1343842 九、發明說明 【發明所屬之技術領域】 本發明關於抑制供給至基板表面之處理的帶出之液體 處理裝置。 【先前技術】 在製造構成液晶顯示器TFT (Thin Film Transistor) 基板時，對玻璃基板實施感光劑（resist )塗佈、曝光、 顯像、蝕刻、感光劑除去等的處理》各處理由複數個製程 所組成，例如一個處理是由對基板供給處理液之製程、洗 淨基板之製程、及使基板乾燥之製程所組成。各製程以專 用的裝置進行，藉由以搬送基板的搬送手段依次通過各裝 置，對基板進行一個處理。又，受到搬送手段所搬送之基 板，在維持著水平的狀態下被搬送，呈水平狀態載置於搬 送手段之各基板依次通過各裝置，藉此可對基板逐次進行 各種處理。 在此，通過供給處理液的裝置之基板，其次被搬入至 洗淨基板之裝置，此時，處理液也會與基板被洗淨裝置一 同帶出。作爲對維持著水平狀態之基板供給處理液的手段 ，適用下述方法，即，在搬送手段的上部配置用來流動處 理液之噴淋裝置，對基板連續地供給處理液者。由噴淋裝 置所流出之處理液會在基板表面成爲液滴而殘存，成爲此 液滴狀的處理液會被下一個洗淨裝置帶出。由於在洗淨裝 置使用洗淨液，故，當洗淨液混入至被帶出的處理液時， -4 - 1343842 則無法進行洗淨液之再利用，需將處理液廢棄。因此，當 大量的處理液被洗淨裝置帶出時，則處理液會大量地被消 耗浪費’造成處理液的利用效率變差之問題產生。 因此’在日本特開平8-294678號公報揭示有，藉由 液體除去滾子，除去附著於基板之處理液，防止處理液被 帶至下一個裝置之液體除去裝置。在該曰本特開平8_ 2946 7 8號公報之液體除去裝置，於從藉由搬送手段所搬送 的基板分離微小的距離之位置，設置液體除去滾子，遮蔽 並停止附著於基板表面之處理液的移動。 【發明內容】 〔發明所欲解決之課題〕 在日本特開平8-294678號公報之液體除去裝置，由 於藉由液體除去滾子接觸於處理液，使推出力作用於處理 液，故處理液會附著於液體除去滾子。因此，必須定期進 行清掃所附著的處理液，造成維修作業繁雜之問題產生。 另外，使用將基板乾燥之氣刀等的手段，對基板表面 噴吹空氣，藉此以空氣壓吹飛處理液之方法也被提案。由 於若使用氣刀的話，是藉由氣體吹飛處理液，故不需要進 行維修作業。但，若依據以氣刀吹飛處理液之方法時，則 不易使氣刀的空氣壓均等地作用於基板表面，造成基板表 面部分乾燥，在處理液附著與未附著之部分產生乾燥不均 。因此，在作爲最終之液晶顯示器之製品上產生圖像不均 之各種問題。 -5- 1343842 因此’本發明之目的在於不需使用液體除去滾子或空 氣，可抑制處理液之被帶出量。 〔用以解決課題之手段〕 爲了解決以上問題，本發明之發明1的液體處理裝置 ’是對基板表面供給處理液，來進行表面處理之液體處理 A置’其特徵爲·具有：搬送手段’其是在前述液體處理 裝置，將前述基板朝水平方向搬送；液體供給手段，其是 對藉由前述搬送手段所搬送的前述基板全面，供給前述處 理液；及液體噴射手段，其是配置於前述液體供給手段與 前述液體處理裝置的搬出口之間，藉由對基板，從斜上方 朝前述基板的搬送方向之相反方向噴射前述處理液，來除 去聚集於前述基板表面的液滴。 孽由發明1的液體處理裝置，因由液體供給手段所供 給而在基板表面成爲液滴之處理液，受到由液體噴射手段 所噴射的處理液之液壓’由基板表面推壓流動而除去，故 ，能夠抑制處理液被帶出。進行滯留於基板表面的處理液 之推出，不是使用液體除去滾子或空氣，而是使用同種液 體之處理液，因此，不需要進行維修作業。又，當使用處 理液（非空氣）’除去處理液時，則基板表面成爲全面性 形成液體膜之狀態，基板表面不需要進行乾燥，能夠常時 維持濕潤狀態。因此，基板表面不會乾燥，處理液未附著 部分消失，亦不會有斑紋（不均）之問題產生。 又’由於基板的搬送方向與處理液的噴射方向呈相反 •6- 1343842 液的噴射壓 的處理液流 〇 反方向，亦 搬送方向與 度相反的情 搬送方向呈 邊推出聚集 〇 滴之處理液 但從抑制帶 佳。若提筒 出力作用， 膜做薄。因 面供給處理 下述方法’ 置噴淋裝置 〇 明1的液體 前述處理液 板的搬送方 方向，故，基板的搬送速度之能量會加在處理 。因此，對成爲液滴狀之處理液，能夠使更強 作用。因此可更有效率地除去基板表面的液滴 在此，相反方向不限於1 80度的角度之相 可爲對搬送方向呈傾斜之相反方向。在基板的 處理液的噴射方向呈傾斜之狀態時，比起1 8 0 況，作用於處理液之液壓若干低。但，當由對 φ 傾斜相反方向噴射處理液時，能夠由基板的兩 的處理液，故能夠有效地除去基板表面的液滴 又，當以所噴射的處理液之液壓使成爲液 流動時，基板表面成爲形成有液體膜之狀態， 出量的觀點來看，液體膜的厚度儘可能的薄爲 所噴射的處理液之液壓的話，能夠使強力之推 能夠將滯留的處理液除去後之基板表面的液體 此，處理液的噴射壓儘可能地提高爲佳。 0 又，作爲液體供給手段，從對基板表面全 液來進行表面處理之觀點來看，例如能夠採用 即，在液體處理裝置的上部，於複數個部位配 ，由此噴淋裝置，對基板表面常時供給處理液 本發明之發明2的液體處理裝置，是如發 處理裝置，其中，將前述液體噴射裝置之噴射 的噴出口形成隙縫狀，以此隙縫成爲與前述基 向呈正交的方向之方式配置前述液體噴射手段。 由於藉由將噴射口形成爲隙縫狀，能夠截流所噴射之 1343842 處理液，故，可使高噴射壓作用於滯 液。在由對基板搬送方向呈1 80度相 之情況，隙縫被配置成對基板的搬送 前述般，由傾斜相反方向噴射處理液 成對基板的搬送方向呈傾斜的狀態。 再者，隙縫基本上適用形成有直 可爲非直線狀，而使用形成爲曲線狀 作爲曲線狀的隙縫之拋物線上的隙縫 點朝向基板的搬送方向之最上游側， 出處理液。又，亦可非爲拋物線，能 的曲線狀隙縫。 本發明的發明3之液體處理裝置 液體處理裝置，其中，前述液體供給 手段配置於前述液體處理裝置的上部 置的下部設置有用來回收前述處理液 將藉由前述處理液回收手段所回收之 述液體供給手段與前述液體噴射手段 行再利用。 由配置於液體處理裝置的上部之 大量的處理液常時供給至基板的狀態 理之一部分的處理液外，幾乎所有的 置的下部流動。將這樣的處理液再次 與液體噴射手段，使處理液循環，能 用。藉此，可消除處理液之浪費，能 留在基板表面之處理 反的方向噴射處理液 方向呈正交，而在如 之情況，隙縫被配置 線狀間隙者。但，亦 的隙縫。例如，使用 ，配置成抛物線的頂 亦可從基板的3邊推 適用圓形或橢圓形等 ，是如發明1或2的 手段與前述液體噴射 ，在前述液體處理裝 之處理液回收手段， 前述處理液循環於前 ，來將前述處理液進 液體供給手段，成爲 *除了使用於表面處 處理液朝液體處理裝 返回至液體供給手段 夠謀求處理液之再利 夠有效率地使用處理 -8- 1343842 液。爲了使處理液循環，在裝置下部設置處理液回收手段 ，將所回收的處理液返回至液體供給手段與液體噴射手段 。作爲用來使處理液循環之手段，可適用例如泵浦。 作爲處理液，適用於用來顯像所曝光的感光劑之顯像 液、用來進行蝕刻處理之蝕刻液、或用來剝離感光劑之感 光劑剝離液等的任意處理液。即，本發明之液體處理裝置 適用於顯像裝置、蝕刻裝置、或感光劑剝離裝置等的任意 裝置。 又，本發明之發明4的液晶顯示器的製造方法，其特 徵爲：使用發明1所記載的液體處理裝置，進行基板表面 的處理，使用進行了此處理之基板，來製造液晶顯示器。 由於液體處理裝置可適用於顯像裝置、蝕刻裝置、感光劑 剝離裝置等，故能夠採用藉由這些各裝置進行了液體處理 之基板來製造液晶顯示器。 〔發明效果〕 本發明，由於對在基板成爲液滴而滞留的處理液噴射 處理液，將所滯留的處理液推出至基板的外部，故，可抑 制處理液的帶出。又，所滞留的處理液是藉由呈液體之相 同的處理液來推出至基板外部，故’不需要進行因處理液 所造成之髒污的維修作業，又能夠將基板常時維持於濕潤 狀態，因此，可防止斑紋產生。 【實施方式】 -9- 1343842 由狹縫噴嘴60所噴射之顯像液會與以預定的液壓滞 留於基板w的顯像液衝突。於是’能量施壓至滯留於基 板W的顯像液而產生流動’與所噴射的顯像液一同被推 出至基板W的外部。在此’由於在基板w僅是噴射顯像 液並使其產生衝突’故’基板w的表面w s可維持經常濕 潤的狀態，而成爲在表面ws形成液體膜之狀態。由於顯 像液爲液體，故’表面ws藉由液體的密接力’常時維持 濕潤性，不會有表面w s乾燥之情事產生。又’由於越提 高噴射壓，則越可除去大量滯留於基板w的顯像液’故 ，能夠將液體膜的厚度做薄，可更進一步抑制顯像液的帶 出。又，由狹縫噴嘴60所噴射的顯像液與從噴淋裝置50 所供給的顯像液是使用相同的顯像液。 液體承接部7〇爲用來承接從噴淋裝置50供給至基板 W而溢出的顯像液或受到由狹縫噴嘴60所噴射的顯像液 ，從基板 W除去的顯像液之承接部。因此，液體承接部 70配置於顯像室30的下部。液體承接部70呈硏鉢狀，液 體回收用配管7 1連結於硏鉢的頂點。在圖2中，爲了謀 求液體承接部70之緊緻化，配置於2部位，但，液體承 接部7 0亦可爲1個.連結於2個液體承接部7 0的頂點之 2條液體回收用配管71在途中會合而成爲1個液體回收用 配管7 1 ’連結至液體回收機構8 0。 液體回收機構80爲謀求使用完畢之顯像液的再利用 的機構。液體回收機構8 0配置於顯像室3 0的下部，作爲 用來儲存由液體回收用配管7 1所輸送的顯像液之儲存槽 -13- 1343842 來發揮功能。又，在液體回收機構8 Ο，連結有噴淋 循環配管.8 1與狹縫噴嘴用循環配管82的兩個配管 裝置用循環配管8 1是經由泵浦Ρ 1連結於噴淋裝f 因此，當使泵浦P〗的泵浦壓力作用時，儲存於液 機構80的顯像液被送至噴淋裝置50，能作爲再次 基板W的顯像液被再利用。 另外，狹縫噴嘴用循環配管82經由泵浦P2連 縫噴嘴60。因此，當使泵浦P2的泵浦壓力作用時 於液體回收機構80的顯像液被送至狹縫噴嘴60, 再次用來除去滞留於基板 W的顯像液之顯像液被 在此，基本上，由於基板 W在未被不純物附 態下搬入至顯像室3 0，故，即使使顯像液循環，也 顯像液的純度降低之情事產生。但，由於基板W 全未附著有不純物，故，亦可考量附著有不純物， 回收機構80設置過濾器，使通過此過濾器的顯像 於噴淋裝置50或狹縫噴嘴60。 如以上所述的方式，排除在基板 W成爲液體 液，表面WS成爲液體膜的狀態之基板W由搬出口 搬出，移行至下一個製程的水置換製程D-2。由於 至水置換製程D-2的基板W除去了液滴，故，可 制顯像液的帶出。又，由於不需要使用液體除去滾 可除去液滴，故，也不需要進行維修作業，不需要 吹空氣’即可除去液滴，因此，基板表面可經常保 裝置用 。噴淋 【5 0 〇 體回收 供給至 結於狹 ，儲存 能作爲 再利用 著的狀 不會有 無法完 在液體 液循環 之顯像 42被 被移行 謀求抑 子，而 進行噴 持濕潤 -14- 1343842 的狀態，不會產生斑紋（不均）。 【圖式簡單說明】 圖1是用來說明各處理的流程之說明圖。 圖2是顯像裝置的說明圖。 【主要元件符號說明】 φ 2 0 :顯像裝置 3 0 :顯像室 40 :搬送滾子 50 :噴淋裝置 6 0 :狹縫噴嘴 7 〇 :液體承接部 8 0 :液體回收機構 W :基板 -15 -1343842 IX. Description of the Invention [Technical Field] The present invention relates to a liquid handling apparatus for carrying out a process of suppressing supply to a surface of a substrate. [Prior Art] When manufacturing a liquid crystal display TFT (Thin Film Transistor) substrate, the glass substrate is subjected to photoresist coating, exposure, development, etching, sensitizer removal, etc. The composition is, for example, a process consisting of a process of supplying a processing liquid to a substrate, a process of cleaning the substrate, and a process of drying the substrate. Each of the processes is carried out by a dedicated device, and each of the substrates is sequentially processed by a transfer means for transporting the substrates. Further, the substrate conveyed by the transport means is transported while being horizontally held, and the substrates placed on the transport means in a horizontal state are sequentially passed through the respective devices, whereby the substrates can be subjected to various processes successively. Here, the substrate of the apparatus for supplying the processing liquid is secondarily carried into the apparatus for cleaning the substrate, and at this time, the processing liquid is also taken out together with the substrate cleaning apparatus. As means for supplying the processing liquid to the substrate in the horizontal state, a method in which a shower device for flowing the processing liquid is disposed on the upper portion of the conveying means and the processing liquid is continuously supplied to the substrate is applied. The treatment liquid that has flowed out of the shower device remains as droplets on the surface of the substrate, and the liquid droplet-shaped treatment liquid is carried out by the next cleaning device. Since the cleaning liquid is used in the cleaning device, when the cleaning liquid is mixed into the processing liquid to be taken out, -4 - 1343842 cannot reuse the cleaning liquid, and the processing liquid needs to be discarded. Therefore, when a large amount of the treatment liquid is taken out by the cleaning device, the treatment liquid is largely consumed and wasted, resulting in a problem that the utilization efficiency of the treatment liquid is deteriorated. Japanese Laid-Open Patent Publication No. Hei 8-294678 discloses a liquid removal device that removes a roller from a liquid to remove a treatment liquid adhering to the substrate and prevents the treatment liquid from being carried to the next device. In the liquid removing device of the Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2, 946, the liquid removing roller is disposed at a position separated by a small distance from the substrate conveyed by the conveying means, and the processing liquid adhering to the surface of the substrate is blocked and blocked. The movement. According to the liquid removal device of Japanese Laid-Open Patent Publication No. Hei 8-294678, the liquid is removed from the treatment liquid by the liquid removal roller, and the ejection force is applied to the treatment liquid. Attached to the liquid to remove the roller. Therefore, it is necessary to clean the attached treatment liquid regularly, which causes a problem of complicated maintenance work. Further, a method of blowing air on the surface of the substrate by means of an air knife or the like which dries the substrate, and blowing the treatment liquid by air pressure has also been proposed. Since the air knife is used, the treatment liquid is blown by the gas, so maintenance work is not required. However, when the treatment liquid is blown by the air knife, it is difficult to uniformly apply the air pressure of the air knife to the surface of the substrate, and the surface of the substrate is partially dried, and unevenness in drying occurs in the portion where the treatment liquid adheres and does not adhere. Therefore, various problems of image unevenness occur in the article as the final liquid crystal display. -5 - 1343842 Therefore, the object of the present invention is to suppress the amount of the treatment liquid to be carried out without using a liquid to remove the roller or the air. [Means for Solving the Problem] In order to solve the above problems, the liquid processing apparatus according to the first aspect of the present invention is a liquid processing A for supplying a processing liquid to a surface of a substrate, and performing surface treatment. In the liquid processing apparatus, the substrate is conveyed in a horizontal direction, and the liquid supply means supplies the processing liquid to the entire substrate conveyed by the conveying means, and the liquid ejecting means is disposed in the liquid storage means. Between the liquid supply means and the transfer port of the liquid processing apparatus, the liquid to be deposited on the surface of the substrate is removed by ejecting the processing liquid from the obliquely upward direction to the opposite direction of the substrate transfer direction. In the liquid processing apparatus according to the first aspect of the invention, the liquid to be treated on the surface of the substrate by the liquid supply means is removed, and the hydraulic pressure of the processing liquid sprayed by the liquid ejecting means is removed by the surface of the substrate. It is possible to suppress the treatment liquid from being taken out. The introduction of the treatment liquid retained on the surface of the substrate does not require the use of a liquid to remove the roller or the air, but the treatment liquid of the same liquid is used, so that maintenance work is not required. Further, when the treatment liquid is removed using the treatment liquid (non-air), the surface of the substrate is in a state in which the liquid film is formed in a comprehensive manner, and the surface of the substrate does not need to be dried, and the wet state can be maintained at all times. Therefore, the surface of the substrate is not dried, the unattached portion of the treatment liquid disappears, and there is no problem of streaks (unevenness). In addition, the processing direction of the substrate is opposite to the direction in which the processing liquid is ejected. • The processing liquid of the jetting pressure of the liquid is in the opposite direction, and the conveying direction is opposite to the degree of the conveying direction. But from the suppression band is good. If the lifting force is applied, the film is made thin. In the surface supply processing, the following method is used. The liquid in the spray device 〇1 is transported in the direction in which the liquid crystal is conveyed. Therefore, the energy of the transport speed of the substrate is added to the treatment. Therefore, it is possible to make the treatment liquid which is in the form of droplets stronger. Therefore, the droplets on the surface of the substrate can be removed more efficiently. Here, the phase in which the opposite direction is not limited to the angle of 180 degrees can be the opposite direction to the direction of the conveyance. When the injection direction of the processing liquid of the substrate is inclined, the hydraulic pressure acting on the treatment liquid is somewhat lower than that in the case of 1880. However, when the processing liquid is ejected in the opposite direction to the φ tilt, since the two processing liquids of the substrate can be effectively removed, the liquid droplets on the surface of the substrate can be effectively removed, and when the liquid is caused to flow by the hydraulic pressure of the ejected processing liquid, In the state in which the liquid film is formed on the surface of the substrate, the thickness of the liquid film is as thin as possible as the pressure of the liquid to be sprayed, and the substrate can be removed by removing the remaining treatment liquid. The liquid on the surface is preferably such that the ejection pressure of the treatment liquid is as high as possible. Further, as a liquid supply means, from the viewpoint of surface treatment of the entire liquid on the surface of the substrate, for example, it can be used in a plurality of places on the upper portion of the liquid processing apparatus, whereby the shower device is applied to the surface of the substrate. The liquid processing apparatus according to the second aspect of the present invention is the hair processing apparatus according to the invention, wherein the ejection port of the liquid ejecting apparatus is formed into a slit shape, and the slit is oriented in a direction orthogonal to the base direction. The aforementioned liquid ejecting means is configured. Since the injection port is formed into a slit shape, the sprayed 1343842 treatment liquid can be shut off, so that the high injection pressure can be applied to the liquid retention. In the case where the substrate is transported at a distance of 180 degrees from the substrate, the slits are arranged to be transported to the substrate. The transport direction of the pair of substrates is inclined in the opposite direction from the direction in which the processing liquid is ejected in the opposite direction. Further, the slit is basically formed to be straight and non-linear, and the processing liquid is discharged to the most upstream side in the conveying direction of the substrate by using the slit point formed on the parabola of the curved slit as a curved shape. Also, it may not be a parabola or a curved slit. In the liquid processing apparatus of the liquid processing apparatus according to the third aspect of the present invention, the liquid supply means is disposed at a lower portion of the liquid processing apparatus, and is provided with a liquid for recovering the processing liquid and recovering the liquid by the processing liquid recovery means. The supply means is reused with the aforementioned liquid ejecting means. Almost all of the lower portion of the processing liquid which is supplied to the substrate at a time when a large amount of the processing liquid disposed in the upper portion of the liquid processing apparatus is supplied to the substrate flows. Such a treatment liquid is recirculated to the liquid ejecting means to circulate the treatment liquid. Thereby, the waste of the treatment liquid can be eliminated, and the direction in which the treatment liquid can be left in the opposite direction to the surface of the substrate is orthogonal, and in the case where the slit is arranged in the linear gap. However, also the gap. For example, the top of the substrate may be applied with a circular or elliptical shape from the three sides of the substrate, and the liquid is ejected by the means of the invention 1 or 2, and the processing liquid recovery means in the liquid processing apparatus, Before the treatment liquid is circulated, the treatment liquid is supplied to the liquid supply means, and the treatment liquid is used in addition to the surface treatment liquid to return to the liquid treatment apparatus to return to the liquid supply means. 1343842 liquid. In order to circulate the treatment liquid, a treatment liquid recovery means is provided in the lower portion of the apparatus, and the recovered treatment liquid is returned to the liquid supply means and the liquid injection means. As means for circulating the treatment liquid, for example, pumping can be applied. The treatment liquid is suitably used for any development liquid for developing a development liquid for a photosensitive agent to be exposed, an etching liquid for performing an etching treatment, or a photosensitive liquid stripping liquid for removing a photosensitive agent. That is, the liquid processing apparatus of the present invention is applied to any of a developing device, an etching device, or a sensitizer peeling device. Further, in the method for producing a liquid crystal display according to the invention of the fourth aspect of the invention, the liquid crystal display is manufactured by using the liquid processing apparatus according to the first aspect of the invention, and processing the surface of the substrate. Since the liquid processing apparatus can be applied to a developing device, an etching device, a sensitizer peeling device, etc., it is possible to manufacture a liquid crystal display using a substrate which has been liquid-treated by these respective devices. [Effect of the Invention] In the present invention, the treatment liquid sprayed on the substrate is discharged, and the retained treatment liquid is pushed out to the outside of the substrate. Therefore, the discharge of the treatment liquid can be suppressed. Further, since the remaining treatment liquid is pushed out to the outside of the substrate by the same treatment liquid as the liquid, it is not necessary to perform maintenance work due to contamination by the treatment liquid, and the substrate can be maintained in a wet state at all times. Therefore, the generation of streaks can be prevented. [Embodiment] -9-1343842 The developing liquid sprayed by the slit nozzle 60 collides with the developing liquid which is stagnated on the substrate w by a predetermined hydraulic pressure. Then, the energy is applied to the developing liquid retained on the substrate W to cause a flow 'to be pushed out to the outside of the substrate W together with the ejected developing liquid. Here, the surface w s of the substrate w is maintained in a state of being constantly wetted by the ejection of the developing liquid on the substrate w, and the liquid film is formed on the surface ws. Since the developing liquid is a liquid, the 'surface ws is constantly wetted by the liquid adhesion force', and the surface w s does not dry. Further, the higher the ejection pressure, the more the developer liquid remaining in the substrate w can be removed, so that the thickness of the liquid film can be made thinner, and the discharge of the developing liquid can be further suppressed. Further, the same liquid is used for the developing liquid sprayed from the slit nozzle 60 and the developing liquid supplied from the shower device 50. The liquid receiving portion 7A is a receiving portion for receiving a developing liquid that overflows from the shower device 50 to the substrate W or a developing liquid that is ejected from the substrate W by the developing liquid that is ejected from the slit nozzle 60. Therefore, the liquid receiving portion 70 is disposed at a lower portion of the developing chamber 30. The liquid receiving portion 70 has a meander shape, and the liquid recovery pipe 7 1 is coupled to the apex of the crucible. In FIG. 2, in order to achieve the tightening of the liquid receiving portion 70, the liquid receiving portion 70 may be disposed at two locations. However, the liquid receiving portion 70 may be one. The two liquids are connected to the apex of the two liquid receiving portions 70. The pipe 71 is joined in the middle to be connected to the liquid recovery pipe 80 by one liquid recovery pipe 7 1 '. The liquid recovery mechanism 80 is a mechanism for reusing the used developing solution. The liquid recovery mechanism 80 is disposed in the lower portion of the developing chamber 30, and functions as a storage tank -13 - 1343842 for storing the developing liquid supplied from the liquid recovery pipe 7 1 . In the liquid recovery mechanism 8 Ο, the two piping device circulation pipes 8 1 to which the shower circulation pipe 8 . 1 and the slit nozzle circulation pipe 82 are connected are connected to the shower device f via the pump Ρ 1 . When the pumping pressure of the pump P is applied, the developing liquid stored in the liquid mechanism 80 is sent to the shower device 50, and the developing liquid which can be used as the second substrate W can be reused. Further, the slit nozzle circulation pipe 82 is connected to the nozzle 60 via the pump P2. Therefore, when the pumping pressure of the pump P2 is applied, the developing liquid of the liquid recovery mechanism 80 is sent to the slit nozzle 60, and the developing liquid for removing the developing liquid retained on the substrate W is again used here. Basically, since the substrate W is carried into the developing chamber 30 without being attached to the impurity, the purity of the developing liquid is lowered even if the developing liquid is circulated. However, since the substrate W is not attached with impurities, impurities may be attached to the substrate, and the recovery mechanism 80 may be provided with a filter to be developed by the filter to the shower device 50 or the slit nozzle 60. In the above-described manner, the substrate W in which the substrate W becomes the liquid liquid and the surface WS becomes the liquid film is removed from the carry-out port, and the water is replaced by the water replacement process D-2 of the next process. Since the liquid crystal to the substrate D of the water replacement process D-2 is removed, it is possible to take out the image liquid. Further, since it is not necessary to use a liquid removing roller to remove the liquid droplets, it is not necessary to perform maintenance work, and it is possible to remove the liquid droplets without blowing air, so that the surface of the substrate can be often used for the device. Spray [50 〇 回收 回收 回收 回收 回收 回收 回收 回收 回收 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The state of 1343842 does not produce streaks (unevenness). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory diagram for explaining the flow of each process. Fig. 2 is an explanatory view of a developing device. [Description of main component symbols] φ 2 0 : developing device 3 0 : developing room 40 : conveying roller 50 : shower device 6 0 : slit nozzle 7 〇 : liquid receiving portion 80 : liquid recovery mechanism W : substrate -15 -