TWI668173B - Floating conveying device and substrate processing device - Google Patents
Floating conveying device and substrate processing device Download PDFInfo
- Publication number
- TWI668173B TWI668173B TW106143470A TW106143470A TWI668173B TW I668173 B TWI668173 B TW I668173B TW 106143470 A TW106143470 A TW 106143470A TW 106143470 A TW106143470 A TW 106143470A TW I668173 B TWI668173 B TW I668173B
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- floating
- substrate
- blocks
- floating device
- gap
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Abstract
提供一種可防止基板撓曲來進行搬送的浮上搬送裝置及基板處理裝置。 本發明的浮上搬送裝置,是使基板浮上來搬送的浮上搬送裝置,其特徵為,夾著基板的搬送經路而具有下側浮上裝置與上側浮上裝置,構成下側浮上裝置與上側浮上裝置之至少任一方的複數個浮上塊體是設置間隙來配置,構成另一方的浮上塊體是配置成與前述間隙相對向。Provided are a floating transfer device and a substrate processing device that can prevent the substrate from being deflected and transferred. The floating conveying device of the present invention is a floating conveying device that lifts a substrate and conveys it, and is characterized by having a lower floating device and an upper floating device sandwiching the conveying path of the substrate, and constituting one of the lower floating device and the upper floating device. A plurality of floating blocks on at least one side are arranged with a gap therebetween, and the floating blocks on the other side are arranged to face the gap.
Description
本發明是關於浮上搬送裝置及基板處理裝置。The present invention relates to a floating transfer apparatus and a substrate processing apparatus.
在液晶製造裝置等,有使用使玻璃製的基板一邊浮上一邊搬送的浮上搬送裝置。 作為浮上搬送裝置的一例,已知有:在浮上塊體的表面分別設置複數個氣體的噴出孔與吸引孔,將來自各噴出孔之氣體的噴出量、以及各吸引孔之氣體的吸引量予以調節,藉此使基板從浮上塊體浮上來進行搬送。該氣體的噴出量或吸引量,是考慮搬送之基板的重量、離浮上塊體表面的浮上距離等來決定。且,隨著基板的大型化,亦進行有將複數個浮上塊體沿著基板的搬送方向及與該搬送方向正交的方向並排配置。 有對所搬送的基板噴上處理液,並進行基板的處理。在此,為了確保供給處理液之噴嘴等的配置空間,而在鄰接的浮上塊體之間設置間隙來配置。 在鄰接的浮上塊體之間形成有間隙的話,在該間隙部分,不會有對基板的上浮力。因此,有時所搬送之基板的前端會撓曲而與浮上塊體衝突。此現象是基板越薄則越顯著發生。且,還不得不中斷基板的搬送。A liquid crystal manufacturing apparatus and the like use a floating transfer apparatus that transfers a glass substrate while floating. As an example of the floating conveying device, it is known to provide a plurality of gas ejection holes and suction holes on the surface of the floating block, and to set the ejection amount of the gas from each ejection hole and the suction amount of the gas to each suction hole. By adjusting, the substrate is floated from the floating block for conveyance. The amount of the gas to be ejected or sucked is determined in consideration of the weight of the substrate to be transported, the floating distance from the surface of the floating block, and the like. In addition, as the substrate becomes larger, a plurality of floating blocks are arranged side by side along the substrate conveyance direction and a direction orthogonal to the conveyance direction. The substrate is sprayed with a processing liquid, and the substrate is processed. Here, in order to secure the arrangement space of the nozzles and the like for supplying the processing liquid, a gap is provided between adjacent floating blocks to arrange them.间隙 If a gap is formed between adjacent floating blocks, there will be no buoyancy on the substrate in the gap portion. Therefore, the front end of the substrate to be transported may be bent to collide with the floating block. This phenomenon is more pronounced when the substrate is thinner. In addition, the transportation of the substrate has to be interrupted.
於是本發明,其目的在於提供一種可防止基板的撓曲來進行搬送的浮上搬送裝置及基板處理裝置。 關於實施形態之基板的浮上搬送裝置, 是使基板浮上來搬送的浮上搬送裝置,其特徵為, 夾著前述基板的搬送經路,具有下側浮上裝置與上側浮上裝置, 構成前述下側浮上裝置與前述上側浮上裝置之至少任一方的複數個浮上塊體是設置間隙來配置,構成另一方的浮上塊體是配置成與前述間隙相對向。 且,關於實施形態的基板處理裝置, 是一邊使基板浮上來搬送一邊對前述基板進行處理的基板處理裝置,其特徵為, 具有: 浮上搬送裝置,其具有:使前述基板浮上的浮上裝置、將被前述浮上裝置給浮上支撐的前述基板往搬送方向搬送的搬送力賦予機構;以及 處理流體供給機構,其對於被前述浮上搬送裝置給浮上搬送的前述基板供給處理流體, 前述浮上搬送裝置,是上述的浮上搬送裝置。 根據本發明,可防止基板的撓曲來進行搬送。It is therefore an object of the present invention to provide a floating transfer device and a substrate processing device that can prevent the substrate from being deflected and transferred. The floating transfer device for the substrate of the embodiment is a floating transfer device that floats and transfers the substrate. It is characterized by having a lower floating device and an upper floating device sandwiching the transport path of the substrate, and constituting the lower floating device. A plurality of floating blocks that are at least one of the above-mentioned upper floating device are arranged with a gap therebetween, and the other floating blocks are arranged so as to face the gap. In addition, regarding the substrate processing apparatus of the embodiment, is a substrate processing apparatus that processes the substrate while the substrate is floated to be transported, and is characterized in that: includes: 上 a floating transfer apparatus having a floating apparatus for floating the substrate, and And a processing fluid supply mechanism for supplying the processing fluid to the substrate transferred to the float by the floating transfer device, and the floating transfer device is the above-mentioned Floating transport device. According to the present invention, it is possible to prevent the substrate from being deflected and to carry it.
以下,參照圖式,針對本發明之實施形態的基板處理裝置進行說明。 如圖1所示般,本實施形態的基板處理裝置100,具有:浮上搬送裝置10、處理液供給裝置(處理流體供給機構)20、30。浮上搬送裝置10,是以基板W的搬送經路為界,具有下側浮上裝置11、上側浮上裝置12、搬送力賦予機構13。 作為下側浮上裝置11、上側浮上裝置12,是使用有:從各自的表面噴出或吸引空氣等的氣體,藉此使基板W浮上之以往周知的浮上塊體。 圖2表示構成上側浮上裝置12的1個浮上塊體12a的概略仰視圖,圖3表示浮上塊體12a中,特別是噴出孔與吸引孔之部分的概略部分剖面圖。浮上塊體12a是長方體,於下面具有整齊排列的噴出孔a與吸引孔b,藉由從噴出孔a所噴出的空氣、從吸引孔b所吸引的空氣、以及基板W的重量等之間的平衡,來將通過下方的基板W予以浮上支撐。又,在圖2,雖將設有噴出孔a、吸引孔b的各區域(以一點鏈線表示)標記為符號a、b,但以一點鏈線表示的各區域內,是配置有噴出孔a或吸引孔b(圖2為圓形圖示)。且,在圖3,箭頭是表示空氣的流動方向。構成該上側浮上裝置12的浮上塊體12a,是如圖1所示般,配置在基板W之搬送面的上方。浮上塊體12a,是剛好與配置在基板W之搬送面的下方之以往周知的浮上塊體12b以上下反轉的狀態來配置。浮上塊體12a、12b所具有的各噴出孔a,是透過通路c或未圖示的過濾器而連接於鼓風機或壓縮機等之加壓氣體供給裝置(未圖示),各吸引孔b,是各自透過通路d而連接於未圖示的泵等之氣體吸引裝置(未圖示)。在各浮上塊體12a、12b,已知可用噴出孔a所噴出之氣體的作用來使基板W浮起,並以吸引孔b的吸引作用來保有浮上剛性。 在本實施形態,構成下側浮上裝置11的複數個浮上塊體12b、以及構成上側浮上裝置12的複數個浮上塊體12a,是夾住後述之搬送力賦予機構13之基板W的搬送經路(搬送面),而成為如下的配置關係。在圖1中,構成下側浮上裝置11的2個浮上塊體12b、構成上側浮上裝置12的2個浮上塊體12a,是各自沿著基板W的搬送方向A來設置。而且,在構成下側浮上裝置11的2個浮上塊體12b之間、以及構成上側浮上裝置12的2個浮上塊體12a之間,均在基板W的搬送方向A設置同樣的間隙來配置。具體來說,為可配置處理液供給裝置20、30之尺寸的間隙。又,該尺寸,如圖1所示般,只要為至少能藉由處理液供給裝置20、30來對基板W供給處理液的尺寸即可。而且,對於構成下側浮上裝置11的2個浮上塊體12b之間所設置的間隙,使構成上側浮上裝置12的2個浮上塊體12a的任一者成為相對向的狀態。且,對於構成上側浮上裝置12的2個浮上塊體12a之間所設置的間隙,使構成下側浮上裝置11的2個浮上塊體12b的任一者成為相對向的狀態。又,浮上塊體12a的下面與浮上塊體12b的上面之間的距離,例如為5mm以下。且,在搬送方向A之基板W的長度,是比一對浮上塊體12a之間的間隙、一對浮上塊體12b之間的間隙還要長。 又,雖將上側浮上裝置12與下側浮上裝置11各自所具有的浮上塊體12a、12b的配置關係使用圖1進行了說明,但在本實施形態,亦可如圖4所示般,浮上塊體12a與12b,是配合所搬送之基板W的大小,不只是在基板W的搬送方向A,還在與搬送方向A正交的方向(以下稱為「寬方向」)複數(在本實施形態為5個)設置。此情況時,先前所述的間隙,是除了搬送方向A之外,還沿著前述寬方向來形成,而且寬方向的長度,是根據基板W的大小來調整浮上塊體12a、12b的數量,藉此可自由地設定。又,在圖4,省略處理液供給裝置20、30與控制部40。 搬送力賦予機構13,是將對浮上塊體12a、12b以非接觸狀態(浮上狀態)來保持的基板W,往搬送方向A搬送。具體來說,如圖4所示般,在沿著基板W之搬送方向A的側面具有接觸的輥子13a。各輥子13a,是藉由未圖示的驅動裝置來旋轉驅動。藉由輥子13a的旋轉,對浮上的基板W賦予往A方向的搬送力。 在圖1,處理液供給裝置20、30,是將用來處理基板W的處理液(例如純水)供給至基板W表面的裝置。處理液供給裝置20,是配置在構成上側浮上裝置12的2個浮上塊體12a之間所形成的間隙,對於通過下方之基板W的表面(上面),例如透過噴嘴來供給處理液。相對於此,處理液供給裝置30,是配置在構成下側浮上裝置11的2個浮上塊體12b之間所形成的間隙,對於通過上方之基板W的裏面(下面),例如透過噴嘴來供給處理液。在圖4的情況,處理液供給裝置20、30,例如具有狹縫噴嘴,而可對所搬送之基板W之寬方向的全域供給處理液。設在狹縫噴嘴的狹縫,是沿著基板W的寬方向延伸,且至少具有基板W之寬方向的尺寸。從該狹縫噴嘴噴出處理液,對所搬送之基板W的表裏面(上下面)供給處理液。 接著,針對基板處理裝置100之基板W的處理製程進行說明。又,以下所述的動作,是由控制部40所控制。 首先,在浮上塊體12a、12b,開始來自噴出孔a之空氣的噴出動作、以及吸引孔b之空氣的吸引動作。然後,當基板W被搬入至基板處理裝置100時,基板W,是以浮上搬送裝置10的作用,被浮上塊體12a、12b給浮上支撐,且藉由輥子13a的旋轉力,被往A方向搬送。當基板W到達處理液供給裝置20的配置位置時,從未圖示的狹縫噴嘴對基板W的表面(上面)供給處理液。且,當基板W到達處理液供給裝置30的配置位置時,從未圖示的狹縫噴嘴對基板W的裏面(下面)供給處理液。然後,藉由處理液供給裝置20、30進行過表裏面之處理的基板W,是從基板處理裝置100被搬出,且藉由未圖示的搬送機構送往下個製程。 其中,在圖1,被搬入至基板處理裝置100的基板W,首先是被搬入側的浮上塊體12a給浮上支撐。在圖1,當基板W的前頭端到達構成上側浮上裝置12的2個浮上塊體12a的間隙時,就不存在與該基板W的前頭端相對向的浮上塊體12a。但是,如前述般,在構成上側浮上裝置12的2個浮上塊體12a之間所設置的間隙,是使構成下側浮上裝置11的2個浮上塊體12b的任一者成為相對向的狀態,故在圖1中,到達至在鄰接的浮上塊體12a之間所設置之間隙的基板W的前頭端部分,是成為從下側浮上裝置11的浮上塊體12b來接受上浮力。而且,在被搬送的基板W中,與在鄰接的浮上塊體12a之間所設置的間隙相對向的部分,亦成為從浮上塊體12b賦予有上浮力。 且,當基板W的前頭端到達構成下側浮上裝置11的2個浮上塊體12b的間隙時,就不存在與該基板W的前頭端相對向的浮上塊體12b。但是,如前述般,對於構成下側浮上裝置11的2個浮上塊體12b之間所設置的間隙,是使構成上側浮上裝置12的2個浮上塊體12a的任一者成為相對向的狀態,故在圖1中,到達至在鄰接的浮上塊體12b之間所設置之間隙的基板W的前頭端部分,是成為從上側浮上裝置12的浮上塊體12a來接受上浮力。而且,在被搬送的基板W中,與在鄰接的浮上塊體12b之間所設置的間隙相對向的部分,是成為從浮上塊體12a賦予有上浮力。 在本實施形態,為了設置處理液供給裝置20、30,是在各浮上塊體12a之間、以及各浮上塊體12b之間設有間隙,但還構成為:配置構成上側浮上裝置12的浮上塊體12a,來與構成下側浮上裝置11的2個浮上塊體12b之間所設置的間隙相對向,或者是,配置構成下側浮上裝置11的浮上塊體12b,來與構成上側浮上裝置11的2個浮上塊體12a之間所設置的間隙相對向。藉此,即使是基板W通過間隙的期間,亦會對基板W賦予上浮力。特別是,在所搬送的基板W之通過上述間隙的部分,亦會被持續賦予上浮力。因此,可以防止所搬送的基板W,特別是前頭端因自重或是由處理液供給裝置20(30)所供給之處理液的加壓力,導致在鄰接的浮上塊體12a(12b)之間所形成的間隙發生撓曲,而有例如撓曲的前頭端與浮上塊體12b衝突而損傷,或使作業中斷而使作業效率降低,或是以撓曲狀態持續搬送導致處理不均勻的問題。 在此,針對各浮上塊體12a、12b的長度關係(從例1至例3)參照圖5進行說明。在圖5,使浮上塊體12a之搬送方向A的長度為L2,使浮上塊體12b之搬送方向A的長度為L1,使浮上塊體12a與浮上塊體12b在搬送方向A1重疊的長度為S。 作為例1,為L2=L1。在此情況時,作為浮上塊體12a、12b,可在上下使用相同的區塊。且,作為例2,是前述的例1(L2=L1),且為S=0以上[L1(=L2)/2]以下。又,所有的S亦可不為相同的值。作為例3,為L2=L1×(1以上2以下)。這種長度關係僅為示例,並不限定於前述的關係。 且,在實施形態,對於被浮上塊體12a、12b給浮上支撐的基板W的搬送力,是由輥子13a的旋轉力來得到。但是,例如只要能將來自浮上塊體12a、12b之噴出孔a的空氣噴出方向朝向基板W的搬送方向A傾斜等來得到搬送力的話,亦可不特別設置輥子13a。亦可與輥子13a併用。 且,雖從浮上塊體12a、12b的噴出孔a噴出空氣,但亦可將空氣改變成氦等的惰性氣體,或是將氣體改變成純水等的液體。 且,在圖1所示的實施形態中,為了對基板W的上下面供給處理液,是在構成下側浮上裝置11與上側浮上裝置12的浮上塊體12a、12b各自形成間隙。但是,例如是只有要對基板W的下面供給處理液的話,就不需要在構成上側浮上裝置12的浮上塊體12a之間形成間隙。也就是說,例如在圖1,在構成下側浮上裝置11與上側浮上裝置12之至少任一方的浮上塊體之間形成間隙的配置時,只要為構成另一方之浮上裝置的浮上塊體是配置成與該間隙相對向的構造即可。 在前述的實施形態,作為處理流體供給機構,雖示例出適用於對基板W供給處理液的處理液供給裝置20、30,但並不限定於此,例如亦可為氣體供給裝置、供給液體及氣體的雙流體供給裝置。 且,在前述的實施形態,雖在分別構成下側浮上裝置11、或上側浮上裝置12的複數個浮上塊體12a之間、12b之間設置間隙,但這是為了將處理液供給裝置20、30配置在該間隙。可是,作為在浮上塊體之間沿著基板W的搬送方向設置間隙的理由,並不限於此,例如,在鄰接的洗淨裝置與乾燥裝置之間搬送基板W之際,在兩裝置的連接部分,於鄰接的浮上塊體之間設置間隙的情況亦可,此外,並不過問理由。Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the substrate processing apparatus 100 according to the present embodiment includes a floating transfer apparatus 10 and a processing liquid supply apparatus (processing fluid supply mechanism) 20 and 30. The floating conveying device 10 is a boundary of the conveying path of the substrate W, and includes a lower floating device 11, an upper floating device 12, and a conveying force imparting mechanism 13. (2) As the lower floating device 11 and the upper floating device 12, a conventionally known floating block is used, in which a gas such as air is ejected or sucked from the respective surfaces, and the substrate W is floated. FIG. 2 is a schematic bottom view of one floating block 12a constituting the upper floating device 12, and FIG. 3 is a schematic partial cross-sectional view of the floating block 12a, in particular, the ejection holes and the suction holes. The floating block 12a is a rectangular parallelepiped, and has a uniform arrangement of the ejection holes a and the suction holes b below, the air ejected from the ejection holes a, the air attracted from the suction holes b, and the weight of the substrate W. Equipped with a balance to support the substrate W below. In addition, in FIG. 2, although each area (shown by a one-dot chain line) in which the ejection holes a and the suction holes b are provided is marked as a, b, the ejection holes are arranged in each area indicated by a one-dot chain line. a or suction hole b (Figure 2 is a circular diagram). In addition, in FIG. 3, arrows indicate the direction of air flow. The floating block 12a constituting the upper floating device 12 is disposed above the conveyance surface of the substrate W as shown in FIG. 1. The floating block 12a is disposed in a state where the floating block 12a is vertically reversed from the conventionally known floating block 12b, which is arranged just below the conveyance surface of the substrate W. Each of the ejection holes a of the floating blocks 12a and 12b is a pressurized gas supply device (not shown) connected to a blower or a compressor through a passage c or a filter (not shown), and each of the suction holes b, It is a gas suction device (not shown) connected to a pump (not shown) or the like through each of the passages d. In each of the floating blocks 12a and 12b, it is known that the substrate W can be floated by the action of the gas ejected from the ejection hole a, and the floating rigidity can be maintained by the suction effect of the suction hole b. In the present embodiment, the plurality of floating blocks 12b constituting the lower floating device 11 and the plurality of floating blocks 12a constituting the upper floating device 12 are conveying paths for sandwiching the substrate W of the conveying force imparting mechanism 13 described later. (Transfer surface), the following arrangement relationship is obtained. In FIG. 1, the two floating blocks 12 b constituting the lower floating device 11 and the two floating blocks 12 a constituting the upper floating device 12 are provided along the transport direction A of the substrate W, respectively. The two floating blocks 12b constituting the lower floating device 11 and the two floating blocks 12a constituting the upper floating device 12 are arranged with the same gap in the transport direction A of the substrate W. Specifically, the gap is a size in which the processing liquid supply devices 20 and 30 can be arranged. In addition, as shown in FIG. 1, the size may be a size capable of supplying the processing liquid to the substrate W at least by the processing liquid supply devices 20 and 30. In addition, with respect to the gap provided between the two floating blocks 12b constituting the lower floating device 11, any one of the two floating blocks 12a constituting the upper floating device 12 is opposed to each other. In addition, with respect to the gap provided between the two floating blocks 12a constituting the upper floating device 12, any one of the two floating blocks 12b constituting the lower floating device 11 is opposed to each other. The distance between the lower surface of the floating block 12a and the upper surface of the floating block 12b is, for example, 5 mm or less. The length of the substrate W in the transport direction A is longer than the gap between the pair of floating blocks 12a and the gap between the pair of floating blocks 12b. In addition, although the arrangement relationship between the floating blocks 12a and 12b of the upper floating device 12 and the lower floating device 11 has been described with reference to FIG. 1, in this embodiment, as shown in FIG. The blocks 12a and 12b correspond to the size of the substrate W to be transferred, and are not limited to the direction A in which the substrate W is transferred, but also in a direction orthogonal to the direction A (hereinafter referred to as the "wide direction"). The pattern is 5). In this case, the gap described above is formed along the width direction in addition to the conveying direction A, and the length in the width direction is adjusted according to the size of the substrate W, and the number of floating blocks 12a, 12b is adjusted. This can be set freely. In FIG. 4, the processing liquid supply devices 20 and 30 and the control unit 40 are omitted. The conveying force imparting mechanism 13 conveys the substrate W held in a non-contact state (floating state) to the floating blocks 12 a and 12 b in the conveying direction A. Specifically, as shown in FIG. 4, a contact roller 13 a is provided on a side surface along the conveyance direction A of the substrate W. Each roller 13a is rotationally driven by a driving device (not shown). By the rotation of the roller 13a, a carrying force in the direction A is applied to the floating substrate W. (1) In FIG. 1, the processing liquid supply devices 20 and 30 are devices for supplying a processing liquid (for example, pure water) for processing the substrate W to the surface of the substrate W. The processing liquid supply device 20 is a gap formed between the two floating blocks 12a constituting the upper floating device 12 and supplies the processing liquid to the surface (upper surface) of the lower substrate W through a nozzle, for example. In contrast, the processing liquid supply device 30 is a gap formed between two floating blocks 12b constituting the lower floating device 11 and is supplied to the inside (bottom) of the upper substrate W through a nozzle, for example. Treatment solution. In the case of FIG. 4, the processing liquid supply devices 20 and 30 have, for example, slit nozzles, and can supply the processing liquid to the entire area in the width direction of the substrate W to be transferred. The slit provided in the slit nozzle extends along the width direction of the substrate W, and has a size at least in the width direction of the substrate W. The processing liquid is ejected from the slit nozzle, and the processing liquid is supplied to the front and back surfaces (upper and lower surfaces) of the transferred substrate W. Next, the processing process of the substrate W of the substrate processing apparatus 100 will be described. The operations described below are controlled by the control unit 40. First, on the floating blocks 12a and 12b, the air ejection operation from the ejection hole a and the air ejection operation from the suction hole b are started. Then, when the substrate W is carried into the substrate processing apparatus 100, the substrate W is supported by the floating blocks 12a and 12b by the function of the floating transfer apparatus 10, and is moved in the direction A by the rotation force of the roller 13a. Transport. When the substrate W reaches the arrangement position of the processing liquid supply device 20, the processing liquid is supplied to the surface (upper surface) of the substrate W from a slit nozzle (not shown). When the substrate W reaches the arrangement position of the processing liquid supply device 30, the processing liquid is supplied to the inside (lower surface) of the substrate W from a slit nozzle (not shown). Then, the substrates W processed on the front and rear surfaces by the processing liquid supply devices 20 and 30 are carried out from the substrate processing device 100 and sent to the next process by a transfer mechanism (not shown). Among them, in FIG. 1, the substrate W carried into the substrate processing apparatus 100 is first supported by the floating block 12 a on the carrying side. In FIG. 1, when the front end of the substrate W reaches the gap between the two floating blocks 12 a constituting the upper floating device 12, there is no floating block 12 a facing the front end of the substrate W. However, as described above, the gap provided between the two floating blocks 12a constituting the upper floating device 12 is such that any one of the two floating blocks 12b constituting the lower floating device 11 is opposed to each other. Therefore, in FIG. 1, the front end portion of the substrate W that reaches the gap provided between the adjacent floating blocks 12 a receives the buoyancy from the floating block 12 b of the lower floating device 11. Further, in the substrate W to be transported, a portion facing the gap provided between the adjacent floating blocks 12a is also provided with buoyancy from the floating blocks 12b. In addition, when the front end of the substrate W reaches the gap between the two floating blocks 12 b constituting the lower floating device 11, there is no floating block 12 b facing the front end of the substrate W. However, as described above, the gap provided between the two floating blocks 12b constituting the lower floating device 11 is such that any one of the two floating blocks 12a constituting the upper floating device 12 faces each other. Therefore, in FIG. 1, the front end portion of the substrate W reaching the gap provided between the adjacent floating blocks 12 b receives the buoyancy from the floating block 12 a of the upper floating device 12. Further, in the substrate W to be transported, a portion facing the gap provided between the adjacent floating blocks 12b is provided with buoyancy from the floating blocks 12a. In this embodiment, in order to provide the processing liquid supply devices 20 and 30, a gap is provided between each floating block 12a and each floating block 12b, but it is also configured to arrange the floating of the upper floating device 12 The block 12a is opposed to the gap provided between the two floating blocks 12b constituting the lower floating device 11, or the floating block 12b constituting the lower floating device 11 is arranged to be opposed to the upper floating device 12b. The gaps between the two floating blocks 12a of 11 are opposite to each other. Thereby, even when the substrate W passes through the gap, the substrate W is given buoyancy. In particular, the portion of the substrate W to be transported that passes through the gap is continuously given buoyancy. Therefore, it is possible to prevent the substrate W being transported, especially the front end, from being caused by the dead weight or the pressure of the processing liquid supplied from the processing liquid supply device 20 (30), causing the substrate W between adjacent floating blocks 12a (12b). The formed gap is deflected, and there is a problem that, for example, the deflected front end collides with the floating block 12b and is damaged, or the operation is interrupted and the operation efficiency is lowered, or the transportation is continued in a deflected state, resulting in uneven processing. Here, the length relationship (from Example 1 to Example 3) of each floating block 12a, 12b will be described with reference to FIG. 5. In FIG. 5, the length of the floating direction of the floating block 12a in the transport direction A is L2, the length of the floating direction of the floating block 12b is L1, and the length of the floating block 12a and the floating block 12b in the transportation direction A1 is S. As an example 1, L2 = L1. In this case, as the floating blocks 12a and 12b, the same block can be used up and down. In addition, as Example 2, it is the aforementioned Example 1 (L2 = L1), and it is S = 0 or more [L1 (= L2) / 2] or less. In addition, all S may not be the same value. As Example 3, L2 = L1 × (1 or more and 2 or less). This length relationship is merely an example, and is not limited to the aforementioned relationship. In addition, in the embodiment, the conveying force of the substrate W supported by the floating blocks 12a and 12b on the floating is obtained by the rotation force of the roller 13a. However, as long as the conveying force can be obtained by, for example, inclining the air ejection direction of the ejection holes a from the floating blocks 12a, 12b toward the conveying direction A of the substrate W, the roller 13a may not be particularly provided. It can also be used in combination with the roller 13a. In addition, although air is ejected from the ejection holes a of the floating blocks 12a and 12b, the air may be changed into an inert gas such as helium or the gas may be changed into a liquid such as pure water. In addition, in the embodiment shown in FIG. 1, in order to supply the processing liquid to the upper and lower surfaces of the substrate W, a gap is formed in each of the floating blocks 12 a and 12 b constituting the lower floating device 11 and the upper floating device 12. However, for example, if only the processing liquid is to be supplied to the lower surface of the substrate W, it is not necessary to form a gap between the floating blocks 12 a constituting the upper floating device 12. That is, for example, in FIG. 1, when a gap is formed between at least one of the floating blocks constituting the lower floating device 11 and the upper floating device 12, as long as the floating blocks constituting the other floating device are It may be arranged in a structure facing the gap. In the aforementioned embodiment, although the processing fluid supply means 20 and 30 suitable for supplying the processing liquid to the substrate W are exemplified as the processing fluid supply means, the present invention is not limited to this. For example, it may be a gas supply device, a supply liquid, and Gas dual fluid supply device. Moreover, in the aforementioned embodiment, although a gap is provided between the plurality of floating blocks 12a and 12b constituting the lower floating device 11 or the upper floating device 12, respectively, this is for supplying the processing liquid to the device 20, 30 is arranged in this gap. However, the reason for providing a gap between the floating blocks along the conveyance direction of the substrate W is not limited to this. For example, when the substrate W is conveyed between the adjacent cleaning device and the drying device, the two devices are connected. In some cases, a gap may be provided between adjacent floating blocks, and the reason is not required.
100‧‧‧基板處理裝置100‧‧‧ substrate processing equipment
10‧‧‧浮上搬送裝置10‧‧‧ Floating Transfer Device
11‧‧‧下側浮上裝置11‧‧‧ underside floating device
12‧‧‧上側浮上裝置12‧‧‧ upper side floating device
12a‧‧‧浮上塊體12a‧‧‧ floating block
12b‧‧‧浮上塊體12b‧‧‧ floating block
13‧‧‧搬送力賦予機構13‧‧‧Transporting force granting agency
13a‧‧‧輥子13a‧‧‧roller
20‧‧‧處理液供給裝置20‧‧‧ treatment liquid supply device
30‧‧‧處理液供給裝置30‧‧‧ treatment liquid supply device
40‧‧‧控制部40‧‧‧Control Department
a‧‧‧噴出孔a‧‧‧outlet
b‧‧‧吸引孔b‧‧‧ suction hole
c‧‧‧通路c‧‧‧access
A‧‧‧搬送方向A‧‧‧ transport direction
W‧‧‧基板W‧‧‧ substrate
圖1為表示本發明之第1實施形態之基板處理裝置之概略的前視圖。 圖2為圖1的基板處理裝置所具有之浮上塊體的概略仰視圖。 圖3為圖2之浮上塊體的概略部分剖面圖。 圖4為圖1之基板處理裝置的俯視圖。 圖5為圖1之浮上塊體的前視圖。FIG. 1 is a front view schematically showing a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic bottom view of a floating block included in the substrate processing apparatus of FIG. 1. FIG. 3 is a schematic partial cross-sectional view of the floating block of FIG. 2. FIG. 4 is a plan view of the substrate processing apparatus of FIG. 1. FIG. 5 is a front view of the floating block of FIG. 1.
Claims (8)
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JP2017227757A JP2018108892A (en) | 2016-12-28 | 2017-11-28 | Floating carrier device and circuit board processing device |
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TW201840458A TW201840458A (en) | 2018-11-16 |
TWI668173B true TWI668173B (en) | 2019-08-11 |
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KR (1) | KR101990219B1 (en) |
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US20070195653A1 (en) * | 2004-04-14 | 2007-08-23 | Yuval Yassour | Non-contact support platforms for distance adjustment |
TW201601850A (en) * | 2014-05-13 | 2016-01-16 | Shibaura Mechatronics Corp | Substrate processing device, substrate processing method, substrate manufacturing device and substrate manufacturing method |
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KR20100123196A (en) * | 2009-05-14 | 2010-11-24 | 엘지디스플레이 주식회사 | Apparatus for treating surface of substrate and method for treating the same |
JP2011084352A (en) | 2009-10-14 | 2011-04-28 | Myotoku Ltd | Work levitation device |
JP2012096920A (en) * | 2010-11-05 | 2012-05-24 | Hitachi High-Technologies Corp | Glass substrate defect inspection device and glass substrate defect inspection method and glass substrate defect inspection system |
JP2014047020A (en) | 2012-08-31 | 2014-03-17 | Tanken Seal Seiko Co Ltd | Levitation device |
JP6315547B2 (en) * | 2013-12-17 | 2018-04-25 | 芝浦メカトロニクス株式会社 | Substrate processing equipment |
JP2016161007A (en) * | 2015-02-27 | 2016-09-05 | 株式会社日本製鋼所 | Gas flotation workpiece support device and non-contact workpiece support method |
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2017
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070195653A1 (en) * | 2004-04-14 | 2007-08-23 | Yuval Yassour | Non-contact support platforms for distance adjustment |
TW201601850A (en) * | 2014-05-13 | 2016-01-16 | Shibaura Mechatronics Corp | Substrate processing device, substrate processing method, substrate manufacturing device and substrate manufacturing method |
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JP2018108892A (en) | 2018-07-12 |
KR20180077052A (en) | 2018-07-06 |
TW201840458A (en) | 2018-11-16 |
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