CN201758142U - LED lead frame and electroplating device thereof - Google Patents
LED lead frame and electroplating device thereof Download PDFInfo
- Publication number
- CN201758142U CN201758142U CN2010201970820U CN201020197082U CN201758142U CN 201758142 U CN201758142 U CN 201758142U CN 2010201970820 U CN2010201970820 U CN 2010201970820U CN 201020197082 U CN201020197082 U CN 201020197082U CN 201758142 U CN201758142 U CN 201758142U
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- Prior art keywords
- lead frame
- silver
- plate
- substrate
- electroplating
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Abstract
The utility model discloses an LED lead frame, which comprises a frame, a functional area and a chip position. An anti-replacing protection film is formed on the whole lead frame. A silver plating layer is formed on the whole functional area by selectively electroplating silver. A secondary silver plating layer is formed on the chip position by locally electroplating silver, so that the silver plating layer on the chip position is thicker than the silver plating layer on the functional area and a copper oxidation resisting organic protection film is formed on the frame. An electroplating device thereof comprises a pressing plate, an upper mold, a lower mold, a base plate, a substrate, a jet plate and an electrode, wherein the upper mold is an imperforate flat plate and is fixed under the pressing plate; a hollow hole is formed on the electroplating-required position of the lower mold; the lower mold is fixed on the base plate; the base plate is fixed on the substrate; the electrode and the jet plate are mounted under the substrate; and the base plate, the substrate and the jet plate are all provided with a through hole for the electroplating solution to flow by. The electroplating device can efficiently utilize silver, thereby lowering the cost, increasing the bonding force between the plastic and the lead frame and achieving the purpose of preventing layering.
Description
Technical field
The utility model relates to a kind of LED lead frame, and relevant with the electroplating device of this LED lead frame.
Background technology
In the prior art, the structure of LED lead frame such as Fig. 1, Fig. 2 and shown in Figure 3, whole lead frame 100 whole silver-plated 200.
Cooperate shown in Figure 4, technological process was as follows when it was electroplated: electrochemical deoiling → electrolytic degreasing → washing → pickling → washing → copper facing → washing → all electrosilvering (or whole electrosilvering → functional areas parcel plating silver) → silver recovery → washing → strip → washing → neutralization → washing → hot water wash → oven dry, wherein all plating is all silver-plated for whole lead frame.
The effect in each step is as follows in the technological process:
Electrochemical deoiling and electrolytic degreasing all are in order to remove the grease on the LED lead frame.
Washing has two effects, and first, clean the LED lead frame, second, clean the preceding road liquid medicine that remains in the LED lead frame, guarantee that road, back liquid medicine is not contaminated.The number of times of washing can be for once or repeatedly.
Pickling be in and electrolytic degreasing remain in degreasing fluid above the LED framework, activation LED lead frame surface, make electroplate silver layer and the framework adhesion more firm.The number of times of pickling can be for once or secondary.
Copper facing is raising silver layer and copper layer adhesion, and improves the evenness of copper laminar surface.
All silver-plated is all to electroplate silver on the framework surface.As Fig. 3, two-sided all plating of LED lead frame gone up silver.
Functional areas (containing the chip rest area) local silver-plating is at framework positive function district part parcel plating silver, and the thickening silver layer meets the requirements of the customers the function area part silver thickness.
Silver recovery is the silver-plated liquid medicine that remains in the LED lead frame in order to reclaim, and can clean lead frame.
Strip is that silver layer surface is polished, and makes the brightness of silver layer surface meet requirement of client.
Neutralization is the strip liquid medicine that neutralization remains in the LED lead frame.
Hot water wash is thoroughly to clean the LED lead frame surface, guarantees the framework cleaning.
Adopt existing method to electroplate, whole lead frame is all electroplated silver, nonfunctional area (frame) is also electroplated silver, does not only adopt whole electrosilverings if there is functional areas parcel plating silver operation, and the silver-plated thickness of frame can be the same with functional areas thick, and, in order to guarantee the silver-plated thickness of chip rest area, the silver-plated thickness in whole functional district is the same with the chip rest area again, thus, cause the utilance of silver very low, the production cost height.Adhesion between silver layer and the plastics is little simultaneously, may cause layering between silver layer and the plastics when the client encapsulates, and influences the quality of LED product.
In view of this, the inventor improves at the electroplating technology of existing LED lead frame, has this case to produce then.
The utility model content
The purpose of this utility model is to provide a kind of LED lead frame and electroplating device thereof, effectively to utilize argent, reduces cost, and improves the adhesion of plastics and lead frame, reaches anti-layering purpose.
To achieve these goals, the technical solution of the utility model is as follows:
A kind of LED lead frame; be divided into frame, functional areas and three parts of chip rest area; form anti-displacement diaphragm on the whole lead frame; form a silver coating through the selection electrosilvering in the whole functional district; form the secondary silver coating through parcel plating silver again on the chip rest area; make the silver coating of chip rest area compare the silver-plated bed thickness of functional areas on every side, form anti-copper oxidation organic protective film on the frame.
A kind of electroplating device of LED lead frame, form by pressing plate, upper die and lower die, base plate, substrate, jet tray and electrode, patrix is the atresia flat board, patrix is fixed on the below of pressing plate, counterdie is to forming hollow hole in requisition for the position of electroplating, and counterdie is fixed on the base plate, and base plate is fixed on the substrate, the below installing electrodes and the jet tray of substrate have the through hole that the power supply plating bath flows through on base plate, substrate and the jet tray.This equipment is applicable to single face (back side or front) functional areas selection electrosilvering or chip rest area parcel plating silver.
A kind of electroplating device of LED lead frame, form by pressing plate, top electrode, upper substrate, upper plate, upper die and lower die, lower shoe, infrabasal plate, jet tray and bottom electrode, the below of pressing plate is fixedly top electrode, upper substrate, upper plate and patrix successively, counterdie and lower shoe are fixed on the top of infrabasal plate successively, bottom electrode and jet tray are installed in the below of infrabasal plate, upper die and lower die have the through hole that the power supply plating bath flows through all to forming hollow hole in requisition for the position of electroplating on upper substrate, upper plate, lower shoe, infrabasal plate and the jet tray.This equipment is applicable to the two-sided disposable functional areas selection parcel plating operation of front and back.
After adopting such scheme, the utility model compared with prior art:
One, the utility model positive function district, functional areas, the back side and chip rest area all adopt and select the parcel plating mode to realize only electroplating the active zone part, frame is not electroplated, the silver coating of chip rest area is thicker than functional areas, whole lead frame electrosilvering aspect is long-pending only for 37.09% of existing method, reduces production costs; And the whole lead frame of prior art is all electroplated upward silver, production cost height;
Two, the utility model is when the client encapsulates, and lead frame part copper layer contacts with plastics with silver layer, and the copper layer is bigger than the adhesion of silver layer and plastics with the adhesion of plastics, thereby improves the adhesion of framework and plastics, prevents framework and plastics layering; And the whole silver layers of prior art lead frame are relative with the adhesion between the plastics little, may cause lead frame and plastics layering in client's encapsulation process.
In a word, the utility model has significantly reduced the electrosilvering aspect and has amassed, and argent is effectively used, and has reduced electroplating cost, and improves the adhesion of plastics and lead frame, reaches anti-layering purpose, has improved the quality of LED product.
Below in conjunction with the drawings and the specific embodiments the utility model is described in further details.
Description of drawings
Fig. 1 is the front view of LED lead frame in the prior art;
Fig. 2 is the rearview of LED lead frame in the prior art;
Fig. 3 is the cross section enlarged drawing of LED lead frame in the prior art;
Fig. 4 is the plating flow chart of LED lead frame in the prior art;
Fig. 5 is the front view of the utility model LED lead frame;
Fig. 6 is the rearview of the utility model LED lead frame;
Fig. 7 is the cross section enlarged drawing of the utility model LED lead frame;
Fig. 8 is the plating flow chart of the utility model LED lead frame;
Fig. 9 is electroplating device one structural representation of the utility model LED lead frame;
Figure 10 is the electroplating device one work schematic diagram of the utility model LED lead frame;
Figure 11 is electroplating device two structural representations of the utility model LED lead frame;
Figure 12 is the electroplating device two work schematic diagrames of the utility model LED lead frame.
Label declaration
Prior art
The utility model
Lead frame 10 frames 11
No. 14 silver coatings 15 of anti-displacement diaphragm
Secondary silver coating 16 organic protective films 17
Patrix 22 counterdies 23
Jet tray 26 electrodes 27
Counterdie 36 lower shoes 37
Embodiment
Seeing also Fig. 5 to shown in Figure 7, is a kind of LED lead frame 10 that the utility model discloses, and is divided into frame 11, functional areas 12 and 13 3 parts of chip rest area.Form anti-displacement diaphragm 14 on the whole lead frame 10.Form a silver coating 15 through the selection electrosilvering in the whole functional district 12.Form secondary silver coating 16 through parcel plating silver again on the chip rest area 13, the silver coating (comprise a silver coating 15 and secondary silver coating 16) that makes chip rest area 13 than around the silver coating (only once silver coating 15) of functional areas 12 thick.Form anti-copper oxidation organic protective film 17 on the frame 11.
As shown in Figure 8, be the electro-plating method of the LED lead frame of the utility model prompting, technological process is as follows:
At first, electroplating front surface handles.Electrochemical deoiling → electrolytic degreasing → washing → pickling → washing → copper facing → washing → anti-displacement processing → washing.
Electrochemical deoiling and electrolytic degreasing all are in order to remove the grease on the LED lead frame.
Washing has two effects, and first, clean the LED lead frame, second, clean the preceding road liquid medicine that remains in the LED lead frame, guarantee that road, back liquid medicine is not contaminated.The number of times of washing can be for once or repeatedly.
Pickling be in and electrolytic degreasing remain in degreasing fluid above the LED framework, activation LED lead frame surface, make electroplate silver layer and the framework adhesion more firm.The number of times of pickling can be for once or secondary.
Copper facing is raising silver layer and copper layer adhesion, and improves the evenness of copper laminar surface.
The utility model has also increased anti-displacement processing in electroplating the front surface processing; copper substrate surface at the LED lead frame forms the anti-displacement diaphragm of one deck, makes lead frame in silver-plated or silver recovery process, when not charged; not with electroplate liquid generation displacement reaction, improve the silver layer adhesion.The concrete anti-displacement liquid medicine (solution of forming by silver potassium cyanide, Mei Taile liquid medicine supplier's conducting salt Adjusting Salts and Mei Taile liquid medicine supplier's anti-displacement liquid Supre DIPA-5T) that adopts, technological parameter: at room temperature, silver (Ag) concentration is 1.0～10.0g/l in the corresponding electroplate liquid, when conducting salt concentration was 5～25g/l, anti-displacement chemical concentration was 10～50ml/l.
Then, carry out electroplating processes.The utility model adopts selects the parcel plating mode to realize only electroplating the active zone part, and frame is not electroplated, and the silver coating of chip rest area is thicker than functional areas.
Concrete operation has three kinds of forms:
First kind, electrosilvering is selected in functional areas, the first back side, and electrosilvering is selected in the positive function district again, last chip rest area parcel plating silver;
Second kind, electrosilvering is selected in first positive function district, and electrosilvering is selected in functional areas, the back side again, last chip rest area parcel plating silver;
The third, electrosilvering, chip rest area parcel plating silver are again selected in the two-sided disposable functional areas of front and back.
As Fig. 9 and shown in Figure 10, be a kind of electroplating device 20 that the utility model discloses, this equipment is applicable to the single face selection parcel plating operation of functional areas, back side selection electrosilvering, positive function district selection electrosilvering or chip rest area parcel plating silver.This equipment is made up of pressing plate 21, patrix 22, counterdie 23, base plate 24, substrate 25, jet tray 26 and electrode 27.Patrix 22 is the atresia flat board, can adopt silica gel to make, and patrix 22 is fixed on the below of pressing plate 21.23 pairs of positions in requisition for plating of counterdie form hollow hole 28, can adopt silica gel to make, and counterdie 23 is fixed on the base plate 24, and base plate 24 is fixed on the substrate 25, the below installing electrodes 27 of substrate 25 and jet tray 26.Have the power supply plating bath on base plate 24, substrate 25 and the jet tray 26 and flow through the through hole 29 of (seeing shown in Figure 10 arrow).
During use, select electrosilvering as functional areas, the back side, lead frame 10 is faced up the back side towards being placed down on the counterdie 23, pressing plate 21, patrix 22 are fitted in the front of lead frame 10 to pressing to patrix 22, compress by pressing plate 21, make patrix 22 and counterdie 23 be close to the front and back of lead frame 10; Before the plating, electroplate liquid does not spray upward, and electroplate liquid does not contact with lead frame 10, as shown in Figure 9; During plating, electroplate liquid sprays upward through the through hole 29 of jet tray 26, substrate 25 and base plate 24, be subjected to the obstruction of patrix 22, counterdie 23, electroplate liquid needs silver-plated zone through the hollow hole 28 contact back sides, and the electroplate liquid spray is less than the front, by electrolysis silver in the parcel plating of the back side of lead frame 10 electroplate liquid contact, all the other are not electroplated by counterdie 23 cover parts, as Figure 10.
This equipment is used for the positive function district and selects electrosilvering the same with the operation of chip rest area parcel plating silver, does not do at this and gives unnecessary details.
As Figure 11 and shown in Figure 12, be the another kind of electroplating device 30 that the utility model discloses, this equipment is applicable to the disposable two-sided functional areas selection parcel plating operation of front and back.This equipment is made up of pressing plate 31, top electrode 32, upper substrate 33, upper plate 34, patrix 35, counterdie 36, lower shoe 37, infrabasal plate 38, jet tray 39 and bottom electrode 40.The below of pressing plate 31 is fixedly top electrode 32, upper substrate 33, upper plate 34 and patrix 35 successively.Counterdie 36 and lower shoe 37 are fixed on the top of infrabasal plate 38 successively, and bottom electrode 40 and jet tray 39 are installed in the below of infrabasal plate 38.Patrix 35 and counterdie 36 are all to forming hollow hole 41,42 in requisition for the position of electroplating.Have the power supply plating bath on upper substrate 33, upper plate 34, lower shoe 37, infrabasal plate 38 and the jet tray 39 and flow through the through hole 43 of (seeing shown in Figure 12 arrow).
During use, lead frame 10 is faced up the back side towards being placed down on the counterdie 36, pressing plate 31 is fitted in the front of lead frame 10 to pressing to patrix 35, compress, make patrix 35 and counterdie 36 be close to the front and back of lead frame 10 by pressing plate 31; Before the plating, electroplate liquid does not spray upward, and electroplate liquid does not contact with lead frame 10, as shown in figure 11; During plating, electroplate liquid sprays upward through the through hole 43 of jet tray 39, infrabasal plate 38, lower shoe 37, upper plate 34 and upper substrate 33, be subjected to the obstruction of patrix 35, counterdie 36, electroplate liquid process hollow hole 41 contacts the back side with 42, the front needs silver-plated zone, and electroplated less than just not having by patrix 35, counterdie 36 cover part electroplate liquid sprays, as Figure 12.
At last, electroplate reprocessing, silver recovery → washing → strip → washing → neutralization → washing → anti-copper oxidation processes → washing → hot water wash → oven dry.
Silver recovery is the silver-plated liquid medicine that remains in the LED lead frame in order to reclaim, and can clean lead frame.
Strip is that silver layer surface is polished, and makes the brightness of silver layer surface meet requirement of client.
Neutralization is the strip liquid medicine that neutralization remains in the LED lead frame.
Hot water wash is thoroughly to clean the LED lead frame surface, guarantees the framework cleaning.
The utility model has also increased anti-copper oxidation processes in hot water wash with in before drying, and is to form one deck organic protective film at the copper laminar surface, and it is not oxidized that the copper layer is exposed in the air.Specifically technology is, at room temperature, adopts copper protection liquid medicine (the copper protection is the copper protection liquid medicine CuPRoTEC that ROHM AND HAAS liquid medicine company provides), and concentration is 10-50ml/l, at copper laminar surface formation one deck organic protective film.
Emphasis of the present utility model is to utilize to select parcel plating to replace all electroplating.Above embodiment is the further explanation to this case, but not to the restriction of interest field, and all modification and variations of being done according to this case spirit all should fall into the protection category of this case.
Claims (3)
1. LED lead frame; be divided into frame, functional areas and three parts of chip rest area; it is characterized in that: form anti-displacement diaphragm on the whole lead frame; form a silver coating through the selection electrosilvering in the whole functional district; form the secondary silver coating through parcel plating silver again on the chip rest area; make the silver coating of chip rest area compare the silver-plated bed thickness of functional areas on every side, form anti-copper oxidation organic protective film on the frame.
2. the electroplating device of a LED lead frame, it is characterized in that: form by pressing plate, upper die and lower die, base plate, substrate, jet tray and electrode, patrix is the atresia flat board, patrix is fixed on the below of pressing plate, counterdie is to forming hollow hole in requisition for the position of electroplating, and counterdie is fixed on the base plate, and base plate is fixed on the substrate, the below installing electrodes and the jet tray of substrate have the through hole that the power supply plating bath flows through on base plate, substrate and the jet tray.
3. the electroplating device of a LED lead frame, it is characterized in that: form by pressing plate, top electrode, upper substrate, upper plate, upper die and lower die, lower shoe, infrabasal plate, jet tray and bottom electrode, the below of pressing plate is fixedly top electrode, upper substrate, upper plate and patrix successively, counterdie and lower shoe are fixed on the top of infrabasal plate successively, bottom electrode and jet tray are installed in the below of infrabasal plate, upper die and lower die have the through hole that the power supply plating bath flows through all to forming hollow hole in requisition for the position of electroplating on upper substrate, upper plate, lower shoe, infrabasal plate and the jet tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201970820U CN201758142U (en) | 2010-05-07 | 2010-05-07 | LED lead frame and electroplating device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201970820U CN201758142U (en) | 2010-05-07 | 2010-05-07 | LED lead frame and electroplating device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201758142U true CN201758142U (en) | 2011-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201970820U Expired - Lifetime CN201758142U (en) | 2010-05-07 | 2010-05-07 | LED lead frame and electroplating device thereof |
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| Country | Link |
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| CN (1) | CN201758142U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383160A (en) * | 2011-10-21 | 2012-03-21 | 顺德工业(江苏)有限公司 | Electroplating electric-conducting device for integrated circuit lead frame |
| CN102888632A (en) * | 2012-09-14 | 2013-01-23 | 艾蒂盟斯（苏州）压铸电子技术有限公司 | Protection tool and method for selective electroplating |
| CN103352241A (en) * | 2013-06-25 | 2013-10-16 | 中山品高电子材料有限公司 | Local plating device for lead frame |
| CN103469289A (en) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | Integrated circuit lead frame plate type electroplating clamp |
| CN103498175A (en) * | 2013-09-28 | 2014-01-08 | 宁波康强电子股份有限公司 | Method for electroplating lead frame |
| CN103741177A (en) * | 2010-05-07 | 2014-04-23 | 厦门永红科技有限公司 | Electroplating device for LED lead wire framework |
| CN103774194A (en) * | 2010-05-07 | 2014-05-07 | 厦门永红科技有限公司 | Electroplating equipment for LED lead wire framework |
| CN108004571A (en) * | 2017-11-24 | 2018-05-08 | 中山复盛机电有限公司 | Tablet electroplating mold electroplates the reinforced structure and tablet electroplating mold of window |
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2010
- 2010-05-07 CN CN2010201970820U patent/CN201758142U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103741177A (en) * | 2010-05-07 | 2014-04-23 | 厦门永红科技有限公司 | Electroplating device for LED lead wire framework |
| CN103774194A (en) * | 2010-05-07 | 2014-05-07 | 厦门永红科技有限公司 | Electroplating equipment for LED lead wire framework |
| CN102383160A (en) * | 2011-10-21 | 2012-03-21 | 顺德工业(江苏)有限公司 | Electroplating electric-conducting device for integrated circuit lead frame |
| CN102888632A (en) * | 2012-09-14 | 2013-01-23 | 艾蒂盟斯（苏州）压铸电子技术有限公司 | Protection tool and method for selective electroplating |
| CN102888632B (en) * | 2012-09-14 | 2014-12-03 | 艾蒂盟斯（苏州）压铸电子技术有限公司 | Protection tool and method for selective electroplating |
| CN103352241A (en) * | 2013-06-25 | 2013-10-16 | 中山品高电子材料有限公司 | Local plating device for lead frame |
| CN103352241B (en) * | 2013-06-25 | 2016-01-20 | 中山品高电子材料有限公司 | A kind of lead frame selective plating device |
| CN103469289A (en) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | Integrated circuit lead frame plate type electroplating clamp |
| CN103498175A (en) * | 2013-09-28 | 2014-01-08 | 宁波康强电子股份有限公司 | Method for electroplating lead frame |
| CN103498175B (en) * | 2013-09-28 | 2015-10-28 | 宁波康强电子股份有限公司 | The electro-plating method of lead frame |
| CN108004571A (en) * | 2017-11-24 | 2018-05-08 | 中山复盛机电有限公司 | Tablet electroplating mold electroplates the reinforced structure and tablet electroplating mold of window |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110309 Effective date of abandoning: 20160824 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |