JP6315547B2 - Substrate processing equipment - Google Patents

Description

  Embodiments described herein relate generally to a substrate transfer apparatus and a substrate processing apparatus.

As a substrate processing apparatus, a substrate processing apparatus for processing a substrate surface such as glass with a processing liquid (for example, chemical liquid or functional water) in a manufacturing process of a liquid crystal substrate or a cover glass and then drying the substrate surface has been developed. ing. The substrate processing apparatus includes a substrate transfer device that transfers a substrate, and performs processing while the substrate is transferred by the substrate transfer device. As a substrate transport device, there is a substrate transport device that transports a small substrate (for example, a rectangular substrate of 3 to 22.5 inches) by a plurality of rotating rollers arranged in parallel.

JP 2012-170828 A

  However, when a small substrate having a light weight is transported as described above, when the processing is performed on the small substrate being transported, the small substrate is, for example, a predetermined transport path due to the pressure of the processing liquid on the small substrate. May be off. This substrate misalignment may cause substrate damage (including scratches) and processing defects. For this reason, it is required to suppress the shift of the small substrate.

  The problem to be solved by the present invention is to provide a substrate transfer apparatus and a substrate processing apparatus capable of suppressing transfer deviation of a small substrate.

The substrate processing apparatus according to the embodiment
A plurality of support rollers having a first shaft for holding a plurality of rollers in the longitudinal direction in parallel with each other along a substrate conveyance path; and a conveyance unit configured to convey the substrate on the support roller by rotation of the support roller; ,
An ejection unit that ejects liquid toward the substrate conveyed by the conveyance unit;
Have
The injection unit is
A first ejection unit that is disposed below a transport path of the substrate and that ejects the liquid toward the upper side to supply the liquid to the lower surface of the substrate transported along the transport path;
A second ejecting unit that is disposed above the transport path of the substrate and that ejects the liquid downward to supply the liquid to the upper surface of the substrate transported along the transport path;
Have
The first injection unit and the second injection unit are disposed apart from each other along the substrate transfer path, and the first injection unit transfers the substrate with respect to the second injection unit. Arranged between two adjacent support rollers on the upstream side in the direction, and the second ejection unit is disposed on the upper surface of the substrate after the liquid is supplied to the lower surface by the first ejection unit. In contrast to supplying the liquid,
A contact roller that comes into contact with the substrate to be conveyed from above is provided at a position facing the first ejection unit via the conveyance path,
The second ejecting unit is located at a position facing one of the support rollers via the transport path.
Provided,
The contact roller is rotatably provided on the support block via the second shaft,
The support block has a support wall that rotatably holds the first shaft.
An adjustment member that adjusts the distance between the lower surface of the support block and the upper surface of the support wall;
A regulating member that regulates movement of the support block in the horizontal plane direction;
It is characterized by being provided via.

  According to the present invention, it is possible to suppress the displacement of the small substrate.

It is a figure which shows schematic structure of the substrate processing apparatus which concerns on one Embodiment. It is explanatory drawing for demonstrating the board | substrate parallel conveyance which concerns on one Embodiment. It is a figure which shows the support roller which concerns on one Embodiment. It is a figure which shows the support roller and auxiliary roller which concern on one Embodiment. It is a figure which expands and shows a part of support roller and auxiliary roller shown in FIG. It is a figure which shows the support structure of the support roller and auxiliary roller which are shown in FIG. (A) It is a figure which decomposes | disassembles and expands and shows the attachment part of the roller and shaft of the support roller which concerns on one Embodiment, (b) The side which shows the attachment part of the roller and shaft of the support roller shown to the (a) FIG.

  An embodiment will be described with reference to the drawings. A substrate processing apparatus according to one embodiment below is an application example in which a substrate transfer apparatus is applied to a substrate processing apparatus.

  As shown in FIG. 1, a substrate processing apparatus 1 according to an embodiment includes a transport unit 2 that transports a substrate W, a processing unit 3 that processes a substrate W transported by the transport unit 2, and a transport unit 2. A cleaning unit 4 for cleaning the substrate W to be transported, a high-pressure unit 5 for processing the substrate W transported by the transport unit 2 at a high pressure, and a drying unit 6 for drying the substrate W transported by the transport unit 2 are provided. ing. The substrate W is transported in a predetermined direction in the horizontal plane (right direction in FIG. 1).

  Here, as shown in FIG. 2, a plurality of substrates W are transported in parallel. For this reason, a plurality of transport paths A1 for the substrates W are arranged in parallel. In FIG. 2, as an example, there are six transport paths A1, and these transport paths A1 are parallel to each other. The six substrates W are simultaneously transferred by the transfer unit 2 along the transfer path A1.

  The substrate W is a rectangular substrate such as glass, and its size is, for example, in the range of 3 inches to 22.5 inches (within the range). On the surface of the substrate W, for example, particles (foreign matter) containing cerium oxide may remain. These particles are attached in the process of polishing the glass substrate, and it is necessary to remove the particles, that is, the abrasive from the glass substrate.

  The transport unit 2 includes a plurality of long support rollers 11 that support the substrate W, and transports the substrate W on each support roller 11 by the rotation of the support rollers 11. These support rollers 11 are arranged along the transport path A1 in parallel with each other, and three or more support rollers 11 are provided at predetermined intervals so as to support the substrate W when the substrate W is transported. . This predetermined interval is determined according to the size of the substrate W. These support rollers 11 are configured to rotate in synchronization with each other.

  As shown in FIG. 3, the support roller 11 has a plurality of rollers 11a for forming six parallel transport paths A1 and a shaft 11b for holding these rollers 11a. Each roller 11a is positioned so as to sandwich the substrate W by a pair of rollers 11a, and is provided so as to form six parallel transport paths A1. The shaft 11b holds all the rollers 11a and serves as a rotating shaft that rotates in response to driving of a motor (not shown).

  Returning to FIG. 1, the processing unit 3 applies a pair of brush rollers 21 and 22 for brushing both surfaces of the substrate W to be transported, that is, upper and lower surfaces (hereinafter simply referred to as upper and lower surfaces) in FIG. Shower units 23 and 24 for supplying the processing liquid are provided. The processing unit 3 brushes the upper and lower surfaces of the substrate W transported by the transport unit 2 with a pair of brush rollers 21 and 22 while supplying the processing liquid from the shower unit 23 to the brush roller 21.

  The brush roller 21 has a rotating brush 21a provided for each of the six transport paths A1 and a shaft 21b that holds the rotating brush 21a. The shaft 21b holds all the rotating brushes 21a, and all these rotating brushes 21a rotate when the shaft 21b rotates. The shaft 21b has a drive source (not shown), and this drive source may be shared with the shaft 11b of the support roller 11. In this case, the shaft 21b rotates in synchronization with the rotation of the support roller 11. It becomes a rotating shaft. The brush roller 21 is provided above the transport path A1 so as to brush the surface of the substrate W, that is, the upper surface in FIG. 1 (hereinafter simply referred to as the upper surface).

  The brush roller 22 has the same structure as the brush roller 21 described above, and includes a rotating brush 22a provided for each of the six transport paths A1 and a shaft 22b that holds the rotating brush 22a. The shaft 22b holds all the rotating brushes 22a, and all these rotating brushes 22a rotate when the shaft 22b rotates. The shaft 22b has a drive source (not shown), and this drive source may be shared with the shaft 11b of the support roller 11. In this case, the shaft 22b rotates in synchronization with the rotation of the support roller 11. It becomes a rotating shaft. The brush roller 22 is provided below the transport path A1 so as to brush the surface of the substrate W, that is, the lower surface in FIG. 1 (hereinafter simply referred to as the lower surface).

  The shower unit 23 has a plurality of shower nozzles 23a that discharge the processing liquid downward, and supplies the processing liquid from the shower nozzles 23a to the rotating brushes 21a of the brush roller 21, respectively. The shower nozzles 23a are arranged in the extending direction of the support roller 11 (the direction orthogonal to the transport direction in the horizontal plane), and the discharge port at the tip is directed toward the brush roller 21 so that the substrate W is transported. The nozzle is tilted downstream and attached to a nozzle support shaft (not shown) so as to be inclined at a predetermined angle with respect to the transport path A1.

  The shower unit 24 has a structure similar to that of the above-described shower unit 23 and includes a plurality of shower nozzles 24a that discharge the processing liquid upward, and each of the brush rollers 22 is provided from the shower nozzle 24a. A processing liquid is supplied to the rotating brush 22a. The shower nozzles 24 a are arranged in the extending direction of the support roller 11 (a direction orthogonal to the transport direction in the horizontal plane), and the discharge port at the tip is directed toward the brush roller 22 to transport the substrate W. The nozzle is tilted downstream and attached to a nozzle support shaft (not shown) so as to be inclined at a predetermined angle with respect to the transport path A1.

  As the treatment liquid for the shower units 23 and 24, for example, a treatment liquid containing at least two kinds of sodium hydroxide, potassium hydroxide, a chelating agent, a surfactant, and alcohol is used. It is desirable that the temperature of the treatment liquid is maintained within a range of, for example, room temperature to 60 ° C. or less.

  The cleaning unit 4 includes a plurality of shower units 31 and 32 that discharge a rinsing liquid (for example, ultrapure water) downward, and a plurality of shower units that discharge a rinsing liquid (for example, ultrapure water) upward. 33 and 34.

  The shower unit 31 has a plurality of shower nozzles 31 a that discharge the processing liquid downward, and supplies a rinse liquid to the upper surface of the substrate W from each of the shower nozzles 31 a. The shower nozzles 31a are arranged in the extending direction of the support roller 11 (a direction orthogonal to the transport direction in the horizontal plane), and the discharge port at the front end is directed downward to be perpendicular to the transport path A1. It is attached to a shaft (not shown) for supporting the nozzle. The shower unit 32 has the same structure as the shower unit 31 described above, and supplies a rinse liquid to the upper surface of the substrate W from the shower nozzle 32a.

  The shower unit 33 has a plurality of shower nozzles 33 a that discharge the processing liquid upward, and supplies a rinse liquid to the lower surface of the substrate W from each of the shower nozzles 33 a. The shower nozzles 33a are arranged in the extending direction of the support roller 11 (a direction orthogonal to the transport direction in the horizontal plane), and the discharge port at the tip is directed upward to be perpendicular to the transport path A1. It is attached to a shaft (not shown) for supporting the nozzle. The shower part 34 has the same structure as the shower part 33 described above, and supplies the rinse liquid to the lower surface of the substrate W from the shower nozzle 34a.

  In the above description, the example in which the shower nozzles 31a, 32a, 33a, and 34a are perpendicular to the transport path A1 (substrate W) has been described. However, the present invention is not limited to this, and the shower nozzles 31a and You may make it incline 32a, 33a, 34a with respect to conveyance path | route A1.

  The high-pressure unit 5 includes an injection tool 41 that injects a cleaning liquid (for example, ultrapure water) at a high pressure upward, an injection tool 42 that injects a cleaning liquid (for example, ultrapure water) at a high pressure, and a conveyance And a plurality of auxiliary rollers 43 that hold down the upper surface of the substrate W moving along the path A1. The high-pressure unit 5 directs the cleaning liquid from the spray tool 41 toward the lower surface of the substrate W transported by the transport unit 2, and directs the cleaning liquid from the spray tool 42 toward the upper surface of the substrate W transported by the transport unit 2, Injection is performed at a predetermined pressure (for example, within a range of 0.1 to 0.7 Mpa).

  The spray tool 41 has a plurality of nozzles 41a that spray the cleaning liquid upward, and supplies the cleaning liquid from the nozzles 41a to the lower surface of the substrate W at the above-described high pressure. The nozzles 41a are arranged in the extending direction of the support roller 11 (a direction orthogonal to the conveying direction in the horizontal plane), and the nozzle at the tip is directed upward to be perpendicular to the conveying path A1. It is attached to a shaft (not shown) for supporting the nozzle.

  The injection tool 42 has a structure similar to that of the above-described injection tool 41, and has a plurality of nozzles 42a for injecting the cleaning liquid downward. The cleaning liquid is supplied at a high pressure which is a pressure. The nozzles 42a are arranged in the extending direction of the support roller 11 (a direction orthogonal to the transport direction in the horizontal plane), and further, the nozzle at the tip is directed downward and perpendicular to the transport path A1. It is attached to a shaft (not shown) for supporting the nozzle.

  These injection tools 41 and 42 are arranged a predetermined distance apart along the transport path A1. Thereby, the injection tools 41 and 42 do not face each other across the conveyance path A1. Furthermore, the ejection tool 41 is provided at a position between the two support rollers 11, and the ejection tool 42 is provided at a position facing the one support roller 11 via the transport path A <b> 1.

  As the ejection tools 41 and 42, a nozzle or shower that ejects one fluid (liquid), a nozzle or shower that ejects two fluids (gas-liquid mixture), and the like can be used. Each of the ejection tools 41 and 42 functions as an ejection unit that ejects liquid toward the substrate W transported by the transport unit 2.

  In the above description, an example is described in which each nozzle 41a and 42a is perpendicular to the transport path A1 (substrate W). However, the present invention is not limited to this, and these nozzles 41a and 42a are connected to the transport path A1. You may make it incline with respect to it. However, since the nozzles 41a and 42a are for the purpose of taking particles from the substrate W at a high pressure by the impact of jetting, the nozzles 41a and 42a are preferably installed vertically as described above.

  As shown in FIG. 4, the auxiliary roller 43 includes a plurality of rollers 43a that respectively press the upper surface of the substrate W that moves along each transport path A1, and a shaft 43b that holds the rollers 43a. The auxiliary roller 43 is provided at a position facing the plurality of support rollers 11 other than the support roller 11 facing the spray tool 42 described above via the transport path A1, and a position facing the spray tool 41 via the transport path A1. It has been. These auxiliary rollers 43 function as contact rollers that contact the substrate W transported by the transport unit 2.

  As shown in FIGS. 4 and 5, each roller 43a is positioned and provided so as to hold a single substrate W by a pair of rollers 43a. The pair of rollers 43 a presses the substrate W by contacting both ends of the substrate W in the width direction (the extending direction of the support roller 11). The shaft 43b holds all the rollers 43a, and all these rollers 43a rotate when the shaft 43b rotates. The shaft 43b has a drive source (not shown), and this drive source may be shared with the shaft 11b of the support roller 11. In this case, the shaft 43b rotates in synchronization with the rotation of the support roller 11. It becomes a rotating shaft. The roller 43a has an elastic member 43a1 such as rubber on its outer periphery (see FIG. 5). This elastic member 43a1 is a place that contacts the substrate W transported by the transport unit 2.

  As shown in FIG. 4, a gear 43 c is provided at one end of the shaft 43 b, and the gear 43 c meshes with a gear 11 c provided at one end of the shaft 11 b of the support roller 11. For this reason, when the shaft 11b of the support roller 11 rotates according to the drive of the motor, the shaft 43b of the auxiliary roller 43 also rotates in synchronization therewith.

  As shown in FIGS. 4 and 6, support blocks 43d for rotatably supporting the shaft 43b are provided at both ends of the shaft 43b. The support block 43d is placed on the upper surface (in FIGS. 4 and 6) of the support wall 11d that rotatably supports the shaft 11b of the support roller 11.

  As shown in FIG. 6, the support block 43d is provided with a plurality of adjustment members (two in FIG. 6) 43e for adjusting the separation distance (vertical separation distance) between the upper surface of the support wall 11d and the lower surface of the support block 43d. It has been. As these adjustment members 43e, for example, bolts or the like can be used, and each adjustment member 43e is inserted into a bolt hole (through hole) located at both ends of the base of the support block 43d. The distance between the upper surface of the support wall 11d and the lower surface of the support block 43d by each adjusting member 43e, that is, the distance between the support roller 11 and the auxiliary roller 43 (the roller 11a and the roller that face each other via the transport path A1) By changing the distance from 43a (see FIG. 5), it is possible to adjust the load when the auxiliary roller 43 presses the substrate W while the substrate W is being transported.

  In order to restrict the movement of the support block 43d in the horizontal plane direction, a plurality of restriction members 11e such as pins are provided on the upper surface of the support wall 11d, and the support block 43d is fitted to these restriction members 11e. A plurality of holes (not shown) are formed in. The support block 43d is placed on the support wall 11d and does not move due to its own weight, but at this time, each regulating member 11e is fitted in each hole of the support block 43d, so that the movement of the support block 43d in the horizontal plane direction is regulated. Become.

  Returning to FIG. 1, the drying unit 6 includes an air knife 51 that discharges a drying gas (for example, air or nitrogen gas) downward, and a drying gas (for example, air or nitrogen gas) upward. And an air knife 52 that discharges water. The drying unit 6 discharges a drying gas from the air knives 51 and 52 toward the upper and lower surfaces of the substrate W being transported by the transport unit 2.

  The air knife 51 is provided at a position above the transport path A1 so that the discharge port at the tip thereof is directed downward and is tilted to the downstream side in the transport direction of the substrate W so as to be inclined at a predetermined angle with respect to the transport path A1. ing. The air knife 52 is provided at a position below the transport path A1 so that the discharge port at the tip thereof is directed upward and is tilted to the downstream side in the transport direction of the substrate W so as to be inclined at a predetermined angle with respect to the transport path A1. ing.

  Next, substrate processing performed by the above-described substrate processing apparatus 1 will be described.

  Each support roller 11 of the transport unit 2 rotates, and the six substrates W on the support rollers 11 are transported in parallel in a predetermined transport direction (the right direction in FIGS. 1 and 2). At this time, each substrate W is transported along each transport path A1 while being supported by at least three support rollers 11.

  By this conveyance, each substrate W moves along the individual conveyance path A <b> 1 and first passes between the pair of brush rollers 21 and 22 in the processing unit 3. During the passage, the upper and lower surfaces of the substrates W are brushed by the brush rollers 21 and 22 rotating while being supplied with the processing liquid from the shower portions 23 and 24. Thereby, particles are removed from the upper and lower surfaces of all six substrates W.

  Next, each substrate W passes between the shower unit 31 and the shower unit 33 and between the shower unit 32 and the shower unit 34 in the cleaning unit 4. During this passage, the rinsing liquid is discharged from the shower portions 31 and 32 to the upper surface of each substrate W, and the rinsing liquid is discharged from the shower portions 33 and 34 to the lower surface of each substrate W. Will be washed. As a result, the residual processing liquid is removed from the upper and lower surfaces of all six substrates W.

  Thereafter, each substrate W passes above the injection tool 41 and below the injection tool 42 in the high-pressure unit 5. During this passage, the cleaning liquid is discharged from the spray tool 41 at a predetermined pressure (for example, within a range of 0.1 to 0.7 MPa) toward the lower surface of each substrate W, and the lower surface of each substrate W is cleaned. Thereby, the lower surfaces of all six substrates W are sufficiently cleaned. Thereafter, the cleaning liquid is discharged from the spray tool 42 toward the upper surface of each substrate W at a predetermined pressure (for example, within a range of 0.1 to 0.7 Mpa), and the upper surface of each substrate W is cleaned. Thereby, the upper and lower surfaces of all six substrates W are sufficiently cleaned.

  Finally, each substrate W passes between the air knife 51 and the air knife 52 in the drying unit 6. During this passage, drying gas is released from the air knife 51 toward the upper surface of each substrate W, and further, drying gas is discharged from the air knife 52 toward the lower surface of each substrate W. The upper and lower surfaces are dried. Thereby, the upper and lower surfaces of all six substrates W are sufficiently dried.

  According to such a substrate processing process, when the substrate W passes through the high-pressure unit 5, the substrate W that moves on each support roller 11 is pressed by the plurality of auxiliary rollers 43. Thereby, it is possible to prevent the substrate W from being displaced from the transport path A1. Further, even when the processing liquid sprayed from the spray tool 41 hits the lower surface of the substrate W, the auxiliary roller 43 that faces the spray tool 41 via the transport path A1 exists and presses the upper surface of the substrate W. It is possible to prevent W from deviating from the transport path A1. Similarly, even when the processing liquid sprayed from the spray tool 42 hits the upper surface of the substrate W, the support roller 11 that faces the spray tool 42 via the transport path A1 exists and presses the lower surface of the substrate W. It is possible to prevent the substrate W from being displaced from the transport path A1.

  Here, normally, when the processing liquid hits the surface (lower surface or upper surface) of the substrate W at a high pressure (for example, within a range of 0.1 to 0.7 MPa), the small substrate W is displaced from the predetermined transport path A1. May end up. However, the auxiliary roller 43 is provided at a position facing the support roller 11 via the transport path A1, and further at a position facing the spray tool 41 via the transport path A1, and the spray tool 42 is supported. It is provided at a position facing the roller 11 via the transport path A1. For this reason, it becomes possible to suppress the conveyance shift of the substrate W with certainty, and it is possible to prevent the substrate W from being damaged (including scratches) or processing failure.

  Further, for example, when the spray tool 41 and the spray tool 42 are opposed to each other via the transport path A1, since the spray ports are opposed to each other, a phenomenon that the substrate W vibrates occurs and a transport shift occurs. May be easier. For this reason, the injection tools 41 and 42 are spaced apart along the transport path A1. As a result, the above-described vibration phenomenon of the substrate W can be suppressed, and the transfer deviation of the substrate W can be reliably suppressed.

  As described above, according to the embodiment, by providing the auxiliary roller 43 as a contact roller at a position facing the ejection tool 41 via the transport path A1, the processing liquid ejected from the ejection tool 41 can be obtained. Even when it hits the lower surface of the substrate W, it is possible to prevent the substrate W from being displaced from the transport path A <b> 1 due to the presence of the auxiliary roller 43. Thereby, the conveyance shift of the board | substrate W can be suppressed. Similarly, by providing the support roller 11 as a contact roller at a position facing the spray tool 42 via the transport path A1, even if the processing liquid sprayed from the spray tool 42 hits the upper surface of the substrate W, the support roller 11 It is possible to suppress the substrate W from being displaced from the transport path A1 due to the presence. Thereby, the conveyance shift of the board | substrate W can be suppressed.

Further, a plurality of rollers 11a, rollers 43a, or rotating brushes 21a and 22a provided corresponding to each substrate W transported along a plurality of transport paths A1 are provided as one shaft 11b and shaft 43b. Alternatively, all the shafts 21b and 22b are held (shared). Therefore, process between the conveying path, washed, dried with synchronization can be achieved easily, such as, so attained is uniform the pressing force to the substrate between the transport path, it is possible to prevent occurrence of uneven processing.

(Other embodiments)
In the above-described embodiment, processing, cleaning, and drying are performed on the upper and lower surfaces (in FIG. 1) of the substrate W (double-side processing), but the present invention is not limited to this. Processing, cleaning, and drying may be performed only on one side (single side processing).

  In the above-described embodiment, the auxiliary roller 43 is configured to hold the single substrate W by the two rollers 43a. However, the present invention is not limited to this. For example, the auxiliary roller 43 is configured by one or three rollers 43a. One substrate W may be pressed, and the number of rollers 43a is not particularly limited.

  Further, in attaching each roller 11a to the shaft 11b, attaching each rotating brush 21a to the shaft 21b, attaching each rotating brush 22a to the shaft 22b, and attaching each roller 43a to the shaft 43b, FIG. ) And a configuration as shown in FIG. The configuration shown in FIGS. 7A and 7B is representative of the attachment structure of one roller 11a to the shaft 11b (FIG. 7B is a side view of FIG. 7A). Is). A hole H having the same diameter as the outer periphery of the shaft 11b is provided at the center of the roller 11a, and the inner surface of the roller 11a has a semicircular cross section (the radius is the same as the radius of the shaft 11b). A half outer ring H1 is provided integrally. The shaft 11b is passed through the hole H provided in the roller 11a, and the roller 11a is slid on the shaft 11b to determine the position of the roller 11a on the shaft 11b. Then, the other half outer ring H2 is fixed using the screw N. By fixing to one outer ring H1, the position of the roller 11a with respect to the shaft 11b can be fixed.

  By comprising in this way, the attachment position of each roller 11a with respect to the shaft 11b, the attachment position of each rotary brush 21a or 22a with respect to the shaft 21b or 22b, and also the attachment position of each roller 43a with respect to the shaft 43b individually It can be easily adjusted. In particular, regarding the rollers 11a and 43a, the support position and the pressing position of the substrate W are individually adjusted to the optimum positions according to the width dimension of the substrate W (the length in the direction orthogonal to the transport direction of the substrate W). It becomes possible. A plurality of grooves 11f are formed at equal intervals in the circumferential direction in FIG. 7A on the inner peripheral surface of the hole H provided in the roller 11a and the inner peripheral surface of one half outer ring H1. Has been. When the position of the roller 11a is changed on the shaft 11b, the friction can be reduced by the formation of the groove 11f, and the position can be changed smoothly. The auxiliary roller 43a can be configured similarly.

  As mentioned above, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Conveyance part 11 Support roller 11a Roller 41 Injection tool 42 Injection tool 43 Auxiliary roller 43a Roller W Substrate

Claims (5)

A plurality of support rollers having a first shaft for holding a plurality of rollers in the longitudinal direction in parallel with each other along a substrate conveyance path; and a conveyance unit configured to convey the substrate on the support roller by rotation of the support roller; ,
An ejection unit that ejects liquid toward the substrate conveyed by the conveyance unit;
Have
The injection unit is
A first ejection unit that is disposed below a transport path of the substrate and that ejects the liquid toward the upper side to supply the liquid to the lower surface of the substrate transported along the transport path;
A second ejecting unit that is disposed above the transport path of the substrate and that ejects the liquid downward to supply the liquid to the upper surface of the substrate transported along the transport path;
Have
The first injection unit and the second injection unit are disposed apart from each other along the substrate transfer path, and the first injection unit transfers the substrate with respect to the second injection unit. Arranged between two adjacent support rollers on the upstream side in the direction, and the second ejection unit is disposed on the upper surface of the substrate after the liquid is supplied to the lower surface by the first ejection unit. In contrast to supplying the liquid,
A contact roller that comes into contact with the substrate to be conveyed from above is provided at a position facing the first ejection unit via the conveyance path,
The second ejection unit is provided at a position facing one of the support rollers via the conveyance path,
The contact roller is rotatably provided on the support block via the second shaft,
The support block has a support wall that rotatably holds the first shaft.
An adjustment member that adjusts the distance between the lower surface of the support block and the upper surface of the support wall;
A regulating member that regulates movement of the support block in the horizontal plane direction;
A substrate processing apparatus, which is provided via a substrate. A plurality of support rollers having a first shaft for holding a plurality of rollers in the longitudinal direction in parallel with each other along a substrate conveyance path; and a conveyance unit configured to convey the substrate on the support roller by rotation of the support roller; ,
An ejection unit that ejects liquid toward the substrate conveyed by the conveyance unit;
Have
The injection unit is
A first ejection unit that is disposed below a transport path of the substrate and that ejects the liquid toward the upper side to supply the liquid to the lower surface of the substrate transported along the transport path;
A second ejecting unit that is disposed above the transport path of the substrate and that ejects the liquid downward to supply the liquid to the upper surface of the substrate transported along the transport path;
Have
The first injection unit and the second injection unit are disposed apart from each other along the substrate transfer path, and the first injection unit transfers the substrate with respect to the second injection unit. Arranged between two adjacent support rollers on the upstream side in the direction, and the second ejection unit is disposed on the upper surface of the substrate after the liquid is supplied to the lower surface by the first ejection unit. In contrast to supplying the liquid,
A contact roller that comes into contact with the substrate to be conveyed from above is provided at a position facing the first ejection unit via the conveyance path,
The second ejection unit is provided at a position facing the one support roller via the transport path;
A substrate processing apparatus. The transport unit forms a plurality of transport paths so that a plurality of the substrates are transported in parallel,
The substrate processing apparatus according to claim 1, wherein the contact roller is individually provided in the plurality of transport paths. The transport unit forms a plurality of transport paths so that a plurality of the substrates are transported in parallel,
The contact rollers are individually provided in the plurality of transport paths,
The substrate processing apparatus according to claim 1 , wherein the contact rollers individually provided in the plurality of transport paths are held by the common second shaft. A processing unit for brushing the substrate transported by the transport unit by a brush roller to which a processing liquid is supplied;
A cleaning unit that discharges a rinsing liquid toward the substrate transported by the transport unit;
A drying section for releasing gas toward the substrate transported by the transport section;
The substrate processing apparatus according to claim 1, further comprising:

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