CN109338427A - Pen device and intelligent Electrochemical plated film and 3D printing device and its application method is electroplated - Google Patents
Pen device and intelligent Electrochemical plated film and 3D printing device and its application method is electroplated Download PDFInfo
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- CN109338427A CN109338427A CN201811470499.7A CN201811470499A CN109338427A CN 109338427 A CN109338427 A CN 109338427A CN 201811470499 A CN201811470499 A CN 201811470499A CN 109338427 A CN109338427 A CN 109338427A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses plating pen device and intelligent Electrochemical plated film and 3D printing device and its application methods, it is prepared in metal coating techniques primarily directed in current electro-deposition, it is deposited the problem of limitation that workpiece needs to be carried out in the electrolytic solution, pass through a kind of new electric deposition device, make unplated piece without being placed in electrolyte, it realizes and freely prepares metal coating in some specific region of workpiece surface or even point, and unplated piece platform is controlled by computer and realizes intelligence electro-deposition.When unplated piece surface carries out same material electro-deposition simultaneously, electrochemistry 3D printing (increasing material manufacturing) can be further realized by the deposition repeatedly in the same area or pattern of the same race.
Description
Technical field
The invention belongs to field of electrochemical deposition, relate generally to electrochemical deposition prepare metal coating plating pen device and
Intelligent Electrochemical plated film and 3D printing device and its application method.
Background technique
As society and development in science and technology and every field require mechanized equipment running environment more harsh, mechanical movement
Component is faced with the problems such as serious abrasion, corrosion, it is therefore desirable to which the coating of specific function provides safeguard.And electro-deposition techniques
So far in invention in 1800, the every aspect of daily production and life is had been applied to.But due to the limitation of its electrochemical principle,
Cause this technology environmental protection, in terms of always have limitation.With the proposition of German Industrial 4.0, China's industry
With information-based portion it is also proposed that " intelligence manufacture 2025 " development statement, technique have a extensive future.
With the starting of China's intelligence manufacture industry, many traditional industries have all carried out subversive reform.And 3D printing
Typical Representative of the technology (increasing material manufacturing) as intelligence manufacture in the fast development of a few years time, and has penetrated into each
A industrial field.3D printing technique is applied to some traditional industries, production cost is not only greatly reduced, reduces environment
Pollution, while new developing direction and Research Thinking are brought for some traditional industry technologies.
Nowadays, all trades and professions machinery just develops towards precise treatment, miniaturization, light-weighted direction, therefore to coating technology
Requirement increasingly improve.And being electroplated is to use at most at present, most widely used metal coating techniques.But with machine work ring
The attention further that the more harsh and environmental pollution in border is administered, development and production of the electroplating industry in China all receive
Greatly limitation.Development of the electrodeposition in terms of intelligence manufacture and increasing material manufacturing at the same time, is in always at home
Budding stage.Therefore emphatically development be electrodeposited in the application of intelligence manufacture and material increasing field to the technology development in China with
Innovation has a very important significance.
The industry of reparation in to(for) the part wears of deposited workpiece at present, needs deposited workpiece being integrally soaked into electricity
It solves in liquid, then eroded area is operated, there are following technical problems for this operation, when on the one hand deposited workpiece is larger
On the other hand inconvenient for operation and waste of resource cannot accurately repair abrading section.Therefore, it is necessary to study new devices
And method, effectively to solve the above problems.
Summary of the invention
The main object of the present invention is led to overcome the part wears of deposited workpiece to repair existing drawbacks described above
It crosses and designs a kind of new electric deposition device and application method, realize and carry out free preparation gold in some specific region of workpiece surface
Belong to coating, and pen device or unplated piece platform realization local plating are electroplated by manual or control with computational intelligence.When to be plated
When part surface carries out same material electro-deposition, it can be further realized by the deposition repeatedly in the same area or pattern of the same race
Electrochemistry 3D printing (increasing material manufacturing).
To achieve the above object, the present invention provides a kind of plating pen device, including pen body ontology, the pen body ontologies
It is provided with inner cavity, pen body ontology is equipped with upper fluid infusion on the top of inner cavity, and lower end is provided with lower leakage mouth, interior intracavitary for holding
Electroplate liquid also inserts intrinsic anode material and reference electrode on the pen body ontology, and the anode material and reference electrode are equal
One end insertion inner cavity is simultaneously immersed in electroplate liquid, and the other end is placed in that pen body sheet is external, the pen body ontology include sealing cover and
Porous flexible material, the sealing cover can cover conjunction and seal upper fluid infusion in upper fluid infusion, the porous flexible material
It is placed at lower leakage mouth.
Further, the porous flexible material is fixed in lower leakage mouth, and lower leakage mouth is blocked completely, described
Electroplate liquid can be leaked out through the hole on porous flexible material from lower leakage mouth.
Further, the porous flexible material is block, and porous flexible material is placed in inner cavity and is stuck in lower leakage
At liquid mouth (12), the electroplate liquid can be leaked out through the hole on porous flexible material from lower leakage mouth.
Further, the reference electrode is placed in the external one end of pen body sheet and is provided with electrode interface, the electrode
Interface with the computer for doing intelligent sedimentation analysis for connecting.
Further, the upper fluid infusion is located at the top of pen body ontology, and correspondingly, sealing is placed on pen body ontology
Surface, the anode material and reference electrode are passed through from sealing cover respectively, the anode material and reference electrode
With sealing cover secure fit.
The present invention also provides a kind of intelligent Electrochemical plated films and 3D printing device using above-mentioned plating pen device, including
Plating pen device, can heat two to mobile platform, platform lifter and power supply unit, the fixation bracket at fixed bracket
Including support portion interconnected and fixed part, pen device is electroplated and is fixed on fixed part, substrate to be deposited is placed in two to movement
It above platform, is electrodeposited on substrate to be deposited and carries out, described two are placed in above platform lifter to mobile platform, described
Two can drive substrate X, Y twin shaft to be deposited mobile to mobile platform, platform lifter can rise or fall two to mobile platform and
Substrate to be deposited makes substrate surface to be deposited contact or separate with the lower leakage mouth that pen device is electroplated, the platform lifter
It is fixedly connected with support bracket fastened support portion bottom, the anode material of the anode connection plating pen device of the power supply unit,
Cathode connects substrate to be deposited.
Further, the power supply unit is direct current power box or electrochemical workstation.
Further, described two to heating layer is equipped in the middle part of mobile platform, is passed through and is changed two surfaces to mobile platform
Temperature heats to treat deposition substrate, and temperature regulating range is 0 ~ 100 DEG C；The fixed part is provided with heating device, described
Heating device can to plating pen device heating, temperature regulating range be 0 ~ 100 DEG C.
Further, the heating layer and heating device are resistance wire.
Further, the support portion be vertical rack, fixed part is horizontal bracket, one end of the fixed part with
The top of support portion is fixedly connected, and the other end is free end, for clamping plating pen device.
The present invention also provides the application method of above-mentioned plating pen device, including the following steps:
Step 1: configuration electroplate liquid imports in plating pen device, seal cap sealing lid is closed in upper fluid infusion；
Step 2: substrate surface to be deposited is polished, and is cleaned respectively to its surface with weak acid and weak base, then with alcohol by its
Remained on surface liquid is cleaned, and is finally dried up with nitrogen；
Step 3: by the positive jointed anode material of power supply unit, cathode connection selects suitable voltage to substrate to be deposited, protects
The lower leakage mouth liquid level for holding plating pen device is in contact with substrate surface to be deposited, manually controls plating pen device to base to be deposited
Plate surface carries out free electro-deposition.
The present invention also provides the application methods of above-mentioned intelligent Electrochemical plated film and 3D printing device, including following step
It is rapid:
Step 1: configuration electroplate liquid imports in plating pen device, seal cap sealing lid is closed in upper fluid infusion；
Step 2: plating pen device is fixed on fixed part；
Step 3: substrate surface to be deposited is polished, and is cleaned respectively to its surface with weak acid and weak base, then with alcohol by its
Remained on surface liquid is cleaned, and is finally dried up with nitrogen；
Step 4: by the positive jointed anode material of power supply unit, cathode connects substrate to be deposited, selects suitable voltage, passes through
Computer program control can heat two to mobile platform and the heating of platform lifter, movement, make the lower leakage mouth liquid level that pen is electroplated
It is in contact with substrate to be deposited, treats deposition substrate surface according to the good mode of program setting and carry out free electro-deposition.
An above-described plating pen body is non-conducting material production.
Compared with the prior art, the advantages of the present invention are as follows: (1) by above-mentioned apparatus and application method, accurately realize
Free metal coating preparation is carried out in some specific region of workpiece surface；(2) by two to the heating layer of mobile platform and solid
Determine the heating device that portion is provided with, accurately realizes the temperature control of substrate and electroplate liquid to be deposited；(3) porous soft by placing
Property material, water conservancy diversion on the one hand is carried out to electroplate liquid, on the other hand absorbs the minute bubbles that plating stops at leakage mouth in the works,
It spreads it uniformly, prevents the disconnection of electroplate liquid and electric current；(4) plating pen can individually be taken out from fixed device, thus into
The manual electro-deposition of row, draws pattern required for oneself, can also be after setting Reasonable Parameters, to the table of original damaged coating
Face carries out point-to-point surface covering reparation；(5) device of above-mentioned application plating pen can be controlled by intelligence control system,
Two dimension or three-dimensional mobile is carried out, thus figure required for depositing and shape；(6) substrate surface progress to be deposited is of the same race simultaneously
When material electro-deposition, it can further realize electrochemistry 3D printing by the deposition repeatedly at the same area or pattern of the same race and (increase
Material manufacture).
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Label in attached drawing are as follows: pen body ontology 1, inner cavity 1a, upper fluid infusion 11, lower leakage mouth 12, electroplate liquid 2, anode material
Material 3, reference electrode 4, electrode interface 4a, sealing cover 5, porous flexible material 6, computer 7, fixed bracket 81, support portion 81a,
Fixed part 81b, substrate to be deposited 82 can heat two to mobile platform 83, platform lifter 84, power supply unit 85.
Specific embodiment
Below by way of specific embodiment, the invention will be further described.
Embodiment 1
The FeSO47H2O solution of configuration 200g/L cooks electroplate liquid 2, is fitted into plating pen device, by plating pen device sealing
Lid 5 seals；
One piece of long 10cm, wide 5cm are taken, the copper sheet of thick 0.2mm makees substrate 82 to be deposited, first by its surface polishing, secondly uses
1mol/L dilute hydrochloric acid and 1mol/L sodium hydroxide solution respectively clean its surface, again with alcohol by its remained on surface liquid
Body is cleaned, and is finally dried up with nitrogen；
Using direct current power box 85, by positive jointed anode material copper 3, cathode connects copper sheet 82, selects voltage for 4V, controls manually
System plating pen device carries out free electro-deposition to 82 surface of copper sheet, and lower 12 liquid level of leakage mouth is during which kept to be in contact with copper sheet 82；
Iron coating can be prepared on 82 surface of copper sheet, and can freely draw required pattern, or carry out point-to-point deposition.
Embodiment 2
The FeSO47H2O solution of configuration 200g/L cooks electroplate liquid 2, is fitted into plating pen device, by plating pen device sealing
Lid 5 seals；
One piece of long 10cm, wide 5cm are taken, the copper sheet of thick 0.2mm makees substrate 82 to be deposited, first by its surface polishing, secondly uses
1mol/L dilute hydrochloric acid and 1mol/L sodium hydroxide solution respectively clean its surface, again with alcohol by its remained on surface liquid
Body is cleaned, and is finally dried up with nitrogen；
Plating pen device is fixed on fixed part 81b；
Using direct current power box 85, by positive jointed anode material copper 3, cathode connects copper sheet 82, selects voltage for 4V, pass through meter
Calculation machine process control can heat two to mobile platform 83 and the movement of platform lifter 84, make the lower leakage mouth liquid level that pen device is electroplated
It is in contact with copperplate 82, free electro-deposition is carried out to copper sheet surface by the good mode of program setting, during which to some region or figure
Shape, which carries out prolonged deposit repeatedly, can be achieved electrochemistry 3D printing.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
For those of ordinary skill, several improvements and modifications without departing from the principles of the present invention should be regarded as protection of the invention
Range.
Claims (12)
1. pen device is electroplated, it is characterized in that: including pen body ontology (1), the pen body ontology (1) is provided with inner cavity (1a), pen
Body ontology (1) is equipped with upper fluid infusion (11) on the top of inner cavity (1a), and lower end is provided with lower leakage mouth (12), uses in inner cavity (1a)
In holding electroplate liquid (2), intrinsic anode material (3) and reference electrode (4), the sun are also inserted on the pen body ontology (1)
Pole material (3) and reference electrode (4) one end insertion inner cavity (1a) are simultaneously immersed in electroplate liquid (2), and the other end is placed in pen body sheet
Outside, the pen body ontology (1) includes sealing cover (5) and porous flexible material (6) to body (1), and the sealing cover (5) can cover conjunction
Upper fluid infusion (11) are sealed on upper fluid infusion (11), the porous flexible material (6) is placed at lower leakage mouth (12).
2. plating pen device according to claim 1, it is characterized in that: the porous flexible material (6) is fixed on lower leakage
On liquid mouth (12), lower leakage mouth (12) is blocked completely, the electroplate liquid (2) can be through the hole on porous flexible material (6)
It is leaked out from lower leakage mouth (12).
3. plating pen device according to claim 1, it is characterized in that: the porous flexible material (6) is block, it is more
Hole flexible material (6) is placed in inner cavity (1a) and is stuck at lower leakage mouth (12), and the electroplate liquid (2) can penetrate porous flexible
Hole on material (6) is leaked out from lower leakage mouth (12).
4. plating pen device according to claim 1 or 2 or 3, it is characterized in that: the reference electrode (4) is placed in pen body
The one end of ontology (1) outside is provided with electrode interface (4a), the electrode interface (4a) by with do based on intelligent sedimentation analysis
Calculation machine (7) connection.
5. plating pen device according to claim 4, it is characterized in that: the upper fluid infusion (11) is located at pen body ontology
(1) top, correspondingly, sealing cover (5) are placed in the surface of pen body ontology (1), the anode material (3) and reference electrode
(4) respectively from sealing cover (5) across the anode material (3) and reference electrode (4) are matched with sealing cover (5) fixation
It closes.
6. a kind of the intelligent Electrochemical plated film and 3D printing device of application plating pen device as described in claim 1, feature
It is: further includes fixed bracket (81), two can be heated to mobile platform (83), platform lifter (84) and power supply unit (85),
The fixation bracket (81) includes support portion interconnected (81a) and fixed part (81b), and plating pen device is fixed on fixation
In portion (81b), substrate (82) to be deposited is placed in two to mobile platform (83) above, and it is enterprising to be electrodeposited in substrate to be deposited (82)
Row, described two are placed in platform lifter (84) above to mobile platform (83), and described two can drive to mobile platform (83)
Substrate (82) X, Y twin shaft to be deposited is mobile, and platform lifter (84) can rise or fall two to mobile platform (83) and to be deposited
Substrate (82) makes substrate to be deposited (82) surface contact or separate with the lower leakage mouth (12) that pen device is electroplated, the platform
Lifter (84) is fixedly connected with the bottom support portion (81a) of fixed bracket (81), and the anode of the power supply unit (85) is even
The anode material (3) of plating pen device is connect, cathode connects substrate (82) to be deposited.
7. intelligent Electrochemical plated film according to claim 6 and 3D printing device, it is characterized in that: the power supply unit
It (85) is direct current power box or electrochemical workstation.
8. intelligent Electrochemical plated film according to claim 6 and 3D printing device, it is characterized in that: described two put down to mobile
Heating layer is housed in the middle part of platform (83), treats deposition substrate (82) heating, temperature by changing two to the surface temperature of mobile platform
Spending adjustable range is 0 ~ 100 DEG C；The fixed part (81b) is provided with heating device, and the heating device can be to plating pen
Device heating, temperature regulating range are 0 ~ 100 DEG C.
9. intelligent Electrochemical plated film according to claim 8 and 3D printing device, it is characterized in that: the heating layer and plus
Thermal is resistance wire.
10. intelligent Electrochemical plated film according to claim 6 and 3D printing device, it is characterized in that: the support portion
(81a) is vertical rack, and fixed part (81b) is horizontal bracket, one end and support portion (81a) of the fixed part (81b)
Top is fixedly connected, and the other end is free end, for clamping plating pen device.
11. the application method of plating pen device as described in claim 1, it is characterized in that: including the following steps:
Step 1: configuration electroplate liquid (2) imports in plating pen device, sealing cover (5) is covered in upper fluid infusion (11)
On；
Step 2: substrate to be deposited (82) surface polishing respectively cleans its surface with weak acid and weak base, then use alcohol
Its remained on surface liquid is cleaned, is finally dried up with nitrogen；
Step 3: by the positive jointed anode material (3) of power supply unit (85), cathode connection is to substrate to be deposited (82), selection
Suitable voltage keeps lower leakage mouth (12) liquid level of plating pen device to be in contact with substrate to be deposited (82) surface, manually controls
Plating pen device treats deposition substrate (82) surface and carries out free electro-deposition.
12. the application method of intelligent Electrochemical plated film as claimed in claim 6 and 3D printing device, it is characterized in that: include with
Under several steps:
Step 1: configuration electroplate liquid (2) imports in plating pen device, sealing cover (5) is covered in upper fluid infusion (11)
On；
Step 2: plating pen device is fixed on fixed part (81b)；
Step 3: substrate to be deposited (82) surface polishing respectively cleans its surface with weak acid and weak base, then use alcohol
Its remained on surface liquid is cleaned, is finally dried up with nitrogen；
Step 4: by the positive jointed anode material (3) of power supply unit (85), cathode connects substrate (82) to be deposited, and selection is closed
Suitable voltage can heat two to mobile platform (83) and platform lifter (84) heating, movement by computer program control, make electricity
Lower leakage mouth (12) liquid level of plated pen is in contact with substrate to be deposited (82), treats deposition substrate (82) surface according to program
The mode set carries out free electro-deposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811470499.7A CN109338427B (en) | 2018-12-04 | 2018-12-04 | Electroplating pen device, intelligent electrochemical coating and 3D printing device and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811470499.7A CN109338427B (en) | 2018-12-04 | 2018-12-04 | Electroplating pen device, intelligent electrochemical coating and 3D printing device and using method thereof |
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| Publication Number | Publication Date |
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| CN109338427A true CN109338427A (en) | 2019-02-15 |
| CN109338427B CN109338427B (en) | 2020-11-24 |
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| CN109750327A (en) * | 2019-03-12 | 2019-05-14 | 西安科技大学 | A kind of more electrochemical metal 3D printing devices and its Method of printing |
| CN110253020A (en) * | 2019-07-16 | 2019-09-20 | 吉林大学 | A kind of micro- increasing material manufacturing device of electrochemical metal and manufacturing method |
| CN110359069A (en) * | 2019-07-16 | 2019-10-22 | 吉林大学 | A kind of more metal mixed increasing material manufacturing device and methods of liquid phase |
| CN111041529A (en) * | 2019-12-24 | 2020-04-21 | 厦门理工学院 | Electro-deposition 3D printing head and device |
| CN111593383A (en) * | 2020-06-08 | 2020-08-28 | 南京航空航天大学 | Preparation method of metal composite material and coating for selective area electrodeposition |
| CN111663121A (en) * | 2020-05-15 | 2020-09-15 | 复旦大学 | Metal micro-nano three-dimensional printing device and method based on chemical plating process |
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| CN110253020A (en) * | 2019-07-16 | 2019-09-20 | 吉林大学 | A kind of micro- increasing material manufacturing device of electrochemical metal and manufacturing method |
| CN110359069A (en) * | 2019-07-16 | 2019-10-22 | 吉林大学 | A kind of more metal mixed increasing material manufacturing device and methods of liquid phase |
| CN110359069B (en) * | 2019-07-16 | 2021-01-29 | 吉林大学 | Liquid-phase multi-metal mixed additive manufacturing device and method |
| CN111041529A (en) * | 2019-12-24 | 2020-04-21 | 厦门理工学院 | Electro-deposition 3D printing head and device |
| CN111041529B (en) * | 2019-12-24 | 2021-12-07 | 厦门理工学院 | Electro-deposition 3D printing device |
| CN111663121A (en) * | 2020-05-15 | 2020-09-15 | 复旦大学 | Metal micro-nano three-dimensional printing device and method based on chemical plating process |
| CN111593383A (en) * | 2020-06-08 | 2020-08-28 | 南京航空航天大学 | Preparation method of metal composite material and coating for selective area electrodeposition |
| CN112458507A (en) * | 2020-10-26 | 2021-03-09 | 河南理工大学 | Electrodeposition writing system and method for preparing metal micro-nano structure in direct writing mode |
| CN112317766A (en) * | 2020-11-06 | 2021-02-05 | 合肥新杉宇航三维科技有限公司 | Submicron-scale printing equipment and printing method thereof |
| CN114875470A (en) * | 2022-05-24 | 2022-08-09 | 深圳大学 | Automatic circulating electrolyte concentration compensation device and method |
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