CN102220593A - Copper surface cleaning device for outer-layer dry film process of circuit board - Google Patents
Copper surface cleaning device for outer-layer dry film process of circuit board Download PDFInfo
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- CN102220593A CN102220593A CN2011101477071A CN201110147707A CN102220593A CN 102220593 A CN102220593 A CN 102220593A CN 2011101477071 A CN2011101477071 A CN 2011101477071A CN 201110147707 A CN201110147707 A CN 201110147707A CN 102220593 A CN102220593 A CN 102220593A
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- cleaning device
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Abstract
The present invention discloses a copper surface cleaning device for an outer-layer dry film process of a circuit board. The device comprises a pickling tank, a first overflow water washing tank, a micro-etching tank, a second overflow water washing tank, a tap water washing tank, an ultrasonic water washing tank, a pressurized water washing tank, a drain tank and a drying tank. The copper surface cleaning device provided by the invention increases the ultrasonic water washing tank on the basis of the existing pickling tank and micro-etching tank, increases the cleaning capability to the copper surfaces of different types of the circuit boards, and especially has very good cleaning capability to selective immersion gold plates, plating boards and circuit boards with high aspect ratio (board thickness of 0.3-3.5 mm and the smallest hole diameter of 0.25 mm) and blind holes. By increasing a grinding plate device, the copper surface cleaning device provided by the present invention enhances the flattening and roughening capability on the surface of circuit boards and enhances the sequent adhesion force between the outer-layer dry film and the copper surface of the circuit boards. The copper surface cleaning device provided by the present invention can be widely applied in the manufacture field of PCB (printed circuit board).
Description
Technical field
The present invention relates to a kind of copper face washing unit of wiring board, the outer dried film operation copper face washing unit of especially a kind of wiring board.
Background technology
Along with PCB(printed circuit board, wiring board) the continuous development of Technology, PCB makes flow process and also day by day becomes complicated, it no longer is single straight line flow process, be used but same operation is circuitous, outer dried film operation is exactly a circuitous operation of using of typical case's quilt, and promptly the half-finished ability of the handled PCB of the equipment of this operation also need possess diversification.Existing copper face cleaning equipment can only be produced Conformal Mask plate and selectivity turmeric plate, and thickness of slab is at 0.3 ~ 2.0mm, the aperture 〉=plate of 0.4mm type, the plate face there are cleaning and microetch function, the wiring board that can produce has certain limitation.Its main flow process is: entering plate-pickling-overflow washing-microetch-overflow washing-pressurization washing-sponge rumble blots-dries-ejecting plate; Its main principle of work is the effect that reaches cleaning and alligatoring plate face by pickling, microetch and washing and oven dry.The wiring board of handling through this copper face can reach removes the oxidation of plate face, cleaning and alligatoring plate face, and oven dry plate face just enters the pad pasting workstation, guarantees the sticking power that the dried film is good.
The accessible wiring board type of this copper face treatment facility is limited, and the wiring board of handling different structure, different thickness is had certain limitation.Wiring board after for example electroplating, as having copper thick on the plate face, or thickness of slab is 3mm, or the minimum-value aperture is the effect that the wiring board of 0.25mm all can not reach good cleaning and roughening and screed face.Moreover, in the same period in, the wiring board of need handling is the wiring board after the plating, this equipment usefulness that must stagnate, but also the equipment that must increase new kind is handled the wiring board after the plating, certainly will cause bigger waste like this on usage space and economic worth.
Summary of the invention
The technical problem to be solved in the present invention is: a kind of copper face treatment unit that is used for multiple copper surface and plurality of plate structure is provided, and described device is not only easy to operate, and can select according to demand.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
The outer dried film operation copper face washing unit of a kind of wiring board comprises the pickling tank, the first overflow water washing trough, microetch groove, the second overflow water washing trough, tap water washing trough, ultrasonic wave washing bath, the pressurized water washing trough that connect successively, blots case and drying baker.
The sulphuric acid soln of preparation 5% is used to remove smaller copper face oxidation, finger-marks etc. in the described pickling tank;
But described overflow water washing trough water saving is used to clean the PCB surface sulphuric acid soln, prevents to bring into next work nest;
Described microetch groove adopts copper sulfate microetch system, and copper face is carried out alligatoring, and cleaning can be handled more serious oxidation, finger-marks etc.
Described tap water washing trough is used to clean the PCB surface sulphuric acid soln, prevents to bring into next work nest;
Described ultrasonic wave washing bath is used to remove liquid medicine and the foreign matter in high aspect ratio plate through hole or the blind hole;
Described pressurized water washing trough is used to strengthen cleaning through hole and the interior foreign matter of blind hole;
The described globule that blots case by absorbent sponge rumble sucking plate face;
Described drying baker is by the globule of hot-air seasoning plate face in porose, and simultaneously, the hot blast that the is advanced filtration unit that haves three layers prevents trickle impurity attached to the plate face, shadow noon outer dried film quality.
Be further used as preferred embodiment, between described second overflow water washing trough and tap water washing trough, increase the nog plate case that can strengthen the wiring board surface roughness.
Described nog plate case adopts nylon brush, drives spray-type volcanic ash particle, copper surface detail small-particle, copper slightly can be reached other foreign matter and remove, and leveling is alligatoring copper surface also, increases the engaging force of dry film.
The invention has the beneficial effects as follows: copper face washing unit of the present invention is by increasing the ultrasonic wave water washing device on the basis of existing pickling, microetch, strengthened the ability of equipment to different sorts wiring board copper face cleaning, especially selectivity turmeric plate, electroplate, high aspect ratio (thickness of slab 0.3 ~ 3.5mm, minimum vias aperture 0.25mm) and blind hole wiring board all there is good cleaning capacity; The present invention has strengthened leveling, alligatoring ability to PCB surface by increasing the nog plate device, strengthens the engaging force of the dried film of follow-up skin and wiring board copper face.
Description of drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described further:
Fig. 1 is that the parts of the outer dried film operation copper face washing unit of wiring board of the present invention constitute synoptic diagram.
Embodiment
With reference to Fig. 1, the outer dried film operation copper face washing unit of a kind of wiring board comprises the pickling tank 1, the first overflow water washing trough 2, microetch groove 3, the second overflow water washing trough 4, tap water washing trough 6, ultrasonic wave washing bath 7, the pressurized water washing trough 8 that connect successively, blots case 9 and drying baker 10.
Be further used as preferred embodiment, increase nog plate case 5 between described second overflow water washing trough 4 and the tap water washing trough 6.
Be further used as preferred embodiment, the described case 9 that blots blots case for the sponge rumble.
The present invention has improved the limited defective of existing copper face washing unit processing circuitry board type, can handle the wiring board after the plating, thickness 0.3 ~ 3.5mm, aperture 〉=wiring board of 0.25mm, Conformal Mask plate and selectivity turmeric plate etc. do not need to flatten the wiring board on surface, install the wiring board copper surface of handling through this, reach effects such as cleaning, alligatoring, leveling and oven dry, provide excellent contact face and dry film to adhere to.
In actual production, can select installing a working cell as required according to the PCB technical process:
Embodiment one
For the wiring board that is used to make Conformal Mask after the pressing, workflow is as follows: the pickling → first overflow washing → microetch → second overflow washing → pressurization washes → blots → and dries.
Embodiment two
For the wiring board after electroplating, when being used to make outer-layer circuit, workflow is as follows: the pickling → first overflow washing → microetch → second overflow washing → nog plate → washing → ultrasonic wave washing → pressurization from the beginning washes → blots → and dries.
Embodiment three
For the wiring board of finishing after the green oil welding resistance (Solder Mask), when being used to make the selectivity turmeric, workflow is as follows: the pickling → first overflow washing → microetch → second overflow washing → washing → ultrasonic wave washing → pressurization from the beginning washes → blots → and dries.
More than be that preferable enforcement of the present invention is specified, but the invention is not limited to described embodiment, those of ordinary skill in the art make all equivalent variations or replacement also can doing under the prerequisite of spirit of the present invention, the distortion that these are equal to or replace all is included in the application's claim institute restricted portion.
Claims (3)
1. the outer dried film operation copper face washing unit of a wiring board is characterized in that: comprise the pickling tank (1), the first overflow water washing trough (2), microetch groove (3), the second overflow water washing trough (4), tap water washing trough (6), ultrasonic wave washing bath (7), the pressurized water washing trough (8) that connect successively, blot case (9) and drying baker (10).
2. the outer dried film operation copper face washing unit of a kind of wiring board according to claim 1 is characterized in that: increase nog plate case (5) between described second overflow water washing trough (4) and tap water washing trough (6).
3. the outer dried film operation copper face washing unit of a kind of wiring board according to claim 1 is characterized in that: the described case (9) that blots blots case for the sponge rumble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101477071A CN102220593A (en) | 2011-06-03 | 2011-06-03 | Copper surface cleaning device for outer-layer dry film process of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101477071A CN102220593A (en) | 2011-06-03 | 2011-06-03 | Copper surface cleaning device for outer-layer dry film process of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102220593A true CN102220593A (en) | 2011-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011101477071A Pending CN102220593A (en) | 2011-06-03 | 2011-06-03 | Copper surface cleaning device for outer-layer dry film process of circuit board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523695A (en) * | 2011-12-29 | 2012-06-27 | 湖南万容科技股份有限公司 | Plate cleaning device and plate cleaning method |
| CN102811561A (en) * | 2012-07-31 | 2012-12-05 | 杭州新三联电子有限公司 | Treatment process before printing of printed circuit board |
| CN103882473A (en) * | 2014-04-11 | 2014-06-25 | 花垣县太丰冶炼有限责任公司 | Sulfide cleaning device of electrolytic manganese piece |
| CN104394655A (en) * | 2014-10-22 | 2015-03-04 | 深圳崇达多层线路板有限公司 | Gold finger manufacturing method for reducing oxidation of gold finger |
| CN105188282A (en) * | 2015-10-23 | 2015-12-23 | 清远市富盈电子有限公司 | Copper deposition manufacturing process for PCB with high aspect ratio |
| CN105208786A (en) * | 2015-08-18 | 2015-12-30 | 四川海英电子科技有限公司 | Fine printed circuit board grinding board technology |
| CN105208787A (en) * | 2015-08-18 | 2015-12-30 | 四川海英电子科技有限公司 | Fine printed circuit board welding resistance grinding board technology |
| CN105350010A (en) * | 2015-11-30 | 2016-02-24 | 内蒙古包钢钢联股份有限公司 | Full-automatic acid pickling trolley |
| CN105578768A (en) * | 2015-12-16 | 2016-05-11 | 昆山铨莹电子有限公司 | Processing method for improving copper surface roughness of circuit board |
| CN109862707A (en) * | 2019-01-24 | 2019-06-07 | 绍兴市微益电器有限公司 | A kind of pre-treating technology of circuit board printing |
| CN112930038A (en) * | 2021-02-08 | 2021-06-08 | 隽美经纬电路有限公司 | Flexible circuit board manufacturing process |
| CN113465359A (en) * | 2021-06-07 | 2021-10-01 | 福州瑞华印制线路板有限公司 | Automatic dust removal scrubbing machine |
| CN116321771A (en) * | 2023-04-20 | 2023-06-23 | 江门全合精密电子有限公司 | PCB manufacturing method |
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| CN201361802Y (en) * | 2009-02-26 | 2009-12-16 | 梅州博敏电子有限公司 | Energy-saving scrubbing machine used for PCB |
| CN101754594A (en) * | 2008-12-19 | 2010-06-23 | 北大方正集团有限公司 | Method for reducing inter-inner layer short circuit in PCB production |
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2011
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| CN101754594A (en) * | 2008-12-19 | 2010-06-23 | 北大方正集团有限公司 | Method for reducing inter-inner layer short circuit in PCB production |
| CN201361802Y (en) * | 2009-02-26 | 2009-12-16 | 梅州博敏电子有限公司 | Energy-saving scrubbing machine used for PCB |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523695A (en) * | 2011-12-29 | 2012-06-27 | 湖南万容科技股份有限公司 | Plate cleaning device and plate cleaning method |
| CN102523695B (en) * | 2011-12-29 | 2014-05-28 | 湖南万容科技股份有限公司 | Plate cleaning device and plate cleaning method |
| CN102811561A (en) * | 2012-07-31 | 2012-12-05 | 杭州新三联电子有限公司 | Treatment process before printing of printed circuit board |
| CN102811561B (en) * | 2012-07-31 | 2015-04-22 | 杭州新三联电子有限公司 | Treatment process before printing of printed circuit board |
| CN103882473A (en) * | 2014-04-11 | 2014-06-25 | 花垣县太丰冶炼有限责任公司 | Sulfide cleaning device of electrolytic manganese piece |
| CN104394655A (en) * | 2014-10-22 | 2015-03-04 | 深圳崇达多层线路板有限公司 | Gold finger manufacturing method for reducing oxidation of gold finger |
| CN105208787A (en) * | 2015-08-18 | 2015-12-30 | 四川海英电子科技有限公司 | Fine printed circuit board welding resistance grinding board technology |
| CN105208786A (en) * | 2015-08-18 | 2015-12-30 | 四川海英电子科技有限公司 | Fine printed circuit board grinding board technology |
| CN105188282A (en) * | 2015-10-23 | 2015-12-23 | 清远市富盈电子有限公司 | Copper deposition manufacturing process for PCB with high aspect ratio |
| CN105188282B (en) * | 2015-10-23 | 2018-08-14 | 清远市富盈电子有限公司 | The heavy copper manufacture craft of high aspect ratio pcb board |
| CN105350010A (en) * | 2015-11-30 | 2016-02-24 | 内蒙古包钢钢联股份有限公司 | Full-automatic acid pickling trolley |
| CN105350010B (en) * | 2015-11-30 | 2018-05-15 | 内蒙古包钢钢联股份有限公司 | Full-automatic acid washing trolley |
| CN105578768A (en) * | 2015-12-16 | 2016-05-11 | 昆山铨莹电子有限公司 | Processing method for improving copper surface roughness of circuit board |
| CN109862707A (en) * | 2019-01-24 | 2019-06-07 | 绍兴市微益电器有限公司 | A kind of pre-treating technology of circuit board printing |
| CN109862707B (en) * | 2019-01-24 | 2020-07-10 | 绍兴市微益电器有限公司 | Pretreatment process for circuit board printing |
| CN112930038A (en) * | 2021-02-08 | 2021-06-08 | 隽美经纬电路有限公司 | Flexible circuit board manufacturing process |
| CN113465359A (en) * | 2021-06-07 | 2021-10-01 | 福州瑞华印制线路板有限公司 | Automatic dust removal scrubbing machine |
| CN116321771A (en) * | 2023-04-20 | 2023-06-23 | 江门全合精密电子有限公司 | PCB manufacturing method |
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Application publication date: 20111019 |