JP2674889B2 - Semiconductor wafer cutting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer cutting method, and more particularly to a semiconductor wafer cutting method in which an adhesive sheet is attached to a semiconductor wafer and fixed to a flat ring.

[0002]

2. Description of the Related Art A conventional semiconductor wafer cutting method is shown in FIG.
As shown in FIG. 3, the adhesive sheet 2 is attached to the semiconductor wafer 1, the adhesive sheet 2 is fixed to the flat ring 6, the semiconductor wafer 1 is further fixed by the wafer suction table 7, and then cut by the cutting blade 3. Was there. In this case, the semiconductor wafer was cut while the flat ring 6 was pulled down from the wafer suction table 7.

[0003]

In the above-mentioned conventional method for cutting a semiconductor wafer, since the cutting portion is formed by a flat surface, it is not possible to smoothly remove the cutting chips during cutting. Especially when the semiconductor wafer is thick or the cutting blade is thick, water containing cutting chips stays on the semiconductor wafer and settles on the surface of the semiconductor wafer during cutting and can be completely removed even by washing with water. However, there is a problem that the semiconductor wafer is contaminated. In addition, the cooling effect of the cutting blade by water becomes insufficient, which causes abnormal wear and, in the worst case, intermediate damage, resulting in a decrease in product yield.

[0004]

According to the method of cutting a semiconductor wafer of the present invention, after the semiconductor wafer is sucked, the flat ring is fixed above the surface of the semiconductor wafer and then the cutting is performed.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of the vicinity of a semiconductor wafer for explaining the first embodiment of the present invention.

As shown in FIG. 1, the semiconductor wafer 1 is attached to an adhesive sheet 2, and the adhesive sheet 2 is fixed to a flat ring 6 fixed to a clamp 5. The semiconductor wafer 1 is fixed to the wafer suction table 7 and then cut by the cutting blade 3. At this time, the clamp 5 of the flat ring 6 is fixed at a position lifted from the surface of the semiconductor wafer 1. For this reason, the water that is poured to cool and clean the cutting blade 3 is flat ring 6
The water pool 4 is formed up to the height of.

As described above, according to the first embodiment, since the water pool 4 is formed on the semiconductor wafer 1, cutting debris is less likely to adhere to the surface of the semiconductor wafer. Further, even if they are attached, they can be easily removed by a washing process.

FIG. 2 is a sectional view in the vicinity of a semiconductor wafer for explaining the second embodiment of the present invention. In the second embodiment, the wafer suction table 7A having a diameter larger than that of the semiconductor wafer 1 is used. As a result, the cutting blade 3 can be cut with a minimum amount of escape from the adhesive sheet 2 during cutting, so that the cutting blade can operate in a shorter time than the cutting time of the first embodiment.

[0009]

As described above, according to the present invention, by fixing the flat ring above the surface of the semiconductor wafer, the water used during cutting is secured in the flat ring and becomes a water pool. The generated dust can be suspended in water without settling on the semiconductor wafer surface. Therefore, it hardly adheres to the surface of the semiconductor wafer during cutting, and the problem of contamination is almost eliminated. Further, the water accumulated in the flat ring is convected at any time due to the rotation of the cutting blade, which makes it difficult for dust to settle and overflows when it is floated up on the upper surface of the flat ring. Due to this phenomenon, the water accumulated in the flat ring is replaced at any time, so that it becomes possible to easily wash away the debris in the subsequent washing step.

Furthermore, since the cutting portion is always under water, the cooling effect of the cutting blade is excellent, and there is also an effect that problems such as abnormal wear and breakage on the way can be alleviated.

[Brief description of the drawings]

FIG. 1 is a sectional view of the vicinity of a wafer suction table for explaining a first embodiment of the present invention.

FIG. 2 is a sectional view of the vicinity of a wafer suction table for explaining the second embodiment of the present invention.

FIG. 3 is a sectional view of the vicinity of a wafer suction table for explaining a conventional semiconductor wafer cutting method.

[Explanation of symbols]

 1 Semiconductor Wafer 2 Adhesive Sheet 3 Cutting Blade 4 Water Pool 5 Clamp 6 Flat Ring 7, 7A Wafer Suction Section

Claims (1)

(57) [Claims] 1. A method for cutting a semiconductor wafer, comprising: sticking an adhesive sheet to a semiconductor wafer, fixing the same with a flat ring, fixing the semiconductor wafer with a wafer suction table, and then cutting the semiconductor wafer with a cutting blade. A method for cutting a semiconductor wafer, which comprises fixing the above to a surface of the semiconductor wafer and then cutting.