sprayed later. Therefore, it is difficult for the chemical liquid to stay on the substrate surface. Therefore, the old chemical | medical solution with which the processing function fell can be discharged | emitted smoothly along a 2nd direction. Therefore, variation in surface treatment due to stagnation of old chemicals can be reduced.
That is, it is possible to provide a surface treatment method that can smoothly discharge old chemical liquid without swinging a plurality of chemical liquid ejecting portions in the second direction and that enables stable surface treatment.

Application Example 10 In the surface treatment method of the application example, the substrate has a conductive film on the surface of the substrate and a resist film coated with the conductive film, and the chemical solution is a developer for the resist film. It is characterized by that.
According to this method, it is possible to provide a developing method as a surface treatment method capable of manufacturing a substrate provided with a resist film having a resist pattern having a stable patterning accuracy in which the resist film is stably developed.

Application Example 11 In the surface treatment method of the application example, the substrate has a conductive film on the surface of the substrate and a resist film formed in a predetermined pattern so as to cover the conductive film. It may be an etching solution for the conductive film.
According to this method, it is possible to provide an etching method as a surface treatment method by which a conductive film is stably etched and a substrate including a conductive film having stable patterning accuracy can be manufactured.

Hereinafter, the present embodiment will be described by taking a method for manufacturing a flexible circuit board as an example.
First, a flexible circuit board as a board of this embodiment will be briefly described with reference to FIG. Note that in the drawings used for description, various components are appropriately enlarged or reduced in scale for easy understanding of the arrangement, dimensions, and the like.

  FIG. 1A is a schematic plan view showing a configuration of a flexible circuit board, and FIG. 1B is a schematic cross-sectional view showing a flexible circuit board on which a semiconductor device is mounted.

  As shown in FIG. 1A, a flexible circuit board 10 according to the present embodiment has a long base 1 formed with a plurality of individual wiring patterns EC.

In this case, each wiring pattern EC includes the wiring 3 connected to the input terminal 3a, the wiring 4 connected to the output terminal 4a, and the insulating film 5 that covers them except for the portion used for electrical connection of the wirings 3 and 4. And a pair of alignment marks AL ₁ and AL ₂ . Each input terminal 3 a and each output terminal 4 a are arranged in the width direction of the substrate 1.

  The long base 1 has a plurality of pilot holes 2 provided in pairs on both ends in the width direction and perforated into a quadrangle at a predetermined arrangement pitch in the long direction. Each wiring pattern EC is formed at predetermined intervals in the longitudinal direction of the substrate 1 with the pair of pilot holes 2 as a reference.

  For example, as shown in FIG. 1B, such a flexible circuit board 10 is a mold having a bonding function in which a semiconductor device (IC) is surface mounted (face-down bonding) on an opening 5a of an insulating film 5. The mounting surface is sealed by the material 8 and used as a COF (Chip on Film) 7. The mounting surface mentioned here includes not only the bumps on the IC side and the joint surfaces of the wirings 3 and 4, but also the active surface of the IC provided with the bumps.

  The substrate 1 is made of, for example, an insulating resin material film such as polyimide, and various widths such as 35 mm, 48 mm, 72 mm, 105 mm, and 150 mm are prepared in accordance with the size and arrangement of the wiring pattern EC to be formed. Has been.

In the manufacturing method of such a flexible circuit board 10, first, a conductive film 6 such as a copper foil is laminated and bonded to a base material 1 on which a pilot hole 2 is formed in advance. Subsequently, a photosensitive resin material is coated (applied) so as to cover the conductive film 6 and dried to form a resist film. Then, the resist film is developed and the conductive film 6 is etched by photolithography so that a desired pattern shape is obtained with the pilot hole 2 as a reference. Thereby, a plurality of wirings 3 and 4 and alignment marks AL ₁ and AL ₂ are formed. Finally, the insulating film 5 is formed by applying an insulating material to a desired region by screen printing or offset printing. The insulating film 5 may be attached by adopting a method of laminating an insulating film having a desired shape on the substrate 1.

  In the case of a wide substrate 1 such as 150 mm, the so-called single processing method as described above is used. For example, in the case of a narrow width such as 35 mm, a plurality of wiring patterns EC are formed on the wide substrate 1. Are formed, and after the respective insulating films 5 are formed, slitting is performed to divide the film into a plurality of pieces.

The flexible circuit board 10 completed in this way is mounted with a semiconductor device (IC) in a long state, molded (sealed), and then punched and pressed using a mold or the like. It is taken out. Not only the semiconductor device (IC) but also chip-type electronic components such as resistors and capacitors may be mounted on the flexible circuit board 10. The alignment marks AL ₁ and AL ₂ are used as position references when mounting these electronic components.

  In recent years, driver ICs used in display devices such as liquid crystal devices have a large number of input / output electrodes in one chip due to progress in miniaturization of semiconductor manufacturing processes. Therefore, the COF 7 on which such a driver IC is mounted is also required to have a finer wiring pattern EC, and a manufacturing apparatus for the flexible circuit board 10 capable of forming a stable pattern is required. An etching apparatus as a surface treatment apparatus, which will be described later, has been developed as one of the purposes to be applied to the manufacture of such a flexible circuit board 10.

<Surface treatment device>
Next, an etching apparatus as a surface treatment apparatus of this embodiment will be described with reference to FIGS. 2A is a schematic plan view showing the configuration of the etching apparatus, and FIG. 2B is a schematic cross-sectional view seen from the side showing the inside of the etching apparatus.

  As shown in FIG. 2A, the etching apparatus 100 of this embodiment has a rectangular housing 103 in plan view. The casing 103 is divided into an etching chamber and a liquid draining chamber in the longitudinal direction, and the base material 1 of the flexible circuit board 10 before etching is conveyed so as to pass through the etching chamber and the liquid draining chamber in this order.

  In the etching chamber, a chemical solution injection unit 101 that injects an etching solution as a chemical solution is provided. The chemical injection unit 101 has a predetermined interval between the transport direction (X direction) as the first direction of the substrate 1 and the second direction (Y direction) orthogonal to (intersect) the transport direction. A plurality are provided.

  The arrangement interval Sx in the transport direction of the chemical solution injection unit 101 is set in the relationship between at least the transport speed of the substrate 1 and the etching time (etching speed) among the etching conditions. In this case, the arrangement interval Sx is approximately 100 mm.

  The arrangement interval Sy in the direction orthogonal to (crossing) the transport direction of the chemical solution injection unit 101 is the width of the base material 1 (in this case, 150 mm) and the injection region in which the chemical solution injection unit 101 can spray the etching solution (in the drawing) In this relationship, the etching solution is set so as to spread over the substrate 1 evenly. Specifically, one of the three chemical liquid ejecting units 101 arranged in the Y direction is located approximately at the center in the width of the base material 1, and the arrangement interval Sy is approximately 60 mm. The distance between the chemical injection unit 101 and the substrate 1 (in other words, the height h of the chemical injection unit 101) is approximately 150 mm.

  Note that the number of the chemical solution injection units 101 in the Y direction is not limited to three, and may be two, for example. In that case, the arrangement interval Sy is set to approximately 120 mm and the substrate 1 is arranged evenly.

  In the liquid draining chamber of the housing 103, an air knife 102 is attached across the width of the base material 1 in order to drain the etching solution remaining on the base material 1.

  As shown in FIG. 2B, the etching apparatus 100 includes a transport mechanism 105 that transports the base material 1 in the transport direction (X direction). The transport mechanism 105 rotationally drives the transport roller 104. As a result, the base material 1 on the transport roller 104 is transported from the inlet 103a to the outlet 103b of the housing 103 at a predetermined transport speed. In addition, it is good also considering the conveyance roller 104 as a sprocket shape so that the base material 1 may be conveyed using the pilot hole 2 provided in the base material 1. FIG.

  While the base material 1 passes through the etching chamber, the etching liquid is sprayed toward the substrate surface of the base material 1 from the plurality of chemical liquid spraying portions 101 provided to face the transport mechanism 105. On the substrate surface, a portion of the conductive film 6 not covered with the resist film is etched (dissolved) by a chemical reaction between the etching solution and the conductive film 6. Therefore, the dissolved component of the conductive film 6 is included in the etching solution after the chemical reaction.

  From the air knife 102 provided in the liquid draining chamber, compressed air is jetted toward the substrate surface, and the etching solution after the chemical reaction is blown off and removed from the substrate surface. The housing 103 is provided with a partition wall so that the etched etchant does not enter the etching chamber.

  The etching solution discharged from the substrate surface flows along the slope provided at the bottom of the housing 103 and is discharged to the outside from the discharge port.

  The etching apparatus 100 supplies a supply system such as a pump for supplying an etching solution, a recovery system for the etching solution, and a long substrate 1 that has been wound before etching, in addition to the above-described components. Equipment such as a supply system and a recovery system for scraping off the long substrate 1 after etching is provided.

  FIG. 3 is a block diagram showing a control system of the etching apparatus. As shown in FIG. 3, the etching apparatus 100 includes a control device 110 that comprehensively controls each unit.

  The control device 110 includes an injection control unit 111 that controls the injection and injection conditions of the chemical solution from the chemical solution injection unit 101, a transport mechanism control unit 112 that controls the transport mechanism 105, the supply system, and the recovery system of the base material 1, and the chemical solution. And a chemical control unit 113 that controls the supply system and recovery system of the etching liquid, and a compressed air control unit 114 that controls the supply of compressed air to the air knife 102.

  The injection control unit 111 can control a valve connected to a chemical solution supply system provided for each chemical solution injection unit 101 to start / stop etching liquid injection and adjust the injection pressure and the injection flow rate. ing. Further, these controls can be performed not only for each chemical solution ejecting unit 101, but also as shown in FIG. 2 (a), each of the three chemical solution ejecting units 101 arranged in parallel in the transport direction as one stage. Can also be controlled. A specific control method will be described in the surface treatment method described later.

<Surface treatment method>
Next, an etching method as the surface treatment method of the present embodiment will be described with reference to FIGS. 4A to 4C are schematic views showing a surface treatment method.

  4A to 4C, the flexible circuit board 10 is conveyed in a direction (X direction) perpendicular to the paper surface. The one-stage chemical solution injection unit 101 includes three chemical solution injection units 101R, 101C, and 101L, and spray nozzles 101a for diffusing and injecting an etching solution are provided downward.

  As the etching solution, when the conductive film 6 of the substrate 1 is a copper foil, for example, a ferric chloride aqueous solution or a cupric chloride aqueous solution can be used. The etching solution is preferably heated to about 40 ° C. to 50 ° C. in consideration of the chemical reaction rate.

  In the present embodiment, the injection control unit 111 sequentially sets the injection pressure or the injection flow rate of the etching solution injected from the plurality of chemical solution injection units 101R, 101C, and 101L in the order of arrangement in the Y direction in the single-step chemical injection unit 101. The etching solution is sprayed in a variable manner.

  For example, as shown in FIG. 4A, when attention is paid to the right-side chemical injection unit 101R, injection starts with a high injection pressure or a high injection flow rate. Next, as shown in FIG. 5B, the injection pressure is changed to a low state or a low injection flow rate. In FIG. 6C, the state changes to a state that is the same as or lower than the case of FIG. Such a change in the injection condition is repeated.

  As shown in FIG. 5A, the central chemical liquid injection unit 101C starts injection with a lower injection pressure or a lower injection flow rate than the adjacent chemical injection unit 101R. Next, as shown in FIG. 5B, the injection pressure changes to a state where the injection pressure is high or the injection flow rate is high. In FIG. 8C, the state changes to the state of the injection pressure or the injection flow rate equivalent to that in the case of FIG.

  As shown in FIG. 6A, the left chemical liquid injection unit 101L starts with a lower injection pressure or a lower injection flow rate than the adjacent chemical injection unit 101C, as shown in FIG. Furthermore, the injection pressure is lower or the injection flow rate is lower than that of the adjacent chemical solution injection unit 101C, and the injection pressure is higher or the injection flow rate is higher than that of the adjacent chemical injection unit 101C, as shown in FIG. It changes to many states.

  The change of the injection condition of each chemical solution injection unit 101R, 101C, 101L is repeated at a predetermined cycle. Moreover, the change of the injection conditions between each chemical | medical solution injection part 101R, 101C, 101L is shifted | deviated periodically.

  Such a change in the injection conditions is not only performed in FIGS. (A) to (c) as one stage, but periodically between the different stages as viewed from the conveyance direction in FIGS. (A) to (c). It may be performed as a change of.

  As shown in FIG. 5A, when the etching liquid is injected from the three chemical injection units 101R, 101C, and 101L while changing the injection conditions, the chemical injection unit 101R having the highest injection pressure or the highest injection flow rate A liquid pool becomes large between the chemical solution injection unit 101C.

  In the liquid pool, an etchant (hereinafter referred to as an old solution) containing the components of the etched conductive film 6 is collected by a chemical reaction between the etchant and the conductive film 6. Therefore, the old liquid tends to stay. Therefore, the liquid function tends to lower the etching function (capability). If the liquid pool can always be accumulated at the same place on the substrate surface, it becomes difficult to supply a new etching liquid (hereinafter referred to as a new liquid), so that etching variation occurs and the wiring pattern EC cannot be formed stably.

In the present embodiment, the enlarged liquid pool is pushed toward a lower injection pressure or a lower injection flow rate.
Then, as shown in FIG. 5B, when the central chemical injection unit 101C is in a state where the injection pressure is high or the injection flow rate is high at a certain timing, the liquid reservoir apparently moves to the left side. Furthermore, as shown in FIG. 5C, when the left liquid chemical injection unit 101L enters a state where the injection pressure is high or the injection flow rate is high at a certain timing, the grown liquid reservoir can be discharged from the flexible circuit board 10. it can.

  According to the etching method of the above embodiment, the injection control unit 111 periodically varies the injection pressure or the injection flow rate of the etching solution injected from the adjacent chemical solution injection unit 101, and shifts the injection period to change the etching solution. Let spray. Therefore, as described above, since the liquid pool is smoothly discharged without staying on the substrate surface, the etching variation can be reduced and the wiring pattern EC can be stably formed.

  4A to 4C, the etching solution is sprayed so that the spray state of the etching solution sprayed from each spray nozzle 101a overlaps when viewed from the conveyance direction (X direction) of the substrate 1. Also good. Even in such a case, the liquid pool formed in the overlapped portion is smoothly discharged.

  Next, the spraying conditions of the spray nozzle 101a will be described in more detail with reference to FIG. FIG. 5 is a schematic diagram for explaining the injection conditions in the spray nozzle.

  As shown in FIG. 5, the etching solution (chemical solution) sprayed from the spray nozzle 101 a is diffused and sprayed onto the surface of the substrate 1. The spray region of the spray nozzle 101a, that is, the spray diameter D, is determined by the spray angle θ with respect to the spray axis connecting the spray nozzle 101a and the substrate surface, and the distance between the spray nozzle 101a and the substrate surface, that is, the height h of the spray nozzle 101a.

  On the other hand, the injection angle θ does not always increase as the injection pressure increases. Depending on the nozzle shape of the spray nozzle 101a, the spray diameter D may decrease as the spray pressure increases. Therefore, in order to spread the etching solution uniformly on the substrate surface, it is necessary to carefully check the performance of the spray nozzle 101a and adjust both the injection pressure and the injection flow rate.

Specifically, for example, when a JJXP-020 full cone nozzle manufactured by Ikeuchi Co., Ltd. is used as the spray nozzle 101a, the relationship between the spray pressure of the etchant, the spray angle θ, the spray diameter D, and the spray flow rate Was as follows. The height h is 150 mm.
・ At pressure 0.05 MPa, θ = 65 degrees, D = 191 mm, flow rate 1.06 L / min ・ At pressure 0.20 MPa, θ = 60 degrees, D = 173 mm, flow rate 2.00 L / min ・ At pressure 0.50 MPa , Θ = 55 degrees, D = 156 mm, flow rate 2.91 L / min When a JJXP-020 full conical nozzle is used, the spray diameter D does not change much even if the pressure is varied as described above. Further, the injection pressure and the injection flow rate have a correlation.
Therefore, in this embodiment, the supply pressure in the etching solution supply system is kept constant, a pressure adjusting valve is provided in each chemical solution injection unit 101, and the injection control unit 111 sets the injection pressure of each chemical solution injection unit 101 to 0.05 MPa. It was set as the structure controlled between -0.5MPa.

  In the plurality of chemical liquid injection units 101, not only the method of discharging the liquid pool by varying the injection pressure or the injection flow as described above, but also the injection timing of whether to inject or not inject with the injection pressure or the injection flow constant. It is also possible to adopt a method of controlling the control so as to be sequentially changed in the order of arrangement in the Y direction.

  For example, in FIGS. 4A to 4C, the selection of the chemical injection unit 101 that injects the etching liquid is controlled, and the chemical injection unit 101R, the chemical injection unit 101C, and the chemical injection unit 101L are injected in this order or vice versa. The etching solution is sprayed at different timings. As a result, the etchant sprayed first is pushed in the second direction by the etchant sprayed later. That is, the drainage of the liquid pool is improved. Also in this case, as described above, the injection control may be periodically performed between different stages as viewed from the conveyance direction. This is because the liquid reservoir apparently moves in the transport direction as the flexible circuit board 10 is transported. Of course, such injection control between different stages is performed in consideration of the conveyance speed.

The effect of the said embodiment is as follows.
(1) According to the etching apparatus 100 and the etching method of the above-described embodiment, the injection control unit 111 sequentially changes the injection pressure or the injection flow rate of the etching solution injected from the plurality of chemical solution injection units 101 in the order of arrangement in the Y direction. Then spray the etchant. Accordingly, since the liquid pool is smoothly discharged without staying on the substrate surface, it is possible to provide the etching apparatus 100 and the etching method capable of reducing the etching variation and stably forming the wiring pattern EC.

  (2) According to the etching apparatus 100 of the above embodiment, the swing mechanism that reciprocates (swings) the chemical injection unit 101 in a direction orthogonal (intersects) with the transport direction of the substrate 1 in order to discharge the liquid pool. Therefore, the device configuration can be simplified (downsized). Further, since it is not necessary to consider the occurrence of patterning failure (etching failure) due to dust generation from the swing mechanism, the flexible circuit board 10 can be manufactured with a high yield.

  Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1) In the etching apparatus 100 of the said embodiment, the form of the chemical | medical solution injection part 101 is not limited to this. FIGS. 6A to 6C are schematic views showing the form of a modified chemical injection unit. For example, as shown in FIG. 5A, the spray direction of the spray nozzle 101a provided in the chemical solution spray unit 101 may be directed at an angle in a direction orthogonal (crossing) to the transport direction for each stage. According to this, the discharge property of the liquid reservoir can be improved.
Further, as shown in FIG. 5B, for example, three spray nozzles 101d, 101e, 101f having different injection directions are provided in the chemical solution injection units 101R, 101C, 101L, and the individual spray nozzles 101d, 101e, 101f are provided. Injection control is performed so as to select and inject. According to this, the liquid direction can be discharged more smoothly by controlling the injection direction. Alternatively, the liquid pool on the substrate surface can always be divided into left and right and discharged efficiently.
Furthermore, as shown in FIG. 5C, it is possible to adopt a configuration in which the spray nozzle 101a is attached at an interval in a direction orthogonal to the transport direction in one chemical liquid ejecting unit 101.

  (Modification 2) The etching apparatus 100 and the etching method of the above embodiment can be applied to the etching process of the flexible circuit board 10. For example, the present invention can be applied to a developing process in the manufacturing process of the flexible circuit board 10. That is, a developing apparatus and a developing method for developing a resist film by using a developer as a chemical and spraying the developer from the chemical spray unit 101 onto the substrate 1 having a resist film (exposed) as an object to be processed. Can be applied. According to this, it is possible to provide a developing device and a developing method capable of stably patterning a resist film.

  (Modification 3) In the etching apparatus 100 and the etching method of the above embodiment, the substrate to be processed is not limited to the flexible circuit board 10. For example, it can also be applied to a manufacturing apparatus and a manufacturing method of an electrode substrate constituting an electro-optical device such as a printed wiring board or a liquid crystal display device in which a wiring pattern is provided on a base material made of rigid glass epoxy resin or ceramic. It is.

(A) is a schematic plan view which shows the structure of a flexible circuit board, (b) is a schematic sectional drawing which shows the flexible circuit board by which the semiconductor device was mounted. (A) is a schematic plan view which shows the structure of an etching apparatus, (b) is the schematic sectional drawing seen from the side surface which shows the inside of an etching apparatus. The block diagram which shows the control system of an etching apparatus. (A)-(c) is the schematic which shows the surface treatment method. Schematic explaining the injection conditions in a spray nozzle. (A)-(c) is the schematic which shows the form of the chemical | medical solution injection part of a modification.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base material, 6 ... Conductive film, 10 ... Flexible circuit board as a board | substrate, 100 ... Etching apparatus as a surface treatment apparatus, 101, 101L, 101C, 101R ... Chemical solution injection part, 101a, 101d, 101e, 101f ... Spray Nozzle, 105... Transport mechanism, 111.

Claims (11)

A surface treatment apparatus for performing a surface treatment of a substrate surface by spraying a chemical liquid toward the substrate,
A transport mechanism for transporting the substrate in a first direction;
A plurality of chemical liquid ejecting units that face the transport mechanism and are arranged in a second direction that intersects the first direction;
An injection control unit that controls injection of the chemical liquid from the plurality of chemical liquid injection units,
The surface treatment apparatus, wherein the ejection control unit sequentially varies the chemical solution ejection conditions of the plurality of chemical solution ejection units in the order of arrangement in the second direction.   The surface treatment apparatus according to claim 1, wherein the injection condition is an injection pressure or an injection flow rate of the chemical liquid.   The surface treatment apparatus according to claim 1, wherein the injection condition is an injection timing of the chemical liquid. The chemical solution injection unit includes a spray nozzle for injecting the chemical solution in a predetermined direction,
The surface treatment apparatus according to claim 1, wherein the spray nozzle is directed in the second direction.   The surface treatment apparatus according to claim 4, wherein the chemical liquid ejecting section includes at least two spray nozzles attached in opposite directions to each other in the second direction. The substrate has a conductive film on the substrate surface and a resist film coated with the conductive film,
The surface treatment apparatus according to claim 1, wherein the chemical solution is a developer for the resist film. The substrate has a conductive film on the surface of the substrate, and a resist film formed in a predetermined pattern by covering the conductive film,
The surface treatment apparatus according to claim 1, wherein the chemical solution is an etching solution for the conductive film. While moving the substrate in the first direction, the chemical solution is ejected toward the substrate surface from a plurality of chemical solution ejecting units arranged in a second direction that faces the moving substrate and intersects the first direction. A surface treatment process for performing surface treatment,
The surface treatment method is characterized in that the chemical liquid is ejected by sequentially changing the injection pressure or flow rate of the chemical liquid of the plurality of chemical liquid ejecting units in the order of arrangement in the second direction. While moving the substrate in the first direction, the chemical solution is ejected toward the substrate surface from a plurality of chemical solution ejecting units arranged in a second direction that faces the moving substrate and intersects the first direction. A surface treatment process for performing surface treatment,
The surface treatment method is characterized in that the chemical liquid is ejected by sequentially changing the injection timing of the chemical liquid of the plurality of chemical liquid ejecting units in the order of arrangement in the second direction. The substrate has a conductive film on the substrate surface and a resist film coated with the conductive film,
10. The surface treatment method according to claim 8, wherein the chemical solution is a developer for the resist film. The substrate has a conductive film on the surface of the substrate, and a resist film formed in a predetermined pattern by covering the conductive film,
The surface treatment method according to claim 8, wherein the chemical solution is an etching solution for the conductive film.

Images