CN105208787A - Fine printed circuit board welding resistance grinding board technology - Google Patents
Fine printed circuit board welding resistance grinding board technology Download PDFInfo
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- CN105208787A CN105208787A CN201510506970.3A CN201510506970A CN105208787A CN 105208787 A CN105208787 A CN 105208787A CN 201510506970 A CN201510506970 A CN 201510506970A CN 105208787 A CN105208787 A CN 105208787A
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- plate
- polish
- brush
- cylinder
- grinding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
he invention relates to a fine printed circuit board welding resistance grinding board technology. The fine printed circuit board welding resistance grinding board technology comprises steps of, S1, cylinder opening, an inner wall of a cylinder is washed, foreign materials are removed, water is filled in the cylinder to one third of the volume of the cylinder, sulfuric acid is filled in the cylinder to 3-5% of the volume of the cylinder, water is further filled into the cylinder to a required liquid level of the cylinder; S2, machine start check; S3, machine start; S4, grinding scratch detection, sub steps are as follows, S41, light copper board selection; S42, light copper board transmission to a grinding and brushing position, S43, grinding and brushing; S44, grinding scratch width detection; and S45, water film testing; and S5, batch production, batch production is carried out according to a sequence of board incoming, pickling, cycle washing, spraying, grinding, two-times cycle washing, high-pressure washing, cleaning, air drying, baking and board outgoing. The fine printed circuit board welding resistance grinding board technology is advantaged in that good grinding effect and high grinding efficiency are realized, and the welding resistance effect is facilitated to improve.
Description
Technical field
The present invention relates to PCB Production technical field, particularly fine-line printed board welding resistance nog plate technique.
Background technology
Circuit board and printed circuit board, also known as printed circuit board (PCB), be the supplier of electronic devices and components electrical connection, adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.Circuit board is base material with insulation board, is cut into certain size, at least with a conduction on it
figureshape, and cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components.
Along with the raising of science and technology, electronic equipment develops rapidly, and it has incorporated in the life into us, particularly general use of mobile phone.Increasing of electronic equipment, inevitable also just needs a large amount of circuit boards, and this is concerning the enterprise producing circuit board, be a good opportunity, but industry competition pressure is also just along with increase.
Printed board nog plate cleans the copper-clad plate of cutting in Plate grinder, makes the foreign material such as its surperficial free from dust, burr, first wear away rear baking.Traditional nog plate is immature in technique, the wiring board nog plate of different-thickness, different to the control of each parameter, traditional nog plate technique adopts consistent technological parameter, cause nog plate poor effect, and nog plate efficiency is low, this is great strike for production enterprise.And although meet wear scar width requirement after nog plate, its hydrophily is bad, the easily follow-up welding resistance effect of impact.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, provide that a kind of nog plate is effective, nog plate efficiency is high and be conducive to improving the fine-line printed board welding resistance nog plate technique of welding resistance effect.
Object of the present invention is achieved through the following technical solutions: fine-line printed board welding resistance nog plate technique, comprises the following steps:
S1, open cylinder: inboard wall of cylinder block is rinsed, eliminating impurities is clean, in cylinder body, then add water to 1/3 of cylinder body volume, then in cylinder body, add the sulfuric acid accounting for cylinder body volume 3 ~ 5%, then in cylinder body, add clear water to cylinder body requirement liquid level;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: started in strict accordance with operation requirements by Plate grinder, controls transfer velocity interval is 3 ~ 5m/min, and pickling pressure limit is 1.0 ~ 1.5kg/cm
2, washing pressure limit is 1.5 ~ 2.5kg/cm
2, bake out temperature scope is 90 ~ 100 DEG C;
S4, polishing scratch detect: comprise following sub-step:
S41, selection tabula rasa: get the light copper coin that width is 650 ~ 800mm, be placed on Plate grinder conveyer belt;
S42, be delivered to polish-brush position: open conveying, be sent to below polish-brush by light copper coin, stop conveying, open polish-brush and also adjust the polish-brush degree of depth;
S43, polish-brush: open spray and polish-brush simultaneously, adjustment polish-brush pressure, to 2.6 ~ 2.9A, carries out polish-brush 3 ~ 5s to light copper coin, closes polish-brush, exported by light copper coin;
S44, detection wear scar width: measure wear scar width with ruler, and according to wear scar width adjustment polish-brush pressure, when wear scar width is between 12 ~ 18mm;
S45, moisture film are tested: the light copper coin after polish-brush is put into water, rocks 3 ~ 5 times with the amplitude of 3 ~ 5mm, take out light copper coin, light copper coin is 40 ~ 50 ° and holds plate, start timing, the timer expiration when fracture phenomena appears in moisture film simultaneously, if timing time is greater than 15s, test passes;
S5, volume production: be pressed into plate → pickling → circulating water wash → spray → nog plate → twice circulating water wash → high-pressure washing → clear water and wash → air-dry → oven dry → ejecting plate, carry out volume production.
When entering plate in described step S5, adopt left and right to interlock and put plate and unified direction, the distance interval 3 ~ 5cm between plate and plate, plate outer and Plate grinder inwall interval 3 ~ 5cm.
The present invention has the following advantages:
1, before nog plate, carry out front inspection of starting shooting, the various piece of equipment is checked in strict accordance with requiring, undesirable parts are adjusted in time, for later stage nog plate operation provides good basis, be conducive to improving nog plate effect.
2, before carrying out volume production, be provided with the step that polishing scratch checks, namely examination polish-brush is carried out to the wiring board that will carry out nog plate, and detect its wear scar width, adjust the position of polishing scratch electric current and polish-brush according to wear scar width, after adjusting to suitable wear scar width, carry out volume production again, when carrying out nog plate to the wiring board of same thickness, do not need to carry out polishing scratch electric current again and polish-brush position adjusts, be conducive to improving nog plate efficiency.
3, in welding resistance nog plate technique, when carrying out polishing scratch and detecting, need to be tested by moisture film, hydrophily examination is carried out to the circuit board after nog plate, for later stage welding resistance is ready, be conducive to improving welding resistance effect.
Embodiment
The present invention will be further described below, but protection scope of the present invention is not limited to the following stated.
[embodiment 1]:
Fine-line printed board welding resistance nog plate technique, comprises the following steps:
S1, open cylinder: inboard wall of cylinder block is rinsed, eliminating impurities is clean, in cylinder body, then add water to 1/3 of cylinder body volume, then in cylinder body, add the sulfuric acid accounting for cylinder body volume 5%, then in cylinder body, add clear water to cylinder body requirement liquid level;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: started in strict accordance with operation requirements by Plate grinder, controls transfer speed is 5m/min, and pickling pressure is 1.5kg/cm
2, washing pressure is 2.5kg/cm
2, bake out temperature scope is 100 DEG C;
S4, polishing scratch detect: comprise following sub-step:
S41, selection tabula rasa: get the light copper coin that width is 800mm, be placed on Plate grinder conveyer belt;
S42, be delivered to polish-brush position: open conveying, be sent to below polish-brush by light copper coin, stop conveying, open polish-brush and also adjust the polish-brush degree of depth;
S43, polish-brush: open spray and polish-brush simultaneously, adjustment polish-brush pressure, to 2.9A, carries out polish-brush 3s to light copper coin, closes polish-brush, exported by light copper coin;
S44, detection wear scar width: measure wear scar width with ruler, and according to wear scar width adjustment polish-brush pressure, make wear scar width between 12 ~ 18mm;
S45, moisture film are tested: the light copper coin after polish-brush is put into water, rocks 3 times with the amplitude of 5mm, take out light copper coin, light copper coin is 40 ° and holds plate, start timing, the timer expiration when fracture phenomena appears in moisture film simultaneously, if timing time is greater than 15s, test passes;
S5, volume production: be pressed into plate → pickling → circulating water wash → spray → nog plate → twice circulating water wash → high-pressure washing → clear water and wash → air-dry → oven dry → ejecting plate, carry out volume production.
When entering plate in described step S5, adopt left and right to interlock and put plate and unified direction, the distance interval 3cm between plate and plate, plate outer and Plate grinder inwall interval 5cm.
[embodiment 2]:
Fine-line printed board welding resistance nog plate technique, comprises the following steps:
S1, open cylinder: inboard wall of cylinder block is rinsed, eliminating impurities is clean, in cylinder body, then add water to 1/3 of cylinder body volume, then in cylinder body, add the sulfuric acid accounting for cylinder body volume 4%, then in cylinder body, add clear water to cylinder body requirement liquid level;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: started in strict accordance with operation requirements by Plate grinder, controls transfer speed is 4m/min, and pickling pressure is 1.2kg/cm
2, washing pressure is 2kg/cm
2, bake out temperature is 95 DEG C;
S4, polishing scratch detect: comprise following sub-step:
S41, selection tabula rasa: get the light copper coin that width is 730mm, be placed on Plate grinder conveyer belt;
S42, be delivered to polish-brush position: open conveying, be sent to below polish-brush by light copper coin, stop conveying, open polish-brush and also adjust the polish-brush degree of depth;
S43, polish-brush: open spray and polish-brush simultaneously, adjustment polish-brush pressure, to 2.7A, carries out polish-brush 4s to light copper coin, closes polish-brush, exported by light copper coin;
S44, detection wear scar width: measure wear scar width with ruler, and according to wear scar width adjustment polish-brush pressure, make wear scar width between 12 ~ 18mm;
S45, moisture film are tested: the light copper coin after polish-brush is put into water, rocks 4 times with the amplitude of 4mm, take out light copper coin, light copper coin is 45 ° and holds plate, start timing, the timer expiration when fracture phenomena appears in moisture film simultaneously, if timing time is greater than 15s, test passes;
S5, volume production: be pressed into plate → pickling → circulating water wash → spray → nog plate → twice circulating water wash → high-pressure washing → clear water and wash → air-dry → oven dry → ejecting plate, carry out volume production.
When entering plate in described step S5, adopt left and right to interlock and put plate and unified direction, the distance interval 4cm between plate and plate, plate outer and Plate grinder inwall interval 4cm.
[embodiment 3]:
Fine-line printed board welding resistance nog plate technique, comprises the following steps:
S1, open cylinder: inboard wall of cylinder block is rinsed, eliminating impurities is clean, in cylinder body, then add water to 1/3 of cylinder body volume, then in cylinder body, add the sulfuric acid accounting for cylinder body volume 3%, then in cylinder body, add clear water to cylinder body requirement liquid level;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: started in strict accordance with operation requirements by Plate grinder, controls transfer speed is 3m/min, and pickling pressure is 1.0kg/cm
2, washing pressure is 1.5kg/cm
2, bake out temperature is 90 DEG C;
S4, polishing scratch detect: comprise following sub-step:
S41, selection tabula rasa: get the light copper coin that width is 650mm, be placed on Plate grinder conveyer belt;
S42, be delivered to polish-brush position: open conveying, be sent to below polish-brush by light copper coin, stop conveying, open polish-brush and also adjust the polish-brush degree of depth;
S43, polish-brush: open spray and polish-brush simultaneously, adjustment polish-brush pressure, to 2.6A, carries out polish-brush 5s to light copper coin, closes polish-brush, exported by light copper coin;
S44, detection wear scar width: measure wear scar width with ruler, and according to wear scar width adjustment polish-brush pressure, make wear scar width between 12 ~ 18mm;
S45, moisture film are tested: the light copper coin after polish-brush is put into water, rocks 5 times with the amplitude of 3mm, take out light copper coin, light copper coin is 50 ° and holds plate, start timing, the timer expiration when fracture phenomena appears in moisture film simultaneously, if timing time is greater than 15s, test passes;
S5, volume production: be pressed into plate → pickling → circulating water wash → spray → nog plate → twice circulating water wash → high-pressure washing → clear water and wash → air-dry → oven dry → ejecting plate, carry out volume production.
When entering plate in described step S5, adopt left and right to interlock and put plate and unified direction, the distance interval 5cm between plate and plate, plate outer and Plate grinder inwall interval 3cm.
Claims (2)
1. fine-line printed board welding resistance nog plate technique, is characterized in that: comprise the following steps:
S1, open cylinder: inboard wall of cylinder block is rinsed, eliminating impurities is clean, in cylinder body, then add water to 1/3 of cylinder body volume, then in cylinder body, add the sulfuric acid accounting for cylinder body volume 3 ~ 5%, then in cylinder body, add clear water to cylinder body requirement liquid level;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: started in strict accordance with operation requirements by Plate grinder, controls transfer velocity interval is 3 ~ 5m/min, and pickling pressure limit is 1.0 ~ 1.5kg/cm
2, washing pressure limit is 1.5 ~ 2.5kg/cm
2, bake out temperature scope is 90 ~ 100 DEG C;
S4, polishing scratch detect: comprise following sub-step:
S41, selection tabula rasa: get the light copper coin that width is 650 ~ 800mm, be placed on Plate grinder conveyer belt;
S42, be delivered to polish-brush position: open conveying, be sent to below polish-brush by light copper coin, stop conveying, open polish-brush and also adjust the polish-brush degree of depth;
S43, polish-brush: open spray and polish-brush simultaneously, adjustment polish-brush pressure, to 2.6 ~ 2.9A, carries out polish-brush 3 ~ 5s to light copper coin, closes polish-brush, exported by light copper coin;
S44, detection wear scar width: measure wear scar width with ruler, and according to wear scar width adjustment polish-brush pressure, when wear scar width is between 12 ~ 18mm;
S45, moisture film are tested: the light copper coin after polish-brush is put into water, rocks 3 ~ 5 times with the amplitude of 3 ~ 5mm, take out light copper coin, light copper coin is 40 ~ 50 ° and holds plate, start timing, the timer expiration when fracture phenomena appears in moisture film simultaneously, if timing time is greater than 15s, test passes;
S5, volume production: be pressed into plate → pickling → circulating water wash → spray → nog plate → twice circulating water wash → high-pressure washing → clear water and wash → air-dry → oven dry → ejecting plate, carry out volume production.
2. fine-line printed board welding resistance nog plate technique according to claim 1, it is characterized in that: when entering plate in described step S5, adopt left and right to interlock and put plate and unified direction, the distance interval 3 ~ 5cm between plate and plate, plate outer and Plate grinder inwall interval 3 ~ 5cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510506970.3A CN105208787A (en) | 2015-08-18 | 2015-08-18 | Fine printed circuit board welding resistance grinding board technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510506970.3A CN105208787A (en) | 2015-08-18 | 2015-08-18 | Fine printed circuit board welding resistance grinding board technology |
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| CN105208787A true CN105208787A (en) | 2015-12-30 |
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| CN201510506970.3A Pending CN105208787A (en) | 2015-08-18 | 2015-08-18 | Fine printed circuit board welding resistance grinding board technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107770969A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of pcb board washes copper method |
| CN111716172A (en) * | 2020-06-24 | 2020-09-29 | 夏春辉 | Novel grinding method for circuit board burrs |
| CN114877778A (en) * | 2022-04-29 | 2022-08-09 | 广东喜珍电路科技有限公司 | Detection sheet for PCB grinding mark test and detection method thereof |
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|---|---|---|---|---|
| CN101378629A (en) * | 2008-09-28 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for processing resistance welding milling point |
| CN102220593A (en) * | 2011-06-03 | 2011-10-19 | 开平依利安达电子第三有限公司 | Copper surface cleaning device for outer-layer dry film process of circuit board |
| CN204231759U (en) * | 2014-09-26 | 2015-03-25 | 3M中国有限公司 | The wiring board tool of production |
| CN104710868A (en) * | 2013-12-14 | 2015-06-17 | 上海泉灵信息科技有限公司 | Etching-resistant photosensitive protection printing ink |
-
2015
- 2015-08-18 CN CN201510506970.3A patent/CN105208787A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378629A (en) * | 2008-09-28 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for processing resistance welding milling point |
| CN102220593A (en) * | 2011-06-03 | 2011-10-19 | 开平依利安达电子第三有限公司 | Copper surface cleaning device for outer-layer dry film process of circuit board |
| CN104710868A (en) * | 2013-12-14 | 2015-06-17 | 上海泉灵信息科技有限公司 | Etching-resistant photosensitive protection printing ink |
| CN204231759U (en) * | 2014-09-26 | 2015-03-25 | 3M中国有限公司 | The wiring board tool of production |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107770969A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of pcb board washes copper method |
| CN111716172A (en) * | 2020-06-24 | 2020-09-29 | 夏春辉 | Novel grinding method for circuit board burrs |
| CN114877778A (en) * | 2022-04-29 | 2022-08-09 | 广东喜珍电路科技有限公司 | Detection sheet for PCB grinding mark test and detection method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151230 |
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| RJ01 | Rejection of invention patent application after publication |