CN112631070A - Method for removing burrs at hole edge on mask - Google Patents
Method for removing burrs at hole edge on mask Download PDFInfo
- Publication number
- CN112631070A CN112631070A CN202011546472.9A CN202011546472A CN112631070A CN 112631070 A CN112631070 A CN 112631070A CN 202011546472 A CN202011546472 A CN 202011546472A CN 112631070 A CN112631070 A CN 112631070A
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- CN
- China
- Prior art keywords
- wax
- mask
- blind hole
- hole
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 238000005498 polishing Methods 0.000 claims abstract description 11
- 238000005406 washing Methods 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000002347 injection Methods 0.000 claims abstract description 6
- 239000007924 injection Substances 0.000 claims abstract description 6
- 238000004080 punching Methods 0.000 claims abstract description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- -1 polyethylene Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- 238000007790 scraping Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
Abstract
The invention discloses a method for removing burrs on the edge of a hole on a mask, which comprises the following steps of S1, step S1, blind hole processing: processing blind holes at corresponding positions of the mask plate; s2, wax injection into the blind hole: dripping molten hot wax into the blind hole, standing and cooling, and then removing redundant wax on the blind hole; s3, step S3, surface grinding: polishing the whole machine of the wax-injected mask plate, and removing raised burrs at the periphery of the blind hole during punching; step S4, heating and melting wax: the polished mask is heated, and the heated solvent is used for washing the blind hole.
Description
Technical Field
The invention relates to the technical field of masks, in particular to a method for removing burrs at the edge of a hole on a mask.
Background
The photomask base plate is an ideal photosensitive blank plate for manufacturing a fine photomask graph, and the required photomask plate can be obtained through a photoetching plate making process. Mask version need punch when adding man-hour, and common processing technology all can leave the burr arch at the top in hole, and the burr can direct influence follow-up mask version's use, can cause bigger error for the machine, consequently all need grind the burring to it and handle, makes itself keep bright and clean, can not receive the influence of flaws such as burr.
The traditional grinding process can directly grind the surface of the mask to remove burrs, but in the mode, a part of burrs are ground, and a part of burrs are turned into the hole due to grinding, so that troubles are caused to the next process.
Based on the above, the invention designs a method for removing burrs at the edge of a hole on a mask to solve the above problems.
Disclosure of Invention
The present invention is directed to a method for removing burrs on a hole edge of a mask, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for removing burrs at the edge of a hole on a mask is characterized by comprising the following steps:
step S1, processing a blind hole: processing blind holes at corresponding positions of the mask plate;
step S2, wax injection into the blind hole: dripping molten hot wax into the blind hole, standing and cooling, and then removing redundant wax on the blind hole;
step S3, surface grinding: polishing the whole machine of the wax-injected mask plate, and removing raised burrs at the periphery of the blind hole during punching;
step S4, heating and melting wax: and heating the polished mask plate, and washing the blind hole by using the heated solvent.
Preferably, in step S1, the chips in the blind holes are blown out by the airflow with high flow speed to clean the chips in the holes.
Preferably, in step S2, the wax is a polyethylene wax having a melting point of 102 ℃ to 115 ℃.
Preferably, in step S2, when the excess wax is removed, the wax is left with a margin of 1-2mm height from the surface of the mask base plate.
Preferably, in step S3, grinding is performed in two steps of rough grinding and finish grinding, and the grinding is performed at an ambient temperature controlled between 5 ℃ and 15 ℃.
Preferably, in step S4, the mask is placed in a heating dish filled with toluene or xylene solvent, the heating dish is placed in a water bath for heating, and the wax is dissolved while maintaining the water bath temperature at 80 ℃ to 90 ℃.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the blind hole is filled in a mode of opening the blind hole on the mask plate and then injecting wax into the blind hole, so that burrs of the mask plate are prevented from turning into the blind hole before grinding, the difficulty that impurities easily enter the blind hole in the prior art is overcome, and the wax in the blind hole can be dissolved and washed after the external grinding is finished through a heating and solvent washing mode, so that the cleaning of the interior and periphery of the blind hole is realized.
Drawings
FIG. 1 is a flow chart of a method for removing burrs at edges of holes on a mask according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A method for removing burrs at the edge of a hole on a mask,
the method comprises the following steps:
step S1, processing a blind hole: processing a blind hole at a corresponding position of the mask, blowing out scraps in the blind hole by using high-flow-rate airflow, and cleaning the scraps in the hole;
step S2, wax injection into the blind hole: dripping molten hot wax into the blind holes, wherein the wax is polyethylene wax with a melting point of 102-115 ℃, standing and cooling, and then removing redundant wax on the blind holes, wherein when the redundant wax is removed, the wax is left with a margin of 1-2mm away from the surface of the mask base plate;
step S3, surface grinding: polishing the whole wax-injected mask plate on a machine, removing raised burrs at the periphery of a blind hole during punching, and performing coarse grinding and fine grinding twice, wherein the polishing is performed by controlling the environment temperature to be 5 ℃;
step S4, heating and melting wax: heating the polished mask plate, washing the blind hole by using the heated solvent, putting the mask plate into a heating vessel filled with a toluene or xylene solvent, putting the heating vessel into a water bath kettle for heating, keeping the water bath temperature at 80-90 ℃, and dissolving the wax.
Example 2
A method for removing burrs at the edge of a hole on a mask,
the method comprises the following steps:
step S1, processing a blind hole: processing a blind hole at a corresponding position of the mask, blowing out scraps in the blind hole by using high-flow-rate airflow, and cleaning the scraps in the hole;
step S2, wax injection into the blind hole: dripping molten hot wax into the blind holes, wherein the wax is polyethylene wax with a melting point of 102-115 ℃, standing and cooling, and then removing redundant wax on the blind holes, wherein when the redundant wax is removed, the wax is left with a margin of 1-2mm away from the surface of the mask base plate;
step S3, surface grinding: polishing the whole wax-injected mask plate on a machine, removing raised burrs at the periphery of a blind hole during punching, and performing coarse grinding and fine grinding twice, wherein the polishing is performed by controlling the environment temperature to be 10 ℃;
step S4, heating and melting wax: heating the polished mask plate, washing the blind hole by using the heated solvent, putting the mask plate into a heating vessel filled with a toluene or xylene solvent, putting the heating vessel into a water bath kettle for heating, keeping the water bath temperature at 80-90 ℃, and dissolving the wax.
Example 3
A method for removing burrs at the edge of a hole on a mask,
the method comprises the following steps:
step S1, processing a blind hole: processing a blind hole at a corresponding position of the mask, blowing out scraps in the blind hole by using high-flow-rate airflow, and cleaning the scraps in the hole;
step S2, wax injection into the blind hole: dripping molten hot wax into the blind holes, wherein the wax is polyethylene wax with a melting point of 102-115 ℃, standing and cooling, and then removing redundant wax on the blind holes, wherein when the redundant wax is removed, the wax is left with a margin of 1-2mm away from the surface of the mask base plate;
step S3, surface grinding: polishing the whole wax-injected mask plate on a machine, removing raised burrs at the periphery of a blind hole during punching, and performing coarse grinding and fine grinding twice, wherein the polishing is performed by controlling the environment temperature to be 10 ℃;
step S4, heating and melting wax: heating the polished mask plate, washing the blind hole by using the heated solvent, putting the mask plate into a heating vessel filled with a toluene or xylene solvent, putting the heating vessel into a water bath kettle for heating, keeping the water bath temperature at 80-90 ℃, and dissolving the wax.
Table one: statistics of grinding effect by grinding environment temperature
As can be seen from the table I, when the polishing environment temperature is controlled to be 10 ℃, the removal effect on burrs at the edges of the holes of the mask is good, and the polishing time of processing can be controlled to be short.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. A method for removing burrs at the edge of a hole on a mask is characterized by comprising the following steps:
step S1, processing a blind hole: processing blind holes at corresponding positions of the mask plate;
step S2, wax injection into the blind hole: dripping molten hot wax into the blind hole, standing and cooling, and then removing redundant wax on the blind hole;
step S3, surface grinding: polishing the whole machine of the wax-injected mask plate, and removing raised burrs at the periphery of the blind hole during punching;
step S4, heating and melting wax: and heating the polished mask plate, and washing the blind hole by using the heated solvent.
2. The method of claim 1, wherein in step S1, the chips in the blind holes are blown out by a high-speed airflow to clean the chips in the holes.
3. The method of claim 1, wherein in step S2, the wax is a polyethylene wax with a melting point of 102-115 ℃.
4. The method for deburring the edge of the hole on the mask as claimed in claim 3, wherein in step S2, the excess wax is removed by scraping, leaving an allowance of 1-2mm in height from the surface of the mask substrate.
5. The method for deburring the edge of the hole on the mask as claimed in claim 4, wherein: in step S3, grinding is carried out by coarse grinding and fine grinding in two steps, wherein the grinding is carried out by controlling the environment temperature between 5 ℃ and 15 ℃.
6. The method for deburring the edge of the hole on the mask as claimed in claim 1, wherein: in step S4, the mask is placed in a heating dish filled with toluene or xylene solvent, the heating dish is placed in a water bath to heat, the water bath temperature is maintained at 80 ℃ to 90 ℃, and the wax is dissolved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011546472.9A CN112631070A (en) | 2020-12-23 | 2020-12-23 | Method for removing burrs at hole edge on mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011546472.9A CN112631070A (en) | 2020-12-23 | 2020-12-23 | Method for removing burrs at hole edge on mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112631070A true CN112631070A (en) | 2021-04-09 |
Family
ID=75324346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011546472.9A Pending CN112631070A (en) | 2020-12-23 | 2020-12-23 | Method for removing burrs at hole edge on mask |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112631070A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07237096A (en) * | 1994-02-23 | 1995-09-12 | Fuji Electric Co Ltd | End face machining method for work having minute hole |
| JPH07310105A (en) * | 1994-05-13 | 1995-11-28 | Seiko Instr Inc | Production of metallic parts |
| CN103235481A (en) * | 2013-03-28 | 2013-08-07 | 深圳市科利德光电材料股份有限公司 | Glue uniformization chromium plate manufacturing process |
| CN104918411A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Orifice burr removing method and apparatus |
| CN106711049A (en) * | 2016-12-22 | 2017-05-24 | 武汉华星光电技术有限公司 | Porous substrate and manufacturing method thereof and manufacturing method of thin film transistor |
| CN107168010A (en) * | 2016-03-08 | 2017-09-15 | 中芯国际集成电路制造(上海)有限公司 | The manufacture method of lithography mask version |
| CN107464780A (en) * | 2017-08-01 | 2017-12-12 | 四川科尔威光电科技有限公司 | A kind of cutting method for optimizing sidewall metallization substrate metal burr |
| CN109834517A (en) * | 2017-11-27 | 2019-06-04 | 蔡玉真 | A kind of minimizing technology of surface of metal product burr |
-
2020
- 2020-12-23 CN CN202011546472.9A patent/CN112631070A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07237096A (en) * | 1994-02-23 | 1995-09-12 | Fuji Electric Co Ltd | End face machining method for work having minute hole |
| JPH07310105A (en) * | 1994-05-13 | 1995-11-28 | Seiko Instr Inc | Production of metallic parts |
| CN103235481A (en) * | 2013-03-28 | 2013-08-07 | 深圳市科利德光电材料股份有限公司 | Glue uniformization chromium plate manufacturing process |
| CN104918411A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Orifice burr removing method and apparatus |
| CN107168010A (en) * | 2016-03-08 | 2017-09-15 | 中芯国际集成电路制造(上海)有限公司 | The manufacture method of lithography mask version |
| CN106711049A (en) * | 2016-12-22 | 2017-05-24 | 武汉华星光电技术有限公司 | Porous substrate and manufacturing method thereof and manufacturing method of thin film transistor |
| CN107464780A (en) * | 2017-08-01 | 2017-12-12 | 四川科尔威光电科技有限公司 | A kind of cutting method for optimizing sidewall metallization substrate metal burr |
| CN109834517A (en) * | 2017-11-27 | 2019-06-04 | 蔡玉真 | A kind of minimizing technology of surface of metal product burr |
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