CN109338427B - Electroplating pen device, intelligent electrochemical coating and 3D printing device and using method thereof - Google Patents
Electroplating pen device, intelligent electrochemical coating and 3D printing device and using method thereof Download PDFInfo
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- CN109338427B CN109338427B CN201811470499.7A CN201811470499A CN109338427B CN 109338427 B CN109338427 B CN 109338427B CN 201811470499 A CN201811470499 A CN 201811470499A CN 109338427 B CN109338427 B CN 109338427B
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- 238000009713 electroplating Methods 0.000 title claims abstract description 65
- 238000010146 3D printing Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011248 coating agent Substances 0.000 title claims abstract description 17
- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 238000004070 electrodeposition Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 39
- 238000007789 sealing Methods 0.000 claims description 21
- 239000010405 anode material Substances 0.000 claims description 18
- 230000002457 bidirectional effect Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 12
- 230000001502 supplementing effect Effects 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 238000004590 computer program Methods 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 9
- 239000000654 additive Substances 0.000 abstract description 6
- 230000000996 additive effect Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000003792 electrolyte Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 238000011161 development Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000003933 environmental pollution control Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000035784 germination Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating pen device, an intelligent electrochemical coating and 3D printing device and a using method thereof, and mainly aims to solve the problem that a deposited workpiece needs to be limited in electrolyte in the existing technology for preparing a metal coating by electrodeposition. Meanwhile, when the surface of the workpiece to be plated is subjected to the same material electrodeposition, the electrochemical 3D printing (additive manufacturing) can be further realized through repeated deposition in the same area or in the same pattern.
Description
Technical Field
The invention belongs to the field of electrochemical deposition, and mainly relates to an electroplating pen device for preparing a metal coating by electrochemical deposition, an intelligent electrochemical coating and 3D printing device and a using method thereof.
Background
With the social and scientific development and the more severe requirements of various fields on the operating environment of mechanical equipment, mechanical moving parts face the problems of serious abrasion, corrosion and the like, so that a coating with special functions is required to provide guarantee. The invention of the electrodeposition technology in 1800 years to date has been applied to aspects of daily production and life. However, due to the limitation of the electrochemical principle, the technology has limitations in aspects of environmental protection, convenience and the like. With the proposal of German industry 4.0, the development outline of intelligent manufacturing 2025 is also proposed by the department of industry and informatization in China, and the technology has wide application prospect.
With the start of the intelligent manufacturing industry in China, many traditional industries are subversively reformed. While 3D printing technology (additive manufacturing), which is a typical representative of smart manufacturing, has been rapidly developed in as short a few years and has penetrated various industrial fields. The 3D printing technology is applied to some traditional industries, so that the production cost is greatly reduced, the environmental pollution is reduced, and meanwhile, a new development direction and a new research idea are brought for some traditional industrial technologies.
Nowadays, various industrial machines are being developed toward precision, miniaturization, and weight reduction, and thus the demand for coating technology is increasing. Electroplating is the most widely used metal coating technology currently used. However, with the increasingly harsh working environment of machinery and the increasing importance on environmental pollution control, the development and production of electroplating industry in China are greatly limited. Meanwhile, the development of the field of electrodeposition in the aspects of intelligent manufacturing and additive manufacturing is always in the germination stage in China. Therefore, the important development of the application of the electrodeposition in the fields of intelligent manufacturing and additive manufacturing has very important significance on the technical development and innovation of China.
In the prior art, for repairing partial abrasion of a deposited workpiece, the deposited workpiece needs to be wholly soaked in electrolyte, and then an abrasion area is operated. Therefore, there is a need for new devices and methods to effectively solve the above problems.
Disclosure of Invention
The main purpose of the invention is to overcome the defects existing in the partial abrasion repair of the deposited workpiece, and to design a novel electro-deposition device and a using method thereof, so as to realize the free preparation of a metal coating on a certain specific area on the surface of the workpiece, and realize the partial electro-deposition by manually or intelligently controlling an electro-plating pen device or a platform of the workpiece to be plated through a computer. When the surface of the workpiece to be plated is subjected to the same material electrodeposition, electrochemical 3D printing (additive manufacturing) can be further realized through repeated deposition in the same area or in the same pattern.
In order to achieve the purpose, the invention provides an electroplating pen device which comprises a pen body, wherein the pen body is provided with an inner cavity, the upper part of the inner cavity of the pen body is provided with an upper liquid supplementing port, the lower end of the inner cavity of the pen body is provided with a lower liquid leakage port, electroplating liquid is contained in the inner cavity, an anode material and a reference electrode are fixedly inserted into the pen body, one ends of the anode material and the reference electrode are inserted into the inner cavity and immersed in the electroplating liquid, the other end of the anode material and the reference electrode is arranged outside the pen body, the pen body comprises a sealing cover and a porous flexible material, the sealing cover can cover the upper liquid supplementing port to seal the upper liquid supplementing port, and the porous flexible material is arranged at the lower liquid leakage port.
Furthermore, the porous flexible material is fixed on the lower leakage opening, so that the lower leakage opening is completely shielded, and the electroplating solution can leak out from the lower leakage opening through the holes in the porous flexible material.
Furthermore, the porous flexible material is a block, the porous flexible material is arranged in the inner cavity and clamped at the lower leakage opening (12), and the electroplating solution can leak out of the lower leakage opening through the holes in the porous flexible material.
Furthermore, one end of the reference electrode, which is arranged outside the pen body, is provided with an electrode interface, and the electrode interface is used for being connected with a computer for intelligent deposition analysis.
Furthermore, the upper fluid infusion port is positioned at the top of the pen body, correspondingly, the sealing cover is arranged right above the pen body, the anode material and the reference electrode respectively penetrate through the sealing cover, and the anode material and the reference electrode are fixedly matched with the sealing cover.
The invention also provides an intelligent electrochemical coating and 3D printing device applying the electroplating pen device, which comprises an electroplating pen device, a fixed support, a heatable bidirectional moving platform, a platform lifter and power supply equipment, wherein the fixed support comprises a supporting part and a fixed part which are mutually connected, the electroplating pen device is fixed on the fixed part, a substrate to be deposited is arranged on the heatable bidirectional moving platform, electrodeposition is carried out on the substrate to be deposited, the heatable bidirectional moving platform is arranged on the platform lifter, the heatable bidirectional moving platform can drive the substrate to be deposited X, Y to move in a double-shaft manner, the platform lifter can ascend or descend the heatable bidirectional moving platform and the substrate to be deposited to enable the surface of the substrate to be deposited to be in contact with or separated from a lower liquid leakage port of the electroplating pen device, and the platform lifter is fixedly connected with the bottom of the supporting part of the fixed support, the anode of the power supply equipment is connected with the anode material of the plating pen device, and the cathode of the power supply equipment is connected with the substrate to be deposited.
Further, the power supply equipment is a direct current power supply box or an electrochemical workstation.
Further, a heating layer is arranged in the middle of the heatable bidirectional moving platform, the substrate to be deposited is heated by changing the surface temperature of the heatable bidirectional moving platform, and the temperature adjusting range is 0-100 ℃; the fixing part in be equipped with heating device, heating device can heat electroplating pen device, the temperature control range is 0~100 ℃.
Furthermore, the heating layer and the heating device are resistance wires.
Furthermore, the supporting part is a vertical support, the fixing part is a horizontal support, one end of the fixing part is fixedly connected with the upper part of the supporting part, and the other end of the fixing part is a free end and used for clamping the electroplating pen device.
The invention also provides a using method of the electroplating pen device, which comprises the following steps:
the method comprises the following steps: preparing electroplating solution, introducing into an electroplating pen device, and sealing and covering a sealing cover on the upper solution supplementing opening;
step two: polishing the surface of a substrate to be deposited, respectively cleaning the surface of the substrate by weak acid and weak base, cleaning residual liquid on the surface of the substrate by alcohol, and finally drying the substrate by nitrogen;
step three: the anode of the power supply equipment is connected with an anode material, the cathode of the power supply equipment is connected with a substrate to be deposited, proper voltage is selected, the liquid level of a lower leakage opening of the electroplating pen device is kept in contact with the surface of the substrate to be deposited, and the electroplating pen device is manually controlled to carry out free electrodeposition on the surface of the substrate to be deposited.
The invention also provides a using method of the intelligent electrochemical coating and 3D printing device, which comprises the following steps:
the method comprises the following steps: preparing electroplating solution, introducing into an electroplating pen device, and sealing and covering a sealing cover on the upper solution supplementing opening;
step two: fixing the electroplating pen device on the fixing part;
step three: polishing the surface of a substrate to be deposited, respectively cleaning the surface of the substrate by weak acid and weak base, cleaning residual liquid on the surface of the substrate by alcohol, and finally drying the substrate by nitrogen;
step four: the anode of the power supply equipment is connected with an anode material, the cathode of the power supply equipment is connected with a substrate to be deposited, appropriate voltage is selected, the heatable two-way moving platform and the platform lifter are controlled by a computer program to heat and move, the liquid level of a lower liquid leakage port of the electroplating pen is made to be in contact with the substrate to be deposited, and free electrodeposition is carried out on the surface of the substrate to be deposited according to a program set mode.
The pen body of the electroplating pen is made of non-conductive materials.
Compared with the prior art, the invention has the advantages that: (1) by the device and the using method, the free metal coating preparation in a certain specific area on the surface of the workpiece is accurately realized; (2) the temperature control of the substrate to be deposited and the electroplating solution is accurately realized through the heating layer capable of heating the bidirectional moving platform and the heating device arranged in the fixing part; (3) by placing the porous flexible material, on one hand, the electroplating solution is guided, and on the other hand, small bubbles staying at a lower leakage opening of the electroplating pen are absorbed to be uniformly diffused, so that the electroplating solution and the current are prevented from being disconnected; (4) the electroplating pen can be taken out of the fixing device independently, so that manual electrodeposition is carried out, a required pattern is drawn, and point-to-point surface coating repair can be carried out on the surface of the original damaged coating after reasonable parameters are set; (5) the device applying the electroplating pen can be controlled by an intelligent control system to move in two dimensions or three dimensions, so that the required graph and shape are deposited; (6) meanwhile, when the same material is electrodeposited on the surface of the substrate to be deposited, electrochemical 3D printing (additive manufacturing) can be further realized through repeated deposition in the same area or in the same pattern.
Drawings
Fig. 1 is a schematic structural view of the present invention.
The reference numbers in the drawings are: the pen body comprises a pen body 1, an inner cavity 1a, an upper liquid supplementing port 11, a lower liquid leakage port 12, an electroplating liquid 2, an anode material 3, a reference electrode 4, an electrode interface 4a, a sealing cover 5, a porous flexible material 6, a computer 7, a fixing support 81, a supporting part 81a, a fixing part 81b, a substrate 82 to be deposited, a heatable two-way moving platform 83, a platform lifter 84 and a power supply device 85.
Detailed Description
The present invention is further illustrated by the following specific examples.
Example 1
FeSO with configuration of 200g/L4·7H2O solution is used as electroplating solution 2, and the electroplating solution is filled into an electroplating pen device which is sealed by a sealing cover 5;
taking a copper sheet with the length of 10cm, the width of 5cm and the thickness of 0.2mm as a substrate 82 to be deposited, firstly polishing the surface of the copper sheet, secondly respectively cleaning the surface of the copper sheet by using 1mol/L dilute hydrochloric acid and 1mol/L sodium hydroxide solution, secondly cleaning residual liquid on the surface of the copper sheet by using alcohol, and finally drying the copper sheet by using nitrogen;
connecting the anode with anode material copper and the cathode with a copper sheet by using a direct current power supply box, selecting a voltage of 4V, manually controlling an electroplating pen device to carry out free electrodeposition on the surface of the copper sheet, and keeping the liquid level of the lower liquid leakage port 12 in contact with the copper sheet;
an iron coating can be prepared on the surface of the copper sheet, and a required pattern can be freely drawn or point-to-point deposition can be carried out.
Example 2
FeSO with configuration of 200g/L4·7H2O solution is used as electroplating solution 2, and the electroplating solution is filled into an electroplating pen device which is sealed by a sealing cover 5;
taking a copper sheet with the length of 10cm, the width of 5cm and the thickness of 0.2mm as a substrate 82 to be deposited, firstly polishing the surface of the copper sheet, secondly respectively cleaning the surface of the copper sheet by using 1mol/L dilute hydrochloric acid and 1mol/L sodium hydroxide solution, secondly cleaning residual liquid on the surface of the copper sheet by using alcohol, and finally drying the copper sheet by using nitrogen;
fixing the plating pen device on the fixing portion 81 b;
the anode is connected with anode material copper, the cathode is connected with a copper sheet, the voltage is selected to be 4V, the heatable bidirectional moving platform 83 and the platform lifter 84 are controlled to move through a computer program, the liquid level of the lower liquid leakage port of the electroplating pen device is made to be in contact with the copper sheet, free electrodeposition is carried out on the surface of the copper sheet according to a program set mode, and long-time repeated deposition is carried out on a certain area or a pattern in the process, so that electrochemical 3D printing can be realized.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.
Claims (7)
1. The using method of the electroplating pen device adopts the electroplating pen device, and is characterized in that: the electroplating pen device comprises a pen body (1), wherein the pen body (1) is provided with an inner cavity (1a), the upper part of the inner cavity (1a) of the pen body (1) is provided with an upper liquid supplementing port (11), the lower end of the inner cavity is provided with a lower liquid leakage port (12), the inner cavity (1a) is used for containing electroplating liquid (2), an anode material (3) and a reference electrode (4) are also inserted and fixed on the pen body (1), one end of the anode material (3) and one end of the reference electrode (4) are inserted into the inner cavity (1a) and are immersed in the electroplating solution (2), the other end is arranged outside the pen body (1), the pen body (1) comprises a sealing cover (5) and a porous flexible material (6), the sealing cover (5) can cover the upper liquid supplementing opening (11) to seal the upper liquid supplementing opening (11), and the porous flexible material (6) is arranged at the lower liquid leakage opening (12); the porous flexible material (6) is a block, the porous flexible material (6) is arranged in the inner cavity (1a) and clamped at the lower liquid leakage port (12), the electroplating solution (2) can leak out of the lower liquid leakage port (12) through holes in the porous flexible material (6), the porous flexible material conducts flow to the electroplating solution on one hand, and small bubbles staying at the lower liquid leakage port of the electroplating pen on the other hand are absorbed to be uniformly diffused, so that the electroplating solution and current are prevented from being disconnected; one end of the reference electrode (4) arranged outside the pen body (1) is provided with an electrode interface (4a), and the electrode interface (4a) is used for being connected with a computer (7) for intelligent deposition analysis; the upper liquid supplementing port (11) is positioned at the top of the pen body (1), correspondingly, the sealing cover (5) is arranged right above the pen body (1), the anode material (3) and the reference electrode (4) respectively penetrate through the sealing cover (5), and the anode material (3) and the reference electrode (4) are fixedly matched with the sealing cover (5); the specific use mode of the electroplating pen device comprises the following steps:
the method comprises the following steps: preparing electroplating solution (2), introducing into an electroplating pen device, and sealing and covering a sealing cover (5) on the upper solution supplementing port (11);
step two: polishing the surface of a substrate (82) to be deposited, respectively cleaning the surface by weak acid and weak base, cleaning residual liquid on the surface by alcohol, and finally drying the surface by nitrogen;
step three: the anode of the power supply device (85) is connected with the anode material (3), the cathode of the power supply device is connected with the substrate (82) to be deposited, proper voltage is selected, the liquid level of the lower liquid leakage port (12) of the electroplating pen device is kept to be in contact with the surface of the substrate (82) to be deposited, and the electroplating pen device is manually controlled to carry out free electrodeposition on the surface of the substrate (82) to be deposited.
2. An intelligent electrochemical coating and 3D printing device applying the electroplating pen device as claimed in claim 1, which is characterized in that: the device comprises a fixed support (81), a heatable bidirectional moving platform (83), a platform lifter (84) and a power supply device (85), wherein the fixed support (81) comprises a supporting part (81a) and a fixed part (81b) which are connected with each other, an electroplating pen device is fixed on the fixed part (81b), a substrate (82) to be deposited is placed on the heatable bidirectional moving platform (83), electrodeposition is carried out on the substrate (82) to be deposited, the heatable bidirectional moving platform (83) is placed on the platform lifter (84), the heatable bidirectional moving platform (83) can drive the substrate (82) to be deposited (X, Y) to move in a biaxial manner, the platform lifter (84) can ascend or descend the heatable bidirectional moving platform (83) and the substrate (82) to be deposited, so that the surface of the substrate (82) to be deposited is in contact with or separated from a lower liquid leakage port (12) of the electroplating pen device, the platform lifter (84) is fixedly connected with the bottom of the supporting part (81a) of the fixed support (81), the positive electrode of the power supply device (85) is connected with the anode material (3) of the plating pen device, and the negative electrode of the power supply device is connected with the substrate (82) to be deposited.
3. The intelligent electrochemical plating and 3D printing device of claim 2, wherein: the power supply equipment (85) is a direct current power supply box or an electrochemical workstation.
4. The intelligent electrochemical plating and 3D printing device of claim 2, wherein: the heating layer is arranged in the middle of the heatable bidirectional moving platform (83), the substrate (82) to be deposited is heated by changing the surface temperature of the heatable bidirectional moving platform, and the temperature adjusting range is 0-100 ℃; the fixing part (81b) is internally provided with a heating device, the heating device can heat the electroplating pen device, and the temperature adjusting range is 0-100 ℃.
5. The intelligent electrochemical plating and 3D printing device of claim 4, wherein: the heating layer and the heating device are resistance wires.
6. The intelligent electrochemical plating and 3D printing device of claim 5, wherein: the supporting part (81a) is a vertical support, the fixing part (81b) is a horizontal support, one end of the fixing part (81b) is fixedly connected with the upper part of the supporting part (81a), and the other end of the fixing part is a free end and used for clamping the electroplating pen device.
7. The use method of the intelligent electrochemical plating and 3D printing device according to claim 6, wherein the use method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: preparing electroplating solution (2), introducing into an electroplating pen device, and sealing and covering a sealing cover (5) on the upper solution supplementing port (11);
step two: fixing the plating pen device on the fixing part (81 b);
step three: polishing the surface of a substrate (82) to be deposited, respectively cleaning the surface by weak acid and weak base, cleaning residual liquid on the surface by alcohol, and finally drying the surface by nitrogen;
step four: the anode of a power supply device (85) is connected with an anode material (3), the cathode is connected with a substrate (82) to be deposited, a proper voltage is selected, the heatable two-way movable platform (83) and the platform lifter (84) are controlled to heat and move through a computer program, the liquid level of the lower liquid leakage port (12) of the electroplating pen is made to be in contact with the substrate (82) to be deposited, and free electrodeposition is carried out on the surface of the substrate (82) to be deposited according to a program set mode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811470499.7A CN109338427B (en) | 2018-12-04 | 2018-12-04 | Electroplating pen device, intelligent electrochemical coating and 3D printing device and using method thereof |
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| CN201811470499.7A CN109338427B (en) | 2018-12-04 | 2018-12-04 | Electroplating pen device, intelligent electrochemical coating and 3D printing device and using method thereof |
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| CN109338427A CN109338427A (en) | 2019-02-15 |
| CN109338427B true CN109338427B (en) | 2020-11-24 |
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| CN111041529B (en) * | 2019-12-24 | 2021-12-07 | 厦门理工学院 | Electro-deposition 3D printing device |
| CN111663121A (en) * | 2020-05-15 | 2020-09-15 | 复旦大学 | Metal micro-nano three-dimensional printing device and method based on chemical plating process |
| CN111593383B (en) * | 2020-06-08 | 2021-03-23 | 南京航空航天大学 | Preparation method of metal composite material and coating for selective area electrodeposition |
| CN112458507A (en) * | 2020-10-26 | 2021-03-09 | 河南理工大学 | Electrodeposition writing system and method for preparing metal micro-nano structure in direct writing mode |
| CN112317766A (en) * | 2020-11-06 | 2021-02-05 | 合肥新杉宇航三维科技有限公司 | Submicron-scale printing equipment and printing method thereof |
| CN114875470A (en) * | 2022-05-24 | 2022-08-09 | 深圳大学 | Automatic circulating electrolyte concentration compensation device and method |
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| CN104593830A (en) * | 2013-11-01 | 2015-05-06 | 无锡华臻新能源科技有限公司 | Electrochemical additive manufacturing method with measuring feedback, and apparatus thereof |
| US20160108534A1 (en) * | 2014-10-17 | 2016-04-21 | Ut-Battelle, Llc | Aluminum deposition devices and their use in spot electroplating of aluminum |
| KR102044963B1 (en) * | 2015-07-15 | 2019-11-18 | 한국전기연구원 | 3d printing apparatus and method using electroplating |
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