JP2001096208A - Liquid chemical jetting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid chemical jetting device (1) prevented in the buckling of a thin plate material, (2) avoided in the forming of puddle, (3) secured in smooth transportation, (4) mitigated in the restriction against jetting pressure or jetting quantity, (5) improved in the speed and the rate efficiency of chemical treatment or liquid chemical treatment and further, (6) avoided in the generation of different concentration parts of the liquid chemical jetted and (7) avoided in the generation of the uneven distribution, the localization, the stagnation, puddle, the coexisting flow or the like of the liquid chemical and (8) capable of precisely and uniformly jetting the liquid chemical. SOLUTION: In the liquid chemical jetting device 6, a slit like jetting opening 7 formed to be bent back and forth at a fixed pitch in a curved wave like shape or a polygonal line like shape is arranged in the right and left width direction to jet the liquid chemical in a vertical film state on the transported thin plate material. In the slit like jetting opening 7, the bent pitch can be shifted right and left, the jetting angle can be changed and further a bridge part, a filter, a slit width fine control structure and the like are arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a chemical liquid ejecting apparatus. For example, for a printed wiring board material that is used in a manufacturing process of a printed wiring board and is transported as a thin plate material,
Chemical treatment by spraying chemicals such as developer, etchant, stripper, etc.
The present invention relates to a chemical liquid ejecting apparatus that performs chemical liquid treatment.

[0002]

2. Description of the Related Art First, the technical background of a printed wiring board, which is a typical example of a thin plate material, will be described. In recent years, the miniaturization, weight reduction, and high density of electronic equipment have been remarkably progressing, and the printed wiring board, which is an important component thereof, has recently become even smaller and lighter.
Fineness, ultra-thinness, flexibility, multi-layering, etc. are advancing. For example, CSP, PB involving a semiconductor chip / package that is grasped as a part of a printed wiring board
With the advent of GAs, ultra-miniaturization, ultra-fine, ultra-thin, and ultra-flexible are being advanced. In particular, in such a printed wiring board, the circuit formed on the outer surface thereof has been significantly densified, miniaturized, and highly accurate. For example, for a circuit of a printed wiring board, the circuit width is 70 μm to 50 μm, and further 30 μm
In addition to the trend toward miniaturization from m to 20 μm, such circuit width tolerance may be required to be within ± 5% or so, and the accuracy is further improved. The shape is also as close as possible to a substantially square or rectangular cross section, that is, as close as possible to a vertical convex shape.

[0003] By the way, such a printed wiring board is formed by cutting a printed wiring board material having a copper foil adhered to an insulating base, → drilling for through holes, polishing, plating, → applying, drying or attaching an etching resist. ,
It is manufactured by sequentially and sequentially following many steps, such as → exposure with a circuit negative film, → development, → etching, → stripping of an etching resist at a circuit portion, and the like. In each of the steps of developing, etching, and stripping the printed wiring board material, a developing solution, a corrosive solution, and the like are transported in processing chambers such as a developing device, an etching device, and a stripping device. , Chemicals such as stripping liquids are conventionally sprayed with a spray nozzle, and then subjected to chemical treatments such as development, etching, and stripping.
Chemical treatment was being performed.

As described above, in a printed wiring board in which circuit densification, miniaturization, and precision increase, such chemical processing such as development, etching, and peeling is uniformly performed as a whole. It is extremely important that what is performed, for example, that the etching process be performed with high accuracy and uniformity as a whole, determines the success or failure. On the other hand, in the conventional example,
As described above, chemicals such as a developing solution, a corrosive solution, and a stripping solution are jetted from a large number of spray nozzles disposed on the entire upper and lower surfaces of the printed wiring board material conveyed in a horizontal posture by the conveyor. Therefore, the following problems have been pointed out because chemical treatment and chemical treatment such as development, etching, and peeling have been performed.

First, the sprayed chemical liquid is diffused and sprayed in a conical shape while being denser at the center of the spray nozzle and rougher at the outer periphery, and is not uniformly sprayed. This causes a difference in the injection pressure and the injection amount between inside and outside, resulting in variation. Further, a blank area where the chemical liquid ejected from each spray nozzle does not reach easily occurs, and the variation also occurs from this surface. Therefore, variations occur in the chemical treatment and chemical treatment such as development, etching, and peeling of the printed wiring board material to which the chemical is sprayed, and the circuit width of the formed circuit becomes non-uniform.
This has become a fatal problem for printed wiring boards in which circuits are becoming denser, finer, and more precise. Second, since the chemical liquid is diffused and sprayed while spreading in a conical shape from the spray nozzle, the chemical liquid to be jetted is not substantially perpendicular to the printed wiring board material, but has a large jetting angle. In this way, the circuit shape formed differs from the ideal shape of a vertically convex shape having a substantially square or rectangular cross section due to the chemical solution being sprayed from the side during the processing such as development, etching, and stripping. In many cases, the cross-section was substantially trapezoidal with a shape of Mt. Fuji (the narrower and narrower the circuit width required in the upper part). Therefore, when used, the value of the current flowing through the circuit changes and there is a risk of heat generation, which has been a fatal problem for a printed wiring board in which the density, density, and density of the circuit are increasing.

Third, the spray nozzle diffuses and sprays the chemical solution pumped from the pump while spreading the solution from a circular small hole into a conical shape. Therefore, in chemical treatment and chemical treatment such as development, etching and peeling, the ejection pressure of the ejected chemical is low and the impact on the printed wiring board material is insufficient.
It has also been pointed out that the processing capacity is low and the processing time is long. Fourthly, since the chemical is spread and sprayed while spreading in a conical shape, many portions that do not directly hit the printed wiring board material to be sprayed but hit the rollers or wheels of the conveyor for transport are scattered. The chemicals thus scattered collide with each other and fall on the printed wiring board material, remain as a liquid pool on the outer surface thereof, and hinder renewal. Therefore, a variation occurs in which the chemical treatment and the chemical liquid treatment become non-uniform according to the above-described first, and the impact of the chemical liquid is insufficient, the processing ability is low, and the processing time is long according to the third. Was also pointed out. The technical background of the printed wiring board is as described above.

Now, in order to solve the various problems of the conventional example using such a spray nozzle, the inventor has made intensive research efforts and developed a chemical liquid ejecting apparatus shown in FIG. 8, FIG. 9, FIG. A patent application was filed as Patent Application No. 137613 in 1998. FIG. 8 is a side view of the whole of this type, which has been recently developed, for explaining the conventional example. FIGS. 9A and 9B are views for explaining a conventional example of this type. FIG. 9A is a side sectional view of a main part, FIG. 9B is a front view of the main part, and FIG. 9C is a bottom view of the main part. FIG.
FIGS. 1A and 1B are schematic views of a plane (bottom), and FIG. 2B is a side view of a main part. FIG. 11 is an explanatory plan view of a printed wiring board (material).

In the chemical liquid ejecting apparatus 1 shown in FIGS. 8, 9 and 10, etc., a slit-shaped ejecting port 2 is employed in place of the above-mentioned conventional spray nozzles, thereby providing printed wiring. The chemical liquid B is injected into the substrate material A from the slit-shaped injection port 2 in a substantially curtain shape. Therefore, compared with the conventional example using the spray nozzle described above, firstly, there is no variation in the chemical solution B to be jetted, and the chemical treatment and the chemical solution treatment are uniformed, and the treatment accuracy is improved.
Then, the liquid B is injected without a large injection angle,
In addition, the injection of the chemical B having a high impact by the intended spray pressure is realized, and the processing capacity and the processing time are excellent.
In addition, since the chemical solution B is directly sprayed directly onto the printed wiring board material A, the processing accuracy is improved from this aspect, and the processing capability and the processing time are excellent. So,
The problems pointed out in the conventional example using the spray nozzle described above are almost solved.

That is, the chemical liquid ejecting apparatus 1 ejects a chemical liquid B to a printed wiring board material A to be conveyed.
It has a slit-shaped injection port 2. The slit-shaped injection port 2 has a linear shape and is disposed to face the printed wiring board material A to be conveyed so as to cover not the front and rear conveyance direction C but the right and left width direction D. The chemical solution B, which has been pressure-fed through the pipe 3 or the like, is sprayed straight and vertically in the form of a vertical curtain without diffusion and spraying toward the entire width of the outer surface of the printed wiring board material A. As described above, the chemical liquid ejecting apparatus 1 is provided with the slit-shaped ejecting port 2, and the printed wiring board material A to be transported is
The chemical liquid B, which is provided to face the width direction D and is pressure-fed via a pump or a pipe 3, is directed uniformly over the entire width of the printed wiring board material A, and has a uniform and strong impact. Spray directly in the shape. In addition,
4 is a conveyor for conveying the printed wiring board material A,
5 is the wheel.

[0010]

As described above, the chemical liquid ejecting apparatus 1 shown in FIGS. 8, 9, 10 and the like employs the slit-shaped ejecting ports 2 arranged in the width direction D, and The above-mentioned problems in the conventional example using the spray nozzle are almost completely eliminated, and a very excellent effect is exhibited. In the course of research and development, the following problem has emerged as a major theme for the chemical solution B injected from the slit-shaped injection port 2.

1) First, in the chemical liquid ejecting apparatus 1, a slit-shaped ejecting port 2 which is linear in the width direction D on the left and right (in particular, see FIG. 9 (3) and FIG. 10 (1)). ), The chemical solution B is ejected in the form of a vertical, flat and direct curtain, so that the printed wiring board material A to be ejected is liable to bend E (see FIG. 10 (2)). The problem was pointed out. That is, the sprayed chemical liquid B in the form of a flat curtain becomes a sharp linear edge with a strong impact and is concentrated on the printed wiring board material A.
Therefore, the ultra-thin and flexible printed wiring board material A may be bent at the jetting location based on the jetting pressure and weight of the chemical solution B, and the hip break E may occur.

2) Secondly, when the waist break E occurs in the printed wiring board material A in such a manner, the chemical solution B becomes a thick liquid pool F and stays at the place of the waist break E, thereby preventing the chemical solution B from being renewed. Become like Therefore, due to such a liquid pool F, an excess or insufficiency occurs in chemical treatment and chemical treatment such as development, etching, and peeling of the printed wiring board material A, and the chemical treatment and chemical treatment become non-uniform, resulting in unevenness. -It was pointed out that the variation phenomenon is likely to occur. And when the variation phenomenon of chemical treatment and chemical solution treatment occurs,
The circuit width of the circuit to be formed becomes non-uniform, which causes a serious problem for the printed wiring board H in which the density, miniaturization, and precision of the circuit are increasing.

3) Third, it has been pointed out that if the buckling E occurs and the liquid pool F occurs as described above, the conveyor 4 may further hinder the conveyance of the printed wiring board material A. That is, in the case of the ultra-thin and flexible printed wiring board material A, if such buckling E and liquid pool F are unevenly distributed and generated in various places, the meandering, warping, jumping, etc. may occur during the transportation by the conveyor, or the transportation may be performed. In some cases, the transfer was not performed smoothly, for example, when the transfer was interrupted. In the worst case, the succeeding printed wiring board material A may be folded over the preceding printed wiring board material A in which the conveyance is hindered.

4) Fourth, in order to avoid such buckling E, liquid pool F, and transport obstacles, the injection pressure and injection amount of the chemical B injected from the slit-shaped injection port 2 are regulated. The need had arisen. That is, in order to reduce the impact on the ultra-thin and flexible printed wiring board material A, thereby preventing the buckling E, and avoiding the occurrence of the liquid pool F and the transportation trouble, the chemical solution B injected from the slit-shaped injection port 2 is used. It has been necessary to reduce the injection pressure of the fuel cell to reduce the injection amount.

5) Fifth, however, when the injection pressure and the injection amount of the chemical solution B are regulated in this manner, the speed and speed efficiency of the chemical processing such as development, etching, and peeling of the printed wiring board material A and the chemical liquid processing are reduced. Therefore, it is necessary to provide a large number of slit-shaped injection ports 2, that is, the chemical liquid injection device 1, in a processing chamber such as a developing device, an etching device, and a peeling device. By arranging a large number of chemical liquid ejecting apparatuses 1 in such a manner, there has been a problem that the processing chamber is enlarged and the installation cost is increased.

6) Sixth, the above-described spray nozzle is described in that the chemical liquid B, which is further ejected in the form of a vertical curtain from the slit-shaped ejection port 2, has a uniform ejection pressure and ejection amount as a whole. This is an important theme in making use of the merit of employing the chemical liquid ejecting apparatus 1 using the slit-shaped ejection port 2 instead of the conventional example used. In other words, the main theme is that the chemical solution B is jetted from the slit-shaped jet port 2 with a uniform jetting pressure and jetting amount as a whole, thereby forming a uniform curtain with high accuracy as a whole.

In view of such circumstances, the present invention has been made as a result of the inventor's earnest research efforts to achieve the above-mentioned theme and solve the problems. First, by adopting a configuration in which the slit-shaped injection ports arranged in the left and right width directions are bent back and forth at a constant pitch, for example, in a curved wave shape or a polygonal wave shape,
Secondly, thin plates such as printed wiring board materials are prevented from breaking, secondly, liquid pools are also avoided, thirdly, smooth conveyance is ensured, and fourthly, the regulation of the injection pressure and injection amount of the chemical liquid is greatly reduced. Fifth, the speed of chemical and chemical treatments,
Speed efficiency will be improved and the number of installations will be reduced,
An object of the present invention is to propose a chemical liquid ejecting apparatus. A fourth object of the present invention is to propose a chemical liquid ejecting apparatus in which the bending pitch of each slit-shaped injection port is shifted to the left and right, thereby avoiding generation of a shaded portion of the injected chemical liquid. And

Further, according to the present invention, the injection angle of the chemical solution can be changed and set. Seventhly, the injected chemical solution is unevenly distributed, offset, retained, and liquid with respect to a thin plate material such as a printed wiring board material. It is an object of the present invention to propose a chemical liquid ejecting apparatus in which pools and flows are prevented from being mixed. Further, as in claim 6, a predetermined tubular body, a slit member, and a slit-shaped injection port are provided, and in claim 7, a bridge portion is bridged over an opening of the tubular body. A filter is interposed between the opening of the tubular body and the slit-shaped injection port. According to claim 9, the width of the slit-shaped injection port can be finely adjusted by a fine adjustment mechanism including a push screw and a tension screw. Eighth, it is an object of the present invention to propose a chemical liquid ejecting apparatus capable of accurately and uniformly ejecting a chemical liquid from a slit-shaped injection port.

[0019]

The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows. That is, this claim 1
Is a chemical liquid ejecting apparatus which performs chemical treatment by injecting a chemical liquid onto a conveyed thin plate material, and includes a slit-shaped injection port.
The slit-shaped injection port is disposed opposite to the thin plate material to be conveyed so as to cover not the front and rear transport directions but the left and right width directions, and the chemical liquid is directed vertically to the outer surface of the thin plate material. Spray in shape. At the same time, the slit-shaped injection port is not formed in a straight line but is formed to be bent back and forth at a constant pitch, and the chemical liquid is injected in a curtain shape bent back and forth.

Next, claim 2 is as follows. That is, in the chemical liquid ejecting apparatus according to claim 2, in the chemical liquid ejecting apparatus according to claim 1, the slit-shaped ejection port is
The liquid medicine is formed into a curved wave shape, and the liquid medicine is ejected in a curtain shape that forms a curved line back and forth. Claim 3 is as follows. That is, in the chemical liquid ejecting apparatus according to the third aspect, in the chemical liquid ejecting apparatus according to the first aspect, the slit-shaped injection port forms a polygonal wave shape such as a triangular wave, a trapezoidal wave, a rectangular wave, and a sawtooth wave. It is characterized in that it is ejected in the form of a curtain that forms a folded line in front and back. Claim 4 is as follows. That is, in the chemical liquid ejecting apparatus according to the fourth aspect, in the chemical liquid ejecting apparatus according to the first aspect, a plurality of the chemical liquid ejecting apparatuses are arranged at intervals in the transport direction before and after the thin plate material. In addition, the bending pitch of the slit-shaped injection port is shifted in the width direction on the left and right at least between adjacent ones.

Next, claim 5 is as follows. That is, in the chemical liquid ejecting apparatus according to the fifth aspect, in the chemical liquid ejecting apparatus according to the first aspect, the chemical liquid ejecting apparatus is entirely front and rear along the conveying direction of the thin plate material around an attached shaft. And can be fixed at an appropriate swing angle. Further, it is characterized in that the spray angle with respect to the thin plate material can be changed and set for the chemical solution injected from the slit-shaped injection port. Claim 6
Is as follows. That is, the chemical liquid ejecting apparatus according to claim 6 is the chemical liquid ejecting apparatus according to claim 1, wherein the chemical liquid ejecting apparatus is connected to a pipe for pressure-feeding the chemical liquid and extends along the left and right width directions. An arranged pipe,
A pair of front and rear slit members tightly assembled to the tube body, and an extremely thin bent front and rear gap between the two slit members and communicating with an opening formed in the tube body. And a slit-shaped injection port.

Next, claim 7 is as follows. That is, in the chemical liquid ejecting apparatus according to the seventh aspect, in the chemical liquid ejecting apparatus according to the sixth aspect, the opening of the tubular body is formed by one long hole formed along the left and right width directions. A plurality of bridge portions for preventing expansion and contraction of the openings are provided at appropriate intervals on the way.
Claim 8 is as follows. That is, in the chemical liquid ejecting apparatus according to claim 8, in the chemical liquid ejecting apparatus according to claim 6, a filter is interposed between the opening of the tubular body and the slit-shaped ejecting port. Features.

Claim 9 is as follows. That is, in the chemical liquid ejecting apparatus according to the ninth aspect, in the chemical liquid ejecting apparatus according to the sixth aspect, the pipe body includes a pair of front and rear plate walls that accommodate the slit members along the left and right width directions. A plurality of through-holes are formed in the both plate walls at intervals in the left and right width directions. A push screw capable of applying a pressing force to the slit member is inserted into a through hole of the plate wall on one side, and a tension screw is applied to the slit member on a through hole of the plate wall on the other side. A tension screw capable of applying a force is inserted. A fine adjustment mechanism is formed by the push screw and the tension screw, whereby the width of the very thin front-rear space of the slit-shaped injection port can be finely adjusted at various positions in the width direction on the left and right, and the slit-shaped injection port can be finely adjusted. It is characterized in that the curtain thickness before and after the chemical solution injected at the mouth can be finely adjusted. Claim 10 is as follows. That is, this claim 10
The chemical liquid ejecting apparatus of claim 1, 2, 3, 5, 6, 7,
8. The chemical liquid ejecting apparatus according to 8 or 9, wherein the chemical liquid ejecting apparatus is used in a manufacturing process of a printed wiring board, and the thin plate material is made of a printed wiring board material having a circuit formed on an outer surface thereof; As the chemical solution, a developing solution, a corrosive solution, a stripping solution or the like is used.

The present invention has the following configuration. This chemical liquid ejecting apparatus is used in, for example, a manufacturing process of a printed wiring board, and injects a chemical such as a developing solution, a corrosive liquid, and a stripping liquid onto a thin plate material such as a printed wiring board material to be conveyed. And this chemical | medical solution injection apparatus is provided with the slit-shaped injection port, with respect to a printed wiring board material etc.
They are arranged opposite to each other so as to cover the left and right width directions, and eject a chemical solution in a vertical curtain shape toward the entire width of a printed wiring board material or the like.

Further, the slit-shaped injection port according to the first, second, and third aspects is formed to be bent back and forth in a curved wave form or a polygonal wave form, so that the chemical solution is curved and bent in a curved form. Spray. In this way, since the total extension distance of the slit-shaped injection port is long, the chemical liquid is also sprayed to the area of the printed wiring board material that spreads in a band shape, with the total extension distance dispersed and circulated long. Is directly injected into the printed wiring board material, etc.
It is injected with weight, concentration, impact, etc. reduced. In the fourth aspect, the bending pitch of each of the plurality of slit-shaped injection ports provided in the transport direction is shifted to the left and right. For the printed wiring board material, etc., the chemical liquid ejected from the left-right bent portion of the slit-shaped outlet is jetted thinly, and the chemical liquid jetted from the front-rear bent portion of the slit-shaped outlet is jetted densely. Tend. On the other hand, when the pitch is shifted, the bent portion of each slit-shaped injection port is shifted, and the chemical liquid is uniformly jetted onto the printed wiring board material or the like without generation of shading.

According to the fifth aspect of the present invention, it is possible to swing and fix in the front and rear transport directions as a whole, and it is possible to change and set the injection angle of the chemical solution. Therefore, the chemical solution can be sprayed not only from directly above or directly below the printed wiring board material, but also inclining back and forth. Accordingly, the injection angle is set at a right angle by observing the degree of occurrence of uneven distribution, offset, stagnation, accumulation of liquid, mixed flow, etc., of the chemical injected into the printed wiring board material or the like in relation to the injection pressure or injection amount of the chemical. Or the inclination can be appropriately changed and set.

According to a sixth aspect of the present invention, a pair of front and rear slit members is assembled to the pipes arranged in the left and right width directions, and a slit-shaped injection port is formed between the two slit members. I will let you communicate. Then, after being introduced into the tube body, the chemical solution is supplied from the opening to the slit-shaped injection port between the slit members, and is injected to the printed wiring board material and the like.
In such a chemical liquid ejecting apparatus, in claim 7, since the bridge portion is bridged at an appropriate interval to the opening portion formed by the elongated hole of the tubular body, the opening of the tubular body by the liquid pressure of the chemical solution. The expansion and contraction of the portion is prevented, and adverse effects on the slit-shaped injection port are also avoided. In the eighth aspect, since the filter is interposed between the opening of the tubular body and the slit-shaped injection port, dust in the supplied chemical solution is removed, and clogging of the slit-shaped injection port is prevented. According to the ninth aspect, by applying a pressing force or a pulling force to necessary portions of both slit members with a push screw or a pull screw of the fine adjustment mechanism, the slit width of the slit-shaped injection port between the slit members can be changed at various places. Fine adjustment can be made freely and the whole can be made uniform, and the curtain thickness of the injected chemical can be finely adjusted and made uniform.

[0028]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a liquid ejecting apparatus according to the present invention. 1, 2, 3, 4, 5, 6, 7
Is provided for describing the embodiment of the present invention. And FIG.
Is a schematic diagram of a bottom surface (plane). FIG. 1A shows one example, FIG. 2B shows another example, and FIG. 3C shows another example. FIG. 2 is a schematic diagram of the entire bottom surface (plane) showing various examples of slit-shaped injection ports. FIG. 2A is a first example, and FIG.
The figure shows the second example, (3) shows the third example, (4) shows the fourth example, (5) shows the fifth example, (6) shows the sixth example, and (7)
The figure shows a seventh example. FIG. 8 is a schematic (bottom) view showing a conventional slit-shaped injection port of this type. FIG. 3 is an overall side sectional view. FIG. 4 is a side sectional view of a main part. FIG. 4A shows a tube, a slit member, a filter, and the like, and FIG. 5B shows a tube, a slit member, a fine adjustment mechanism, and the like. FIG. 5A is a front view of the whole, and FIG.
The figure is a side sectional view of the entirety, (3) is a front view of the slit member, and (4) is a plan view of the slit member. FIG. 6A is a bottom view of an example of the opening of the tubular body,
FIG. 2B is a bottom view of another example of the opening of the tubular body. The liquid ejecting apparatus shown in FIGS. 1 and 2 is a schematic bottom view for the liquid ejecting apparatus shown in the upper part of FIG. 3, and is a schematic plan view for the liquid ejecting apparatus shown in the lower part of FIG. . or,
The liquid ejecting apparatus shown in FIGS. 4, 5, and 6 relates to the liquid ejecting apparatus shown in FIG. FIG.
FIG. 3 is an explanatory side view showing an example in which a chemical liquid ejecting apparatus is provided in a chemical liquid.

This chemical liquid ejecting apparatus includes a thin plate material manufacturing process,
Although it is used in a processing step and other various processing steps, a case where it is used in a manufacturing step of a printed wiring board H which is a typical example of a thin plate material will be described in detail. First, the premise of the printed wiring board H will be described with reference to FIG.

The printed wiring board H is used for various purposes, such as a board for various OA equipment, a board for a mobile phone, a board for a computer, a board for a computer, and a board for other electronic equipment. The processes are also diverse. The types of the printed wiring board H include, for example, a single-sided board, a double-sided board, a multilayer board (including a recent build-up method),
Flexible substrates and the like are conceivable, but recently, CSP and PB related to semiconductor chips and packages
GA has also appeared. In recent years, the printed circuit board H has become increasingly smaller, lighter, finer, extremely thinner, more flexible, more multilayered, and the like. In particular, the density and fineness of the circuit G formed on the outer surface have increased. Accuracy is increasing. Then, such a printed wiring board H is manufactured, for example, as follows. That is, the printed wiring board H is sequentially laminated, polished, cut, drilled for through holes, polished, plated, polished, and coated, dried, or pasted with an etching resist for the printed wiring board material A, which is a thin plate material. → Exposure, → development, → etching, → stripping of the etching resist in the circuit G portion, and many other steps are sequentially and sequentially followed.

The method of manufacturing the printed wiring board H will be described in more detail. First, after copper foil is laminated and laminated on both surfaces of an insulating base material such as polyimide by hot pressing or the like, cleaning and polishing are performed. Then, soft etching for roughening the copper foil surface is performed, and the printed wiring board material A, for example, a double-sided copper foil-clad laminate obtained through such a pretreatment step is cut into a short piece having a work size. Then, after a through hole drilling process is performed, cleaning and double-side polishing are performed, and then panel plating is performed. As a result, plating is applied to the inner wall of the through hole so as to conduct the circuit G on the front surface and the circuit G on the back surface. (Independently of this, a single-sided copper foil-clad laminate in which copper foil is bonded to only one side of an insulating base material may be used as the printed wiring board material A. In this case,
The application, exposure, development and the like of the photosensitive resist described below are also performed on only one side, but the present invention is, of course, applicable to the printed wiring board material A and the printed wiring board H for such a single-sided board.
Also applies. The same applies hereinafter in this specification. A large number of through-holes are formed in a single printed wiring board material A (printed wiring board H), with a few hundreds or thousands of extremely small diameters.

After that, the printed wiring board material A is again cleaned, polished, cleaned, dried, etc.
An etching resist, that is, a photosensitive resist serving as an alkali-resistant or acid-resistant protective film is applied and dried to form a coating film. Then, on both surfaces, that is, on the outer surface of the circuit G on the upper surface and the lower surface, a circuit G photograph, which is a negative film of the circuit G, is exposed to light, and then the photosensitive resist leaves the exposed and hardened circuit G portion. Unnecessary portions are dissolved and removed by spraying the developer as the chemical solution B (see also FIG. 3 described later). Then, after such a printed wiring board material A is washed and dried,
Thus, the photosensitive resist is cured to leave the copper foil in the portion of the circuit G covered and protected, and the unnecessary portion of the copper foil in which the photosensitive resist has been dissolved and removed as described above is dissolved by spraying a corrosive liquid as a chemical solution B. It is removed and etched (see also FIG. 3 described later). Then, after the remaining photosensitive resist in the above-described cured circuit G portion is dissolved and removed by spraying a stripping solution as a chemical solution B (see also FIG. 3 described later), the photosensitive resist is washed and dried, and the predetermined circuit is removed. A printed wiring board H on which G is formed is obtained.

The printed wiring board H is, for example, 5
50mm × 550mm, 500mm × 500mm, 50
It has a size of about 0 mm x 300 mm, and its thickness is
The portion of the insulating base material is, for example, about 0.06 mm, and the portion of the circuit G made of copper foil is extremely thin, for example, to about 0.018 mm. Even in the case of such a multilayer board in which the printed wiring board H is laminated in four layers or the like, the overall thickness is 1.
The thickness is becoming extremely thin, from 0 mm to 0.8 mm and further to about 0.4 mm. Also, the width of the circuit G has been tending to be reduced from 70 μm to 50 μm, and further from 30 μm to 20 μm. For example, there is a need for a circuit width of 20 μm and a space between the circuits G of about 30 μm. The peripheral edge of the outer surface (that is, the upper surface and the lower surface) on which the circuit G is formed is a notch portion that can be gripped with a width of about 10 mm.

Incidentally, as for the printed wiring board H manufactured by following these steps, a protective film of the formed circuit G is formed as a post-processing step which is a part of the manufacturing steps. That is, first, a photosensitive resist, which is a solder resist, is applied to the entire surface of the printed wiring board H on which the circuit G is formed on the outer surface of the printed wiring board H and then dried to form a coating film. Then, exposure and development are performed by applying a negative film, and only the photosensitive resist in the component mounting portion such as the through-hole portion, that is, the portion where soldering is performed afterwards is exposed by dissolving and removing (these processes are described below). Substantially according to the above-described steps). In this way, a protective film made of a photosensitive resist is formed on the printed wiring board H, and the circuit G is protected. Thereafter, the circuit G of the printed wiring board H is protected from the attachment of solder to the component mounting portion. The printed wiring board H is manufactured by following these steps.

As described above, in the manufacturing process of the printed wiring board H, for example, in the developing step, the etching step, the peeling step, etc., the printed wiring board material A Is transported, and a chemical solution B such as a developing solution, a corrosive solution (etching solution), and a stripping solution is jetted to perform chemical processing and chemical liquid processing such as development, etching, and stripping. That is, first, in the processing chamber of each process, as shown in FIG.
, The printed wiring board material A is transported in a horizontal posture. In the conveyor 4, a large number of wheels 5 are attached to each shaft, with a large number of shafts being parallel to the left and right width direction D and a large number in the front and rear transport direction C. Thus, in the example of FIG. 3 (the same applies to the above-described conventional example of FIG. 8),
Although a type having wheels 5 attached at predetermined intervals is used for each axis, a type having straight rollers attached to each axis can be used instead.

In the example of FIG. 3 (the same applies to the conventional example of FIG. 8 described above), the shaft and the printed wiring board material A on which the wheel 5 is conveyed are vertically opposed to each other so as to sandwich the same. The lower wheel 5 is driven to rotate and functions as a carrier, and the upper wheel 5 functions as a presser and a meandering prevention in a free state. Each of the upper and lower wheels 5 has a wide front and rear gap space K formed by a space corresponding to one wheel 5 in the middle.
Are arranged closely close to each other (in the illustrated example, they are arranged close enough to partially overlap between the axial intervals). Such a conveyor 4
Thereby, the printed wiring board material A is transported.

Hereinafter, the chemical liquid ejecting apparatus 6 will be described.
First, as shown in FIG. 3, the chemical liquid ejecting apparatus 6 is used in a manufacturing process of a printed wiring board H, and a thin plate material is a printed wiring board material A on which a circuit G is formed on an outer surface.
As the chemical solution B, a developing solution, a corrosion solution, a stripping solution, or the like is used. The chemical liquid ejecting apparatus 6 includes a slit-shaped ejection port 7 for ejecting the chemical liquid B to the printed wiring board material A as a thin plate material to be conveyed, and ejects the chemical liquid B over the entire width of the printed wiring board material A. . In other words, the slit-shaped ejection port 7 of the chemical solution ejection device 6 is provided so as to face the printed wiring board material A conveyed in the horizontal posture so as to cover not the front and rear conveyance direction C but the right and left width direction D. The chemical solution B, which is pumped through a pump (not shown) or a pipe 3 or the like, is directed straight to the entire width of the outer surface of the printed wiring board material A without being diffused or sprayed, and is vertically extended. Spray in shape.

The liquid injector 6 will be described in more detail. As shown in FIG. 3, a chemical solution B, for example, a developing solution or a corrosive solution or a stripping solution is supplied to a liquid tank (not shown) at the lower part of the processing chamber.
It is stored in. Then, the chemical solution B in the liquid tank is pumped through the pump and the pipe 3, then branched to each of the chemical solution ejecting devices 6, and conveyed from the slit-shaped ejection ports 7 of each of the chemical solution ejecting devices 6 by the conveyor 4. In the illustrated example, the liquid is injected from above and below toward the printed wiring board material A (see FIG.
See also this type of conventional example). Then, the chemical solution B flows through the surface of the printed wiring board material A on which the circuit G is formed, and then flows again into the lower liquid tank, is collected, and is circulated again afterwards.

As shown in FIGS. 3 and 4, the chemical liquid ejecting apparatus 6 includes a slit-shaped ejection port 7, and the slit-shaped ejection port 7 is a linear gap having a slit width of a narrow front-rear width. It has a groove shape, and is arranged along the left and right width directions D, not the front and rear transport directions C. Fig. 1 (1),
(2) The slit-shaped injection port 7 shown in the figure is disposed along the width direction D perpendicular to the transport direction C on the horizontal plane, and has a left and right width substantially matching the width of the conveyor 4.
On the other hand, the slit-shaped injection port 7 shown in FIG. 1C is slightly inclined in the front-rear direction with respect to the left and right width direction D in the horizontal plane. Slit-shaped injection port 7
Any of these types is appropriately selected and used. Now, as shown in FIGS. 3 and 4, the chemical solution B press-fitted, supplied, and filled from the pipe 3 into the chemical solution injection device 6,
It is jetted from the slit-shaped jet port 7 toward the printed wiring board material A. The chemical solution B is used for the printed wiring board material A.
Is sprayed in a vertical curtain shape over the entire width in the left and right width direction D, and is sprayed straight as it is without being diffused in a spray shape.

First, the chemical liquid ejecting apparatus 6 and the slit-shaped ejecting port 7 of each of the illustrated examples are of a long type, each of which is provided so as to cover the entire left and right width direction D. However, instead of the illustrated example, a type that is divided into, for example, three short pieces in the left and right width direction D is also possible. In the case of the latter type,
In the liquid port 13 of the pipe body 10 of each divided chemical liquid ejecting apparatus 6,
The branched pipes 3 are connected and connected.

Secondly, as shown in FIG. 3, the slit-shaped injection port 7 of the chemical liquid injection device 6 is provided with a predetermined wheel 5 of the conveyor 4 for transporting the printed wiring board material A.
(Or rollers), it is disposed to face the gap space K formed between them. Therefore, the chemical solution B is directly sprayed onto the outer surface of the printed wiring board material A without contacting the wheel 5 or the like which becomes an obstacle. That is, for the wheels 5 closely arranged before and after the conveyor 4, a gap space K of a space substantially corresponding to one wheel 5 is formed. The chemical liquid ejecting device 6 is disposed above or below such a gap space K, and the slit-shaped ejection port 7 is opposed to the gap space K.

Third, in the illustrated example shown in FIG. 3, the printed wiring board material A is conveyed by the conveyor 4 in a horizontal horizontal position, and the chemical liquid ejecting device 6 and the slit-shaped ejecting ports 7 are moved to the left and right. Although opposed to cover the width direction, the present invention is not limited to the illustrated example. For example, the printed wiring board material A is conveyed by the conveyor 4 not in a horizontal direction but in a left-right inclined posture or a vertical posture, and the chemical liquid ejecting device 6 and the slit-shaped ejecting holes 7 also cover the width direction D thereof. For this purpose, it is also conceivable that they are arranged to be inclined and opposed to each other or to be vertically opposed.

Fourth, in the illustrated example shown in FIG. 3, the chemical liquid ejecting device 6 and the slit-shaped ejection port 7 are opposed to the printed wiring board material A conveyed in a horizontal posture in the vertical direction. Although arranged, the present invention is not limited to such illustrated examples. That is, in the case of a double-sided substrate in which the circuit G is formed on both the front and back surfaces of the printed wiring board material A, there are many types shown in the drawings, but a single-sided substrate in which the circuit G is formed only on one side of the printed wiring board material A In the case of (1), the chemical liquid ejecting device 6 and the slit-shaped ejecting port 7 are provided opposite to each other only above (or only below) the printed wiring board material A to be conveyed, regardless of the illustrated example.

Fifthly, FIGS. 1, 3 and 7 which will be described later, etc. show only the essential parts of the number of chemical liquid ejecting devices 6 and slit-shaped ejecting ports 7 to be arranged. It's just That is, it is rare that only one chemical liquid ejecting device 6 and one slit-shaped ejecting port 7 are provided above and below the printed wiring board material A, and in many cases, a plurality of and a large number of Are arranged at predetermined intervals in the transport direction C.

Hereinafter, the chemical injection device 6 of the present invention will be described.
The characteristic points will be described. First, as shown in FIGS. 1 and 2, the slit-shaped injection port 7 of the chemical liquid injection device 6 does not form a straight line in a horizontal plane (see FIG. 2 (8)). (Comparative contrast with the shape injection port 2), which is bent at a constant pitch in the front-rear direction, and jets the chemical solution B in a curtain shape bent back and forth. The slit-shaped nozzles 7 of the examples shown in FIGS. 1 and 2 (1), (2), (3) and the like, that is, the slit-shaped nozzles 7 of the first, second, and third examples. Has, for example, a sinusoidal / sine-curve curved wave shape, and ejects the chemical solution B in a curtain shape having a curved shape back and forth. As shown in the figure, the pitch, the height of the waves, and the like can be variously set. On the other hand, (4) of FIG.
, (5), (6), (7), etc., the slit-shaped injection port 7, ie, the fourth example, the fifth example, the sixth example, and the seventh example
The slit-shaped injection port 7 in the example has a pulse waveform, that is, a polygonal waveform such as a triangular wave, a trapezoidal waveform, a rectangular waveform, a saw-tooth waveform, and the like, and injects the chemical solution B in a front and rear curtain shape. Of course, the pitch, wave height, and the like can be variously set.
Thus, the slit-shaped injection port 7 is bent.

Next, in many cases, a plurality of the chemical liquid ejecting devices 6 are arranged at predetermined intervals in the transport direction C before and after the printed wiring board material A as described above. The relationship between the slit-shaped injection ports 7 in the thus-arranged plural or many chemical liquid injection apparatuses 6 is as follows. First, in the example shown in FIG.
The bending pitch of each slit-shaped injection port 7 is aligned. On the other hand, in the example shown in FIG. 1B, the bending pitch of each slit-shaped injection port 7 is shifted in the left-right width direction D (see the imaginary line display in the figure). For the latter, the degree of the pitch shift is １ ／ pitch, ４ pitch,
1/8 pitch and others are conceivable. In the latter case,
It is sufficient that the pitch is shifted at least between the slit-shaped outlets 7 adjacent at the front and rear, and the pitch between all the slit-shaped outlets 7 does not necessarily need to be shifted. As described above, it is conceivable to shift the pitch of each slit-shaped injection port 7.

Next, the structure of the chemical liquid ejecting apparatus 6 will be described in detail with reference to FIGS. This chemical liquid ejecting apparatus 6 includes the following tubular body 10 and slit member 1.
1, a slit-shaped injection port 7 is provided. That is, while being connected to the pipe 3 that has pumped the chemical solution B at the side,
A pipe 10 disposed along the left and right width directions D, and a pair of front and rear slit members 1 closely assembled to the pipe 10
1 and a slit-shaped injection port 7 formed as an extremely thin front-back gap bent between the slit members 11 and communicating with an opening 12 formed in the tube 10.

These will be described in more detail. First, the tube 10 of the liquid injector 6 will be described. Tube 10
Are arranged along the left and right width directions D perpendicular to the transport direction C of the printed wiring board material A to be transported, and have a long tubular shape, and in the illustrated example, a rectangular tubular shape. And this tube 10
Is connected to an end of the pipe 3 at a liquid port 13 formed on the side thereof. In the example shown in FIG. 6A, the liquid ports 13 are provided on both the left and right sides and ends. Are formed, and the ends of the pipes 3 are connected to each other, so that the pumped chemical solution B is supplied to the inside of the pipe body 10 from the liquid ports 13 on both the left and right sides and ends. On the other hand, in the example shown in FIG. 6 (2), the liquid port 13 is formed only on one of the right and left sides and the end, and is connected to the end of the pipe 3 and the other side. The end is closed, so that the pumped chemical solution B is supplied into the inside of the tube 10 from the liquid port 13 on one of the left and right sides and the end.

An opening 12 is formed in the tube 10 on the surface of the printed wiring board material A to be conveyed. The opening 12 is formed on the bottom surface (upper one in FIG. 3, FIGS. 4, 5 and 6) and the upper surface (lower one in FIG. 3) of the tube 10. The opening 12 has a length of one at the center of the bottom surface or the top surface of the tubular body 10 along the left-right width direction D of the printed wiring board material A, that is, the entire length along the longitudinal direction of the tubular body 10. It is formed in a hole shape.

Further, as shown in FIG. 6, a plurality of bridge portions 14 for preventing expansion and contraction of the opening 12 are provided at appropriate intervals in the middle of the opening 12 having an elongated hole shape in the tube 10. Have been hanged over. In the illustrated example, a plurality of such bridge portions 14 are bridged at regular intervals along the width direction D. Each of the bridge portions 14 is formed integrally with the tube 10 around the opening 12. The configuration of the bridge portion 14 is not limited to the illustrated example, and various other configurations are possible. For example, the space between both wall surfaces of the upper and lower pipes 10 of the opening 12 is
You may use a bolt or nut to hang it over,
Further, a thin plate material may be fixed to the upper and lower portions of the opening 12.

Further, as shown in FIGS. 3, 4 and 5, (1), (2), and FIG. Reference numeral 15 is provided along the left-right width direction D of the printed wiring board material A, that is, along the longitudinal direction of the tubular body 10. In the illustrated example, the tubular body 10 having a rectangular cylindrical shape has both wall surfaces along its longitudinal direction hanging down (upper one in FIG. 3, examples in FIGS. 4, 5, 5 and 6) or as it is. By being erected (the lower one in FIG. 3), a pair of front and rear plate walls 15 is formed. Further, in the illustrated example, such a plate wall 15 is also attached to the front and rear, so that such a plate wall 15 is provided around the outer edge of the tube 10. The two plate walls 15 thus attached to the tube body 10
The two slit members 11 are housed between them. In FIG. 5 (2), reference numeral 16 designates the two slit members 11 housed in this way as the bottom of the tube 10 (the upper one in FIG. 3, FIG. 4, FIG. 5, FIG. 6) or the tube. A mounting screw for mounting on the upper surface of the body 10 (the lower one in FIG. 3). As the mounting screw 16, for example, a bolt is used, but the illustration of the mounting screw 16 is omitted in each drawing other than the drawing (2) of FIG. The tube 10 is configured as described above.

Next, the slit member 11 of the liquid injector 6 will be described. FIG. 3, FIG. 4, FIG.
(4) As shown in the figures and the like, the slit member 11 has a long and substantially rectangular shape, and two pairs of front and rear slit members are used.
In the illustrated example, both left and right end portions of the pair of front and rear slit members 11 are integrally fixed by an adhesive M or the like as shown in FIG. The slit-shaped injection port 7 is formed in the middle of both ends), so that both slit members 11 are bonded to each other at both ends.
It is used as fixed and connected. In addition, regardless of the illustrated example, the front and rear slit members 11 are formed as a single member from the beginning, and the center part is bored and slit with a laser or the like, leaving the left and right ends, so that the slit-shaped injection port 7 is formed. You may make it. in this case,
The pair of front and rear slit members 11 means the front and rear portions of one member. Further, such a pair of front and rear slit members 11 is housed between the plate walls 15 of the tube body 10 as described above, and is attached to the bottom of the tube body 10 (see FIG. 3 (FIG. 4, FIG. 5, FIG. 6) and the tube 10 (lower in FIG. 3). The opposing surfaces (that is, the front and rear surfaces) of such a pair of front and rear slit members 11 are respectively formed so as to be bent in a corresponding curved wave shape or polygonal wave shape (in particular, FIG. 5 (4)). reference). Slit member 11
Is like this.

Next, the slit-shaped injection port 7 of this chemical liquid injection device 6 will be described. FIG. 3, FIG. 4, and FIG.
(4) As shown in the figures and the like, the slit-shaped injection port 7 has an extremely thin slit width of, for example, about 0.15 mm between the front and rear slit members 11 assembled to the tube body 10 as described above. It is formed as a front and rear gap. That is, the slit-shaped injection port 7 is provided between the opposed surfaces of the front and rear slit members 11 which are bent in a corresponding curved or polygonal wave shape.
It is formed along the left and right width direction D as a vertical, ultrathin slit bent and formed in a curved wave shape or a polygonal wave shape.
The upper end (the upper one in FIG. 3, FIG. 4 and FIG. 5) and the lower end (the lower one in FIG. 3) of such a slit-shaped injection port 7 are formed on the above-described tube body 10 side. And is in communication with the opening 12. Note that the two slit members 11 forming the slit-shaped injection port 7 are on both sides of the upper end of the slit-shaped injection port 7 communicating with the opening 12 in this manner (the upper side in FIG. For example, stepped concave portions 17 are formed on both sides of the lower end (the lower side in FIG. 3). The total front and rear width of the concave portions 17 of both slit members 11 is set to the same dimension as the front and rear width of the opening 12 described above. The slit-shaped injection port 7 is configured as described above.

Next, in this chemical injection device 6, as shown in FIG. 4A, a filter 18 is interposed between the opening 12 of the tube 10 and the slit-shaped injection port 7. ing. In the illustrated example, a filter 18 is stretched between the opening 12 of the tube 10 communicated as described above and the space formed by the recesses 17 of both slit members 11.
That is, between the opening 12 and the slit-shaped injection port 7,
A filter 18 having, for example, a net shape is interposed through the space of the concave portion 17. Both ends of the filter 18 are sandwiched between the tubular body 10 and both slit members 11 via upper and lower packings. The illustration of the filter 18 is omitted in each drawing other than the drawing (1) of FIG. The filter 18 is interposed as described above.

Next, the fine adjustment mechanism 19 will be described. As shown in FIG. 4 (2), first, both slit members 1
1 are placed in the left and right width directions D
A plurality of through holes 20 are formed at equal intervals. The through hole 20 of the plate wall 15 on one side (the right side in the drawing) is formed as a screw hole. A push screw 8 capable of applying a pressing force to is inserted (see also FIG. 5 (1)). Further, the through-hole 20 of the plate wall 15 on the other side (the left side in the drawing) is a simple through-hole, and the through-hole 20 formed by this through-hole is provided with a slit member 1 respectively.
A tension screw 9 capable of applying a tensile force to 1 (the left slit member 11 in the drawing) is inserted (see also FIG. 5 (1)). The tip of the tension screw 9 is screwed through a through hole 20 into a screw hole 21 provided in the opposite slit member 11.

A fine adjustment mechanism 19 is formed by the push screw 8 and the tension screw 9 described above. By such a fine adjustment mechanism 19, the width of the very thin front-rear interval of the slit-shaped injection port 7, that is, the slit width can be finely adjusted at various positions in the left-right width direction D. The curtain thickness before and after the chemical solution B is wide or narrow so that fine adjustment is possible, and the injection pressure and the injection amount of the chemical solution B to be injected can be freely changed. In other words, when the slit width of the slit-shaped injection port 7 is too wide as a whole or there is a part that is too wide, by screwing all or the set screws 8 of the part into the through hole 20, Opposed slit member 11 (right slit member 1 in the drawing)
1) is pushed in by the tip of the push screw 8 having passed through the through hole 20. Thereby, the slit width of the slit-shaped injection port 7 is finely adjusted to an appropriate narrow dimension as a whole or at the location. On the other hand, when the slit width of the slit-shaped injection port 7 is too narrow as a whole or there is a part that is too narrow, the pulling screws 9 of all or the parts are passed through the through holes 20. Screw hole 2 on slit member 11 side
1, the slit member 11 (the left slit member 11 in the drawing) is pulled outward. Thereby, the slit width of the slit-shaped injection port 7 is finely adjusted to an appropriate wide dimension as a whole or at the location. The fine adjustment mechanism 19 is shown in FIG.
5 and (1) and (2) of FIG. 5 are omitted in each drawing. The fine adjustment mechanism 19 is configured as described above.

Next, the swinging and fixing of the chemical injection device 6 will be described. In the chemical liquid ejecting apparatus 6, the pipe body 10 in which the two slit members 11 are assembled can swing along the front and rear transport directions C around the attached shaft and can be fixed at an appropriate swing angle. is there. Thus, it is possible to change and set the injection angle of the chemical solution B to the printed wiring board material A by the slit-shaped injection port 7. Examples of such a swinging and fixing system of the chemical liquid ejecting apparatus 6 include,
A method is considered in which a union joint that can be freely rotated and fixed is interposed and provided as a swinging shaft between the liquid port 13 of the tube 10 and the end of the pipe 3 or in the pipe 3 near the liquid port 13. .

At the same time, as shown in FIG. 3, a plate 23 having a protractor scale 22 is attached to the tube 10, and a protractor needle 25 is attached to a pin 24 protruding from the plate 23. Is pivoted. That is, a plate 23 is protruded from the tube 10 along the transport direction C, and a protractor scale 22 is displayed on the plate 23. A pin 24 protrudes from the plate 23 on the side of the protractor scale 22, and the base end of a protractor needle 25 is rotatably attached to the pin 24. The tip of the protractor needle 25 is located at the position corresponding to the protractor scale 22. The plate 23, the protractor scale 22, the pin 24, the protractor needle 25 and the like are shown in FIG.
Are omitted in the other drawings. Chemical injection device 6
Swinging and fixing are performed with reference to such a relationship between the protractor scale 22 and the protractor needle 25.

In the illustrated example, the slit-shaped injection port 7 of the chemical liquid injection device 6 is set so that the injection angle with respect to the printed wiring board material A is a right angle. That is, for the printed wiring board material A conveyed in the horizontal orientation,
The chemical solution ejecting device 6 and the slit-shaped ejection port 7 are set at an angle such that the curtain of the medicinal solution B is ejected from the vertical direction. On the other hand, regardless of the illustrated example, the slit-shaped ejection port 7 of the chemical solution ejection device 6 is swung by the above-described manner so that the ejection angle with respect to the printed wiring board material A is slightly inclined back and forth from a right angle. It is also possible to fix. In other words, the chemical liquid ejecting device 6 and the slit-shaped ejecting port 7 are swung so that the substantially curtain-shaped chemical liquid B is ejected onto the printed wiring board material A at an ejection angle slightly inclined in the front-rear direction from the right angle. , Fixing is also conceivable. The injection angle inclined in this manner is set to a slightly slight angle, for example, about 5 degrees, but the lower limit may be about 1 to 2 degrees, and the upper limit may be about 10 degrees. It is. Further, it is inclined to the downstream side in the transport direction C, and the firing angle of the slit-shaped injection port 7 is set to an obtuse angle on the upstream side, an acute angle on the downstream side, an incident angle on the printed wiring board material A, an acute angle on the upstream side, and an obtuse angle on the downstream side. Or, conversely, it may be inclined to the upstream side in the transport direction C. In this case, the emission angle of the slit-shaped injection port 7 is such that the upstream side is an acute angle and the downstream side is an obtuse angle. At the angle of incidence,
The upstream side is set at an obtuse angle and the downstream side is set at an acute angle. The swinging and fixing of the chemical injection device 6 are performed in this manner.

The present invention is configured as described above. Then, it becomes as follows. As shown in FIGS. 1 and 3, the chemical liquid ejecting apparatus 6 is used, for example, in a manufacturing process of a printed wiring board H, and applies a developing solution A chemical solution B such as a corrosive liquid or a stripping liquid is sprayed. The chemical liquid ejecting apparatus 6 includes a slit-shaped ejecting port 7, and the slit-shaped ejecting port 7 is provided to face the printed wiring board material A to be conveyed so as to cover the left and right width directions D. I have. Then, the chemical solution B pressure-fed via the pump or the pipe 3 is directly jetted uniformly and straightly in a vertical curtain shape toward the entire width of the printed wiring board material A. Then, in this chemical liquid ejecting apparatus 6, the following first, second, third, fourth, fifth, sixth, seventh and eighth are as follows.

1) First, as shown in FIG. 1 and FIG. 2, the slit-shaped injection port 7 of the chemical liquid injection device 6 is formed to be bent back and forth at a constant pitch, for example, in a curved or polygonal waveform. In this case, the total extension distance is long, and the liquid medicine B is ejected in a vertical curtain shape bent back and forth in, for example, a curved line or a broken line (FIG. 2).
(8) and (1) of FIG. 10 and the like, and the total extension distance of the slit-shaped injection port 2 of this type of conventional example and the like for comparison. Therefore, when viewed in a horizontal plane, the chemical solution B also multi-faces with the printed wiring board material A so as to meander rather than linearly in the width direction D on the left and right in an area having a spread in the front and rear transport direction C. It is jetted and contacts in a state where the total extension distance that is dispersed and circulated is long. As described above, the chemical solution B is sprayed onto the printed wiring board material A in a direct vertical curtain shape, but is sprayed with the spray pressure, weight, concentration, impact, and the like reduced. Thus, the printed wiring board material A to be ejected is extremely thin and flexible, but it is possible to prevent bending and hip break E from occurring at the ejection location (see this type of conventional example in FIG. 10 (2)). ).

2) Second, the printed wiring board material A
As a result, the occurrence of the liquid pool F is avoided (see the conventional example of this type in FIG. 10 (2)). That is, as described above for the printed wiring board material A, the use of the chemical liquid ejecting apparatus 6 prevents the bending and hip break E from occurring, so that the chemical liquid B stays as a dense liquid pool F at the waist break E. That is avoided. The chemical solution B sprayed on the outer surface of the printed wiring board material A is smoothly updated without staying on the outer surface of the printed wiring board material A.

3) Third, since the occurrence of the buckling E and the liquid pool F is prevented or avoided, the printed wiring board material A is smoothly conveyed by the conveyor 4 as expected. In other words, although the printed wiring board material A is extremely thin and flexible, as shown in FIG.

4) Fourth, when the chemical liquid ejecting apparatus 6 is used, the chemical liquid B is directly diffused and not sprayed onto the printed wiring board material A as described in the first point. Although the ejection is performed in the form of a vertical curtain, the ejection is performed on the printed wiring board material A to be ejected in a state where the ejection pressure, weight, concentration, impact, and the like are reduced. Therefore, although the ultra-thin and flexible printed wiring board material A is to be ejected, the ejection pressure of the chemical solution B ejected from the slit-shaped ejection port 7 can be increased to increase the ejection amount. The regulation of quantity will be greatly eased.

5) Fifth, in the chemical liquid ejecting apparatus 6, as described in the above-mentioned fourth, the slit-shaped ejecting port 7 is provided.
It is possible to increase the injection pressure of the chemical solution B injected from the nozzle and increase the injection amount. Therefore, the speed and speed efficiency of the chemical treatment such as development, etching, and peeling of the printed wiring board material A and the chemical solution treatment can be improved. Thus, for example, as shown in each drawing of FIG. 1, the arrangement interval of the chemical liquid ejecting device 6 and the slit-shaped ejection port 7 in the processing chamber can be widened, and the number of disposing them can be greatly reduced (FIG. 10).
(1) FIG. 1 shows a comparative example of the arrangement intervals and the number of arrangements of the chemical liquid ejecting apparatus 1 and the slit-shaped ejection openings 2 of the conventional example of this type.

6) Sixth, as shown in, for example, FIG. 1 (2), a plurality of chemical liquid ejecting devices 6 are arranged in the front and rear transport directions C in the processing chamber, and each of them has a slit shape. When the bending pitch of the injection port 7 is shifted in the left and right width direction D between adjacent ones, the following is further obtained. On the printed wiring board material A to be ejected, a chemical solution B ejected from a relatively left-right bent portion of the slit-shaped ejection port 7 on the horizontal plane is ejected and contacted thinly. The chemical solution B ejected from the bent portion forming the target front-rear direction tends to be strongly ejected and contacted.
In contrast, by shifting the pitch as described above,
Since the bent portion of each slit-shaped outlet 7 is displaced, the chemical solution B ejected to the printed wiring board material A to be ejected is shifted without the shading corresponding to each slit-shaped outlet 7 being overlapped. , And a state is obtained in which the entire area is uniformly jetted without any shading. Thus, the chemical treatment and chemical treatment such as development, etching, and peeling of the printed wiring board material A are made uniform.

7) Seventh, as shown in FIG. 3, this chemical liquid ejecting apparatus 6 can be swung and fixed in the forward and backward transport directions C as a whole, and is ejected from the slit-shaped ejecting port 7. The injection angle of the chemical solution B can be changed and set as appropriate. Therefore, the chemical B is applied to the printed wiring board material A to be ejected.
It is possible not only to inject from right above or directly below at a right angle of injection, but also to inject at an angle of inclination slightly inclined back and forth from the right angle. The chemical B sprayed on the printed wiring board material A due to the injection pressure and the injection amount of the chemical B is
Irregular distribution, offset, stagnation, liquid pool F, mixed flow, and the like often occur. Therefore, when these occurrences are remarkable, the jetting angle is further inclined to form a flow of the chemical solution B on the printed wiring board material A toward the upstream side or the downstream side, thereby eliminating these occurrences. Let it do. On the other hand, if these occurrences are small,
Reduce the injection angle or set it to a right angle. As described above, in the chemical liquid ejecting apparatus 6, it is possible to appropriately change and set whether the injection angle of the chemical liquid B is a right angle or slightly inclined back and forth.

8) Eighth, as shown in FIGS. 3, 4 and 5, (1) and (2) of FIG. , And a structure having a slit-shaped injection port 7. That is, a pair of front and rear slit members 11 is assembled to a pipe body 10 disposed in the width direction D on the left and right of the printed wiring board material A to be conveyed, and the slit-shaped injection port 7 is It has a structure formed as a thin front-rear space and communicated with the opening 12 of the tube body 10. Then, the chemical solution B pumped through the pump or the pipe 3 is guided to the inside of the tube 10, and then from the opening 12 of the tube 10 to the slit-shaped injection port 7 between both slit members 11. It is supplied and jetted toward the printed wiring board material A.

The chemical injection device 6 having such a structure is
There are various ingenuity as follows. First, as shown in FIG. 6, the opening 12 of the tube body 10 is formed of one long hole along the left-right width direction D, and the opening 12 is provided with bridge portions 14 at appropriate intervals. Has been passed over. This prevents the opening 12 from expanding and contracting due to the liquid pressure of the supplied chemical solution B. Therefore, the tube 10
The slit member 11 assembled near the opening 12 with the mounting screw 16 (see FIG. 5B) is prevented from being displaced by such expansion and contraction.
A change in the slit width of the slit-shaped injection port 7 is also avoided.

As shown in FIG. 4A, a filter 18 is interposed between the opening 12 of the tube 10 and the slit-shaped injection port 7. Accordingly, dust mixed in the chemical solution B supplied from the inside of the tube 10 to the slit-shaped injection port 7 is removed, and for example, a slit width of about 0.015 mm and an accuracy of the order of 0.01 mm is required. The clogging of the slit-shaped injection port 7 is prevented.

Further, FIG. 4 (2), FIG. 5 (1),
(2) As shown in the figures and the like, a plurality of through-holes 20 are formed in the plate wall 15 before and after accommodating the two slit members 11 attached to the tube body 10 with an interval in the left and right width direction D. ,
The push screw 8 of the fine adjustment mechanism 19 is inserted into each through-hole 20 of the plate wall 15 on one side, and each through-hole 2 of the plate wall 15 on the other side.
At 0, the tension screw 9 of the fine adjustment mechanism 19 is inserted. Then, by applying a pressing force or a pulling force to a required portion in the left and right width direction D of the slit member 11 and pushing or pulling over a minute portion with the push screw 8 or the pull screw 9, the gap between the slit members 11 is obtained. The width of the front-rear interval, that is, the slit width of the slit-shaped injection port 7 formed as described above can be freely and finely adjusted at various positions in the left and right width directions D. By such fine adjustment, for example, 0.1
The slit-shaped injection port 7 having a slit width of about 5 mm and requiring an accuracy of the order of 0.01 mm can be easily and uniformly widened or narrowed as a whole. By finely adjusting the curtain thickness of B, it is possible to make the width or width uniform.

As described above, the chemical liquid ejecting apparatus 6 employs various measures such as prevention of expansion and contraction by the bridge portion 14, prevention of clogging by the filter 18, and adjustment of the slit width by the fine adjustment mechanism 19. With these various devices, the chemical liquid ejecting apparatus 6 has, for example, 0.15
From the slit-shaped injection port 7 having a slit width of about mm and requiring an accuracy of the order of 0.01 mm, the chemical solution B is surely uniformly sprayed in a uniform liquid pressure and liquid amount as a whole and in a uniform curtain shape. Is done.

Here, the chemical liquid ejecting apparatus 6 shown in FIG. 7 will be described. In the example shown in FIG. 3 and the like described above, the slit-shaped injection port 7 of the chemical liquid injection device 6 is disposed in the atmosphere and in the air. However, the present invention is not limited to this. For example, as shown in FIG.
The same applies to the example arranged inside.

The chemical liquid ejecting device 6 shown in FIG. 7 will be described in more detail. In this example, the conveyor 4 and the chemical liquid ejecting device 6 are disposed in the chemical liquid B in a chemical tank 26 filled with the chemical liquid B in the processing chamber. Therefore, the printed wiring board material A that is conveyed in the chemical solution B stored in the chemical solution tank 26 while being sandwiched between the conveyors 4 such as wheels 5 and rollers.
A fresh chemical solution B is injected into the chemical solution B stored in the chemical solution tank 26 from the slit-shaped injection port 7 of the chemical solution injection device 6 to the thin plate material such as. In this way, a fresher chemical solution B is jetted not in the atmosphere but in the stored chemical solution B. In this processing chamber, for example, the printed wiring board material A is subjected to chemical treatment and chemical treatment such as development, etching, and stripping with a chemical solution B such as a developing solution, a corrosive solution, and a stripping solution. The desired circuit G is formed on the outer surface of the wiring board material A.

By the way, the conveyor 4 and the chemical injection device 6
In the example of FIG. 7, is disposed entirely in the chemical solution B of the chemical solution tank 26, but an example not depending on this is also conceivable. That is, it is necessary and sufficient for the conveyor 4 to transport a thin plate material such as the printed wiring board material A in the chemical solution B in the chemical solution tank 26,
The chemical liquid ejecting device 6 such as the slit-shaped injection port 7 also has a chemical liquid tank 26.
It is necessary and sufficient if a fresh chemical solution B can be sprayed onto a thin plate material such as a printed wiring board material A in the chemical solution B. That is, the conveyor 4 and a part of the chemical liquid ejecting device 6 are
May be arranged in the atmosphere or in the air instead of the chemical solution B. Other configurations, functions, and the like of the chemical liquid ejecting apparatus 6 of the example shown in FIG. Therefore, the same reference numerals are given and the description is omitted. The liquid medicine injection device 6 shown in FIG. 7 is configured as described above.

[0076]

As described above, the chemical liquid ejecting apparatus according to the first, second, and third aspects of the present invention provides the slit-shaped ejecting ports arranged in the left and right width directions, for example, in a curved wave shape or a polygonal wave shape. The following effects are exhibited by adopting a configuration bent forward and backward at a constant pitch.

1) First, bending of a thin plate material such as a printed wiring board material is prevented. That is, the slit-shaped injection port of this chemical liquid injection device has a long total extension distance,
Since the injection is performed in a curved shape or a curtain shape with a long total extension distance, the injection pressure, weight, concentration, and impact of the chemical solution are reduced. Thus, although the sheet material is extremely thin and is a thin sheet material such as a flexible printed wiring board material, it is possible to prevent bending and waist breakage at the jetting point. That is, as in the above-described conventional example, the chemical liquid is ejected in a flat vertical curtain shape, and comes into contact with a sharp, straight, sharp edge having a strong impact and is extremely thin and flexible. It is not possible to cause bending and waist breaks in thin plate materials such as printed wiring board materials.
It is surely prevented.

2) Secondly, it is possible to avoid the occurrence of liquid pool in thin plate materials such as printed wiring board materials.
That is, in this chemical injection device, the first
Therefore, as in the above-described conventional example, the accumulation of the chemical solution at the place where the thin plate material such as the printed wiring board material is bent at the waist is also avoided, and the chemical solution is smoothly updated. Become. Therefore, chemical treatments such as development, etching, and peeling of the thin plate material such as a printed wiring board material and the chemical solution treatment are uniformly performed without excess or shortage, and the occurrence of unevenness and variation is avoided. Therefore, the significance is particularly significant for a printed wiring board in which the density, miniaturization, and precision of a circuit are advanced, for example, the circuit width of a formed circuit is made uniform.

3) Third, smooth conveyance of thin sheet materials such as printed wiring board materials is ensured. That is,
In this chemical liquid ejecting apparatus, the hip break and the liquid pool are eliminated as described in the first and second embodiments. Therefore, as described in the above-described conventional example, due to these factors, an extremely thin and flexible thin sheet material such as a printed wiring board material may meander, warp, jump, or be interrupted during conveyance by the conveyor. The occurrence of a situation where the preceding one folds over the preceding one is reliably avoided. Thin sheet materials such as printed wiring board materials can be smoothly transported as expected.

4) Fourth, the regulation of the injection pressure and the injection amount of the chemical solution is greatly eased. That is, in this chemical liquid ejecting apparatus, the chemical liquid is ejected in the form of a curtain bent in a curved line or a broken line, so that the contact with the object to be ejected is made in a state where the injection pressure, weight, concentration, impact, etc. are reduced. I do. Therefore, although a thin plate material such as an ultra-thin and flexible printed wiring board material is to be ejected, the ejection pressure of the chemical solution can be increased and the ejection amount can be increased as compared with the above-described conventional example. .

5) Fifthly, the speed and speed efficiency of the chemical treatment and the chemical liquid treatment are improved, and the number of chemical liquid ejecting devices can be reduced. That is, in this chemical liquid ejecting apparatus, as described above, the regulation of the injected chemical liquid is greatly relaxed, and the injection pressure can be increased to increase the injection amount. Thus, the speed and speed efficiency of chemical and chemical treatments, such as development, etching, and peeling, of a thin plate material such as a printed wiring board material can be improved as compared with the above-described conventional example of the type described above. In addition, the number of chemical liquid ejecting devices provided in a processing chamber such as a peeling device can be greatly reduced. Thus, the processing chamber can be reduced in size, and equipment costs can be reduced.

Next, the chemical liquid ejecting apparatus according to a fourth aspect of the present invention employs a configuration in which a plurality of liquid ejecting apparatuses are arranged in the transport direction, and the bending pitch of each slit-shaped ejecting port is shifted to the left and right. Thus, the following effects are further exhibited.

6) Sixth, the occurrence of shading in the chemical solution sprayed on a thin plate material such as a printed wiring board material is avoided. That is, by using this slit-shaped injection port, the chemical solution injected from the bent portion forming the left-right direction is thinly sprayed on a thin plate material such as a printed wiring board material, and is injected from the bent portion forming the front-rear direction. The chemical tends to be sprayed densely on a thin plate material such as a printed wiring board material. Therefore, if the bending pitch of each slit-shaped injection port is aligned without shifting from side to side, the above-mentioned tendency is superimposed and strengthened, and the density portion of the chemical liquid sprayed on a thin plate material such as a printed wiring board material is changed. There is a possibility that it will occur. On the other hand, by shifting the bending pitch of each slit-shaped injection port, the occurrence of such dark and light spots is reliably avoided, and the chemical sprayed on the thin plate material such as the printed wiring board material is not entirely dark and light. A uniform state is obtained. Thus, uniform chemical treatment and chemical treatment can be realized from this aspect.

Next, the chemical liquid ejecting apparatus according to the fifth aspect of the present invention is configured such that it can be swung and fixed in the forward and backward transport directions, and the injection angle of the chemical liquid ejected from the slit-shaped injection port can be changed and set. The following effects are exhibited by adopting.

7) Seventh, the spray angle of the chemical solution sprayed from the slit-shaped spray port to a thin plate material such as a printed wiring board material can be appropriately changed. That is, in this chemical liquid ejecting apparatus, the chemical liquid is not only ejected from directly above or directly below the ejection target printed wiring board material or the like at a right ejection angle, but also as needed, for example, about 5 degrees from the right angle. It is also possible to inject at an injection angle slightly inclined back and forth. And when the chemical liquid is sprayed at an inclined spray angle, after the chemical liquid sprayed on the printed wiring board material or the like flows regularly downstream or upstream along the transport direction,
Downstream, it will be collected. Therefore, it is possible to avoid a situation in which the injected chemical liquid is unevenly distributed in the central portion and other portions of the printed wiring board material and the like and becomes a liquid pool that stays eccentrically, thereby preventing the renewal of the chemical liquid. Further, the flow of the chemical solution is not mixedly formed in both directions of the upstream side and the downstream side of the printed wiring board material and the like. Become.

The occurrence of such uneven distribution, offset, stagnation, accumulation of liquid, mixture of flows, and the like of the chemical liquid is correlated with the injection pressure and injection amount of the chemical liquid. While the injection angle is set to be large, the smaller the occurrence of these, the smaller the injection angle and the right angle. By the way, when this chemical liquid ejecting apparatus is used in a manufacturing process of a printed wiring board as a thin plate material, for example,
From the above-mentioned aspects, chemical and chemical treatments such as development, etching, stripping, etc., using a developing solution, corrosive solution, stripping solution, etc., are surely carried out, and the circuit has a higher density, a smaller size, and a higher accuracy. The significance of this is great for printed wiring boards that have remarkably developed.

Further, according to a sixth aspect of the present invention, a chemical liquid ejecting apparatus having a predetermined tubular body, a slit member, and a slit-shaped ejecting port is provided. According to the eighth aspect, by adopting a configuration in which a plurality of bridge portions are bridged, a configuration in which a filter is interposed between the opening of the tubular body and the slit-shaped injection port is employed. The following effects are exhibited by adopting a configuration in which the width of the slit-shaped injection port and the curtain thickness of the chemical solution can be finely adjusted in each of the left and right portions by the fine adjustment mechanism.

8) Eighth, the chemical can be accurately and uniformly injected from the slit-shaped injection port. In other words, in the present invention, the opening of the tubular body is prevented from expanding and contracting due to the liquid pressure of the chemical solution, and the change in the slit width of the slit-shaped injection port is prevented. . According to claim 8, since the filter is interposed between the opening of the tubular body and the slit-shaped outlet, dust mixed in the chemical solution is removed, thereby preventing the slit-shaped outlet from being clogged. . According to the ninth aspect, by finely pushing or pulling the slit member by the fine adjustment mechanism, the front-rear interval of the slit-shaped injection port and the curtain thickness of the injected chemical liquid can be finely adjusted at various positions in the width direction. Has become.
The slit-shaped injection port has a slit width of, for example, about 0.15 mm, and is required to have an accuracy of the order of 0.01 mm. As a result, a highly accurate slit-shaped injection port can be obtained.

As a result, the chemical liquid ejected from the slit-shaped ejection port can be surely uniformly ejected at a uniform ejection pressure and ejection amount, for example, with an accuracy of the order of 0.01 mm, and a uniform constant width with high accuracy. It is in the shape of a curtain and is injected. Therefore, when this chemical liquid ejecting apparatus is used in, for example, a manufacturing process of a printed wiring board as a thin plate material, a chemical liquid such as a developing solution, a corrosive liquid, and a stripping liquid is uniformly jetted, thereby developing, etching, peeling, and the like. The chemical treatment and the chemical treatment can be performed with high accuracy and uniformity. In printed wiring boards, circuit densification, miniaturization, and precision have been remarkably advanced, and the significance of realizing such a reliable, accurate, and uniform chemical / chemical treatment is particularly significant. As described above, the effects exerted by the present invention are remarkable and large, for example, all the problems existing in this type of conventional example are solved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a bottom surface (plane) used for describing an embodiment of the present invention for a chemical liquid ejecting apparatus according to the present invention;
FIG. 1A shows one example, FIG. 2B shows another example, and FIG. 3C shows another example.

FIG. 2 is a schematic diagram of a bottom surface (plane) showing various examples of a slit-shaped injection port for describing the embodiment of the present invention;
(1) Fig. 1 shows the first example, (2) Fig. 2 shows the second example, (3) Fig. 3 shows the third example, (4) Fig. 4 shows the fourth example, (5) Fig. 5 shows the fifth example,
FIG. 6 shows a sixth example, and FIG. 7 shows a seventh example. In addition,
(8) The figure shows a slit-shaped injection port of this type of conventional example.
It is a bottom (plane) schematic diagram.

FIG. 3 is a side sectional view of the entirety provided for describing the embodiment of the present invention.

FIG. 4 is a side sectional view of a main part, which is used for describing the embodiment of the present invention. FIG. 2 shows a slit member, a fine adjustment mechanism, and the like.

FIGS. 5A and 5B are views for explaining the embodiment of the present invention, wherein FIG. 1A is a front view of the whole, FIG. 5B is a side sectional view of the whole, and FIG. Figure and (4)
It is a top view of a slit member.

FIGS. 6A and 6B are views for explaining the embodiment of the present invention, in which FIG. 1A is a bottom view of one example of an opening of a tube, and FIG. FIG.

FIG. 7 is a side view for explaining the embodiment of the present invention and showing an example in which the chemical liquid ejecting device is provided in the chemical liquid.

FIG. 8 is an overall side view for explaining a conventional example of this type recently developed.

FIGS. 9A and 9B are illustrations of a conventional example of this type, in which FIG. 1A is a side sectional view of a main part, FIG. 9B is a front view of the main part, and FIG.

FIGS. 10A and 10B are views for explaining a conventional example of this type, in which FIG. 1A is a schematic plan view (bottom surface), and FIG.

FIG. 11 is an explanatory plan view of a printed wiring board (material).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chemical liquid injection device (this type of conventional example) 2 Slit-shaped injection port (this type of conventional example) 3 Pipe 4 Conveyor 5 Wheel 6 Chemical liquid injection device (of the present invention) 7 Slit-shaped injection port (of the present invention) 8) Push screw 9 Pull screw 10 Tube 11 Slit member 12 Opening part 13 Liquid port 14 Bridge part 15 Plate wall 16 Mounting screw 17 Concave part 18 Filter 19 Fine adjustment mechanism 20 Through hole 21 Screw hole 22 Protractor scale 23 Plate body 24 pin 25 Protractor needle 26 Chemical bath A Printed wiring board material (thin plate material) B Chemical solution C Transport direction D Width direction E Hip break F Liquid pool G Circuit H Printed wiring board (thin plate material) K Gap space M Adhesion

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/06 H01L 21/30 569A 5F046 F term (Reference) 2H096 AA00 AA26 GA21 HA19 HA20 LA02 LA03 4F035 AA04 BC06 CB13 CC02 CD03 4F041 AA02 AA06 BA12 BA15 4K057 WA11 WB04 WM06 WM09 WM20 WN01 5E339 AD03 BE13 BE16 5F046 LA04 MA10

Claims (10)

[Claims] 1. A chemical liquid ejecting apparatus for performing chemical treatment by injecting a chemical solution onto a conveyed thin plate material, comprising a slit-shaped ejection port, wherein the slit-shaped ejection port is a conveyed thin sheet material. On the other hand, opposed to cover the left and right width directions, not the front and rear transport directions, the liquid medicine is sprayed in the form of a vertical curtain toward the outer surface of the thin plate material, and the slit-shaped injection port is A chemical liquid ejecting apparatus characterized in that the liquid medicine is formed not to be linear, but to be bent back and forth at a constant pitch, and to inject the liquid medicine in a curtain shape bent back and forth. 2. The chemical liquid ejecting apparatus according to claim 1, wherein the slit-shaped injection port has a curved wave shape, and ejects the chemical liquid in a curtain shape having a curved front and rear. apparatus. 3. The chemical liquid ejecting apparatus according to claim 1, wherein the slit-shaped ejection port has a triangular wave, a trapezoidal wave, a rectangular wave,
A chemical liquid ejecting apparatus, which has a polygonal wave shape such as a saw-tooth wave, and injects the chemical solution in a curtain shape that forms a polygonal line back and forth. 4. The chemical liquid ejecting apparatus according to claim 1, wherein a plurality of the chemical liquid ejecting apparatuses are arranged at intervals in the conveying direction before and after the thin plate material, and at least between the adjacent mutual parts. , The bending pitch of the slit-shaped injection port is shifted in the left and right width directions. 5. The chemical liquid ejecting apparatus according to claim 1, wherein the chemical liquid ejecting apparatus is capable of swinging back and forth around the attached shaft as a whole in the transport direction of the thin plate material. A chemical liquid ejecting apparatus characterized in that it can be fixed at an appropriate swing angle, and the injection angle with respect to the thin plate material can be changed and set for the chemical liquid injected from the slit-shaped injection port. 6. The chemical liquid ejecting apparatus according to claim 1, wherein the chemical liquid ejecting apparatus is connected to a pipe for pressure-feeding the chemical liquid and is disposed along the left and right width directions. ,
A pair of front and rear slit members tightly assembled to the tube body, and an extremely thin bent front and rear gap between the two slit members and communicating with an opening formed in the tube body. And a slit-shaped injection port. 7. The chemical liquid ejecting apparatus according to claim 6, wherein the opening of the tubular body is formed by one long hole formed along the left and right width directions, and prevents the opening from expanding and contracting. A plurality of bridge portions for the chemical liquid are interposed at appropriate intervals on the way. 8. The chemical liquid ejecting apparatus according to claim 6, wherein a filter is interposed between the opening of the tubular body and the slit-shaped injection port. 9. The chemical liquid ejecting apparatus according to claim 6, wherein a pair of front and rear plate walls for accommodating the slit members are provided along the left and right width directions in the pipe body. Has a plurality of through holes formed at intervals in the width direction on the left and right sides, and it is possible to apply a pressing force to the slit member in each of the through holes in the plate wall on one side. A push screw is inserted into the through hole of the plate wall on the other side, and a tension screw capable of applying a tensile force to the slit member is inserted into the through hole. An adjusting mechanism is formed, so that the width of the extremely thin front-rear space of the slit-shaped injection port can be finely adjusted at various places in the width direction on the left and right, and before and after the chemical solution injected at the slit-shaped injection port. The curtain thickness can be finely adjusted, Injection device. 10. The method of claim 1, 2, 3, 5, 6, 7, 8,
Or the chemical liquid ejecting apparatus according to 9, wherein the chemical liquid ejecting apparatus is used in a manufacturing process of a printed wiring board, and the thin plate material is made of a printed wiring board material having a circuit formed on an outer surface thereof; Wherein a developer, a corrosive liquid, a stripping liquid, or the like is used.