JPS63156653A - Method of polishing copper laminated layer plate and printed circuit board substrate and device therefor - Google Patents

Abstract

PURPOSE:To prevent a material to be polished, such as a substrate, a laminated layer plate, a laminated layer sheet or the like from being damaged, and to make it possible to perform dry type polishing without the necessity of a water processing device by absorbing the material to be polished, so as to make it into close contact with a running conveyer belt, and by allowing a polishing cloth to take circular motion so as to effect dry type polishing. CONSTITUTION:A substrate 4 as a material to be polished is absorbed so as to be made into close contact with a conveyer type setting bed 3 having perforations 5 by a suction pump 8, and is conveyed. A motor 10 in a polishing cloth attaching device causes a polishing device 14 to take circular motion through the intermediary of a small gear 12 and an internal gear 13 so as to polish the substrate 4. Meanwhile, abrasive dust produced during polishing is removed by an endless belt-type unwoven fabric 15 rotated by a motor 16 and is retrieved into a dust collector. As a result, it is possible to prevent the substrate 4 as the material to be polished, from being swung during polishing, without the substrate being damaged, and therefore, it is possible to carry out continuous dry type polishing without the necessity of a water processing device.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to surface preparation, roughening, and grinding of the copper-clad laminate, laminate sheet, and printed circuit board.

Surface preparation of conventional copper-clad laminates, copper-clad sheets, printed circuit boards,
The surface preparation and grinding method is a wet method in which water is poured over the surface using a rotating brush or a belt sander.

The method and apparatus according to this invention have the following features.

b) In the conventional method, polishing is performed mainly by applying water, so it is necessary to treat the waste water by installing a water application device, a drainage device, and a device to remove copper powder and patina that cause pollution. Since this method is a dry polisher method, there is no need for a waste liquid collection device, and pollution-free polishing is possible.

Mouth) Circular motion polishing allows for continuous deburring without pushing the deburr into the hole, and there is no damage to the hole edges or the edges of the board.

C] Because of the circular motion method and suction contact method, thin flexible (soft) copper-clad sheets can be worked on tightly on the conveyor belt without turning over or moving, allowing high-speed processing without dimensional changes. I can do it.

2) Since high-speed rotating brushes are not used, the operating noise is low and safe work can be done.

e) Since it is a dry method that does not use water, it is possible to design relatively small equipment and it does not take up much space.

f) Because of the circular motion, the sand pressure is constant, so the life of the abrasive paper and cloth is long and economical.

The present invention solves the drawbacks of the prior art. Specifically, the substrate is placed on an endless belt-shaped mounting table having a large number of small holes, and air is removed through the small holes so that the substrate does not move even when polished. The polishing powder is then wiped with a non-woven fabric belt and removed using a dust collector.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

Figure 1 shows an outline of a device for carrying out the method of the present invention. In the figure, a set of belt conveyor installation stand ■ is hung between pulleys ■ and ■ that are pivotally supported at both ends of the upper part of the machine frame ■. This installation stand ■ has many small holes ■, and there is a box-shaped support member ■ with an opening at the top on the bottom of the installation stand ■. A pipe ■ extends downward from the center of the bottom. This pipe ■ is connected to the vacuum device ■. On the other hand, in the polishing cloth attachment device ■, the small gear @ is turned by the motor [phase], which moves the polishing device ■ in a circular motion together with the internal gear [Co., Ltd.], and the polishing powder is collected on the installation table ■ by the close device.

Since the present invention is as described above, it is possible to automatically and continuously polish soft flexible printed circuit boards and flexible copper-clad sheets, which were conventionally considered impossible to polish using a grinding process.
It uses 111 different types of Yr without using any water.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional side view showing the method of the present invention, and FIGS. 2 and 3 are diagrams showing circular motion of the polishing device. FIG. 4 shows the conventional method (old method), in which a brush [phase] is rotated on top of the belt (2) and the substrate (2) is polished while being sprayed with water from a water pipe (2). ■Placement table, ■Substrate, ■Small hole, ■Top opening box-shaped support member,
■Suction pump, ■Polishing device, [phase] motor, ■Bearing,
■Small gear, ■Internal gear, ■Internal gear slide plate, ■Endless strip nonwoven fabric, [Phase] Motor, O drive device, [Co., Ltd.] Upper machine body, ■Transport belt, [Phase] Brush, ■Water tube

Claims (1)

[Claims] Copper (including other conductive materials) foil for rigid copper-clad laminates and flexible copper-clad sheets for the manufacture of perforated, non-perforated soft flexible printed circuit boards and hard rigid printed circuit boards. the surface of
and metal plating on the surface of the copper-clad laminate and copper-clad sheet,
When polishing the surface of a semi-finished printed circuit board that has been soldered or coated with a cured resin, the board, laminate, or laminate sheet is brought into close contact with a conveyor belt, and the polishing cloth is moved in a circular motion using a dry method that does not use water. Method and apparatus for polishing by method.