CN207002846U - A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field - Google Patents
A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field Download PDFInfo
- Publication number
- CN207002846U CN207002846U CN201720827439.0U CN201720827439U CN207002846U CN 207002846 U CN207002846 U CN 207002846U CN 201720827439 U CN201720827439 U CN 201720827439U CN 207002846 U CN207002846 U CN 207002846U
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- CN
- China
- Prior art keywords
- circuit board
- electrode plate
- coating bath
- electric field
- positive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field, including for accommodating the coating bath body of circuit board, and the positive electrode plate and negative electrode plate positioned opposite beyond the coating bath body；The positive electrode plate and negative electrode plate are each parallel to the circuit board.The utility model to the plating bath in coating bath by introducing electric field, it can act on various metal cations, increase the activity of metal cation, so that metal cation is arranged and goed deep into the thickness of circuit board surface, and it can more closely be incorporated in circuit board surface, the coating with higher intensity is formed, is effectively prevented from the generation of plating leakage, and shortens the process time, improve production efficiency.
Description
Technical field
Circuit board surface processing technology field is the utility model is related to, especially a kind of circuit board in electroless nickel immersion gold treatment coating bath, the plating
Groove has electric field.
Background technology
Change nickel gold, also known as chemical nickel and gold, the nickel that sinks is golden, is abbreviated as ENIG (Electroless Nickel/Immersion
Gold), it is had main steps that by chemically reacting in the surface replacement palladium of copper, then one layer of nickel phosphorus of chemical plating on the basis of palladium core
Alloy-layer, last layer gold is then plated on the surface of nickel by replacing reaction.It has that coating is flat, contact resistance is low, solderability
It is good, and have the advantages that certain wear-resisting, it is particularly suitable for the printed circuit board of routing (Wire Bonding) technique, turns into indispensable
Coating.
In displacement palladium, plating nickel-phosphorus alloy layer and these three gold-plated steps, circuit board is placed into by hanger clamping respectively
Chemical reaction is completed in different coating baths.The speed trend of these three chemical reactions is roughly the same, and starting velocity is very fast, and with
Metal surface is gradually covered by new material, and the speed of chemical reaction is gradually reduced.Particularly in heavy nickel groove, initial reaction stage master
If the catalytic action of palladium is being carried out, when palladium crystal is completely covered the deposition of nickel, if heavy nickel groove activity deficiency, chemistry are heavy
Product will stop, and then plating leakage problem just generates.The coarse golden face of white is presented in plating leakage position after turmeric, influences hardness and contact
Resistance.In the prior art typically can be by controlling tank liquor temperature, adjusting the concentration of chemical reagent, controlled using modes such as stabilizers
Chemical reaction process processed.Although can obtain preferable effect with upper type, control process is not complex, easy to operate,
And chemical reagent generally has pollution.
Utility model content
Technical problem to be solved in the utility model is：Improve the activity of circuit board in electroless nickel immersion gold treatment coating bath, avoid plating leakage
Produce.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is：A kind of circuit board in electroless nickel with electric field
Golden coating bath, including for accommodating the coating bath body of circuit board, and the positive electricity positioned opposite beyond the coating bath body
Pole plate and negative electrode plate；The positive electrode plate and negative electrode plate are each parallel to the circuit board.
Preferably, the length of positive electrode plate and negative electrode plate is all higher than the length of circuit board, positive electrode plate and negative electrode plate
Width be all higher than the width of circuit board.
Preferably, the voltage strength of the positive electrode plate can be adjusted.
Preferably, the side of the positive electrode plate and negative electrode plate and it is provided with insulation away from the surface of coating bath body
Protective cover.
Preferably, the circuit board is the polylith of horizontal Tile arrangement.
Preferably, the circuit board is the polylith being arranged side by side vertically.
The utility model can act on various metal cations, increase gold by introducing electric field to the plating bath in coating bath
Belong to the activity of cation, so that metal cation is arranged and goed deep into the thickness of circuit board surface, and can more closely tie
Close in circuit board surface, form the coating with higher intensity, be effectively prevented from the generation of plating leakage, and shorten the process time, carry
High efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of the circuit board in electroless nickel immersion gold treatment coating bath with electric field of the utility model first embodiment；
Fig. 2 is the structural representation of the circuit board in electroless nickel immersion gold treatment coating bath with electric field of the utility model second embodiment.
Shown in figure：10th, coating bath body；11st, circuit board；21st, positive electrode plate；22nd, negative electrode plate；3rd, insulating protective cover.
Embodiment
For the ease of understanding above-mentioned purpose of the present utility model, feature and advantage, it is illustrated with reference to embodiment.Should
Understand, these embodiments are merely to illustrate the utility model rather than limitation the scope of the utility model.For these implementations
A variety of modifications of example will be apparent to those skilled in the art, generic principles defined herein,
It can be achieved in other embodiments in the case where not departing from spirit or scope of the present utility model.
First embodiment schematic diagram shown in Figure 1, the circuit board in electroless nickel immersion gold treatment coating bath have coating bath body 10 first.Institute
It is similar with coating bath body of the prior art to state coating bath body 10, can be displacement palladium, plating nickel-phosphorus alloy layer and it is gold-plated etc. no
Different according to technique with the coating bath used in processing step, the composition of plating bath, temperature etc. are different in coating bath.The coating bath
Body 10 can include the part such as hanger, support, be carried out for clamping circuit board 11 and circuit board 11 is maintained in plating bath
Chemical reaction.
It is placed in the coating bath body 10 in parallel uniform electric field, the parallel uniform electric field is by positive electrode plate positioned opposite
21 and negative electrode plate 22 form, the positive electrode plate 21 is located at the top of coating bath body 10 and connects positive power supply, the negative electricity
Pole plate 22 is located at the lower section of coating bath body 10 and ground connection, thus, formation direction is between positive electrode plate 21 and negative electrode plate 22
Top-down parallel uniform electric field.
The positive electrode plate 21 is arranged in parallel with negative electrode plate 22 and circuit board 11, and positive electrode plate 21 and negative electrode plate
22 length is all higher than the length of circuit board 11, and the width of positive electrode plate 21 and negative electrode plate 22 is all higher than the width of circuit board 11
Degree, it may thereby be ensured that the direction of an electric field of each opening position of circuit board 11 is orthogonal with circuit board 11, and circuit board 11 is each
The electric-field intensity of opening position is identical.
The positive electrode plate 21 is preferably made up with negative electrode plate 22 of conducting metal, its side and away from coating bath body 10
Surface be provided with insulating protective cover 3.Because positive electrode plate 21 and the voltage of negative electrode plate 22 at work are pacified more than human body
Full voltage, therefore, the setting of insulating protective cover 3 are very important.
In displacement palladium, plating nickel-phosphorus alloy layer and the various plating process such as gold-plated, the metal sun in plating bath be present
Ion is displaced to the step in the surface metal-layer of circuit board 11.When applying electric field to plating bath, by increasing capacitance it is possible to increase above-mentioned metal
The activity of cation, promote it to arrange and go deep into the thickness on the surface of circuit board 11.It is orthogonal with direction of an electric field circuit board 11, promote
Thickness direction of the metal cation along circuit board 11 moves, and avoids offseting toward other directions.Each opening position of circuit board 11
Electric-field intensity it is identical so that the activity of metal cation is uniformly distributed, and the depth for going deep into circuit board 11 is also uniformly distributed.More than
Design is all beneficial.
The voltage strength of the positive electrode plate 21 can be adjusted, and then make it that electric-field intensity is adjusted.For example, pass through increasing
Extra show is strong, and metal cation can be caused further highly to arrange and further go deep into the thickness on the surface of circuit board 11.And for example,
Strong, feeble field is strong by being used alternatingly, and metal cation can be caused more closely to be incorporated in the surface of circuit board 11, being formed has more
The coating of high intensity.
Second embodiment schematic diagram shown in Figure 2.In the first embodiment, circuit board 11 is horizontally disposed, therefore,
Positive electrode plate 21 and negative electrode plate 22 are also horizontally disposed；In a second embodiment, circuit board 11 is to arrange vertically, therefore positive electricity
Pole plate 21 and negative electrode plate 22 and vertical arrangement, it is ensured that the length of positive electrode plate 21 and negative electrode plate 22 is all higher than circuit board 11
Length, the width of positive electrode plate 21 and negative electrode plate 22 is all higher than the width of circuit board 11.Different, the positive electricity according to actual conditions
Pole plate 21 is different with the arrangement of negative electrode plate 22, and this patent is not particularly limited to this.
Claims (6)
1. a kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field, including for accommodating the coating bath body of circuit board, it is characterised in that
Also include being located at the positive electrode plate and negative electrode plate positioned opposite beyond the coating bath body；The positive electrode plate and negative electrode
Plate is each parallel to the circuit board.
2. there is the circuit board in electroless nickel immersion gold treatment coating bath of electric field as claimed in claim 1, it is characterised in that：The positive electrode plate is with bearing
The length of battery lead plate is all higher than the length of circuit board, and the width of the positive electrode plate and negative electrode plate is all higher than the width of circuit board
Degree.
3. there is the circuit board in electroless nickel immersion gold treatment coating bath of electric field as claimed in claim 1, it is characterised in that：The electricity of the positive electrode plate
Compressive Strength can be adjusted.
4. there is the circuit board in electroless nickel immersion gold treatment coating bath of electric field as claimed in claim 1, it is characterised in that：The positive electrode plate is with bearing
The side of battery lead plate and it is provided with insulating protective cover away from the surface of coating bath body.
5. there is the circuit board in electroless nickel immersion gold treatment coating bath of electric field as claimed in claim 1, it is characterised in that：The circuit board is level
The polylith being arranged side by side.
6. there is the circuit board in electroless nickel immersion gold treatment coating bath of electric field as claimed in claim 1, it is characterised in that：The circuit board is vertical
The polylith being arranged side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720827439.0U CN207002846U (en) | 2017-07-10 | 2017-07-10 | A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720827439.0U CN207002846U (en) | 2017-07-10 | 2017-07-10 | A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207002846U true CN207002846U (en) | 2018-02-13 |
Family
ID=61452695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720827439.0U Expired - Fee Related CN207002846U (en) | 2017-07-10 | 2017-07-10 | A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207002846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109402613A (en) * | 2018-10-09 | 2019-03-01 | 全球能源互联网研究院有限公司 | A kind of method in matrix surface coated with silver and silver-plated four acicular type zinc oxide crystal whisker prepared therefrom |
-
2017
- 2017-07-10 CN CN201720827439.0U patent/CN207002846U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109402613A (en) * | 2018-10-09 | 2019-03-01 | 全球能源互联网研究院有限公司 | A kind of method in matrix surface coated with silver and silver-plated four acicular type zinc oxide crystal whisker prepared therefrom |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180213 Termination date: 20200710 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |