TWI575641B - Wet chemistry process apparatus - Google Patents

Wet chemistry process apparatus Download PDF

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Publication number
TWI575641B
TWI575641B TW105117311A TW105117311A TWI575641B TW I575641 B TWI575641 B TW I575641B TW 105117311 A TW105117311 A TW 105117311A TW 105117311 A TW105117311 A TW 105117311A TW I575641 B TWI575641 B TW I575641B
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Taiwan
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water
liquid
flow channels
oblique
water flow
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TW105117311A
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Chinese (zh)
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TW201743396A (en
Inventor
黃榮龍
呂峻杰
陳瀅如
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盟立自動化股份有限公司
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Priority to TW105117311A priority Critical patent/TWI575641B/en
Priority to CN201610440307.2A priority patent/CN107459263A/en
Priority to CN201620602647.6U priority patent/CN205740751U/en
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Publication of TWI575641B publication Critical patent/TWI575641B/en
Publication of TW201743396A publication Critical patent/TW201743396A/en

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075Cleaning of glass

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)

Description

溼式製程設備Wet process equipment

本發明關於一種溼式製程設備,尤指一種可於製程中減少對基板的磨耗及可對基板進行雙面製程的溼式製程設備。The invention relates to a wet process equipment, in particular to a wet process equipment capable of reducing wear on a substrate and performing double-sided processing on a substrate in a process.

一般而言,業界多採用溼式製程來對觸控面板的玻璃基板進行加工,溼式製程例如為將玻璃基板經過蝕刻製程進行圖案化的蝕刻或是經過清先製程進行表面清洗等。當玻璃基板在進行上述的溼式製程時,多利用滾輪同時對玻璃基板的板體及從板體延伸的側邊部進行固定與輸送。因此,在玻璃基板與滾輪接觸的一面,滾輪容易對玻璃基板(包含板體及從板體延伸的側邊部)磨耗,另外玻璃基板與滾輪接觸的一面也因滾輪的設置而無法有效進行溼式製程,即習知利用滾輪對玻璃基板進行固定與輸送的作法,僅可對玻璃基板進行單面製程。In general, the wet process is used in the industry to process the glass substrate of the touch panel. For example, the wet process is performed by etching the glass substrate through an etching process or by surface cleaning. When the glass substrate is subjected to the above-described wet process, the plate body of the glass substrate and the side portions extending from the plate body are simultaneously fixed and conveyed by the roller. Therefore, on the side where the glass substrate is in contact with the roller, the roller easily wears the glass substrate (including the plate body and the side portion extending from the plate body), and the side of the glass substrate in contact with the roller is also not effectively wetted by the arrangement of the roller. The process, that is, the conventional method of fixing and conveying the glass substrate by using a roller, can only perform single-sided processing on the glass substrate.

因此,本發明提供一種可於製程中減少對基板的磨耗及可對基板進行雙面製程的溼式製程設備,以解決上述問題。Therefore, the present invention provides a wet process apparatus capable of reducing wear on a substrate and performing a double-sided process on a substrate in a process to solve the above problems.

為了達成上述目的,本發明揭露一種溼式製程設備,可用以支撐一基板,該基板具有一板體部及一側邊部,該側邊部延伸於該板體部,該板體部具有一上表面及相對於該上表面之一下表面,該溼式製程設備包含一槽體、複數個導輪、複數個液浮載板以及一水路模組,該槽體用以容置該基板,該複數個導輪設置於該槽體內,該複數個導輪對應於該側邊部並用以支撐該基板的該側邊部,該複數個液浮載板設置於該下表面下方,該複數個液浮載板用以對該下表面噴射一處理液,以於該下表面與該複數個液浮載板間形成一薄膜層流,該薄膜層流用以液浮支撐該板體部,該水路模組耦接於該複數個液浮載板,該水路模組控制該複數個液浮載板產生能沿一輸送方向流動之該薄膜層流或產生能沿相反於該輸送方向之一回復方向流動之該薄膜層流。In order to achieve the above object, the present invention discloses a wet process apparatus for supporting a substrate having a plate body portion and a side edge portion extending from the plate body portion, the plate body portion having a The upper surface of the upper surface and the lower surface of the upper surface, the wet processing apparatus includes a tank body, a plurality of guide wheels, a plurality of liquid floating carrier plates, and a water channel module, wherein the tank body is used for accommodating the substrate, a plurality of guide wheels are disposed in the slot body, the plurality of guide wheels corresponding to the side portions and configured to support the side portions of the substrate, the plurality of liquid floating carriers are disposed below the lower surface, the plurality of liquids The floating carrier is configured to spray a processing liquid on the lower surface to form a laminar laminar flow between the lower surface and the plurality of liquid floating carriers, the laminar flow for liquid floating supporting the plate body portion, the water channel mode The group is coupled to the plurality of liquid floating carriers, the water circuit module controlling the plurality of liquid floating carriers to generate a laminar flow of the film that can flow in a conveying direction or to generate a flow in a direction opposite to a direction opposite to the conveying direction The film laminar flow.

根據本發明其中之一實施方式,該水路模組包含複數個第一斜行水流通道以及複數個第二斜行水流通道,該複數個第一斜行水流通道的走向斜交於該輸送方向與該回復方向,該複數個第一斜行水流通道用以將該處理液以一第一出水方向噴出,該第一出水方向與該輸送方向的內積值大於零,該複數個第二斜行水流通道的走向斜交於該輸送方向與該回復方向,該複數個第二斜行水流通道用以將該處理液以一第二出水方向噴出,該第二出水方向與該回復方向的內積值大於零。According to one embodiment of the present invention, the waterway module includes a plurality of first oblique flow channels and a plurality of second oblique flow channels, and the plurality of first oblique flow channels are obliquely intersected in the conveying direction In the return direction, the plurality of first oblique water flow channels are used to spray the treatment liquid in a first water discharge direction, and the inner product value of the first water discharge direction and the transport direction is greater than zero, and the plurality of second oblique lines The direction of the water flow channel is oblique to the conveying direction and the returning direction, and the plurality of second oblique water flow channels are used for spraying the processing liquid in a second water discharge direction, and the inner product of the second water discharging direction and the returning direction The value is greater than zero.

根據本發明其中之一實施方式,該水路模組另包含一供水泵、一第一水路以及一第二水路,該供水泵用以供給該處理液,該第一水路連接該複數個第一斜行水流通道與該供水泵,該供水泵所供給的該處理液經由該第一水路進入該複數個第一斜行水流通道,該第二水路連接該複數個第二斜行水流通道與該供水泵,該供水泵所供給的該處理液經由該第二水路進入該複數個第二斜行水流通道。According to one embodiment of the present invention, the waterway module further includes a water supply pump, a first waterway and a second waterway, wherein the water supply pump supplies the processing liquid, and the first waterway connects the plurality of first obliques a water flow channel and the water supply pump, the processing liquid supplied by the water supply pump enters the plurality of first oblique water flow channels via the first water path, and the second water path connects the plurality of second oblique water flow channels and the supply a water pump, the processing liquid supplied by the water supply pump enters the plurality of second oblique water flow channels via the second water path.

根據本發明其中之一實施方式,該水路模組另包含一第一止水閥以及一第二止水閥,該第一止水閥耦接於該第一水路,該第一止水閥用以選擇性地阻止該供水泵所供給的該處理液經由該第一水路進入該複數個第一斜行水流通道,該第二止水閥耦接於該第二水路,該第二止水閥用以選擇性地阻止該供水泵所供給的該處理液經由該第二水路進入該複數個第二斜行水流通道。According to one embodiment of the present invention, the waterway module further includes a first water stop valve and a second water stop valve, the first water stop valve is coupled to the first waterway, and the first water stop valve is The second water stopping valve is coupled to the second water stopping channel, the second water stopping valve is configured to selectively block the processing liquid supplied by the water supply pump from entering the plurality of first oblique water flow passages through the first water passage And a method for selectively preventing the processing liquid supplied by the water supply pump from entering the plurality of second oblique water flow passages via the second water passage.

根據本發明其中之一實施方式,該複數個第一斜行水流通道形成於一部分的該複數個液浮載板上,且該複數個第二斜行水流通道形成於另一部分的該複數個液浮載板上。According to one embodiment of the present invention, the plurality of first oblique flow channels are formed on a portion of the plurality of liquid floating carriers, and the plurality of second oblique flow channels are formed in the other portion of the plurality of liquids Floating on the board.

根據本發明其中之一實施方式,該部分的該複數個液浮載板與該另一部分的該複數個液浮載板交錯設置。According to one embodiment of the invention, the plurality of liquid floating carrier plates of the portion are interleaved with the plurality of liquid floating carrier plates of the other portion.

根據本發明其中之一實施方式,該複數個第一斜行水流通道與該複數個第二斜行水流通道分別形成於各液浮載板上。According to one embodiment of the present invention, the plurality of first oblique flow channels and the plurality of second oblique flow channels are formed on each of the liquid floating carriers.

根據本發明其中之一實施方式,該水路模組包含複數個第一循環水流通道以及複數個第二循環水流通道,該複數個第一循環水流通道用以選擇性地將該處理液噴出或吸入,該複數個第二循環水流通道用以選擇性地將該處理液噴出或吸入,當該複數個第一循環水流通道噴出該處理液時,該複數個第二循環水流通道吸入該複數個第一循環水流通道所噴出的該處理液,使該處理液經由該複數個第一循環水流通道與該複數個第二循環水流通道產生沿該輸送方向流動之該薄膜層流,當該複數個第二循環水流通道噴出該處理液時,該複數個第一循環水流通道吸入該複數個第二循環水流通道所噴出的該處理液,使該處理液經由該複數個第二循環水流通道與該複數個第一循環水流通道產生沿該回復方向流動之該薄膜層流。According to one embodiment of the present invention, the waterway module includes a plurality of first circulating water flow channels and a plurality of second circulating water flow channels, and the plurality of first circulating water flow channels are configured to selectively spray or inhale the processing liquid The plurality of second circulating water flow channels are configured to selectively eject or inhale the processing liquid, and when the plurality of first circulating water flow channels eject the processing liquid, the plurality of second circulating water flow channels inhale the plurality of The treatment liquid sprayed from a circulating water flow passage causes the treatment liquid to generate the laminar flow of the film flowing in the conveying direction through the plurality of first circulating water flow channels and the plurality of second circulating water flow channels, when the plurality of When the two circulating water flow channels eject the processing liquid, the plurality of first circulating water flow channels suck the processing liquid sprayed by the plurality of second circulating water flow channels, so that the processing liquid passes through the plurality of second circulating water flow channels and the plural The first circulating water flow channels produce a laminar flow of the film flowing in the recovery direction.

根據本發明其中之一實施方式,該水路模組另包含一第一供水泵、一第一水路、一第二供水泵以及一第二水路,該第一供水泵用以供給該處理液或將該處理液吸入,該第一水路連接該複數個第一循環水流通道與該第一供水泵,該第一供水泵所供給的該處理液經由該第一水路進入該複數個第一循環水流通道,或該第一供水泵將該處理液經由該第一水路由該複數個第一循環水流通道吸入,該第二供水泵用以供給該處理液或將該處理液吸入,該第二水路連接該複數個第二循環水流通道與該第二供水泵,該第二供水泵所供給的該處理液經由該第二水路進入該複數個第二循環水流通道,或該第二供水泵將該處理液經由該第二水路由該複數個第二循環水流通道吸入。According to one embodiment of the present invention, the waterway module further includes a first water supply pump, a first waterway, a second water supply pump, and a second waterway, the first water supply pump is configured to supply the processing liquid or The first water channel is connected to the plurality of first circulating water flow channels and the first water supply pump, and the processing liquid supplied by the first water supply pump enters the plurality of first circulating water flow channels via the first waterway Or the first water supply pump draws the treatment liquid through the first water to the plurality of first circulating water flow channels, and the second water supply pump supplies the treatment liquid or inhales the treatment liquid, and the second water connection The plurality of second circulating water flow channels and the second water supply pump, the processing liquid supplied by the second water supply pump enters the plurality of second circulating water flow channels via the second water path, or the second water supply pump processes the processing The liquid is routed through the plurality of second circulating water flow passages via the second water.

綜上所述,本發明溼式製程設備的導輪僅對應基板的側邊部,而基板的板體部係利用液浮載板所產生的薄膜層流來液浮支撐,因此本發明溼式製程設備的導輪便不會接觸基板的板體部,進而減少對基板的板體部的磨耗。除此之外,本發明溼式製程設備的液浮載板所噴射的處理液可為一蝕刻液或一清洗液,亦即本發明溼式製程設備除了可利用一水刀噴頭(未繪示於圖中)對基板的板體部的上表面進行蝕刻或清洗等的溼式製程外,本發明溼式製程設備亦可利用液浮載板對基板的板體部的下表面噴射處理液,以對板體部的下表面也進行蝕刻或清洗等的溼式製程,從而使本發明溼式製程設備達到對基板進行雙面溼式製程的目的。有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之實施例的詳細說明中,將可清楚的呈現。In summary, the guide wheel of the wet process apparatus of the present invention only corresponds to the side portion of the substrate, and the plate body portion of the substrate is supported by the laminar flow of the film generated by the liquid floating carrier plate, so that the wet type of the present invention The guide wheel of the process device does not contact the plate body portion of the substrate, thereby reducing the wear on the plate body portion of the substrate. In addition, the processing liquid sprayed by the liquid floating carrier of the wet processing apparatus of the present invention may be an etching liquid or a cleaning liquid, that is, the wet processing apparatus of the present invention can use a water jet nozzle (not shown). In the wet process of etching or cleaning the upper surface of the plate body portion of the substrate, the wet process apparatus of the present invention can also spray the treatment liquid onto the lower surface of the plate body portion of the substrate by using the liquid floating carrier plate. The wet process of etching or cleaning the lower surface of the plate body is also performed, so that the wet process equipment of the present invention achieves the purpose of performing a two-sided wet process on the substrate. The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention.

以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。請參閱第1圖以及第2圖,第1圖為本發明第一實施例一溼式製程設備1000的俯視示意圖,第2圖為第1圖所示的溼式製程設備1000沿剖面線X-X且處於一第一液浮態樣的剖視示意圖。如第1圖以及第2圖所示,溼式製程設備1000可用以支撐一基板1,基板1具有一板體部10及一側邊部11,側邊部11延伸於板體部10,板體部10具有一上表面101及相對於上表面101之一下表面102。於此實施例中,基板1可為一觸控面板的玻璃基板,而溼式製程設備1000可用以對該玻璃基板進行一溼式製程,該溼式製程例如可為將該玻璃基板經過蝕刻製程進行圖案化的蝕刻或是經過清先製程進行表面清洗等。The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic plan view of a wet process equipment 1000 according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view XX of the wet process equipment 1000 shown in FIG. 1 . A schematic cross-sectional view of a first liquid float. As shown in FIG. 1 and FIG. 2, the wet process apparatus 1000 can be used to support a substrate 1 having a plate portion 10 and a side portion 11 extending from the plate portion 10, the plate The body 10 has an upper surface 101 and a lower surface 102 opposite the upper surface 101. In this embodiment, the substrate 1 can be a glass substrate of a touch panel, and the wet processing apparatus 1000 can be used to perform a wet process on the glass substrate, for example, the glass substrate can be subjected to an etching process. Perform pattern etching or surface cleaning after a clear process.

另外,溼式製程設備1000包含一槽體2、複數個導輪3、複數個液浮載板4以及一水路模組5,槽體2用以容置基板1,複數個導輪3設置於槽體2內,且複數個導輪3對應於基板1的側邊部11並用以支撐側邊部11,複數個液浮載板4設置於板體部10的下表面102下方,且複數個液浮載板4用以對下表面102噴射一處理液6,以於下表面102與複數個液浮載板4間形成一薄膜層流6',其中薄膜層流6'可用以液浮支撐基板1的板體部10,水路模組5耦接於複數個液浮載板4,水路模組5控制複數個液浮載板4產生能沿一輸送方向X1流動之薄膜層流6'或產生能沿相反於輸送方向X1之一回復方向X2流動之薄膜層流6'。另外,槽體2上形成有一入口20及一出口21,使導輪3可將基板1經由入口20送入槽體2內,或使導輪3可將基板1經由出口21送出槽體2外。In addition, the wet process equipment 1000 includes a tank body 2, a plurality of guide wheels 3, a plurality of liquid floating carrier plates 4, and a waterway module 5, the tank body 2 is for accommodating the substrate 1, and the plurality of guide wheels 3 are disposed on In the tank body 2, a plurality of guide wheels 3 correspond to the side portions 11 of the substrate 1 and support the side portions 11, and a plurality of liquid floating carriers 4 are disposed below the lower surface 102 of the board portion 10, and a plurality of The liquid floating carrier 4 is configured to spray a processing liquid 6 on the lower surface 102 to form a thin film laminar flow 6' between the lower surface 102 and the plurality of liquid floating carrier plates 4, wherein the thin film laminar flow 6' can be used for liquid floating support. The plate body portion 10 of the substrate 1 is coupled to a plurality of liquid floating carrier plates 4, and the water channel module 5 controls a plurality of liquid floating carrier plates 4 to generate a laminar flow 6' which can flow in a conveying direction X1 or A thin film laminar flow 6' is produced which can flow in a recovery direction X2 opposite to the transport direction X1. In addition, the inlet body 20 and the outlet 21 are formed on the tank body 2, so that the guide wheel 3 can feed the substrate 1 into the tank body 2 via the inlet 20, or the guide wheel 3 can send the substrate 1 out of the tank body 2 via the outlet 21. .

綜上所述,本發明溼式製程設備1000的液浮載板4所產生的薄膜層流6'可液浮支撐基板1的板體部10,且本發明溼式製程設備1000的導輪3可支撐基板1的側邊部11,進而使基板1可穩固地於槽體2內進行溼式製程。另外,本發明溼式製程設備1000的導輪3僅對應基板1的側邊部11,而基板1的板體部10係利用液浮載板4所產生的薄膜層流6'來液浮支撐,因此本發明溼式製程設備1000便可減少對基板1的板體部10的接觸,進而減少對基板1的板體部10的磨耗。除此之外,本發明溼式製程設備1000的液浮載板4所噴射的處理液6可為一蝕刻液或一清洗液,亦即本發明溼式製程設備1000除了可利用一水刀噴頭(未繪示於圖中)對基板1的板體部10的上表面101進行蝕刻或清洗等的溼式製程外,本發明溼式製程設備1000亦可利用液浮載板4對基板1的板體部10的下表面102噴射處理液6,以對板體部10的下表面102也進行蝕刻或清洗等的溼式製程,從而使本發明溼式製程設備1000達到對基板1進行雙面溼式製程的目的。In summary, the thin film laminar flow 6' produced by the liquid floating carrier 4 of the wet processing apparatus 1000 of the present invention can float the support body portion 10 of the substrate 1 and the guide wheel 3 of the wet process apparatus 1000 of the present invention. The side portion 11 of the substrate 1 can be supported, so that the substrate 1 can be stably wet-processed in the tank 2. In addition, the guide wheel 3 of the wet process apparatus 1000 of the present invention only corresponds to the side portion 11 of the substrate 1, and the plate body portion 10 of the substrate 1 is supported by the thin film laminar flow 6' generated by the liquid floating carrier 4. Therefore, the wet process apparatus 1000 of the present invention can reduce the contact with the board portion 10 of the substrate 1, thereby reducing the wear on the board portion 10 of the substrate 1. In addition, the processing liquid 6 sprayed by the liquid floating carrier 4 of the wet processing apparatus 1000 of the present invention may be an etching liquid or a cleaning liquid, that is, the wet processing apparatus 1000 of the present invention can utilize a water jet nozzle. (not shown in the drawing) The wet process apparatus 1000 of the present invention can also use the liquid floating carrier 4 to the substrate 1 in addition to the wet process of etching or cleaning the upper surface 101 of the board portion 10 of the substrate 1. The lower surface 102 of the plate body portion 10 ejects the processing liquid 6 to perform a wet process such as etching or cleaning the lower surface 102 of the plate body portion 10, thereby causing the wet process apparatus 1000 of the present invention to achieve double-sided substrate 1 The purpose of the wet process.

請參閱第1圖至第3圖,第3圖為本發明第一實施例溼式製程設備1000處於一第二液浮態樣的剖視示意圖。如第1圖至第3圖所示,水路模組5包含複數個第一斜行水流通道50、複數個第二斜行水流通道51、一供水泵52、一第一水路53、一第二水路54、一第一止水閥55以及一第二止水閥56,各第一斜行水流通道50的走向斜交於輸送方向X1與回復方向X2,使第一斜行水流通道50可用以將處理液6以一第一出水方向Y1噴出,其中第一出水方向Y1與輸送方向X1的內積值大於零,即第一出水方向Y1在輸送方向X1的投影分量與輸送方向X1同向。各第二斜行水流通道51的走向斜交於輸送方向X1與回復方向X2,使第二斜行水流通道51可用以將處理液6以一第二出水方向Y2噴出,其中第二出水方向Y2與回復方向X2的內積值大於零,即第二出水方向Y2在回復方向X2的投影分量與回復方向X2同向。Please refer to FIG. 1 to FIG. 3 . FIG. 3 is a cross-sectional view showing the second liquid floating state of the wet process equipment 1000 according to the first embodiment of the present invention. As shown in FIG. 1 to FIG. 3, the waterway module 5 includes a plurality of first oblique flow channels 50, a plurality of second oblique flow channels 51, a water supply pump 52, a first water path 53, and a second. The water path 54, a first water stop valve 55 and a second water stop valve 56, the direction of each of the first oblique water flow passages 50 is oblique to the conveying direction X1 and the recovery direction X2, so that the first oblique water flow passage 50 can be used. The treatment liquid 6 is ejected in a first water discharge direction Y1, wherein the inner product value of the first water discharge direction Y1 and the transport direction X1 is greater than zero, that is, the projection component of the first water discharge direction Y1 in the transport direction X1 is in the same direction as the transport direction X1. The direction of each of the second oblique flow passages 51 is oblique to the conveying direction X1 and the recovery direction X2, so that the second oblique flow passage 51 can be used to spray the treatment liquid 6 in a second discharge direction Y2, wherein the second outlet direction Y2 The inner product value with the return direction X2 is greater than zero, that is, the projected component of the second water discharge direction Y2 in the return direction X2 is in the same direction as the return direction X2.

另外,供水泵52用以供給處理液6,第一水路53連接第一斜行水流通道50與供水泵52,使供水泵52所供給的處理液6能經由第一水路53進入第一斜行水流通道50,第二水路54連接第二斜行水流通道51與供水泵52,使供水泵52所供給的處理液6能經由第二水路54進入第二斜行水流通道51。第一止水閥55耦接於第一水路53,且第一止水閥55可用以選擇性地阻止供水泵52所供給的處理液6經由第一水路53進入第一斜行水流通道50,第二止水閥56耦接於第二水路54,且第二止水閥56可用以選擇性地阻止供水泵52所供給的處理液6經由第二水路54進入第二斜行水流通道51。Further, the water supply pump 52 supplies the treatment liquid 6, and the first water passage 53 connects the first oblique flow passage 50 and the water supply pump 52, so that the treatment liquid 6 supplied from the water supply pump 52 can enter the first oblique line via the first water passage 53. The water flow passage 50 and the second water passage 54 connect the second oblique flow passage 51 and the water supply pump 52, so that the treatment liquid 6 supplied from the water supply pump 52 can enter the second oblique flow passage 51 via the second water passage 54. The first water stop valve 55 is coupled to the first water passage 53 , and the first water stop valve 55 can be used to selectively prevent the processing liquid 6 supplied from the water supply pump 52 from entering the first oblique water flow passage 50 via the first water passage 53 . The second water stop valve 56 is coupled to the second water passage 54 , and the second water stop valve 56 can be used to selectively prevent the treatment liquid 6 supplied from the water supply pump 52 from entering the second oblique water flow passage 51 via the second water passage 54 .

如第2圖所示,當第一止水閥55開啟而第二止水閥56關閉時,第一止水閥55不阻止供水泵52所供給的處理液6能經由第一水路53進入第一斜行水流通道50,因此第一斜行水流通道50便可將處理液6以第一出水方向Y1噴出,而第二止水閥56阻止供水泵52所供給的處理液6經由第二水路54進入第二斜行水流通道51,因此第二斜行水流通道51便無處理液6供應。此時,由第一斜行水流通道50以第一出水方向Y1噴出的處理液6便可在板體部10的下表面102與液浮載板4間形成沿輸送方向X1流動的薄膜層流6',使基板1能被薄膜層流6'帶動而往輸送方向X1移動。As shown in FIG. 2, when the first water stop valve 55 is opened and the second water stop valve 56 is closed, the first water stop valve 55 does not prevent the treatment liquid 6 supplied from the water supply pump 52 from entering the first water passage 53. The water flow passage 50 is inclined, so that the first inclined water flow passage 50 can discharge the treatment liquid 6 in the first water discharge direction Y1, and the second water stop valve 56 prevents the treatment liquid 6 supplied from the water supply pump 52 from passing through the second water passage. 54 enters the second oblique flow passage 51, so that the second oblique flow passage 51 is supplied without the treatment liquid 6. At this time, the treatment liquid 6 ejected from the first oblique flow passage 50 in the first discharge direction Y1 can form a laminar flow of the film flowing in the conveying direction X1 between the lower surface 102 of the plate portion 10 and the liquid floating carrier 4. 6', the substrate 1 can be moved by the film laminar flow 6' to move in the transport direction X1.

反之,如第3圖所示,當第一止水閥55關閉而第二止水閥56開啟時,第一止水閥55阻止供水泵52所供給的處理液6能經由第一水路53進入第一斜行水流通道50,因此第一斜行水流通道50便無處理液6供應,而第二止水閥56不阻止供水泵52所供給的處理液6經由第二水路54進入第二斜行水流通道51,因此第二斜行水流通道51便可將處理液6以第二出水方向Y2噴出。此時,由第二斜行水流通道51以第二出水方向Y2噴出的處理液6便可在板體部10的下表面102與液浮載板4間形成沿回復方向X2流動的薄膜層流6',使基板1能被薄膜層流6'帶動而往回復方向X2移動。如此一來,本發明溼式製程設備1000便於槽體2內將基板1沿輸送方向X1移動,或本發明溼式製程設備1000亦可於槽體2內將基板1沿輸送方向X1與回復方向X2作往復運動,以增加溼式製程的作用時間,端視實際需求而定。On the other hand, as shown in FIG. 3, when the first water stop valve 55 is closed and the second water stop valve 56 is opened, the first water stop valve 55 prevents the treatment liquid 6 supplied from the water supply pump 52 from entering through the first water passage 53. The first oblique flow passage 50, so that the first oblique flow passage 50 is not supplied with the treatment liquid 6, and the second check valve 56 does not prevent the treatment liquid 6 supplied from the water supply pump 52 from entering the second oblique passage via the second water passage 54. Since the water flow passage 51 is provided, the second oblique flow passage 51 can discharge the treatment liquid 6 in the second discharge direction Y2. At this time, the treatment liquid 6 ejected by the second oblique flow passage 51 in the second discharge direction Y2 can form a laminar flow of the film flowing in the recovery direction X2 between the lower surface 102 of the plate portion 10 and the liquid floating carrier 4. 6', the substrate 1 can be driven by the film laminar flow 6' to move in the recovery direction X2. In this way, the wet process apparatus 1000 of the present invention facilitates moving the substrate 1 in the transport direction X1 in the tank body 2, or the wet process apparatus 1000 of the present invention can also move the substrate 1 along the transport direction X1 and the return direction in the tank body 2. X2 is reciprocated to increase the duration of the wet process, depending on actual needs.

於此實施例中,第一斜行水流通道50是形成於一部分的液浮載板4上,第二斜行水流通道51是形成於另一部分的液浮載板4上,且該部分的液浮載板4與該另一部分的液浮載板4彼此交錯,即第一斜行水流通道50與第二斜行水流通道51是形成於不同的液浮載板4上,且形成有第一斜行水流通道50的液浮載板4與形成有第二斜行水流通道51的液浮載板4彼此交錯設置。而本發明第一斜行水流通道50與第二斜行水流通道51的設置可不侷限於此實施例圖式所繪示。In this embodiment, the first oblique flow passage 50 is formed on a portion of the liquid floating carrier 4, and the second oblique flow passage 51 is formed on the liquid floating carrier 4 of another portion, and the liquid of the portion The floating carrier 4 and the other portion of the liquid floating carrier 4 are staggered with each other, that is, the first oblique flow channel 50 and the second oblique flow channel 51 are formed on different liquid floating carrier plates 4, and are formed first. The liquid floating carrier 4 of the oblique flow passage 50 and the liquid floating carrier 4 formed with the second oblique flow passage 51 are alternately arranged with each other. The arrangement of the first oblique flow channel 50 and the second oblique flow channel 51 of the present invention may not be limited to the embodiment of the embodiment.

舉例來說,請參閱第4圖以及第5圖,第4圖為本發明第二實施例一溼式製程設備1000'處於一第一液浮態樣的剖視示意圖,第5圖為本發明第二實施例溼式製程設備1000'處於一第二液浮態樣的剖視示意圖。如第4圖以及第5圖所示,溼式製程設備1000'與上述溼式製程設備1000的主要不同處在於,溼式製程設備1000'的第一斜行水流通道50與第二斜行水流通道51分別形成於各液浮載板4上,即溼式製程設備1000'的各液浮載板4上分別形成有第一斜行水流通道50與第二斜行水流通道51。而此實施例與上述實施例中具有相同標號之元件,其具有相同之結構設計與作用原理,為求簡潔,於此不再贅述。For example, referring to FIG. 4 and FIG. 5, FIG. 4 is a cross-sectional view showing a first liquid floating state of a wet processing apparatus 1000' according to a second embodiment of the present invention, and FIG. 5 is a view of the present invention. The second embodiment of the wet process apparatus 1000' is in a schematic cross-sectional view of a second liquid floating state. As shown in FIGS. 4 and 5, the main difference between the wet process apparatus 1000' and the wet process apparatus 1000 described above is that the first oblique flow passage 50 and the second oblique flow of the wet process apparatus 1000' The channels 51 are respectively formed on the respective liquid floating carriers 4, that is, the respective liquid floating carriers 4 of the wet processing apparatus 1000' are respectively formed with a first oblique water flow channel 50 and a second oblique water flow channel 51. The components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for brevity.

請參閱第6圖以及第7圖,第6圖為本發明第三實施例一溼式製程設備1000''處於一第一液浮態樣的剖視示意圖,第7圖為本發明第三實施例溼式製程設備1000''處於一第二液浮態樣的剖視示意圖。如第6圖以及第7圖所示,溼式製程設備1000''的一水路模組5'包含複數個第一循環水流通道57、複數個第二循環水流通道58、一第一供水泵59、一第一水路5A、一第二供水泵5B以及一第二水路5C,第一循環水流通道57用以選擇性地將處理液6噴出或吸入,第二循環水流通道58用以選擇性地將處理液6噴出或吸入,第一供水泵59與第二供水泵5B用以供給處理液6或將處理液6吸入,第一水路5A連接第一循環水流通道57與第一供水泵59,使第一供水泵59所供給的處理液6能經由第一水路5A進入第一循環水流通道57,或者是第一供水泵59能將處理液6經由第一水路5A由第一循環水流通道57吸入,第二水路5C連接第二循環水流通道58與第二供水泵5B,使第二供水泵5B所供給的處理液6能經由第二水路5C進入第二循環水流通道58,或者是第二供水泵5B能將處理液6經由第二水路5C由第二循環水流通道58吸入。而此實施例與上述實施例中具有相同標號之元件,其具有相同之結構設計與作用原理,為求簡潔,於此不再贅述。Please refer to FIG. 6 and FIG. 7 . FIG. 6 is a cross-sectional view showing a first liquid floating state of a wet processing apparatus 1000 ′′ according to a third embodiment of the present invention, and FIG. 7 is a third embodiment of the present invention. An example of a wet process apparatus 1000'' is in a schematic view of a second liquid float. As shown in FIG. 6 and FIG. 7, a waterway module 5' of the wet process equipment 1000'' includes a plurality of first circulating water flow channels 57, a plurality of second circulating water flow channels 58, and a first water supply pump 59. a first water passage 5A, a second water supply pump 5B, and a second water passage 5C for selectively discharging or sucking the treatment liquid 6, and the second circulation water flow passage 58 for selectively The treatment liquid 6 is sprayed or sucked, and the first water supply pump 59 and the second water supply pump 5B are used to supply the treatment liquid 6 or to suck the treatment liquid 6. The first water passage 5A connects the first circulation water flow passage 57 and the first water supply pump 59, The treatment liquid 6 supplied from the first water supply pump 59 can enter the first circulation water flow passage 57 via the first water passage 5A, or the first water supply pump 59 can pass the treatment liquid 6 from the first circulation water flow passage 57 via the first water passage 5A. Inhalation, the second water passage 5C connects the second circulating water flow passage 58 and the second water supply pump 5B, so that the processing liquid 6 supplied from the second water supply pump 5B can enter the second circulating water flow passage 58 via the second water passage 5C, or is the second The water supply pump 5B can process the treatment liquid 6 from the second circulating water via the second water passage 5C. Channel 58 inhalation. The components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for brevity.

綜上所述,當第一循環水流通道57噴出處理液6時,第二循環水流通道58可用以吸入第一循環水流通道57所噴出的處理液6,使處理液6經由第一循環水流通道57與第二循環水流通道58產生沿輸送方向X1流動之薄膜層流6',如此基板1便能被薄膜層流6'帶動而往輸送方向X1移動。另一方面,當第二循環水流通道58噴出處理液6時,第一循環水流通道57可用以吸入第二循環水流通道58所噴出的處理液6,使處理液6經由第二循環水流通道58與第一循環水流通道57產生沿回復方向X2流動之薄膜層流6',如此基板1便能被薄膜層流6'帶動而往回復方向X2移動。   相較於先前技術,本發明溼式製程設備的導輪僅對應基板的側邊部,而基板的板體部係利用液浮載板所產生的薄膜層流來液浮支撐,因此本發明溼式製程設備的導輪便不會接觸基板的板體部,進而減少對基板的板體部的磨耗。除此之外,本發明溼式製程設備的液浮載板所噴射的處理液可為一蝕刻液或一清洗液,亦即本發明溼式製程設備除了可利用一水刀噴頭(未繪示於圖中)對基板的板體部的上表面進行蝕刻或清洗等的溼式製程外,本發明溼式製程設備亦可利用液浮載板對基板的板體部的下表面噴射處理液,以對板體部的下表面也進行蝕刻或清洗等的溼式製程,從而使本發明溼式製程設備達到對基板進行雙面溼式製程的目的。以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。In summary, when the first circulating water flow channel 57 ejects the processing liquid 6, the second circulating water flow channel 58 can be used to suck in the processing liquid 6 ejected from the first circulating water flow channel 57, so that the processing liquid 6 passes through the first circulating water flow channel. 57 and the second circulating water flow passage 58 generate a thin film laminar flow 6' flowing in the conveying direction X1, so that the substrate 1 can be moved by the thin film laminar flow 6' to move in the conveying direction X1. On the other hand, when the second circulating water flow path 58 ejects the processing liquid 6, the first circulating water flow path 57 can be used to suck the processing liquid 6 ejected from the second circulating water flow path 58 to cause the processing liquid 6 to pass through the second circulating water flow path 58. The first laminar water flow channel 57 generates a thin film laminar flow 6' flowing in the recovery direction X2, so that the substrate 1 can be moved by the thin film laminar flow 6' to move in the recovery direction X2. Compared with the prior art, the guide wheel of the wet process equipment of the present invention only corresponds to the side portion of the substrate, and the plate body portion of the substrate is supported by the laminar flow of the film generated by the liquid floating carrier, so that the present invention is wet. The guide wheel of the process equipment does not contact the plate body portion of the substrate, thereby reducing the wear on the plate body portion of the substrate. In addition, the processing liquid sprayed by the liquid floating carrier of the wet processing apparatus of the present invention may be an etching liquid or a cleaning liquid, that is, the wet processing apparatus of the present invention can use a water jet nozzle (not shown). In the wet process of etching or cleaning the upper surface of the plate body portion of the substrate, the wet process apparatus of the present invention can also spray the treatment liquid onto the lower surface of the plate body portion of the substrate by using the liquid floating carrier plate. The wet process of etching or cleaning the lower surface of the plate body is also performed, so that the wet process equipment of the present invention achieves the purpose of performing a two-sided wet process on the substrate. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1000、1000'、1000''‧‧‧溼式製程設備
1‧‧‧基板
10‧‧‧板體部
101‧‧‧上表面
102‧‧‧下表面
11‧‧‧側邊部
2‧‧‧槽體
20‧‧‧入口
21‧‧‧出口
3‧‧‧導輪
4‧‧‧液浮載板
5、5'‧‧‧水路模組
50‧‧‧第一斜行水流通道
51‧‧‧第二斜行水流通道
52‧‧‧供水泵
53、5A‧‧‧第一水路
54、5C‧‧‧第二水路
55‧‧‧第一止水閥
56‧‧‧第二止水閥
57‧‧‧第一循環水流通道
58‧‧‧第二循環水流通道
5‧‧‧第一供水泵
5B‧‧‧第二供水泵
6‧‧‧處理液
6'‧‧‧薄膜層流
X1‧‧‧輸送方向
X2‧‧‧回復方向
Y1‧‧‧第一出水方向
Y2‧‧‧第二出水方向
X-X‧‧‧剖面線
1000, 1000', 1000''‧‧‧ Wet process equipment
1‧‧‧Substrate
10‧‧‧ Board Department
101‧‧‧ upper surface
102‧‧‧lower surface
11‧‧‧ Sideside
2‧‧‧Slot
20‧‧‧ entrance
21‧‧‧Export
3‧‧‧guide wheel
4‧‧‧Liquid floating board
5, 5'‧‧‧ Waterway Module
50‧‧‧First oblique flow channel
51‧‧‧Second oblique flow channel
52‧‧‧Water supply pump
53, 5A‧‧‧ First Waterway
54, 5C‧‧‧Second waterway
55‧‧‧First water stop valve
56‧‧‧Second stop valve
57‧‧‧First circulating water flow channel
58‧‧‧Second circulating water flow channel
5‧‧‧First water supply pump
5B‧‧‧Second water supply pump
6‧‧‧Processing fluid
6'‧‧‧Laminar laminar flow
X1‧‧‧ conveying direction
X2‧‧‧Responding direction
Y1‧‧‧First water direction
Y2‧‧‧Second water direction
XX‧‧‧ hatching

第1圖為本發明第一實施例溼式製程設備的俯視示意圖。 第2圖為第1圖所示的溼式製程設備沿剖面線X-X且處於第一液浮態樣的剖視示意圖。 第3圖為本發明第一實施例溼式製程設備處於第二液浮態樣的剖視示意圖。 第4圖為本發明第二實施例溼式製程設備處於第一液浮態樣的剖視示意圖。 第5圖為本發明第二實施例溼式製程設備處於第二液浮態樣的剖視示意圖。 第6圖為本發明第三實施例溼式製程設備處於第一液浮態樣的剖視示意圖。 第7圖為本發明第三實施例溼式製程設備處於第二液浮態樣的剖視示意圖。1 is a top plan view of a wet process apparatus according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing the wet process apparatus shown in Fig. 1 along the section line X-X and in the first liquid floating state. Fig. 3 is a cross-sectional view showing the second liquid floating state of the wet process apparatus according to the first embodiment of the present invention. Fig. 4 is a cross-sectional view showing the first liquid floating state of the wet process apparatus according to the second embodiment of the present invention. Fig. 5 is a cross-sectional view showing the second liquid floating state of the wet process apparatus according to the second embodiment of the present invention. Figure 6 is a cross-sectional view showing the first liquid floating state of the wet process equipment according to the third embodiment of the present invention. Figure 7 is a cross-sectional view showing the second liquid floating state of the wet process apparatus according to the third embodiment of the present invention.

1000‧‧‧溼式製程設備 1000‧‧‧wet process equipment

1‧‧‧基板 1‧‧‧Substrate

101‧‧‧上表面 101‧‧‧ upper surface

102‧‧‧下表面 102‧‧‧lower surface

2‧‧‧槽體 2‧‧‧Slot

20‧‧‧入口 20‧‧‧ entrance

21‧‧‧出口 21‧‧‧Export

3‧‧‧導輪 3‧‧‧guide wheel

4‧‧‧液浮載板 4‧‧‧Liquid floating board

5、5'‧‧‧水路模組 5, 5'‧‧‧ Waterway Module

50‧‧‧第一斜行水流通道 50‧‧‧First oblique flow channel

51‧‧‧第二斜行水流通道 51‧‧‧Second oblique flow channel

52‧‧‧供水泵 52‧‧‧Water supply pump

53‧‧‧第一水路 53‧‧‧First Waterway

54‧‧‧第二水路 54‧‧‧Second waterway

55‧‧‧第一止水閥 55‧‧‧First water stop valve

56‧‧‧第二止水閥 56‧‧‧Second stop valve

6‧‧‧處理液 6‧‧‧Processing fluid

6'‧‧‧薄膜層流 6'‧‧‧Laminar laminar flow

X1‧‧‧輸送方向 X1‧‧‧ conveying direction

Y1‧‧‧第一出水方向 Y1‧‧‧First water direction

Claims (9)

一種溼式製程設備,可用以支撐一基板,該基板具有一板體部及一側邊部,該側邊部延伸於該板體部,該板體部具有一上表面及相對於該上表面之一下表面,該溼式製程設備包含: 一槽體,用以容置該基板; 複數個導輪,設置於該槽體內,該複數個導輪對應於該側邊部並用以支撐該基板的該側邊部; 複數個液浮載板,設置於該下表面下方,該複數個液浮載板用以對該下表面噴射一處理液,以於該下表面與該複數個液浮載板間形成一薄膜層流,該薄膜層流用以液浮支撐該板體部;以及 一水路模組,耦接於該複數個液浮載板,該水路模組控制該複數個液浮載板產生能沿一輸送方向流動之該薄膜層流或產生能沿相反於該輸送方向之一回復方向流動之該薄膜層流。A wet process apparatus for supporting a substrate having a plate body portion and a side edge portion extending from the plate body portion, the plate body portion having an upper surface and opposite the upper surface a lower surface surface, the wet process apparatus includes: a tank body for accommodating the substrate; a plurality of guide wheels disposed in the tank body, the plurality of guide wheels corresponding to the side edges and supporting the substrate The plurality of liquid floating carrier plates are disposed under the lower surface, and the plurality of liquid floating carrier plates are configured to spray a processing liquid on the lower surface to the lower surface and the plurality of liquid floating carrier plates Forming a thin film laminar flow for liquid floating support of the plate body portion; and a water circuit module coupled to the plurality of liquid floating carrier plates, the water circuit module controlling the plurality of liquid floating carrier plates to generate The laminar flow of the film that can flow in a transport direction or the laminar flow of the film that can flow in a direction opposite to one of the transport directions. 如請求項1所述之溼式製程設備,其中該水路模組包含: 複數個第一斜行水流通道,其走向斜交於該輸送方向與該回復方向,該複數個第一斜行水流通道用以將該處理液以一第一出水方向噴出,該第一出水方向與該輸送方向的內積值大於零;以及 複數個第二斜行水流通道,其走向斜交於該輸送方向與該回復方向,該複數個第二斜行水流通道用以將該處理液以一第二出水方向噴出,該第二出水方向與該回復方向的內積值大於零。The wet process apparatus of claim 1, wherein the waterway module comprises: a plurality of first oblique water flow channels, the strike direction is oblique to the transport direction and the return direction, and the plurality of first oblique water flow channels The process liquid is sprayed in a first water discharge direction, the inner product value of the first water discharge direction and the transport direction is greater than zero; and the plurality of second oblique water flow channels are obliquely intersected in the transport direction and the In the recovery direction, the plurality of second oblique water flow channels are used to spray the treatment liquid in a second water discharge direction, and the inner product value of the second water discharge direction and the recovery direction is greater than zero. 如請求項2所述之溼式製程設備,其中該水路模組另包含: 一供水泵,用以供給該處理液; 一第一水路,連接該複數個第一斜行水流通道與該供水泵,該供水泵所供給的該處理液經由該第一水路進入該複數個第一斜行水流通道;以及 一第二水路,連接該複數個第二斜行水流通道與該供水泵,該供水泵所供給的該處理液經由該第二水路進入該複數個第二斜行水流通道。The wet process apparatus of claim 2, wherein the waterway module further comprises: a water supply pump for supplying the processing liquid; a first waterway connecting the plurality of first oblique water flow channels and the water supply pump The processing liquid supplied by the water supply pump enters the plurality of first oblique water flow passages through the first water passage; and a second water passage connecting the plurality of second oblique water flow passages with the water supply pump, the water supply pump The supplied treatment liquid enters the plurality of second oblique water flow passages via the second water passage. 如請求項3所述之溼式製程設備,其中該水路模組另包含: 一第一止水閥,耦接於該第一水路,該第一止水閥用以選擇性地阻止該供水泵所供給的該處理液經由該第一水路進入該複數個第一斜行水流通道;以及 一第二止水閥,耦接於該第二水路,該第二止水閥用以選擇性地阻止該供水泵所供給的該處理液經由該第二水路進入該複數個第二斜行水流通道。The wet process apparatus of claim 3, wherein the waterway module further comprises: a first water stop valve coupled to the first waterway, the first water stop valve for selectively blocking the water supply pump The supplied treatment liquid enters the plurality of first oblique water flow passages via the first water passage; and a second water stop valve coupled to the second water passage, the second water stop valve is configured to selectively block The treatment liquid supplied by the water supply pump enters the plurality of second oblique water flow passages via the second water passage. 如請求項2所述之溼式製程設備,其中該複數個第一斜行水流通道形成於一部分的該複數個液浮載板上,且該複數個第二斜行水流通道形成於另一部分的該複數個液浮載板上。The wet process apparatus of claim 2, wherein the plurality of first oblique flow channels are formed on a portion of the plurality of liquid floating carriers, and the plurality of second oblique flow channels are formed in another portion The plurality of liquid floating carriers. 如請求項5所述之溼式製程設備,其中該部分的該複數個液浮載板與該另一部分的該複數個液浮載板交錯設置。The wet process apparatus of claim 5, wherein the plurality of liquid floating carriers of the portion are interleaved with the plurality of liquid floating carriers of the other portion. 如請求項2所述之溼式製程設備,其中該複數個第一斜行水流通道與該複數個第二斜行水流通道分別形成於各液浮載板上。The wet process apparatus of claim 2, wherein the plurality of first oblique flow channels and the plurality of second oblique flow channels are formed on each of the liquid floating carriers. 如請求項1所述之溼式製程設備,其中該水路模組包含: 複數個第一循環水流通道,用以選擇性地將該處理液噴出或吸入;以及 複數個第二循環水流通道,用以選擇性地將該處理液噴出或吸入,當該複數個第一循環水流通道噴出該處理液時,該複數個第二循環水流通道吸入該複數個第一循環水流通道所噴出的該處理液,使該處理液經由該複數個第一循環水流通道與該複數個第二循環水流通道產生沿該輸送方向流動之該薄膜層流,當該複數個第二循環水流通道噴出該處理液時,該複數個第一循環水流通道吸入該複數個第二循環水流通道所噴出的該處理液,使該處理液經由該複數個第二循環水流通道與該複數個第一循環水流通道產生沿該回復方向流動之該薄膜層流。The wet process apparatus of claim 1, wherein the waterway module comprises: a plurality of first circulating water flow channels for selectively discharging or inhaling the treatment liquid; and a plurality of second circulating water flow channels, Selectively ejecting or inhaling the treatment liquid, and when the plurality of first circulating water flow channels eject the treatment liquid, the plurality of second circulating water flow channels suck the liquid discharged from the plurality of first circulating water flow channels And causing the treatment liquid to generate the laminar flow of the film flowing in the conveying direction through the plurality of first circulating water flow channels and the plurality of second circulating water flow channels, when the plurality of second circulating water flow channels eject the processing liquid, The plurality of first circulating water flow channels suck the processing liquid sprayed by the plurality of second circulating water flow channels, so that the processing liquid is generated along the plurality of first circulating water flow channels and the plurality of first circulating water flow channels The laminar flow of the film in the direction of flow. 如請求項8所述之溼式製程設備,其中該水路模組另包含: 一第一供水泵,用以供給該處理液或將該處理液吸入; 一第一水路,連接該複數個第一循環水流通道與該第一供水泵,該第一供水泵所供給的該處理液經由該第一水路進入該複數個第一循環水流通道,或該第一供水泵將該處理液經由該第一水路由該複數個第一循環水流通道吸入; 一第二供水泵,用以供給該處理液或將該處理液吸入;以及 一第二水路,連接該複數個第二循環水流通道與該第二供水泵,該第二供水泵所供給的該處理液經由該第二水路進入該複數個第二循環水流通道,或該第二供水泵將該處理液經由該第二水路由該複數個第二循環水流通道吸入。The wet process apparatus of claim 8, wherein the waterway module further comprises: a first water supply pump for supplying the treatment liquid or sucking the treatment liquid; and a first water passage connecting the plurality of first a circulating water flow channel and the first water supply pump, the processing liquid supplied by the first water supply pump enters the plurality of first circulating water flow channels via the first water path, or the first water supply pump passes the processing liquid through the first Water is routed through the plurality of first circulating water flow passages; a second water supply pump for supplying the treatment liquid or sucking the treatment liquid; and a second water passage connecting the plurality of second circulating water flow passages and the second a water supply pump, the processing liquid supplied by the second water supply pump enters the plurality of second circulating water flow passages via the second water passage, or the second water supply pump routes the processing liquid to the plurality of second waters via the second water The circulating water flow channel is inhaled.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040074601A1 (en) * 2002-10-16 2004-04-22 Lee Seok Won Apparatus and method for etching insulating film
US20050034742A1 (en) * 2003-08-11 2005-02-17 Kaijo Corporation Cleaning method and cleaning apparatus
US20100122716A1 (en) * 2008-11-14 2010-05-20 Tae Young Oh Washing device
TW201250816A (en) * 2011-04-27 2012-12-16 Dainippon Screen Mfg Substrate processing apparatus and substrate processing method
CN103187337A (en) * 2011-12-29 2013-07-03 均豪精密工业股份有限公司 Base plate surface processing device and method for processing base plate surface
TW201536656A (en) * 2013-11-22 2015-10-01 Oiles Industry Co Ltd Floating transport device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283441B (en) * 2001-03-14 2007-07-01 Sumitomo Precision Prod Co Substrate treating device
KR20020093578A (en) * 2001-06-08 2002-12-16 수미도모 프리시젼 프로덕츠 캄파니 리미티드 Substrate processing device
JP2004158765A (en) * 2002-11-08 2004-06-03 Tokyo Kakoki Kk Substrate treatment apparatus
JP2004345814A (en) * 2003-05-23 2004-12-09 Murata Mach Ltd Floatation transport device
CN100557766C (en) * 2006-02-07 2009-11-04 大日本网目版制造株式会社 Substrate board treatment
JP4859242B2 (en) * 2006-07-27 2012-01-25 芝浦メカトロニクス株式会社 Substrate processing equipment
KR100823583B1 (en) * 2006-10-23 2008-04-21 삼성전기주식회사 Wet process apparatus
JP5877954B2 (en) * 2011-03-07 2016-03-08 株式会社ゼビオス Substrate processing apparatus having non-contact levitation transfer function
CN106396423A (en) * 2015-07-27 2017-02-15 盟立自动化股份有限公司 Grooved disc type liquid circulation system capable of reducing turbulence

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040074601A1 (en) * 2002-10-16 2004-04-22 Lee Seok Won Apparatus and method for etching insulating film
US20050034742A1 (en) * 2003-08-11 2005-02-17 Kaijo Corporation Cleaning method and cleaning apparatus
US20100122716A1 (en) * 2008-11-14 2010-05-20 Tae Young Oh Washing device
TW201250816A (en) * 2011-04-27 2012-12-16 Dainippon Screen Mfg Substrate processing apparatus and substrate processing method
CN103187337A (en) * 2011-12-29 2013-07-03 均豪精密工业股份有限公司 Base plate surface processing device and method for processing base plate surface
TW201536656A (en) * 2013-11-22 2015-10-01 Oiles Industry Co Ltd Floating transport device

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