JP2018108892A5 - - Google Patents
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- JP2018108892A5 JP2018108892A5 JP2017227757A JP2017227757A JP2018108892A5 JP 2018108892 A5 JP2018108892 A5 JP 2018108892A5 JP 2017227757 A JP2017227757 A JP 2017227757A JP 2017227757 A JP2017227757 A JP 2017227757A JP 2018108892 A5 JP2018108892 A5 JP 2018108892A5
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- levitation
- substrate
- blocks
- gap
- levitation device
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- 238000005339 levitation Methods 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 39
- 239000012530 fluid Substances 0.000 claims description 15
- 230000032258 transport Effects 0.000 description 12
- 239000007788 liquid Substances 0.000 description 1
Description
また、実施形態に係る基板処理装置は、
基板を浮上させて搬送しながら前記基板に対して処理を行う基板処理装置において、
前記基板を浮上させる浮上装置と、前記浮上装置によって浮上支持される前記基板を搬送方向に搬送する搬送力付与機構と、を有する浮上搬送装置と、
前記浮上搬送装置により浮上搬送される前記基板に対して処理流体を供給する処理流体供給機構と、
を有し、
前記浮上装置は、
前記基板の搬送経路を挟んで、下側浮上装置と上側浮上装置を有し、
前記下側浮上装置と前記上側浮上装置は、いずれも複数の浮上ブロックを有し、
前記各浮上ブロックは、搬送される前記基板に対向する面に、流体を噴出する噴出孔と、前記流体を吸引する吸引孔と、をそれぞれ複数有し、
前記下側浮上装置と前記上側浮上装置をそれぞれ構成する複数の前記浮上ブロックは、
前記基板の搬送方向において間隙を設けて配置され、
前記下側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙には、前記上側浮上装置を構成するいずれかの前記浮上ブロックが対向し、前記上側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙には、前記下側浮上装置を構成するいずれかの前記浮上ブロックが対向し、
前記下側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙と、前記上側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙とは、対向しないようにして配置されることを特徴とする。
In addition, the substrate processing apparatus according to the embodiment
In the substrate processing apparatus for processing the substrate while the substrate is lifted and conveyed,
A levitation transport device having a levitation device for levitating the substrate, and a transport force applying mechanism for transporting the substrate supported and levitated by the levitation device in a transport direction;
A processing fluid supply mechanism that supplies a processing fluid to the substrate that is levitated and conveyed by the levitating and conveying device;
Have
The levitating device is
With a lower levitation device and an upper levitation device across the substrate transport path,
The lower levitation device and the upper levitation device both have a plurality of levitation blocks,
Each of the floating blocks has a plurality of ejection holes for ejecting fluid and suction holes for sucking the fluid on the surface facing the substrate to be conveyed,
The plurality of levitation blocks that respectively constitute the lower levitation device and the upper levitation device,
Arranged with a gap in the substrate transport direction,
Any of the levitation blocks constituting the upper levitation device faces the gap between the plurality of levitation blocks constituting the lower levitation device, and the plurality of levitation blocks constituting the upper levitation device. Any of the levitation blocks constituting the lower levitation device are opposed to the gap between them,
The gap between the plurality of floating blocks constituting the lower levitation device and the gap between the plurality of levitation blocks constituting the upper levitation device are arranged so as not to face each other. Features.
なお、上側浮上装置12と下側浮上装置11がそれぞれ有する浮上ブロック12a、12bの配置関係を図1を用いて説明したが、本実施形態においては、図4に示すように、浮上ブロック12aと12bは、搬送される基板Wの大きさに合わせて、基板Wの搬送方向Aだけでなく、搬送方向Aとは直交する方向(以下、「幅方向」という。)にも複数(本実施形態においては5つ)設けられていてもよい。この場合には、先に述べた間隙は、搬送方向Aに加え、前述の幅方向に沿っても形成され、しかも幅方向の長さは、基板Wの大きさによって浮上ブロック12a、12bの数を調整することで、自由に設定することができる。なお、図4においては、処理液供給装置20、30、制御部40を省略してある。 In addition, although the arrangement | positioning relationship of the floating blocks 12a and 12b which each of the upper levitation apparatus 12 and the lower levitation apparatus 11 has was demonstrated using FIG. 1, in this embodiment, as shown in FIG. According to the size of the substrate W to be transported, a plurality of 12b are provided not only in the transport direction A of the substrate W but also in a direction perpendicular to the transport direction A (hereinafter referred to as “width direction”) (this embodiment). 5) may be provided. In this case, the gap described above is formed not only in the conveyance direction A but also in the width direction described above, and the length in the width direction depends on the size of the substrate W and is equal to the number of the floating blocks 12a and 12b. It can be set freely by adjusting. In FIG. 4, the processing liquid supply devices 20 and 30 and the control unit 40 are omitted.
搬送力付与機構13は、浮上ブロック12a、12bに対して非接触状態(浮上状態)で保持された基板Wを、搬送方向Aに搬送するものである。具体的には、図4に示すように、基板Wの搬送方向Aに沿った側面に接触するローラ13aを有している。各ローラ13aは、不図示の駆動装置によって回転駆動させられるようになっている。ローラ13aの回転により、浮上している基板WにA方向への搬送力が付与されることになる。
The transport force applying mechanism 13 transports the substrate W held in a non-contact state (floating state) with respect to the floating blocks 12a and 12b in the transport direction A. Specifically, as shown in FIG. 4, the roller 13 a is in contact with the side surface along the transport direction A of the substrate W. Each roller 13a is rotationally driven by a driving device (not shown). By the rotation of the roller 13a , a transport force in the A direction is applied to the substrate W that is flying.
Claims (7)
前記基板の搬送経路を挟んで、下側浮上装置と上側浮上装置を有し、
前記下側浮上装置と前記上側浮上装置は、いずれも複数の浮上ブロックを有し、
前記各浮上ブロックは、搬送される前記基板に対向する面に、流体を噴出する噴出孔と、前記流体を吸引する吸引孔と、をそれぞれ複数有し、
前記下側浮上装置と前記上側浮上装置をそれぞれ構成する複数の前記浮上ブロックは、
前記基板の搬送方向において間隙を設けて配置され、
前記下側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙には、前記上側浮上装置を構成するいずれかの前記浮上ブロックが対向し、前記上側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙には、前記下側浮上装置を構成するいずれかの前記浮上ブロックが対向し、
前記下側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙と、前記上側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙とは、対向しないようにして配置されることを特徴とする浮上搬送装置。 A levitating and conveying device for levitating and conveying a substrate,
With a lower levitation device and an upper levitation device across the substrate transport path,
The lower levitation device and the upper levitation device both have a plurality of levitation blocks,
Each of the floating blocks has a plurality of ejection holes for ejecting fluid and suction holes for sucking the fluid on the surface facing the substrate to be conveyed,
The plurality of levitation blocks that respectively constitute the lower levitation device and the upper levitation device,
Arranged with a gap in the substrate transport direction,
Any of the levitation blocks constituting the upper levitation device faces the gap between the plurality of levitation blocks constituting the lower levitation device, and the plurality of levitation blocks constituting the upper levitation device. Any of the levitation blocks constituting the lower levitation device are opposed to the gap between them,
The gap between the plurality of floating blocks constituting the lower levitation device and the gap between the plurality of levitation blocks constituting the upper levitation device are arranged so as not to face each other. Floating transport device characterized.
前記基板を浮上させる浮上装置と、前記浮上装置によって浮上支持される前記基板を搬送方向に搬送する搬送力付与機構と、を有する浮上搬送装置と、
前記浮上搬送装置により浮上搬送される前記基板に対して処理流体を供給する処理流体供給機構と、
を有し、
前記浮上装置は、
前記基板の搬送経路を挟んで、下側浮上装置と上側浮上装置を有し、
前記下側浮上装置と前記上側浮上装置は、いずれも複数の浮上ブロックを有し、
前記各浮上ブロックは、搬送される前記基板に対向する面に、流体を噴出する噴出孔と、前記流体を吸引する吸引孔と、をそれぞれ複数有し、
前記下側浮上装置と前記上側浮上装置をそれぞれ構成する複数の前記浮上ブロックは、
前記基板の搬送方向において間隙を設けて配置され、
前記下側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙には、前記上側浮上装置を構成するいずれかの前記浮上ブロックが対向し、前記上側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙には、前記下側浮上装置を構成するいずれかの前記浮上ブロックが対向し、
前記下側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙と、前記上側浮上装置を構成する複数の前記浮上ブロック間に有する前記間隙とは、対向しないようにして配置されることを特徴とする基板処理装置。 In the substrate processing apparatus for processing the substrate while the substrate is lifted and conveyed,
A levitation transport device having a levitation device for levitating the substrate, and a transport force applying mechanism for transporting the substrate supported and levitated by the levitation device in a transport direction;
A processing fluid supply mechanism that supplies a processing fluid to the substrate that is levitated and conveyed by the levitating and conveying device;
Have
The levitating device is
With a lower levitation device and an upper levitation device across the substrate transport path,
The lower levitation device and the upper levitation device both have a plurality of levitation blocks,
Each of the floating blocks has a plurality of ejection holes for ejecting fluid and suction holes for sucking the fluid on the surface facing the substrate to be conveyed,
The plurality of levitation blocks that respectively constitute the lower levitation device and the upper levitation device,
Arranged with a gap in the substrate transport direction,
Any of the levitation blocks constituting the upper levitation device faces the gap between the plurality of levitation blocks constituting the lower levitation device, and the plurality of levitation blocks constituting the upper levitation device. Any of the levitation blocks constituting the lower levitation device are opposed to the gap between them,
The gap between the plurality of floating blocks constituting the lower levitation device and the gap between the plurality of levitation blocks constituting the upper levitation device are arranged so as not to face each other. A substrate processing apparatus.
前記下側浮上装置が有する2つの前記浮上ブロックによって形成される前記間隙は、前記上側浮上装置が有する2つの前記浮上ブロックによって形成される前記間隙よりも、前記基板の搬送方向の下流側に形成されることを特徴とする請求項5に記載の基板処理装置。 The lower levitation device and the upper levitation device both have two levitation blocks,
The gap formed by the two levitation blocks of the lower levitation device is formed on the downstream side in the substrate transport direction with respect to the gap formed by the two levitation blocks of the upper levitation device. The substrate processing apparatus according to claim 5, wherein:
前記上側浮上装置が有する前記間隙に配置されて、前記処理流体を供給する第1の供給ノズルと、
前記下側浮上装置が有する前記間隙に配置されて、前記処理流体を供給する第2の供給ノズルと、
を有し、
前記搬送力付与機構によって搬送される前記基板の上面に前記第1の供給ノズルから前記処理流体を供給し、前記基板の下面に前記第2の供給ノズルから前記処理流体を供給することを特徴とする請求項6に記載の基板処理装置。 The processing fluid supply mechanism includes:
A first supply nozzle disposed in the gap of the upper levitation device for supplying the processing fluid;
A second supply nozzle that is disposed in the gap of the lower levitation device and supplies the processing fluid;
Have
The processing fluid is supplied from the first supply nozzle to the upper surface of the substrate transported by the transport force applying mechanism, and the processing fluid is supplied from the second supply nozzle to the lower surface of the substrate. The substrate processing apparatus according to claim 6.
Priority Applications (4)
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TW106143470A TWI668173B (en) | 2016-12-28 | 2017-12-12 | Floating conveying device and substrate processing device |
KR1020170178373A KR101990219B1 (en) | 2016-12-28 | 2017-12-22 | Floating conveying device and substrate processing apparatus |
CN201711444785.1A CN108249159B (en) | 2016-12-28 | 2017-12-27 | Floating transfer device and substrate processing device |
US15/856,665 US10421622B2 (en) | 2016-12-28 | 2017-12-28 | Floating conveyor and substrate processing apparatus |
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JP2016254564 | 2016-12-28 | ||
JP2016254564 | 2016-12-28 |
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JP2018108892A5 true JP2018108892A5 (en) | 2019-10-10 |
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WO2005099350A2 (en) * | 2004-04-14 | 2005-10-27 | Coreflow Scientific Solutions Ltd. | Non-contact support platforms for distance adjustment |
KR20100123196A (en) * | 2009-05-14 | 2010-11-24 | 엘지디스플레이 주식회사 | Apparatus for treating surface of substrate and method for treating the same |
JP2011084352A (en) | 2009-10-14 | 2011-04-28 | Myotoku Ltd | Work levitation device |
JP2012096920A (en) * | 2010-11-05 | 2012-05-24 | Hitachi High-Technologies Corp | Glass substrate defect inspection device and glass substrate defect inspection method and glass substrate defect inspection system |
JP2014047020A (en) | 2012-08-31 | 2014-03-17 | Tanken Seal Seiko Co Ltd | Levitation device |
JP6315547B2 (en) * | 2013-12-17 | 2018-04-25 | 芝浦メカトロニクス株式会社 | Substrate processing equipment |
JP6258892B2 (en) * | 2014-05-13 | 2018-01-10 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and substrate processing method |
JP2016161007A (en) * | 2015-02-27 | 2016-09-05 | 株式会社日本製鋼所 | Gas flotation workpiece support device and non-contact workpiece support method |
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- 2017-11-28 JP JP2017227757A patent/JP2018108892A/en active Pending
- 2017-12-12 TW TW106143470A patent/TWI668173B/en active
- 2017-12-22 KR KR1020170178373A patent/KR101990219B1/en active IP Right Grant
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