JP2002292315A - Spraying apparatus and development method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spraying apparatus with a stabilized spraying capability by efficiently defoaming foams occurred in a liquid in a tank and increase the stability of a development treatment. SOLUTION: The spraying apparatus comprises a tank 1 for storing a liquid, a nozzle 2 for spraying droplets, and a pump 3 for supplying the liquid stored in the tank to the nozzle 2 with a prescribed pressure. In the apparatus, the tank 1 is divided into a first tank 1a, a second tank 1b, and a third tank 1c and the first tank 1a and the second tank 1b are connected to each other through joining parts 10a, 10b from the bottom part of the first tank 1a to the upper part of the second tank 1b and the liquid in the first tank 1b is discharged out through the bottom part of the first tank 1a and led to the next second tank 1b through the upper part via the joining part 10a and finally discharged out of the bottom part of the third tank 1c and after that, the liquid is supplied to the pump 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spraying device and, more particularly, to a developing method for spraying a developing solution at the time of development for removing uncured portions from a member containing a photocurable resin after light irradiation. is there.

[0002]

2. Description of the Related Art In general, a laminated ceramic substrate is formed by laminating a plurality of insulating layers made of ceramic or glass-ceramic. Internal wirings are formed between the insulating layers, and via-hole conductors are connected to the internal wirings. . A high melting point metal material such as tungsten or a low resistance material such as gold, silver or copper is used as a conductor material of the internal wiring and the via hole conductor.

The following manufacturing method is used as a method for manufacturing such a multilayer ceramic substrate. One of them is to form a slip material containing a ceramic powder to be a ceramic layer, form a green sheet by a doctor blade method or the like, and then form a via hole in a green sheet at a via hole forming position with an NC punch or a mold. Then, printing and filling conductive paste on the green sheet according to the internal wiring pattern and via hole conductor,
Next, a green sheet laminating system is used in which a plurality of these sheets are laminated and the laminated body is simultaneously fired at a time.

However, this manufacturing method requires a tape molding step for producing a green sheet to be a ceramic layer, and furthermore, a via hole as a via hole for connecting internal wiring between different ceramic layers is formed. A process is required, and when drilling, it is common to use a mold or an NC punch. In the case of an NC punch, since one hole must be formed, the man-hour and the cost are high. It has become.

The other is a method using a photosensitive slurry by a photolithography method. this is,
Ceramic material, a photocurable resin, after forming a ceramic formed body slip material composed of an organic binder and an organic solvent and thin layer and dried, removed after exposure to ultraviolet rays, the uncured portion by spraying a developing solution After forming a fine via hole for connecting the internal wiring by the developing process, filling the via hole with a conductive paste, printing the internal wiring pattern, and repeating this to produce a laminated molded body This is fired to form a multilayer ceramic substrate.

The method of manufacturing a laminated ceramic substrate by the photolithography method can simplify the process, form a via hole with high accuracy, enable high-density internal wiring, and solve the problems of the green sheet lamination method. Things.

As for a developing method capable of forming such fine via holes with high precision and collectively, many methods have been studied as compared with the prior art. For example, Japanese Patent Application Laid-Open No. 4-48085 discloses a method. In order to reduce the development variation in the substrate, use a developing device equipped with a plurality of oscillating nozzles for applying the developing solution to the substrate and a transport rail. There is disclosed a method of adjusting the distance and the liquid pressure to improve the developability of a central portion where supply of a fresh liquid is difficult.

In recent years, the diameter of a via hole has been required to be as small as about 70 to 100 μm from the conventional 150 μm.
Since the droplets of the developing solution are as large as 300 μm or more and the pressure is as small as 0.2 MPa or less, a deep via hole is formed in an ideal shape for a ceramic layer molded body that cannot be sufficiently cured to the inside by ultraviolet rays. It was difficult to do.

As a means for solving this, the present applicant has
By previously increasing the pressure to 2 MPa or more and forming fine droplets having a droplet diameter of 100 μm or less, it is possible to effectively remove the uncured portion and form a via hole having an ideal cross-sectional shape with a vertical wall surface. It was proposed.

[0010]

However, if the developer is sprayed at a high pressure in order to form such fine developer droplets, the pressure in the tank drops sharply. Bubbles are generated in the developer and remain in the developer in the tank. These bubbles disappear after being left for a certain period of time, but if they reach the pump before they disappear, the bubbles themselves will hinder the increase in pressure by the pump, and as a result, the original development ability cannot be exhibited. Become.

Therefore, conventionally, there have been proposed some methods for eliminating bubbles generated in the developer in the tank. One method is to use a defoaming agent such as polyoxyalkylene ether or glycerol monostearate. In this method, the defoaming agent itself is a source of contamination of a developing device and a product.

It has also been proposed to apply a magnetic force to the developer to perform defoaming. However, in this method, the defoaming ability was small, and defoaming in a short time was impossible.

Further, as disclosed in Japanese Patent Application Laid-Open No. 8-122996, it has been proposed to spray a developing solution containing no air bubbles on the surface of the developing solution above the tank to eliminate bubbles. According to this method, bubbles generated on the surface of the liquid can be eliminated, but there is little effect on bubbles existing inside the developer, and it is impossible to eliminate bubbles in the liquid in a short time.

Therefore, according to the present invention, it is an object of the present invention to provide a spraying apparatus as described above, which effectively eliminates bubbles generated in a liquid in a tank and has a stable spraying ability. Is what you do. Another object of the present invention is to provide a developing method capable of forming a fine uneven shape by removing an uncured portion by using the spray device.

[0015]

According to the present invention, the developer can be defoamed without using chemicals by controlling the circulation path of the developer in the tank in the spraying device. I found that my goal could be achieved.

That is, the spraying device of the present invention comprises a tank for storing a liquid, a nozzle for ejecting liquid droplets, and a pump for supplying the liquid in the tank to the nozzle at a predetermined pressure. In the spraying device, the inside of the tank is
Divided into at least a first tank and a second tank,
The tank and the second tank are connected by a connecting part communicating from the bottom of the first tank to the upper part of the second tank. The liquid in the tank of the first tank is discharged from the bottom of the first tank and the connecting part , Is supplied from the upper part of the subsequent second tank, is further discharged from the bottom part of the second tank, and is then supplied to the pump.

It is desirable that a pressure of 2 MPa or more be applied to the liquid by the pump, and that the size of the droplet sprayed from the nozzle be 100 μm or less. Further, it is desirable that the spray device is used as a developing device by using a liquid as a developing solution for removing an uncured portion of the photocurable resin.

According to the present invention, the bubbles generated in the liquid in the tank in the spraying device can be effectively eliminated in a short time without using an extra defoaming agent or the like. , And fine droplets can be continuously and stably generated. Therefore, stable processing can be performed even when a fine via hole or the like is processed by spraying a developer onto a molded body containing a photocurable resin.

That is, according to the present invention, in the production of a laminated body of an insulating film having an arbitrary thickness of 50 to 100 μm using a photolithography method, the development process for forming a via hole is improved, and in particular, the inside is exposed. When forming a fine via hole in a ceramic layer molded product that is difficult to cure by using the developer, the developer particle size is made smaller than the required hole size, and the spraying force (jet power) of the developer is used. In addition, a fine via hole can be formed accurately in the vertical direction without causing unnecessary dissolution of the outer peripheral wall surface of the via hole.

Further, after exposing at least the member containing the photocurable resin to partially cure the member, the developing solution is sprayed on the uncured portion using the above-described spraying device to remove the uncured portion. By doing so, it is possible to remove bubbles in the developing solution generated in the developing process effectively and continuously in a short period of time, so that development can be stably performed.

Further, since the size of the droplet of the developer by spraying can be made as fine as 100 μm or less, the step of forming a via hole can be carried out by batch processing by exposure and development. It can be set arbitrarily and a pore size that could not be obtained conventionally, for example, a diameter of about 70 to 5000 μ
With an arbitrary size of about m, it is possible to form a tapered via hole whose cross-sectional shape becomes narrower in the exposure direction. Further, since the relative positional accuracy is extremely improved, a multilayer ceramic substrate having high-density wiring can be manufactured.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a schematic view of an example of the spraying device of the present invention. As shown in FIG. 1, the spray device of the present invention supplies a tank 1 for storing a liquid such as a developer, a nozzle 2 for ejecting liquid droplets, and supplies the developer in the tank 1 to the nozzle 2 at a predetermined pressure. And a pump 3 to be used.

Although the tank needs to be divided into two or more tanks, in the spraying device shown in FIG. 1, the tank 1 has three tanks, a first tank 1a, a second tank 1b, and a third tank 1c. Divided into two tanks, each of which has a capacity of 0.02 m ³
It has a volume of ０．０５0.05 m ³ .

In this spraying device, the first tank 1a and the second tank 1a
The tank 1b is partitioned by two partition plates 7a and 8a. The bottom of the first partition plate 7a is the second
A hole 9a communicating with the tank is formed, a partition plate 8a is provided at a predetermined interval to form a connecting portion 10a, and the upper portion of the partition plate 8a is set lower than the liquid level of the second tank 1b. As a result, the liquid in the first tank 1a flows from the hole 9a at the bottom of the partition plate 7a to the upper portion of the second tank 1b from the upper portion of the partition plate 8a via the connecting portion 10a provided between the partition plate 8a and the partition plate 8a. Flows into

Similarly, the second tank 1b and the third tank 1c are partitioned by partition plates 7b and 8b, and the liquid in the tank 1 is supplied from the hole 9b at the bottom of the second tank 1b to the partition plate 8b. Flows into the upper part of the third tank 1c from the upper part of the partition plate 8b via the connecting part 10b provided in the third part. And the third
It is discharged to the pump 3 from a discharge port 6 provided at the lower part of the tank. Then, after being sent to the nozzle 2 by the pump 3 at a predetermined pressure and sprayed, the excess liquid after spraying is injected into the upper portion of the first tank 1 a via the inlet 5.

In such a flow of the liquid, while the liquid repeatedly moves from the upper part to the lower part of each tank, bubbles contained in the liquid float on the liquid surface of each tank by its own buoyancy. The bubbles in the liquid can be effectively eliminated by being discharged into the atmosphere. The number of tanks is three in FIG. 1, but may be determined according to the amount of liquid used.

FIG. 2 is a perspective view of the multilayer ceramic substrate. Reference numeral 11 denotes an insulating substrate, and terminals such as an input / output terminal, a power supply terminal, and a ground terminal are shown as end electrodes 12. The end surface electrode 12 is formed so as to be exposed on the side surface of the insulating base 11.

A surface electrode (wiring) 13 is formed on the upper surface of the insulating substrate 11, and a chip component 14 such as a resistor, a capacitor, and an inductor is connected to the surface electrode 13.

Further, the cavity portion 15 in the insulating base 11
A semiconductor bare chip 16 is housed in the cavity 15 and is connected to the surface electrode 13 by a wire.

As shown in FIG. 3, the insulating base 11 is composed of ceramic layers 11a to 11h, internal wiring 17, and via-hole conductors 18.
1h is made of, for example, a glass ceramic material, and has a thickness of 40 to 150 μm. Such a ceramic layer 11b and a ceramic layer 11c, a ceramic layer 11d and a ceramic layer 11e, and a ceramic layer 11f
An internal wiring 17 is formed between the semiconductor layer 11g and the ceramic layer 11g. The internal wiring 17 is made of a gold-based, silver-based, copper-based metal material,
For example, it is made of a silver-based conductor. In addition, the internal wiring 17 may be connected by a via-hole conductor 18 or may be connected in a distributed manner by capacitive coupling or the like.
This via-hole conductor 18 is also made of a gold-based material like the internal wiring 17.
It is made of a silver-based or copper-based metal material, for example, a silver-based conductor.

On the surface of the insulating substrate 11, a surface electrode 13 connected to the via-hole conductor 18 is formed. On this surface electrode 13, a thick-film resistor film and a thick-film protective film are formed as necessary. Or plating, and
As shown in FIG. 5, various chip components 14 including an IC, an inductor, a resistor, and a capacitor are joined by soldering.

The manufacturing method of such a multilayer ceramic substrate is as follows.
A description will be given based on FIG. First, the ceramic layers 11a to 11a
A slip material for 1 h is produced. The slip material is, for example, glass ceramic or ceramic raw material powder, a photocurable monomer such as polyoxyethylated trimethylolpropane triacrylate, an organic binder,
For example, it is prepared by mixing an alkyl methacrylate and a plasticizer with an organic solvent, for example, ethyl carbitol acetate, and kneading with a ball mill.

[0033] As the ceramic raw material powder, for example, at least Mg, Ti, a composite oxide containing Ca, a composition formula by a metal element oxide _{(1-x) MgTiO 3 -xCaTiO} 3 as the metal element ( Where x
Represents a weight ratio, and a boron-containing compound is added to B ₂ O ₃ with respect to 100 parts by weight of a main component represented by 0.01 ≦ x ≦ 0.15).
A compound containing 3 to 30 parts by weight in terms of conversion and 1 to 25 parts by weight of an alkali metal-containing compound in terms of alkali metal carbonate is used.

In the above embodiment, a solvent-based slip material is prepared. However, a photocurable monomer having a hydrophilic functional group added thereto, for example, a polyfunctional methacrylate monomer,
An aqueous slip material kneaded with ion-exchanged water using an organic binder, for example, a carboxyl-modified alkyl methacrylate, may be used.

Examples of the ceramic raw material powder include glass materials such as SiO ₂ , Al ₂ O ₃ , ZnO, MgO,
A powder composed of 70% by weight of crystallized glass powder containing B ₂ O ₃ as a main component and 30% by weight of alumina powder as a ceramic material is also used. The ceramic raw material powder is not particularly limited.

The via-hole conductor 18 and the internal wiring 17
Then, a conductive paste to be the surface electrode 13 is prepared.
The conductive paste includes a low melting point and low resistance metal material such as silver powder and a borosilicate low melting point glass such as B _2.
O ₃ —SiO ₂ —BaO glass, CaO—B ₂ O ₃ —SiO
₂ glass, and _{CaO-Al 2 O 3 -B 2} O 3 -SiO 2 glass, an organic binder, such as ethyl cellulose, an organic solvent, for example 2,2,4-trimethyl-1,3-pentanediol mono-isobutyrate And homogenous kneading with three rollers.

First, as shown in FIG. 4A, the method of manufacturing a multilayer ceramic substrate according to the present invention applies the above-mentioned slip material onto a supporting substrate 25 by a doctor blade method and dry the ceramic layer 11a. The ceramic layer molded body 31a to be formed is formed. Here, a mylar film is used as the supporting substrate 25 and is removed before the firing step.

Next, as shown in FIG.
As shown in (b), a via hole 35a is formed.
The formation of the via hole 35a is performed by an exposure process, a development process, and a cleaning / drying process.

In the exposure processing, a photo target is placed on the ceramic layer molded body 31a so that the area where the via hole 35a is formed is shielded from light, and for example, an ultra-high pressure mercury lamp (10 mW / cm ² ) is used as a light source. Exposure is performed using

As a result, in the ceramic layer molded body 31a in the region where the via hole 35a is formed, the photopolymerization reaction of the photocurable monomer does not occur, and the via hole 35a is formed.
A photopolymerization reaction occurs in the ceramic layer molded body 31a other than the region where a is formed. Here, the part where the photopolymerization reaction has occurred is called an insolubilized part, and the part where the photopolymerization reaction does not occur is called a solubilized part.

In the developing treatment, the solubilized portion of the ceramic layer molded body 31a is removed with a developing solution. Specifically, for example, a developing solution is sprayed on the surface of the ceramic layer molded body 31a with an aqueous solution of triethanolamine. Do it. By this developing process, the via hole 35a can be formed by dissolving and removing the insolubilized portion in the ceramic layer molded body 31a.

The developing process includes three processes of a paddle process, a spray process, and a pure water cleaning process. The ceramic layer molded body 31a to be processed is sequentially conveyed to each processing layer tank by a conveyor, processed, and processed. An air shower is provided at the end of the tank so that the developer and pure water are sufficiently removed.

First, in the paddle treatment to be initially applied, a developing solution having a dilution concentration of 5 to 10% is used, water is discharged from the surface of the ceramic layer molded body 31a using a nozzle, and the ceramic layer molded body 31a is subjected to surface tension. This is a processing tank in which a developing solution is placed on the processing tank so as to be immersed for 30 to 60 seconds. The processing tank mainly dissolves unexposed portions.

Subsequently, the spraying treatment is performed at a dilution concentration of 1
Using a 2% developer, the ceramic layer compact 31a
The surface is treated with a developing solution in the form of a mist for 30 to 60 seconds, and mainly removes a film dissolved in an unexposed portion.

According to the present invention, in performing the spraying process, a spraying device as shown in FIG. 1 is used. At this time, the pressure of the developing solution is set in the range of 2 to 7 MPa by the pump 3 so that the average particle size of the droplets of the developing solution sprayed from the nozzle 2 is 100 μm or less, particularly 70 to 100 μm. Set.

For example, as shown in FIG.
They are arranged at regular intervals of 60 mm, and swing at right angles to the transport direction of the ceramic layer molded body 31a. Accordingly, the ceramic layer molded body 31a moves under the nozzle 2 at a constant speed while receiving the developing solution sprayed from the spray developing device, and performs the spraying process for a time set according to the transport speed. The processed developer is sent to the first tank 1a of the tank 1 immediately below the developer and is reused. Then, after the bubbles in the developer are removed in the tank 1, the bubbles are sent to the pump 3, sprayed from the nozzle 2, and returned to the first tank 1a.

Subsequently, in the pure water washing treatment in which the ceramic layer molded body 31a is charged, water is discharged using a nozzle on the surface of the dried film using pure water, and the washing treatment is performed for 30 to 60 seconds.
This is mainly for washing away the developing solution.

Thus, the desired ceramic layer compact 31
A predetermined via hole 35a is formed in a. Unnecessary scum and the like generated by development of the ceramic layer molded body 31a are completely removed by a washing and drying process.

Next, as shown in FIG. 4C, a conductive paste is filled in the via hole 35a by a screen printing method or the like, and dried at about 60 to 90 ° C. to form a via hole conductor 36a. At the same time, a circuit pattern 38 is formed on the surface of the ceramic layer molded body 31a using a conductive paste.

By repeating the steps (a), (b) and (c) as described above, a laminated body having a predetermined number of layers is manufactured by successively stacking the ceramic layer molded body 31a to the ceramic layer molded body 31g.

Thereafter, a slip material is applied to the surface of the laminated body by a doctor blade method and dried to form a top ceramic layer molded body 31h. The above-described exposure / development processing is performed on the ceramic layer molded body 31h, and a conductive paste is filled or printed to form a surface electrode. Then, if necessary, the shape of the laminate is adjusted by pressing, the support substrate 25 is removed, and a surface electrode is printed and formed on the bottom surface of the laminate using a conductive paste, as shown in FIG. Create a laminated molded body.

If necessary, in order to produce a large number of products, a sharp blade is pressed from each side of the laminated molded body to a position where it is divided into circuit blocks to form division grooves.

Thereafter, the laminated molded body is subjected to a sintering process including a binder removal step and a main sintering step. In the binder removal step, the organic binder and the photo-curable monomer contained therein are eliminated. Sinter. In addition, a plurality of product substrates can be obtained by dividing by the dividing grooves.

Thereafter, as a surface treatment of the product substrate, the circuit board is further processed by printing and baking a thick-film resistive film and a thick-film protective film, plating, and joining the electronic components 14 and 16 including IC chips. Can be made.

In FIG. 2, the surface electrodes 13 and the electronic components 14 and 16 are formed only on the upper surface side of the insulating base 11, but they may also be formed on the lower surface side of the insulating base 11.

The surface electrode 13 is formed of the insulating films 11a to 11a.
The surface of the baked laminate for 1 hour may be printed and dried, and baked in a predetermined atmosphere. For example, internal wiring 1
In the case where an Ag-based conductor is used for 1 and a Cu-based conductor is used as the surface electrode 13, a laminate including the ceramic layers 11a to 11h and the conductor film of the internal wiring 17 is fired in an oxidizing atmosphere or a neutral atmosphere, and fired. The surface of the laminated body is printed and dried with a Cu-based conductor and fired at a temperature of 780 ° C. (eutectic point of Ag and Cu) or less in a neutral atmosphere or a reducing atmosphere.

In the above embodiment, the method for manufacturing the laminated ceramic substrate has been described. However, a ceramic layer molded body may be manufactured using a photocurable resin and an organic resin.

In the above embodiment, an example was described in which the conductive paste was filled in the via hole 35a. However, in the present invention, a dielectric paste or a resin paste may be filled in the via hole as necessary. .

[0059]

EXAMPLE First, a photosensitive slurry was applied on a mylar film and dried to form a ceramic layer molded body. The photosensitive slurry is obtained by mixing a ceramic raw material powder, a photocurable monomer (polyoxyethylated trimethylolpropane triacrylate), an organic binder (alkyl methacrylate), and a plasticizer into an organic solvent (ethyl carbitol acetate). It was prepared by mixing and kneading with a ball mill.

The ceramic raw material powder is 0.95MgTi
O ₃ with respect to 100 parts by weight of the main component represented by -5CaTiO _3, a B B ₂ O ₃ 10 parts by weight in terms, LiCO the Li ₃
What was added in an amount of 5 parts by weight in conversion was used.

Next, a photo target was placed on the ceramic layer compact, and an ultra-high pressure mercury lamp (illuminance: 30 mW / c) was used.
m ² ) was used as a light source for 10 seconds.

Next, in order to perform paddle processing, spray processing, and pure water cleaning processing, the ceramic layer molded body is sequentially transported to each of the three processing tanks by a conveyor, and at the end of each of the tanks, developed by an air shower. The liquid and pure water were sufficiently removed.

First, a developing solution having a dilution concentration of 2.5% is used, water is discharged from the surface of the dried film using a nozzle, and the developing solution is immersed for 30 seconds by placing the developing solution on the work by surface tension. And paddle processing.

In the subsequent spraying treatment, the treatment was performed using the spraying device of the present invention divided into three tanks as shown in FIG. Using a tank provided with three tanks having a capacity of 0.02 m ³ , a developer having a dilution concentration of 1% was placed in the tank, and the spray pressure and the average particle diameter of the developer droplets were 7 MPa, respectively. , Φ70 μm. Spray nozzle 5
A total of fifteen pieces were arranged at equal intervals at 0 mm, and oscillated at right angles to the transport direction of the ceramic layer molded body. At this time, the spraying treatment time for one ceramic layer compact was 30 seconds. The spraying of the developer was continuously performed regardless of the presence or absence of the ceramic layer molded body. At this time, the flow rate of the developer was 25 L / minute in total for all nozzles.

Further, in the pure water washing treatment, pure water was used to discharge water on the surface of the dried film using a nozzle, and the film was washed for 60 seconds. Thereafter, drying was performed at 80 ° C. for 10 minutes.

After observing the shape of the via hole formed on the surface of the ceramic layer molded body after this treatment, FIG.
An ideal via hole having a diameter of 160 μm on the surface and a diameter of 140 μm on the bottom and having a tapered side wall as shown in FIG.

Further, even if the above spraying process was continued for 30 minutes or more, the bubbles in the developing solution did not reach the pump, and continuous operation became possible. The cross-sectional shapes of the via holes at the initial stage and after 30 minutes were compared. After 30 minutes of continuous operation, the same tapered cross-sectional shape as in the initial stage was obtained.

As a comparative example, a conventional sprayer provided with a conventional developer tank consisting of a single tank having a capacity of 0.06 m ³ , a developer was charged from the upper part, and sent to the pump from the lower part was used. As a result, bubbles are entrapped in the pump in about 90 seconds, the development pressure is reduced, and the bottom of the via hole has a diameter of 180 μm with respect to the surface diameter of 150 μm as shown in FIG. And a reverse tapered shape. In addition, the result was that the developed residue that could not be removed by the development remained on the bottom.

Although not shown in the above example, the same applies to the case where the above-described exposure and development is performed on the laminated ceramic layer molded body formed by applying slurry on the ceramic layer molded body. The result was obtained.

[0070]

As described above, according to the present invention, the bubbles generated in the tank of the spraying device can be efficiently removed, and the bubbles can be prevented from being caught in the pump. Spraying can be performed.

For this reason, even in the case where continuous development processing is performed, stable development processing can be performed. For example, a ceramic molded body containing at least a photocurable resin is exposed and partially cured. After the addition, 10
In a developing process in which a droplet of a developing solution having a diameter of 0 μm or less is jetted at a pressure of 2 MPa or more to remove an uncured portion and form a small-diameter via hole, this is continuously and stably realized for 30 minutes or more. Can be done. Therefore, the hole diameter of the via-hole conductor, for example, about 70 to 5000 μm, which cannot be obtained by the green sheet lamination method or the print lamination method by alternately printing the slip material and the conductive paste.
Via holes having a tapered cross section in the exposure direction can be formed easily, continuously and stably at an arbitrary size of about m, and a multilayer ceramic substrate having a high-density internal wiring pattern can be easily manufactured. be able to.

[Brief description of the drawings]

FIG. 1 is a schematic diagram for explaining an example of a spray device of the present invention.

FIG. 2 is a perspective view illustrating an example of a multilayer ceramic substrate according to the present invention.

FIG. 3 is a schematic sectional view of the multilayer ceramic substrate of FIG. 2;

FIG. 4 is a manufacturing process diagram of a multilayer ceramic substrate according to the present invention.

5A is a diagram showing an ideal via hole shape formed by the present invention, and FIG. 5B is a diagram showing a via hole shape according to a comparative example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tank 2 Nozzle 3 Pump 5 Inlet 6 Outlet 7a, 8a, 7b, 8b Partition plate 9a, 9b Hole 10a, 10b Connection part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B05D 7/24 301 B05D 7/24 301T // G03F 7/30 501 G03F 7/30 501 H01L 21/027 H01L 21/30 569F F term (reference) 2H096 AA00 AA26 GA21 4D075 AA01 AA72 BB65Z CA47 DA06 DB14 DC21 DC22 EA05 EA45 EB22 EC07 4F033 AA14 BA03 CA07 DA01 EA03 RA11 5F046 LA14 LA19

Claims (6)

[Claims] 1. A spraying apparatus comprising: a tank for storing a liquid; a nozzle for ejecting droplets; and a pump for supplying the liquid in the tank to the nozzle at a predetermined pressure. Inside at least the first tank and the second tank
The first tank and the second tank are connected by a connecting part communicating from the bottom of the first tank to the upper part of the second tank, and the liquid in the first tank is connected to the bottom of the first tank. A spraying device which is discharged from the upper portion of the subsequent second tank via the connecting portion, further discharged from the bottom of the second tank, and then supplied to a pump. 2. The spray device according to claim 1, wherein a pressure of 2 MPa or more is applied to the liquid by the pump. 3. The spraying apparatus according to claim 1, wherein the size of the droplet ejected from said nozzle is 100 μm or less. 4. The spray device according to claim 1, wherein the liquid is a developer for removing an uncured portion of the photocurable resin. 5. A part containing at least a photo-curable resin-containing resin is exposed and cured, and then a developer is applied to the uncured part by using the spraying device according to claim 1. A developing method, wherein the uncured portion is removed by spraying. 6. The developer according to claim 1, wherein the size of the droplet of the developer is 1
6. The developing method according to claim 5, wherein the thickness is not more than 00 [mu] m.