CN104918411B - A kind of method and device removing aperture burr - Google Patents
A kind of method and device removing aperture burr Download PDFInfo
- Publication number
- CN104918411B CN104918411B CN201510249726.3A CN201510249726A CN104918411B CN 104918411 B CN104918411 B CN 104918411B CN 201510249726 A CN201510249726 A CN 201510249726A CN 104918411 B CN104918411 B CN 104918411B
- Authority
- CN
- China
- Prior art keywords
- plate surface
- grinding machine
- machine
- aperture burr
- layer board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to circuit board making technical field, specially a kind of method and device for removing aperture burr.The present invention is by increasing amary tape grinding machine and precision lapping machine, first with amary tape grinding machine polishing multilayer plate surface, then with the multiple-plate surface of precision lapping machine polishing, then again with the multiple-plate surface of kibbling mill polishing, the cutting output of nog plate section can be increased, to guaranteeing that aperture burr is completely severed removings, solving the problems, such as in rear process manufacturing process that dry film is punctured leads to the qualities hidden danger such as formation copper wire in having no copper in the holes or hole.By amary tape grinding machine and precision lapping machine and kibbling mill line, the treatment effeciency of aperture burr can be improved.
Description
Technical field
The present invention relates to circuit board making technical field more particularly to a kind of method and devices for removing aperture burr.
Background technique
PCB (Printed Circuit Board) is one of important component of electronics industry, is the support of electronic component
Body, the carrier of electrical connection.With electronics applications technology continuous renewal and function it is perfect, the design of PCB is more next
More precision, densification and high performance.For multi-layer PCB, realized between layers by drilling and making hole metallization
Circuit conducting, existing process is usually: preceding process production multi-layer board → drilling → kibbling mill nog plate → heavy copper → electric plating of whole board
→ rear process.However, it is easy occur burr at aperture, especially the thicker multi-layer board of external copper layers after drilling on multilayer boards,
Aperture burr situation is more serious, although part burr can be removed by kibbling mill nog plate, due to the polish-brush of kibbling mill nog plate
Measure small, the burr after nog plate at aperture is still raised, and during negative film technique makes outer-layer circuit, pasted dry film is easy to be pierced
It is broken, it is not switched off but is extruded to after kibbling mill nog plate to burr at the quality defects such as having no copper in the holes or aperture occur
In hole, copper wire can be formed in hole after electric plating of whole board, quality hidden danger occur.
Summary of the invention
The present invention is difficult to completely remove burr at aperture and leads to having no copper in the holes for the method for existing production plated through-hole
Or the problem of qualities hidden danger such as copper wire are formed in hole, a kind of method that can effectively remove burr at aperture is provided, and application should
Method removes the device of burr at aperture.
To achieve the above object, the present invention uses following technical scheme.
A method of removal aperture burr, comprising the following steps:
S1, it after drilling on multilayer boards, is polished multiple-plate surface with amary tape grinding machine；The multi-layer board includes internal layer
Plate, prepreg and outer copper foil, the inner plating and outer copper foil are press-fitted together as one by prepreg.
Preferably, using the multiple-plate surface of amary tape grinding machine polishing of 600 mesh of abrasive band model.
It is furthermore preferred that nog plate electric current is 4-5A, and wear scar width is when using amary tape grinding machine polishing multiple-plate surface
10-16mm。
S2, multi-layer board is blown with blower, the dust in multilayer plate surface and hole is blown out.
S3, multiple-plate surface of being polished with precision lapping machine.
Preferably, the nonwoven fabric polish-brush there are four 320 mesh of model is set on the precision lapping machine.
It is furthermore preferred that nog plate electric current is 2.6-3.0A, and wear scar width is when with precision lapping machine polishing multiple-plate surface
10-16mm。
S4, multiple-plate surface of being polished with kibbling mill.
Preferably, the polish-brush of the kibbling mill includes a circular shaft, and the surface of the circular shaft is fixed with nylon yarn.
It is furthermore preferred that wear scar width is 10-16mm when with kibbling mill polishing multiple-plate surface.
S5, clear multi-layer board is washed with water, then dries multi-layer board.
It is a kind of using the above method removal aperture burr device, including it is sequentially connected enter plate conveyer, dust cleaning
Mechanism, inspection body, kibbling mill, water washing mechanism and drier, it is described enter plate conveyer before be additionally provided with abrasive band grinding mechanism, institute
It states abrasive band grinding mechanism and includes the first amary tape grinding machine and the second amary tape grinding machine, first amary tape grinding machine and the second abrasive band
A panel turnover machine is equipped between grinder.
Preferably, a precision lapping machine is set between inspection body and kibbling mill.
Compared with prior art, the beneficial effects of the present invention are: the present invention is by increasing amary tape grinding machine and precise finiss
Then machine first uses corase grinding then with the multiple-plate surface of precision lapping machine polishing with amary tape grinding machine polishing multilayer plate surface again
The multiple-plate surface of machine polishing, can increase the cutting output of nog plate section, to guarantee that aperture burr is completely severed removing, solve
Dry film is punctured the problem of leading to the qualities hidden danger such as formation copper wire in having no copper in the holes or hole in process manufacturing process afterwards.Abrasive band is ground
Grinding machine and precision lapping machine and kibbling mill line, can be improved the treatment effeciency of aperture burr.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that the device of aperture burr is removed in embodiment；
Fig. 2 is the first amary tape grinding machine, the second amary tape grinding machine and the panel turnover machine in embodiment in abrasive band grinding mechanism
Structural schematic diagram.
Specific embodiment
In order to more fully understand technology contents of the invention, technical solution of the present invention is made combined with specific embodiments below
It is further described and illustrates.
Embodiment
Referring to Fig.1-2, the present embodiment provides a kind of methods for removing aperture burr, and this kind of method of application to remove aperture
The device of burr.
Firstly, board production process according to prior art, carries out sawing sheet to substrate and obtains being used to prepare each inner plating
Substrate.After carrying out conventional pre-treatment to substrate, passes sequentially through and apply wet film on substrate, exposure, development, etch, move back film work
Sequence (negative film technique), inner line figure is made on substrate, each inner plating is thus made.It is checked and assessed by internal layer AOI
The quality of each piece of inner plating.
Then, brownification processing is carried out to inner plating using inner plating brownification technique before existing pressing, made on inner plating
One layer of brown oxide is generated, the roughing in surface of inner plating is made.Then according to design data, by inner plating, prepreg, outer layer
Copper foil carries out pre- plate-laying, is then pressed, is press-fitted together as one inner plating with outer copper foil, and multi-layer board is formed.
Then, it drills on multilayer boards according to design data.
Before carrying out heavy copper to multi-layer board and electric plating of whole board processing makes hole metallization, aperture burr first is carried out to multi-layer board
Processing.
Remove aperture burr method the following steps are included:
(1) with the multiple-plate surface of amary tape grinding machine polishing；
(2) multi-layer board is blown with blower, the dust in multilayer plate surface and hole is blown out；
(3) with the multiple-plate surface of precision lapping machine polishing；
(4) with the multiple-plate surface of kibbling mill polishing；
(5) clear multi-layer board is washed with water, then dries multi-layer board.
In conjunction with the device of removal aperture burr as described below, the specific side of aperture burr is carried out to the multi-layer board after drilling
Method is as follows:
The device of aperture burr is removed as shown in Figure 1, entering plate conveyer 1, amary tape grinding machine including sequentially connected first
Structure 2, second enter plate conveyer 3, dust cleaning mechanism 4, inspection body 5, precision lapping machine 6, kibbling mill 7, water washing mechanism 8, do
Dry mechanism 9 and ejecting plate conveyer 10.Shown in abrasive band grinding mechanism 2 include the first amary tape grinding machine 21, the second amary tape grinding machine
23 and panel turnover machine 22, as shown in Figure 2.
First enters plate conveyer 1 for automatic suction hanging machine, and automatic suction hanging machine passes through negative pressure absorbing multi-layer board and moves multi-layer board
To the first amary tape grinding machine 21.It can be realized by automatic suction hanging machine and enter plate automatically, save manpower.
First amary tape grinding machine 21 and the second amary tape grinding machine 23 use the abrasive band of 600 mesh of model.Multi-layer board passes through
When the first amary tape grinding machine 21, the first amary tape grinding machine 21 is polished a multiple-plate surface；Then multi-layer board passes through panel turnover machine 22,
Panel turnover machine 22 overturns multi-layer board, exchanges multiple-plate upper and lower surface；Then multi-layer board pass through the second amary tape grinding machine 23, second
Amary tape grinding machine 23 is polished multiple-plate another surface.First amary tape grinding machine 21 and the second amary tape grinding machine 23 to multi-layer board into
When row polish-brush, for nog plate current control in 4-5A, control point is 4.5A；Wear scar width is controlled in 10-16mm, and control point is 13mm.
Multiple-plate two surface enters second after amary tape grinding machine is polished and enters plate conveyer 3, and second enters plate conveyer 3
For a conveyer belt, an infrared inductor 31 is installed on the conveyor belt, multiple-plate thickness can measure by infrared inductor 31,
It can be according to the polish-brush electric current for the plate thickness data adjustment precision grinder 6 and kibbling mill 7 that infrared inductor 31 measures.
Second, which enters plate conveyer 3, is delivered to dust cleaning mechanism 4 for multi-layer board.High-pressure blast is equipped in dust cleaning mechanism 4
Machine can be blown out the dust in multilayer plate surface and hole by high pressure blower when multi-layer board passes through high pressure blower.
After dust cleaning mechanism 4 clears up dust, multi-layer board enters inspection body 5.In inspection body 5, pass through people
Work visual inspection observes the situation of aperture burr on multi-layer board by the way of sampling observation.
Multi-layer board is transferred into precision lapping machine 6 after mechanism 5 checks on inspection.Model there are four being set on precision lapping machine 6
For the nonwoven fabric polish-brush of 320 mesh, high cutting nog plate is carried out to multiple-plate upper and lower surface by precision lapping machine 6, is further gone
Except aperture burr.When precision lapping machine 6 carries out polish-brush to multi-layer board, for nog plate current control in 2.6-3.0A, control point is 2.8A；
Wear scar width is controlled in 10-16mm, and control point is 13mm.
Multi-layer board continues to be transferred into kibbling mill 7, and the polish-brush on kibbling mill 7 includes a circular shaft, on the surface of circular shaft
It is fixed with nylon yarn, model is 320 mesh or 500 mesh.By the polish-brush for the kibbling mill 7 that runs at high speed, multilayer plate surface can be scrubbed
Dirt makes multilayer plate surface form uniform roughness, when making heavy copper, increases copper in the adhesive force of multilayer plate surface.Kibbling mill 7
When carrying out polish-brush to multi-layer board, wear scar width is controlled in 10-16mm, and it is the polish-brush of 320 mesh for model that control point, which is 13mm,
Nog plate current control is in 2.4-3.4A, and control point is 2.9A, and electric current value for reference only, is subject to wear scar width；For
Model is the polish-brush of 500 mesh, and nog plate current control is in 2.0-3.0A, and control point is 2.5A, and electric current value for reference only, with
Subject to wear scar width.
Multi-layer board is respectively after amary tape grinding machine 21,23, precision lapping machine 6 and kibbling mill 7 are polished, into water washing mechanism
8 carry out washing cleaning.Be successively arranged in water washing mechanism 8 pressurization rinsing bowl, ultrasonic dip tank, high pressure water washing trough, it is swing plus
Press rinsing bowl and spray groove.When multi-layer board is by pressurization rinsing bowl, the water pump in the rinsing bowl that pressurizes sprays water, hydraulic pressure to multi-layer board
It is 2.0-3.0Kg/cm2, clean the residue in multilayer plate surface and hole；Multi-layer board embathes in ultrasonic dip tank, ultrasound
The delivery efficiency of wave soaker is 60-100%, is handled by ultrasonic wave the residue in multilayer plate surface and hole；It is more
When laminate passes through high pressure water washing trough, the high-pressure hydraulic pump in high pressure water washing trough sprays water to multi-layer board, and hydraulic pressure is 10-20Kg/cm2,
Further clean the residue in multilayer plate surface and hole；Then so that multi-layer board is entered swing pressurization rinsing bowl, utilize left and right
The pressure (hydraulic) water cleaning waved, hydraulic pressure is 70-80Kg/cm2, the remnant in plate face and hole is rinsed；Finally make multi-layer board
By spray groove, multi-layer board is sprayed using clean clear water, water flow is 4-6L/min, guarantees that multi-layer board is clean.
Multi-layer board is after the cleaning of water washing mechanism 8, into drier 9.The section that is successively arranged that sponge sucks in water in drier 9,
High wind blowing section and hot blast drying section.The moisture of multilayer plate surface is drawn using water-absorbing sponge in sponge sucks in water section；It is blown in high wind
Dry section, is dried the moisture in multilayer plate surface and hole to multi-layer board wind by air blower；In hot blast drying section, lead to
It crosses air-heater and hot wind is blowed into multi-layer board, the temperature for controlling hot wind is 70-80 DEG C, further by the water in multilayer plate surface and hole
Divide drying.
Multi-layer board completes the processing of removal aperture burr after drier 9 is sufficiently dried.Pass through ejecting plate conveyer
10 are sent to multi-layer board in next production process, and process is processed after progress.
After carrying out deburring processing to multi-layer board, starts to carry out heavy copper and electric plating of whole board processing, make hole metallization, gold is made
Categoryization hole.It makes outer-layer circuit (positive blade technolgy) and solder mask on multilayer boards further according to the prior art, and successively carries out surface
PCB is made in the rear process such as processing, excision forming, quality testing.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (9)
1. a kind of method for removing aperture burr, which comprises the following steps:
S1, it after drilling on multilayer boards, is polished multiple-plate surface with amary tape grinding machine；The multi-layer board includes inner plating, half
Cured sheets and outer copper foil, the inner plating and outer copper foil are press-fitted together as one by prepreg；
S2, multi-layer board is blown with blower, the dust in multilayer plate surface and hole is blown out；
S3, multiple-plate surface of being polished with precision lapping machine；
S4, multiple-plate surface of being polished with kibbling mill；
S5, clear multi-layer board is washed with water, then dries multi-layer board.
2. a kind of method for removing aperture burr according to claim 1, which is characterized in that in step S1, using abrasive band type
It number polishes multiple-plate surface for the amary tape grinding machine of 600 mesh.
3. a kind of method for removing aperture burr according to claim 2, which is characterized in that in step S1, ground using abrasive band
When the grinding machine multiple-plate surface of polishing, nog plate electric current is 4-5A, and wear scar width is 10-16mm.
4. a kind of method for removing aperture burr according to claim 1, which is characterized in that in step S3, the precision is ground
The nonwoven fabric polish-brush there are four 320 mesh of model is set on grinding machine.
5. a kind of method for removing aperture burr according to claim 4, which is characterized in that in step S3, use precise finiss
When the machine multiple-plate surface of polishing, nog plate electric current is 2.6-3.0A, and wear scar width is 10-16mm.
6. a kind of method for removing aperture burr according to claim 1, which is characterized in that in step S4, the kibbling mill
Polish-brush include a circular shaft, the surface of the circular shaft is fixed with nylon yarn.
7. a kind of method for removing aperture burr according to claim 6, which is characterized in that in step S3, use precise finiss
When the machine multiple-plate surface of polishing, wear scar width is 10-16mm.
8. it is a kind of remove aperture burr device, including it is sequentially connected enter plate conveyer, dust cleaning mechanism, inspection body,
Kibbling mill, water washing mechanism and drier, which is characterized in that it is described enter plate conveyer before be additionally provided with abrasive band grinding mechanism, institute
It states abrasive band grinding mechanism and includes the first amary tape grinding machine and the second amary tape grinding machine, first amary tape grinding machine and the second abrasive band
A panel turnover machine is equipped between grinder.
9. a kind of device for removing aperture burr according to claim 8, which is characterized in that the inspection body and kibbling mill
Between be equipped with a precision lapping machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510249726.3A CN104918411B (en) | 2015-05-15 | 2015-05-15 | A kind of method and device removing aperture burr |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510249726.3A CN104918411B (en) | 2015-05-15 | 2015-05-15 | A kind of method and device removing aperture burr |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104918411A CN104918411A (en) | 2015-09-16 |
| CN104918411B true CN104918411B (en) | 2019-02-12 |
Family
ID=54086980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510249726.3A Active CN104918411B (en) | 2015-05-15 | 2015-05-15 | A kind of method and device removing aperture burr |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104918411B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682379A (en) * | 2016-01-25 | 2016-06-15 | 东莞联桥电子有限公司 | Process for rapidly fabricating multi-layer circuit board |
| CN106061116B (en) * | 2016-06-23 | 2019-04-26 | 江西景旺精密电路有限公司 | A kind of method that pcb board removes aperture burr |
| CN107072046B (en) * | 2017-02-15 | 2019-09-17 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit production method |
| CN108580407A (en) * | 2018-01-23 | 2018-09-28 | 滁州英诺信电器有限公司 | Base material cleaning procedure before printing |
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
| CN110831333A (en) * | 2019-10-22 | 2020-02-21 | 大连崇达电路有限公司 | Method for removing burrs of drilling hole |
| CN111300218B (en) * | 2019-11-27 | 2021-08-03 | 电子科技大学中山学院 | Nail gun casting flash grinding process |
| CN111295052B (en) * | 2020-03-25 | 2021-06-01 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN111716172B (en) * | 2020-06-24 | 2021-11-16 | 深圳玛斯兰电路科技实业发展有限公司 | Novel grinding method for circuit board burrs |
| CN112631070A (en) * | 2020-12-23 | 2021-04-09 | 江苏高光半导体材料有限公司 | Method for removing burrs at hole edge on mask |
| CN112492764B (en) * | 2021-01-27 | 2021-04-20 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN115872132A (en) * | 2023-02-21 | 2023-03-31 | 广东金凯智能装备有限公司 | Efficient circuit board turnover stacking device and turnover stacking method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201898664U (en) * | 2010-11-08 | 2011-07-13 | 苏州市华扬电子有限公司 | Preprocessor for circuit board |
| CN102416587A (en) * | 2011-09-29 | 2012-04-18 | 东莞生益电子有限公司 | Board grinding method for removing orifice burrs of printed circuit board (PCB) |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686075A (en) * | 2011-03-11 | 2012-09-19 | 深圳富泰宏精密工业有限公司 | Electronic device casing and manufacturing method thereof |
-
2015
- 2015-05-15 CN CN201510249726.3A patent/CN104918411B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201898664U (en) * | 2010-11-08 | 2011-07-13 | 苏州市华扬电子有限公司 | Preprocessor for circuit board |
| CN102416587A (en) * | 2011-09-29 | 2012-04-18 | 东莞生益电子有限公司 | Board grinding method for removing orifice burrs of printed circuit board (PCB) |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104918411A (en) | 2015-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104918411B (en) | A kind of method and device removing aperture burr | |
| CN205253611U (en) | PCB board washs conveying system | |
| CN106028655B (en) | A kind of quick nog plate method for adhering film of outer-layer circuit plate | |
| TWI589433B (en) | Copper foil with carrier foil, copper clad laminate, and printed circuit board | |
| CN108282966A (en) | A kind of PCB welding resistances pre-treating technology | |
| JPS63278752A (en) | Polishing device for printed circuit board | |
| TW201406225A (en) | Transparent printed circuit board and method for manufacturing same | |
| CN105208786A (en) | Fine printed circuit board grinding board technology | |
| CN112492764B (en) | Method for eliminating solder resist ink in through hole of printed circuit board | |
| CN103972513A (en) | Porous current collector metal material continuous processing method | |
| CN110831333A (en) | Method for removing burrs of drilling hole | |
| CN210694511U (en) | Glue removing device for circuit board production | |
| CN104394655B (en) | A kind of method for manufacturing gold finger for reducing golden finger oxidation | |
| CN106028682B (en) | A kind of PCB plated hole method | |
| CN209435572U (en) | One kind being used for LED circuit board SMT chip mounter | |
| CN105208787A (en) | Fine printed circuit board welding resistance grinding board technology | |
| CN111385972A (en) | PCB dry film laminating hole plugging method | |
| CN202826655U (en) | Device for cleaning mirror face steel plate | |
| JP2004008990A (en) | Continuous washing method and continuous washing apparatus for sheet | |
| CN214642562U (en) | PCB board burnishing device for mechano-electronic engineering | |
| TWI230414B (en) | Drying deice for the substrate material | |
| CN209930638U (en) | PCB face cleaning device | |
| JP2007294938A (en) | Method and device for cleaning workpiece, and method and device for manufacturing printed wiring board | |
| CN206835468U (en) | Pcb sprays tin reprocessing line | |
| CN206602720U (en) | Pcb spray tin post processing streamlines |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |