CN207002844U - A kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field - Google Patents
A kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field Download PDFInfo
- Publication number
- CN207002844U CN207002844U CN201720830043.1U CN201720830043U CN207002844U CN 207002844 U CN207002844 U CN 207002844U CN 201720830043 U CN201720830043 U CN 201720830043U CN 207002844 U CN207002844 U CN 207002844U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- magnet
- coating bath
- magnetic field
- electroless nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Chemically Coating (AREA)
Abstract
The utility model discloses a kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field, including for accommodating the coating bath body of circuit board, and the magnet positioned at coating bath outer body；The magnet has N poles and S poles, and the magnet has thickness, and the thickness direction is orthogonal to the circuit board parallel to the direction that S poles are pointed to from N poles, the thickness direction.The utility model to the plating bath in coating bath by introducing magnetic field, it can act on various metal coordination complexs, increase the activity of metal coordination complex, so that the ligand of metal coordination complex is arranged and goed deep into the thickness of circuit board surface, and it can more closely be incorporated in circuit board surface, the coating with higher intensity is formed, is effectively prevented from the generation of plating leakage, and shortens the process time, improve production efficiency.
Description
Technical field
Circuit board surface processing technology field is the utility model is related to, especially a kind of circuit board in electroless nickel immersion gold treatment coating bath, the plating
Groove has magnetic field.
Background technology
Change nickel gold, also known as chemical nickel and gold, the nickel that sinks is golden, is abbreviated as ENIG (Electroless Nickel/Immersion
Gold), it is had main steps that by chemically reacting in the surface replacement palladium of copper, then one layer of nickel phosphorus of chemical plating on the basis of palladium core
Alloy-layer, last layer gold is then plated on the surface of nickel by replacing reaction.It has that coating is flat, contact resistance is low, solderability
It is good, and have the advantages that certain wear-resisting, it is particularly suitable for the printed circuit board of routing (Wire Bonding) technique, turns into indispensable
Coating.
In displacement palladium, plating nickel-phosphorus alloy layer and these three gold-plated steps, circuit board is placed into by hanger clamping respectively
Chemical reaction is completed in different coating baths.The speed trend of these three chemical reactions is roughly the same, and starting velocity is very fast, and with
Metal surface is gradually covered by new material, and the speed of chemical reaction is gradually reduced.Particularly in heavy nickel groove, initial reaction stage master
If the catalytic action of palladium is being carried out, when palladium crystal is completely covered the deposition of nickel, if heavy nickel groove activity deficiency, chemistry are heavy
Product will stop, and then plating leakage problem just generates.The coarse golden face of white is presented in plating leakage position after turmeric, influences hardness and contact
Resistance.In the prior art typically can be by controlling tank liquor temperature, adjusting the concentration of chemical reagent, controlled using modes such as stabilizers
Chemical reaction process processed.Although can obtain preferable effect with upper type, control process is not complex, easy to operate,
And chemical reagent generally has pollution.
Utility model content
Technical problem to be solved in the utility model is：Improve the activity of circuit board in electroless nickel immersion gold treatment coating bath, avoid plating leakage
Produce.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is：A kind of circuit board in electroless nickel with magnetic field
Golden coating bath, including for accommodating the coating bath body of circuit board, and the magnet positioned at coating bath outer body；The magnet has N
Pole and S poles, the magnet have thickness, and the thickness direction is orthogonal parallel to the direction that S poles are pointed to from N poles, the thickness direction
In the circuit board.
Preferably, the thickness of the magnet is less than the length and width of the magnet, and the magnet is in flat.
Preferably, the length of the magnet, width are respectively greater than the length of circuit board, width.
Preferably, the field strength of the magnet can be adjusted.
Preferably, the magnet is two be arranged symmetrically along coating bath body.
Preferably, the circuit board is the polylith of horizontal Tile arrangement.
Preferably, the circuit board is the polylith being arranged side by side vertically.
The utility model can act on various metal coordination complexs, increase by introducing magnetic field to the plating bath in coating bath
Add the activity of metal coordination complex, so that the ligand of metal coordination complex is arranged and gos deep into the thickness of circuit board surface
It is interior, and circuit board surface can be more closely incorporated in, the coating with higher intensity is formed, is effectively prevented from the production of plating leakage
It is raw, and shorten the process time, improve production efficiency.
Brief description of the drawings
Fig. 1 is the utility model first embodiment schematic diagram；
Fig. 2 is the utility model second embodiment schematic diagram；
Shown in figure：10th, coating bath body；11st, circuit board；2nd, magnet.
Embodiment
For the ease of understanding above-mentioned purpose of the present utility model, feature and advantage, it is illustrated with reference to embodiment.Should
Understand, these embodiments are merely to illustrate the utility model rather than limitation the scope of the utility model.For these implementations
A variety of modifications of example will be apparent to those skilled in the art, generic principles defined herein,
It can be achieved in other embodiments in the case where not departing from spirit or scope of the present utility model.
First embodiment schematic diagram shown in Figure 1, the circuit board in electroless nickel immersion gold treatment coating bath have coating bath body 10 first.Institute
It is similar with coating bath body of the prior art to state coating bath body 10, can be displacement palladium, plating nickel-phosphorus alloy layer and it is gold-plated etc. no
Different according to technique with the coating bath used in processing step, the composition of plating bath, temperature etc. are different in coating bath.The coating bath
Body 10 can include the part such as hanger, support, be carried out for clamping circuit board 11 and circuit board 11 is maintained in plating bath
Chemical reaction.
Be provided with magnet 2 in the bottom of the coating bath body 10, the magnet 2 can by one or more permanent magnet,
Electromagnet or its combination are formed.
The magnet 2 has N poles and S poles, and the magnet 2 has thickness, and the thickness direction points to S poles parallel to from N poles
Direction, the thickness be less than magnet 2 length and width, the magnet 2 is in flat.Magnet 2 is only shown in Fig. 1
Length and thickness, and can be seen that length is much larger than thickness, it is to be understood that the width of magnet 2 is also greater than thickness.In a word,
The magnet 2 has flat shape.And magnet 2 is roughly parallel to circuit board 11 and arranged, the thickness direction of magnet 2 is substantially orthogonal
In circuit board 11.The length of magnet 2, width are more than the length of circuit board 11, width.
Design has advantages below above：Circuit board 11 is included by magnet 2, thus, magnetic induction line is in (the figure of circuit board 11
In line with the arrow) be substantially orthogonal in each opening position of circuit board 11 with circuit board 11, and each position of circuit board 11
The magnetic flux at place is roughly the same or relatively.
The magnetic of magnet 2 can act on various metal coordination complexs, such as：The ferromagnetism co-ordination complex such as iron, nickel,
The paramagnetism co-ordination complex such as tungsten, aluminium, tantalum, and the noble metal complexes such as palladium, silver, gold, increase above-mentioned metal coordination complex
Activity so that the ligand of metal coordination complex is arranged and goed deep into the thickness on the surface of circuit board 11.When magnetic induction line and electricity
Road plate 11 is orthogonal, promotes thickness direction of the ligand along circuit board 11 to move, and avoids offseting toward other directions.Circuit board 11
The magnetic flux of each opening position is approached so that the activity of ligand is uniformly distributed, and the depth for going deep into circuit board 11 is also uniformly distributed.
Design is all beneficial above.
The field strength of the magnet 2 can be adjusted.For example, by increasing field strength, ligand can be caused further highly to arrange
Cloth and further go deep into the thickness on the surface of circuit board 11.And for example, strong, feeble field is strong by being used alternatingly, and can cause ligand
The surface of circuit board 11 is more closely incorporated in, forms the coating with higher intensity.
Second embodiment schematic diagram shown in Figure 2.In the first embodiment, circuit board 11 is horizontally disposed, therefore,
Magnet 2 is also horizontally disposed；In a second embodiment, circuit board 11 is to arrange vertically, therefore magnet 2 and vertical arrangement, really
Protect the length of magnet 2, width is more than the length of circuit board, width.And in symmetrically placed two magnetic in the both sides of coating bath body 10
Body 2, compared to using only a single magnet, be more readily formed between the two magnets 2 be orthogonal to circuit board 11, it is uniform
Magnetic induction line.Therefore, uniform coating can also be obtained with greater number of circuit board 11 placed side by side in embodiment two.
Claims (7)
1. a kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field, including for accommodating the coating bath body of circuit board, it is characterised in that
Also include the magnet positioned at coating bath outer body；The magnet has N poles and S poles, and the magnet has thickness, the thickness direction
Parallel to the direction that S poles are pointed to from N poles, the thickness direction is orthogonal to the circuit board.
2. there is the circuit board in electroless nickel immersion gold treatment coating bath in magnetic field as claimed in claim 1, it is characterised in that：The thickness of the magnet is small
In the length and width of the magnet, the magnet is in flat.
3. there is the circuit board in electroless nickel immersion gold treatment coating bath in magnetic field as claimed in claim 1, it is characterised in that：The length of the magnet,
Width is respectively greater than the length of circuit board, width.
4. there is the circuit board in electroless nickel immersion gold treatment coating bath in magnetic field as claimed in claim 1, it is characterised in that：The field strength energy of the magnet
Enough regulations.
5. there is the circuit board in electroless nickel immersion gold treatment coating bath in magnetic field as claimed in claim 1, it is characterised in that：The magnet is along plating
Be arranged symmetrically two of groove body.
6. there is the circuit board in electroless nickel immersion gold treatment coating bath in magnetic field as claimed in claim 1, it is characterised in that：The circuit board is level
The polylith being arranged side by side.
7. there is the circuit board in electroless nickel immersion gold treatment coating bath in magnetic field as claimed in claim 1, it is characterised in that：The circuit board is vertical
The polylith being arranged side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720830043.1U CN207002844U (en) | 2017-07-10 | 2017-07-10 | A kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720830043.1U CN207002844U (en) | 2017-07-10 | 2017-07-10 | A kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207002844U true CN207002844U (en) | 2018-02-13 |
Family
ID=61453751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720830043.1U Expired - Fee Related CN207002844U (en) | 2017-07-10 | 2017-07-10 | A kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207002844U (en) |
-
2017
- 2017-07-10 CN CN201720830043.1U patent/CN207002844U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ghosh | Electroless copper deposition: A critical review | |
| KR20120066608A (en) | Plating catalyst and method | |
| CN102171820A (en) | Lead frame and manufacturing method thereof | |
| CN102347542B (en) | Linear joint-plug terminal and manufacturing method thereof | |
| CN102543855B (en) | Manufacture method of three-dimensional integrated circuit structure and material | |
| CN102808203A (en) | Gold-plating process using gold potassium citrate | |
| CN110468394A (en) | A kind of silver-based wiring board of chemical nickel plating porpezite and preparation method thereof | |
| CN102943290B (en) | Method for electroplating of nickel-cobalt alloy on electronic packaging casing | |
| CN207002844U (en) | A kind of circuit board in electroless nickel immersion gold treatment coating bath with magnetic field | |
| CN205249519U (en) | Coil panel and electromagnetic heating equipment | |
| KR101898470B1 (en) | Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes | |
| CN104451619A (en) | SMD LED packaging substrate electroplating structure and electroplating technology thereof | |
| CN102373497A (en) | Electroplating apparatus and electroplating method thereof | |
| CN207002846U (en) | A kind of circuit board in electroless nickel immersion gold treatment coating bath with electric field | |
| CN103726051A (en) | Plating technology for surface treatment of engineering plastic | |
| CN109295341A (en) | A kind of preparation method of magnetism coating copper bonding wire | |
| CN106637159A (en) | Electroless plating solution, preparation method and nonmetal electroless plating method | |
| CN109056038A (en) | Electroplanting device and its electro-plating method | |
| CN105862398B (en) | Polymer fiber based conductive composite material and preparation method thereof | |
| CN205040103U (en) | Heavy golden clothes of circuit board are put | |
| CN106804069B (en) | Coil disc, manufacturing method thereof and electromagnetic heating equipment | |
| CN107709262A (en) | The manufacture method of membrane glass plate | |
| CN201598342U (en) | Circuit board plating rack | |
| JP5025815B1 (en) | Hard gold plating solution | |
| CN116324032A (en) | Electroless nickel deposition on copper without palladium activation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180213 Termination date: 20200710 |