CN106498465A - A kind of water-soluble conducting carbon nano-metal slurry and electrical-conductive nanometer metal carbon film bushing pipe - Google Patents
A kind of water-soluble conducting carbon nano-metal slurry and electrical-conductive nanometer metal carbon film bushing pipe Download PDFInfo
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- CN106498465A CN106498465A CN201611015905.1A CN201611015905A CN106498465A CN 106498465 A CN106498465 A CN 106498465A CN 201611015905 A CN201611015905 A CN 201611015905A CN 106498465 A CN106498465 A CN 106498465A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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Abstract
A kind of water-soluble conducting carbon nano-metal slurry of the present invention, water-soluble conducting carbon nano-metal slurry is by the nanometer non-ferrous metal powder with satisfactory electrical conductivity that particle size range is 15～60 nanometers, the such as Nano metal powder such as copper, aluminium, tin, concentration is the water-soluble nano metallic solution of 0.1～10 grams per liter；With the nano-level conducting carbon black that a kind of particle diameter is 100～1000 nanometers, concentration is the water-soluble nano level conductive black solution of 10～50 grams per liters, by 1：100 ratio makes water-soluble conducting nano metal carbon solution, and ground machine grinding makes nano metal powder particles disperse to be inlaid in carbon black pellet, forms water-soluble conducting carbon nano-metal slurry.The invention has the beneficial effects as follows：The water-soluble conducting carbon nano-metal slurry provides a kind of conductive nano metal carbon film of the conductive carbon film formed better than carbon black or graphite for the metallization of pcb board fiberglass layer hole wall surface, simplifies black holes making technology, improve production efficiency.
Description
Technical field
The present invention relates to nano metal product technical field, more particularly, to one kind of pcb board hole metallization manufacturing process
Water-soluble conducting carbon nano-metal slurry and electrical-conductive nanometer metal carbon film bushing pipe.
Background technology
During in pcb board manufacture, the UNICOM of two-sided or multi-layer PCB board interlayer wire, is by leading to pcb board interlayer
Line linked hole metallized technology is realizing.
Pcb board interlayer connecting wire via metal process technique, experienced electroless copper process technique, black holes process technique
And the evolution of shadow process technique.As black holes process technique and shadow process technique overcome electroless copper technology in ring
The defect that the aspects such as guarantor, safety, quality, cost, efficiency are present, has become pcb board interlayer connecting wire via metal
Emerging technology.
Black holes process technique is the adsorptivity using carbon, by the electrical interattraction of physics, has been drilled in pcb board
Adsorb one layer of carbon black on the glass-fiber-plate hole wall of linked hole as conductive carbon film；And shadow process technique has been bored in pcb board
Adsorb one layer of graphite on the glass-fiber-plate hole wall of good linked hole as conductive carbon film；The purpose of the two is all in the hole of linked hole
On wall, copper facing provides a basic lining；Pcb board black holes processing procedure or shadow processing procedure horizontal production line technological process are：
→ black holes → whole hole → secondary black holes → microetch of cleaning →
Anti-oxidant → discharging.
The basic function of each work step of the technological process is：
1st, clean
It is weakly alkaline solution and faint complexing agent in cleaning coating bath（It is a kind of interfacial agent）Mixed solution, pcb board enters
After groove, mixed solution gos deep into hole wall using the water delivery base of complexing agent, and the dirt on hole wall is washed, in mixed solution complexing agent
Hydrophilic group the resin of pcb board hole wall and glass fibre are adjusted to positively charged surface then；
2nd, a black holes
Mainly include fine graphite and carbon powder, liquid dispersant in black holes coating bath（Deionized water）And surfactant
Deng the mixed solution of composition, the fine graphite in mixed solution is negatively charged with carbon powder；After pcb board after cleaned enters groove,
Under the suction-operated of pcb board hole wall surface positive charge, pcb board hole wall surface forms one layer of graphite or carbon black conductive carbon film；
3rd, whole hole
The whole hole, is substantially to repeat " cleaning " operation, and reason is：The electrical not malleable of the glass-fiber-plate of pcb board is black for the first time
Hole processing procedure can not form satisfactory graphite or carbon black conductive carbon film in the glass flaggy hole wall surface of pcb board, therefore must be again
Cleaning treatment carries out secondary black holes processing procedure；
4th, secondary black holes
The secondary black holes, is substantially to repeat " black holes " operation, it is therefore an objective to guarantee that pcb board hole wall surface forms one layer and meets
The graphitic carbon black conductive carbon film of requirement；
5th, microetch
Enter after groove through the pcb board after secondary black holes, the micro-corrosion liquid in microetch groove by sprinkling and is sprung up through between conductive carbon film
Gap touches pcb board copper clad layers hole wall, and corrodes copper clad layers hole wall, the conductive carbon film at this is separated with copper clad layers hole wall
And come off, while copper clad layers hole wall is roughened because of microetch；
6th, anti-oxidant
After pcb board after through microetch enters groove, using copper face be passivated liquid medicine, to microetch after pcb board copper clad layers hole wall be passivated
Process；
7th, discharge
Pcb board after through anti-oxidant treatment is proceeded to plating copper process.
Although black holes process technique overcomes the defect of electroless copper technology with shadow process technique, but both itself also deposit
In different defects, particularly in double-sided PCB board and PCB slab hole metallization processing procedures, as black holes process technique is with carbon
Black limited to by carbon black material electric conductivity is low for conducting medium, electricity again after forming conductive carbon film on pcb board glass flaggy hole wall
During copper facing, plating ability is worn not enough, so thin plate or soft board field locally can only be used in；And shadow processing procedure is led with graphite as medium
Although electrically good than carbon black, it is because that granular graphite footpath is larger（1000 nanometers of ＞）, easily formed on pcb board copper clad layers hole wall
Residual ink, causes follow-up reliability defect；And the common defects that both has are that processing procedure operation is long, that is, need secondary cleaning and
Secondary black holes operation, low production efficiency.
Content of the invention
For solving the problems referred to above that prior art is present, the invention provides a kind of water-soluble conducting carbon nano-metal slurry,
Nano metal of the present invention refers to the non-ferrous metal with satisfactory electrical conductivity, the such as Nano metal powder such as copper, aluminium, tin；The water
Soluble conductive carbon nano-metal slurry is achieved through the following technical solutions：
A kind of water-soluble conducting carbon nano-metal slurry, it is characterised in that：The water-soluble conducting carbon nano-metal slurry includes particle diameter
The water-soluble nano metallic solution that scope is 10～60 nanometers, concentration is 0.05～8 grams per liter, particle diameter be 100～1000 nanometers,
Concentration is the water-soluble nano level conductive carbon black solution of 10～50 grams per liters；The water-soluble nano metallic solution is water-soluble with described
Property nano-level conducting carbon black solution press 1：100 ratio mixing, then add water and boundary that at least 5 kinds concentration is 0.5～10 grams per liter
After face activating agent, concentration are the organic reducing agent of 0.05～1 grams per liter, dispersion is ground using grinder, Nano metal powder is made
Particle studded enter carbon black granules in, form water-soluble conducting carbon nano-metal slurry.
Preferably, the particle diameter of the Nano metal powder is 15～50 nanometers；The particle diameter of the nano-level conducting carbon black is 180
～950 nanometers；The interfacial agent includes wetting agent, bleeding agent, dispersant, macromolecule barrier, thixotropic agent, defoamer.
Preferably, the grinder is rectilinear, horizontal or basket type sand mill.
Preferably, the grinder is nanometer sand mill, and 1000 revs/min of rotating speed, milling time are 2 hours.
Fiberglass layer hole wall surface of the water-soluble conducting carbon nano-metal slurry in pcb board hole described in a kind of application claim 1
The electrical-conductive nanometer metal carbon film bushing pipe of making, the constructive method of the electrical-conductive nanometer metal carbon film bushing pipe is：
A, cleaning
Be weakly alkaline solution and the mixed solution of faint complexing agent in coating bath, the pcb board leaching of drilling will be completed by design requirement
Enter coating bath, the water delivery base of complexing agent gos deep into hole wall in mixed solution, and the dirt on hole wall is washed, complexing agent in mixed solution
Hydrophilic group the surface of the fiberglass layer hole wall of pcb board is adjusted to positively charged then；
B, black holes
Main including the mixed of the compositions such as water-soluble conducting carbon nano-metal slurry, liquid dispersant and surfactant in black holes coating bath
Solution is closed, the water-soluble conducting carbon nano-metal slurry in mixed solution is negatively charged；Pcb board immersion coating bath after cleaned,
Under the suction-operated of pcb board hole wall surface positive charge, formed in the glass flaggy hole wall surface and copper clad layers hole wall surface of pcb board
One electrical-conductive nanometer metal carbon film bushing pipe；
C, microetch
The pcb board immersion microetch coating bath that UNICOM's hole surface is had electrical-conductive nanometer metal carbon film bushing pipe, the micro-corrosion liquid in microetch coating bath
By spraying and gap-contact through electrical-conductive nanometer silver carbon film being sprung up to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall,
The electrical-conductive nanometer metal carbon film at this is made to separate with copper clad layers hole wall and come off；
D, anti-oxidant
Pcb board after through microetch enters to immerse anti-oxidant coating bath, using copper face be passivated liquid medicine, to microetch after pcb board copper clad layers hole
Wall is passivated process；
E, washing
Remove excessive antioxidant；
F, drying
Moisture content is removed, dries pcb board.
The electrical-conductive nanometer that fiberglass layer hole wall surface of the application water-soluble conducting carbon nano-metal slurry in pcb board hole makes
In the method for metal carbon film bushing pipe, to work step c, the black holes processing procedure in pcb board hole is completed, and subsequent step d, e, f are under
The work step that one copper facing prepares.
Preferably, the pcb board thickness is 0.05～3.5 millimeter, 0.1～1.0 millimeter of aperture.
Preferably, nanometer homogeneous milling apparatus are provided with water-soluble conducting carbon nano-metal slurry black holes coating bath described in step b；
The nanometer homogeneous milling apparatus are ground for being centrifuged bead mill or dither grinding or ultrasonic disruption machine or aforementioned more than two kinds
Mill equipment is used in combination.
Preferably, the nanometer homogeneous milling apparatus continuously-running, or intermittent duty.
By above-mentioned preferred fabrication step, the electrical-conductive nanometer metal of the pcb board hole glass flaggy hole wall surface can be made
Carbon film bushing pipe obtains the quality of more high-quality relatively.
Water-soluble conducting metal carbon of the present invention starches the mechanism to be formed：The particle diameter of the Nano metal powder is received for 10～30
Rice；The particle diameter of nano-level conducting carbon black is 100～800 nanometers；Its microstructure of nano-level conducting carbon black is the height of band side chain
Structure hollow conductive carbon black, the i.e. particle of nano-level conducting carbon black have a lot of spaces as sponge, and its specific surface area is 600
～1500 meters squared per grams, the water-soluble nano level conductive carbon black solution press 1 with the water-soluble nano silver solution：100 ratio
After example mixing, dispersion is ground through grinder, nano metal powder particles is just inlaid in carbon black granules, formed water-soluble
Conductive nano metal carbon is starched.
Compared with electrically conductive graphite or carbon black coating, conductive nano metal carbon of the present invention starches the conductive nano metal to be formed
The resistance of carbon film bushing pipe is significantly reduced, and reaches conductive level material horizontal, can extensively apply pcb board hole metallization manufacturing process.
Experiment is proved：Black holes processing procedure, pcb board hole glass are carried out using water-soluble nano conducting metal carbon of the present invention slurry
The conductance ratio of the conducting metal carbon film bushing pipe that flaggy hole wall surface is formed is had significantly using graphite or carbon black black holes process technique
Lifted, various pcb board black holes processing procedures can be met, especially the demand of PCB slabs and multi-layer sheet hole metallization, substantially improves product
Matter and raising efficiency, have received good effect.
Description of the drawings：
Fig. 1 is the electrical-conductive nanometer metal carbon film bushing pipe schematic diagram in a kind of pcb board hole, wherein：
Fig. 1 a are schematic diagrames above pcb board；
Fig. 1 b are schematic diagrames below pcb board.
Fig. 2 is the generalized section of pcb board hole shown in Fig. 1, wherein：
Fig. 2 a are the generalized sections after the drilling of pcb board shown in Fig. 1；
Fig. 2 b are the schematic diagrames for making electrical-conductive nanometer metal carbon film bushing pipe in pcb board hole shown in Fig. 2 a.
Fig. 3 is the schematic diagram after pcb board hole metallization shown in Fig. 2 b, wherein：
Fig. 3 a are the schematic diagrames after the electrical-conductive nanometer metal carbon film bushing pipe microetch in pcb board shown in Fig. 2 b；
Fig. 3 b are the schematic diagrames after pcb board hole metallization shown in 3a.
Description of reference numerals
Above 1 pcb board, wire above 11 pcb boards；
Below 2 pcb boards, wire below 21 pcb boards；
With following wire linked hole above 3 pcb boards, 31 electrical-conductive nanometer metal carbon film bushing pipes；
32 pcb board plated through-holes；
4 pcb board glass laminates.
Specific embodiment
With reference to specific embodiment, the present invention will be described.
Embodiment 1：
A kind of water-soluble conducting carbon nano-metal slurry, it is characterised in that：The water-soluble conducting carbon nano-metal slurry includes particle diameter
The water-soluble nano metallic solution that scope is 10～60 nanometers, concentration is 0.05～8 grams per liter, particle diameter be 100～1000 nanometers,
Concentration is the water-soluble nano level conductive carbon black solution of 10～50 grams per liters；The water-soluble nano metallic solution is water-soluble with described
Property nano-level conducting carbon black solution press 1：100 ratio mixing, then add water and boundary that at least 5 kinds concentration is 0.5～10 grams per liter
After face activating agent, concentration are the organic reducing agent of 0.05～1 grams per liter, dispersion is ground using grinder, Nano metal powder is made
Particle studded enter carbon black granules in, form water-soluble conducting carbon nano-metal slurry.
Embodiment 2：
The present embodiment with the difference of embodiment 1 is：The particle diameter of the Nano metal powder is 15～50 nanometers；The nano-level conducting
The particle diameter of carbon black is 180～950 nanometers；The interfacial agent include wetting agent, bleeding agent, dispersant, macromolecule barrier,
Thixotropic agent, defoamer.
Embodiment 3：
The present embodiment with the difference of embodiment 1 is：The grinder is rectilinear, horizontal or basket type sand mill.
Embodiment 4：
The present embodiment with the difference of embodiment 3 is：The grinder is nanometer sand mill, 1000 revs/min of rotating speed, and milling time is
2 hours.
Application Example 1
Described in a kind of application claim 1, fiberglass layer hole wall surface of the water-soluble conducting carbon nano-metal slurry in pcb board hole makes
Electrical-conductive nanometer metal carbon film bushing pipe, the constructive method of the electrical-conductive nanometer metal carbon film bushing pipe is：
A, cleaning
Be weakly alkaline solution and the mixed solution of faint complexing agent in coating bath, the pcb board leaching of drilling will be completed by design requirement
Enter coating bath, the water delivery base of complexing agent gos deep into hole wall in mixed solution, and the dirt on hole wall is washed, complexing agent in mixed solution
Hydrophilic group the surface of the fiberglass layer hole wall of pcb board is adjusted to positively charged then；
B, black holes
Mainly include the compositions such as water-soluble conducting carbon nano-metal slurry, liquid dispersant and surfactant in black holes coating bath
Mixed solution, the water-soluble conducting carbon nano-metal slurry in mixed solution are negatively charged；Pcb board immersion coating bath after cleaned,
Under the suction-operated of pcb board hole wall surface positive charge, in glass flaggy hole wall surface and the copper clad layers hole wall surface shape of pcb board
Into an electrical-conductive nanometer metal carbon film bushing pipe；
C, microetch
The pcb board immersion microetch coating bath that UNICOM's hole surface is had electrical-conductive nanometer metal carbon film bushing pipe, the micro-corrosion liquid in microetch coating bath
By spraying and gap-contact through electrical-conductive nanometer silver carbon film being sprung up to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall,
The electrical-conductive nanometer metal carbon film at this is made to separate with copper clad layers hole wall and come off；
D, anti-oxidant
Pcb board after through microetch enters to immerse anti-oxidant coating bath, using copper face be passivated liquid medicine, to microetch after pcb board copper clad layers hole
Wall is passivated process；
E, washing
Remove excessive antioxidant；
F, drying
Moisture content is removed, dries pcb board.
The electrical-conductive nanometer that fiberglass layer hole wall surface of the application water-soluble conducting carbon nano-metal slurry in pcb board hole makes
In the method for metal carbon film bushing pipe, to work step c, the black holes processing procedure in pcb board hole is completed, and subsequent step d, e, f are under
The work step that one copper facing prepares.
Application Example 2
This application embodiment with the difference of Application Example 1 is：The pcb board thickness is 0.05～3.5 millimeter, aperture 0.1～
1.0 millimeter.
Application Example 3
This application embodiment with the difference of Application Example 1 is：Water-soluble conducting carbon nano-metal slurry black holes coating bath described in step b
Nanometer homogeneous milling apparatus are inside provided with；The nanometer homogeneous milling apparatus are centrifugation bead mill or dither grinding or ultrasonic wave
Disintegrating machine or aforementioned more than two kinds milling apparatus are used in combination.
Application Example 4
This application embodiment with the difference of Application Example 3 is：The nanometer homogeneous milling apparatus continuously-running, or interval fortune
OK.
By above-mentioned preferred fabrication step, the electrical-conductive nanometer metal of the pcb board hole glass flaggy hole wall surface can be made
Carbon film bushing pipe obtains the quality of more high-quality relatively.
Water-soluble conducting metal carbon of the present invention starches the mechanism to be formed：The particle diameter of the Nano metal powder is received for 10～30
Rice；The particle diameter of nano-level conducting carbon black is 100～800 nanometers；Its microstructure of nano-level conducting carbon black is the height of band side chain
Structure hollow conductive carbon black, the i.e. particle of nano-level conducting carbon black have a lot of spaces as sponge, and its specific surface area is 600
～1500 meters squared per grams, the water-soluble nano level conductive carbon black solution press 1 with the water-soluble nano silver solution：100 ratio
After example mixing, dispersion is ground through grinder, nano metal powder particles is just inlaid in carbon black granules, formed water-soluble
Conductive nano metal carbon is starched.
Compared with electrically conductive graphite or carbon black coating, conductive nano metal carbon of the present invention starches the conductive nano metal to be formed
The resistance of carbon film bushing pipe is significantly reduced, and reaches conductive level material horizontal, can extensively apply pcb board hole metallization manufacturing process.
Experiment is proved：Black holes processing procedure, pcb board hole glass are carried out using water-soluble nano conducting metal carbon of the present invention slurry
The conductance ratio of the conducting metal carbon film bushing pipe that flaggy hole wall surface is formed is had significantly using graphite or carbon black black holes process technique
Lifted, and simplify black holes making technology, improve production efficiency.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, will change in specific embodiments and applications, and this specification content is should not be construed as to the present invention
Restriction.
Claims (8)
1. a kind of water-soluble conducting carbon nano-metal is starched, it is characterised in that：The water-soluble conducting carbon nano-metal slurry includes grain
The water-soluble nano metallic solution that footpath scope is 10～60 nanometers, concentration is 0.05～8 grams per liter, particle diameter are received for 100～1000
Rice, the water-soluble nano level conductive carbon black solution that concentration is 10～50 grams per liters；The water-soluble nano metallic solution and the water
Dissolubility nano-level conducting carbon black solution presses 1：100 ratio mixing, then to add water and at least 5 kinds concentration be 0.5～10 grams per liter
After interfacial agent, concentration are the organic reducing agent of 0.05～1 grams per liter, dispersion is ground using grinder, nano metal is made
Powder particles are inlaid in carbon black granules, form the water-soluble conducting carbon nano-metal slurry.
2. water-soluble conducting carbon nano-metal as claimed in claim 1 is starched, it is characterised in that：The particle diameter of the Nano metal powder is
15～50 nanometers；The particle diameter of the nano-level conducting carbon black is 180～950 nanometers；The interfacial agent includes wetting agent, oozes
Agent thoroughly, dispersant, macromolecule barrier, thixotropic agent, defoamer.
3. water-soluble conducting carbon nano-metal as claimed in claim 1 is starched, it is characterised in that：The grinder is rectilinear, sleeping
Formula or basket type sand mill.
4. water-soluble conducting carbon nano-metal as claimed in claim 1 is starched, it is characterised in that：The grinder is nanometer sand milling
Machine, 1000 revs/min of rotating speed, milling time are 2 hours.
5. water-soluble conducting carbon nano-metal described in a kind of application claim 1 starches the fiberglass layer hole wall surface system in pcb board hole
The electrical-conductive nanometer metal carbon film bushing pipe of work, it is characterised in that：The constructive method of the electrical-conductive nanometer metal carbon film bushing pipe is：
A, cleaning
Be weakly alkaline solution and the mixed solution of faint complexing agent in coating bath, the pcb board leaching of drilling will be completed by design requirement
Enter coating bath, the water delivery base of complexing agent gos deep into hole wall in mixed solution, and the dirt on hole wall is washed, complexing agent in mixed solution
Hydrophilic group the surface of the fiberglass layer hole wall of pcb board is adjusted to positively charged then；
B, black holes
Main including the mixed of the compositions such as water-soluble conducting carbon nano-metal slurry, liquid dispersant and surfactant in black holes coating bath
Solution is closed, the water-soluble conducting carbon nano-metal slurry in mixed solution is negatively charged；Pcb board immersion coating bath after cleaned,
Under the suction-operated of pcb board hole wall surface positive charge, formed in the glass flaggy hole wall surface and copper clad layers hole wall surface of pcb board
One electrical-conductive nanometer metal carbon film bushing pipe；
C, microetch
The pcb board immersion microetch coating bath that UNICOM's hole surface is had electrical-conductive nanometer metal carbon film bushing pipe, the micro-corrosion liquid in microetch coating bath
By spraying and gap-contact through electrical-conductive nanometer silver carbon film being sprung up to pcb board copper clad layers hole wall, and corrode copper clad layers hole wall,
The electrical-conductive nanometer metal carbon film at this is made to separate with copper clad layers hole wall and come off.
6. the electrical-conductive nanometer metal carbon film bushing pipe in pcb board hole as claimed in claim 5, it is characterised in that：The pcb board thickness
For 0.05～3.5 millimeter, 0.1～1.0 millimeter of aperture.
7. the electrical-conductive nanometer metal carbon film bushing pipe in pcb board hole as claimed in claim 5, it is characterised in that：Water-soluble described in step b
Property electrical-conductive nanometer metal carbon slurry black holes coating bath in be provided with nanometer homogeneous milling apparatus, the nanometer homogeneous milling apparatus are centrifugation pearl
Mill or dither grinding or ultrasonic disruption machine or aforementioned more than two kinds milling apparatus are used in combination.
8. the electrical-conductive nanometer metal carbon film bushing pipe in pcb board hole as claimed in claim 7, it is characterised in that：The nanometer homogeneous
Milling apparatus continuously-running, or intermittent duty.
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Cited By (3)
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| CN107645829A (en) * | 2017-10-16 | 2018-01-30 | 广州市天承化工有限公司 | A kind of circuit board conductive liquid and its preparation method and application |
| CN110306226A (en) * | 2019-07-25 | 2019-10-08 | 常州大学 | The method of electro-deposition carbon film in supercritical carbon dioxide |
| CN114828397A (en) * | 2022-04-21 | 2022-07-29 | 华南理工大学 | Preparation method and application of conductive metal carbon paste |
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| CN107645829A (en) * | 2017-10-16 | 2018-01-30 | 广州市天承化工有限公司 | A kind of circuit board conductive liquid and its preparation method and application |
| CN110306226A (en) * | 2019-07-25 | 2019-10-08 | 常州大学 | The method of electro-deposition carbon film in supercritical carbon dioxide |
| CN114828397A (en) * | 2022-04-21 | 2022-07-29 | 华南理工大学 | Preparation method and application of conductive metal carbon paste |
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