CN106804069B - Coil disc, manufacturing method thereof and electromagnetic heating equipment - Google Patents
Coil disc, manufacturing method thereof and electromagnetic heating equipment Download PDFInfo
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- CN106804069B CN106804069B CN201510828701.9A CN201510828701A CN106804069B CN 106804069 B CN106804069 B CN 106804069B CN 201510828701 A CN201510828701 A CN 201510828701A CN 106804069 B CN106804069 B CN 106804069B
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Abstract
The invention relates to the technical field of electromagnetic heating, in particular to a coil panel, a manufacturing method thereof and electromagnetic heating equipment. The coil panel comprises a carrier, wherein a wire groove extending according to a preset winding path is formed in the carrier, a precious metal layer formed through activation treatment is attached to the surface of the wire groove, and a conducting layer is attached to the precious metal layer. In addition, the manufacturing method of the coil panel completes the plating process after carrying out rough treatment, activation treatment and conductive treatment on the carrier, so that the coil panel is easier to manufacture, and the effect of convenient manufacture is realized; and its factor of safety is high, can be according to different demands, makes different coil panels, has simple structure and energy-conserving advantage of reducing consumption.
Description
Technical Field
The invention relates to the technical field of electromagnetic heating, in particular to a coil panel, a manufacturing method thereof and electromagnetic heating equipment.
Background
Along with the development of modern science and technology, the demand of energy is higher and higher, energy conservation is also emphasized by various countries and related organizations in the world, china also sets a series of policies for energy conservation and consumption reduction correspondingly, energy conservation and consumption reduction of living electric appliances are very much concerned, various heating coil panels are necessities of each family life, the heating mode is generally electromagnetic heating or fuel flame heating, if the heat utilization efficiency of the heating coil panels can be improved, the waste of energy can be reduced, the consumed electric energy and energy can be reduced, and therefore starting from the heating coil panels, energy conservation and consumption reduction can be realized, the economic benefits generated by the heating coil panels and the energy conservation can be very considerable.
At present, coils of small household appliances heated by IH (english name is index Heating, chinese name is Indirect Heating) are all manufactured by winding enameled wires. The manufacturing process of the winding is complex, and different coils are required to be wound according to specific use occasions, so that materials are wasted. The problems of wire jumping, scratching, short wire and poor manufacturing process are easy to occur in the using process of the heating coil disk for winding the enameled wire, the safety coefficient is low, and the form of the coil is single.
Disclosure of Invention
Technical problem to be solved
The invention aims to solve the technical problems that the existing small household appliance has a complex winding process, and is easy to have the problems of wire jumping, scratching, short wire, poor manufacturing process, low safety factor and single coil form in the using process.
(II) technical scheme
In order to solve the above technical problems, the present invention provides a coil panel, which includes a carrier, wherein a wire groove extending along a predetermined winding path is formed in the carrier, a noble metal layer formed by an activation process is attached to a surface of the wire groove, and a conductive layer is attached to the noble metal layer.
The conductive layer at least comprises a first conductive layer, and the first conductive layer is attached to the noble metal layer in an electroless plating mode.
The conductive layer further comprises a second conductive layer, and the second conductive layer is attached to the first conductive layer in an electroplating mode.
Wherein, an anti-oxidation layer is also attached on the conductive layer.
The wire groove is formed by carving the carrier through laser according to a preset wire winding path.
The wire grooves are formed in the carrier forming process at the same time, or the wire grooves are formed by carving the carrier after the carrier is formed, and the side walls on two sides of each wire groove are respectively expanded outwards from the groove bottom of each wire groove to the direction of the notch.
The cross section of the wire groove is in an inverted ladder shape, an inverted triangle shape or a semicircular arc shape.
The carrier is provided with two mounting surfaces opposite to each other in the thickness direction, and the wire grooves comprise a first wire groove arranged on one mounting surface according to a first preset winding path and a second wire groove arranged on the other mounting surface according to a second preset winding path.
The carrier is made of plastic, ceramic or metal coated with an insulating layer.
The invention also provides electromagnetic heating equipment which comprises the coil panel, wherein the coil panel is used for electromagnetic heating.
The invention also provides a manufacturing method of the coil disc, which comprises the following steps:
s1, forming a carrier;
s2, forming a wire slot, wherein the wire slot extending according to a preset winding path is formed on the carrier;
s3, performing activation treatment, namely immersing the carrier into an activation solution, wherein the activation solution comprises a noble metal compound, and noble metal ions in the noble metal compound are reduced into noble metal particles and adsorbed on the inner surface of the wire slot to form a noble metal layer;
and S4, attaching a conductive layer on the noble metal layer.
And the step of forming the wire groove in the step S2 is to perform laser etching treatment on the carrier by using laser according to a preset wire winding path so as to form the wire groove with the inner surface being a rough surface. Wherein, the wire casing shaping in step S2 includes: carving the carrier by using a cutter according to a preset winding path; or the step S2 of forming the wire grooves and the step S1 of forming the carrier are the same, and the step S1 of forming the carrier includes: and putting the carrier material into a mould, wherein the inner surface of the mould is provided with a convex ring extending according to a preset winding path, so that a wire groove extending according to the preset winding path is imprinted on the surface of the carrier while the carrier is molded.
The step S4 of forming the first conductive layer and the second conductive layer on the conductive layer by a metallization process includes the steps of:
s42, soaking the carrier in chemical plating solution, wherein conductive metal ions in the chemical plating solution are subjected to oxidation-reduction reaction under the catalytic action of a noble metal layer to generate conductive metal particles which are attached to the wire grooves to form a first conductive layer;
and S43, immersing the carrier subjected to the chemical plating treatment into electroplating solution, wherein conductive metal ions in the electroplating solution are subjected to oxidation-reduction reaction under the action of current to generate conductive metal particles to be attached to the first conductive layer to form the second conductive layer.
Wherein, after the step S4 of attaching the conductive layer on the noble metal layer, the method further includes: and attaching an anti-oxidation layer on the conductive layer in an electroplating mode.
(III) advantageous effects
The technical scheme of the invention has the following advantages:
the invention provides a coil panel, a manufacturing method thereof and electromagnetic heating equipment, wherein a coil is directly wound on the surface of a carrier in a mode of attaching a conductive metal layer, and compared with the prior art, the coil panel has the following technical effects:
1. the winding process is simple, and structures such as a limiting groove for clamping the coil and a positioning rib do not need to be arranged on the carrier, so that the structure of the carrier is simpler.
2. The coil has flexible and various forms, can be wound into coils with various shapes according to the requirements of users, and has the characteristic of flexible production.
3. The production efficiency is high, and the manufacturing efficiency of the coil panel is much higher than that of the conventional mode of producing the coil panel by winding the copper wire, so that the coil panel is beneficial to mass production.
4. The material requirement of the carrier is reduced, the coil panel is firstly attached with a noble metal layer on the surface of the carrier in an activation treatment mode, and then the conductive layer is attached on the noble metal layer, so that the material requirement on the carrier is greatly reduced.
5. The coil panel is convenient to use and high in safety factor, compared with a traditional enameled wire winding mode, the coil panel can avoid the problems of poor manufacturing processes of jumper wires, scratches and short wires in the using process, and has the advantages of high safety factor, energy conservation and consumption reduction.
Drawings
FIG. 1 is a top view of a coil disk according to an embodiment of the present invention;
FIG. 2 is a perspective view of a coil disk in accordance with an embodiment of the present invention;
FIG. 3 is a schematic structural view of a double-sided slot-shaped coil disk according to an embodiment of the present invention;
FIG. 4 isbase:Sub>A sectional view A-A of FIG. 3;
FIG. 5 is a schematic structural view of a single-sided slot-shaped coil disk according to a second embodiment of the present invention;
FIG. 6 is a cross-sectional view B-B of FIG. 5;
fig. 7 is a schematic diagram of a positional relationship among the secondary oxidation prevention layer, the conductive layer and the noble metal layer according to the embodiment of the invention.
In the figure: 1: a carrier; 2: a conductive layer; 3: a wire slot; 4: a stopper; 5: an oxidation-resistant layer; 6: a noble metal layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example one
As shown in fig. 1, fig. 2 and fig. 7, the present embodiment provides a coil panel, which includes a carrier 1, and a wire slot 3 extending along a predetermined winding path is provided on the carrier 1, where the predetermined winding path is a winding manner preset, and the form of the predetermined winding path can be flexibly set according to actual needs, and is not limited herein, for example: the predetermined winding path may take the form of a spiral, also known as an archimedean spiral. A noble metal layer 6 formed by activation treatment is attached to the surface of the wire groove 3, and the conductive layer 2 is attached to the noble metal layer 6.
Therefore, the coil disc provided by the embodiment directly winds the coil on the surface of the carrier 1 in a mode of attaching the conductive metal layer, and structures such as a limiting groove for clamping the coil and a positioning rib do not need to be arranged on the carrier 1, so that the structure of the carrier 1 is simpler; and can also be used for winding coils with various shapes according to the requirements of users, and has the characteristic of flexible production. In addition, the manufacturing efficiency of the coil panel is much higher than that of the conventional mode for producing the coil panel by winding a copper wire. More importantly, in the embodiment, the precious metal layer 6 is attached to the surface of the wire groove 3 by means of activation treatment, and then the conductive layer 2 is attached to the precious metal layer 6, so that the requirement on the material of the carrier 1 is greatly reduced, for example, common plastics, ceramics, or even metal covered with an insulating layer can be adopted.
Example two
The same technical contents of the second embodiment and the first embodiment are not described repeatedly, the contents disclosed in the first embodiment also belong to the contents disclosed in the second embodiment, and the second embodiment is obtained by further refining on the basis of the first embodiment.
First, the material of the carrier 1 in this embodiment may be plastic. For example, PC plastic, i.e. the carrier 1, is obtained by injection molding of PC plastic. The molding of PC plastic has the characteristics of low shrinkage, high strength, fatigue resistance, stable size and little creep deformation, and has stable electric insulation property in a wider temperature and humidity range. In addition, the coil disk made of PC plastic is thinner and lighter than the conventional coil disk. Of course, in this embodiment, other plastic with good insulation property, such as polyphenylene oxide or engineering plastic, may also be used for the carrier 1 according to the requirement. Besides plastics, the material of the carrier 1 in this embodiment can be expanded to ceramic or metal coated with an insulating layer, so as to ensure stable electrical insulation.
Next, in this embodiment, the noble metal layer 6 is attached to the inner surface of the wire groove 3 by performing an activation process. The noble metal mainly refers to 8 metal elements such as gold, silver, and platinum group metals (ruthenium, rhodium, palladium, osmium, iridium, platinum).
The specific mode of the activation treatment is as follows: the carrier 1 of the coil disc is immersed in an activation solution comprising a noble metal compound, a concentrated acid, a reducing agent and a complexing agent. The noble metal compound can be palladium chloride or silver chloride, the concentrated acid can be concentrated hydrochloric acid or concentrated sulfuric acid, the reducing agent can be tin dichloride, and the complexing agent can be sodium citrate, sodium cyanide, sodium tartrate or sodium pyrophosphate. Wherein the concentrated acid is used to dissolve the noble metal compound; the reducing agent is used for reducing the noble metal compound into a noble metal layer 6 which is attached to the inner surface of the wire slot 3; the complexing agent keeps the noble metal compound and the reducing agent in a suspension state, so that the noble metal compound and the reducing agent do not generate oxidation-reduction reaction in a solution state, and only generate oxidation-reduction reaction when contacting with the inner surface of the wire casing 3.
Correspondingly, the embodiment also provides a specific method for configuring the activation solution, which comprises the following steps: pdCl 2 Dissolving the solution in mixed solution of concentrated HCl and distilled water, and adding SnCl into the mixed solution 2 Forming a first mixed solution; dissolving sodium citrate, naCN, sodium tartrate or sodium pyrophosphate in distilled water to form a second mixed solution; and stirring and mixing the first mixed solution and the second mixed solution to form the activation solution.
In this embodiment, the wire casing 3 is formed by engraving the carrier 1 according to a predetermined winding path by laser, so that a rough surface can be formed on the inner surface of the wire casing while the wire casing is formed, and the noble metal layer 6 can be uniformly and firmly attached to the inner surface of the wire casing 3.
It should be noted that in the present embodiment, the process of performing the laser engraving process (i.e. the roughening process) on the wire chase 3 is also the process of forming the wire chase 3. That is, before the line groove 3 is roughened, the line groove 3 is virtually present on the carrier 1, and the line groove 3 actually present cannot be seen on the carrier 1. The cross section of the wire groove 3 formed on the surface of the carrier 1 through laser engraving is rectangular, and the width of the wire groove 3 is far larger than the depth of the wire groove. Generally, such wire grooves 3 have a depth of typically several micrometers, a width in the range of 0.2mm to 10mm, and a spacing between adjacent wire grooves 3 in the range of 0.2mm to 10mm.
Finally, the structure of the conductive layer 2 in this embodiment can be further optimized. For example: the conductive layer 2 comprises at least a first conductive layer which is attached to the noble metal layer 6 by means of electroless plating. Of course, the conductive layer 2 further includes a second conductive layer, and the second conductive layer is attached to the first conductive layer by electroplating.
Wherein, the chemical plating mode is as follows: the carrier 1 is soaked in the chemical plating solution, and under the catalysis of the noble metal layer 6 attached to the wire groove 3, conductive metal ions in the chemical plating solution are attached to the inner surface of the wire groove 3 through oxidation-reduction reaction to form a first conductive layer. The electroless plating mode is easier to firmly attach the first conductive layer on the extremely thin noble metal layer 6, and makes it easier to attach the second conductive layer on the first conductive layer by electroplating, but the thickness of the first conductive layer capable of being attached by the electroless plating is extremely thin, and the coil panel can only adapt to the condition of low-power heating. When the coil panel needs to realize high-power heating, the second conductive layer needs to be attached to the first conductive layer in an electroplating manner, because the thickness of the second conductive layer attached in the electroplating manner is relatively large and the attachment speed is high. The second conductive layer is electroplated by immersing the carrier subjected to the chemical plating treatment in an electroplating solution, and conducting metal ions in the electroplating solution undergo an oxidation-reduction reaction under the action of current to generate conducting metal particles which are attached to the first conductive layer to form the second conductive layer.
The material used for the conductive layer 2 in this embodiment is copper because copper has good conductivity. Of course, other electrically conductive materials such as silver or aluminum may be used for the conductive layer 2.
As shown in fig. 7, when the conductive layer 2 is made of a conductive material with relatively poor oxidation resistance, such as copper or silver, an oxidation preventing layer 5 needs to be attached to the outside of the conductive layer 2, that is, the oxidation preventing layer 5 is disposed outside the second conductive layer, so as to prevent oxidation of the conductive layer 2 from affecting the conductive performance of the conductive layer 2. When the conductive layer 2 is made of a material having a relatively good oxidation resistance, such as aluminum, the oxidation-preventing layer 5 may not be provided. The material of the oxidation preventing layer 5 is nickel, and may be one or a mixture of any of nickel, silver, aluminum and gold.
Specifically, the thickness of the first conductive layer is 5um-10um, the thickness of the second conductive layer is 40um-70um, and the thickness of the oxidation-resistant layer 5 is 5um-10um. Of course, the thicknesses of the first conductive layer, the second conductive layer and the oxidation preventing layer 5 can be adjusted correspondingly according to actual requirements.
Referring to fig. 3 to 6, in the present embodiment, the carrier 1 has a first mounting surface and a second mounting surface opposite to each other in a thickness direction, and the wire groove 3 includes a first wire groove 3 disposed on the first mounting surface and a second wire groove 3 disposed on the second mounting surface. The coil panel can be arranged into a single-side wire slot 3 shape or a double-side wire slot 3 shape, namely, the wire slots 3 can be arranged on the single side or the double sides of the carrier 1, and the conductive layers 2 are arranged in the wire slots 3. By adopting the scheme, the two sides of the coil panel are both provided with the coils wound by the conducting layers 2, so that the heating power of the coil panel can be improved by nearly one time under the condition that the volume of the coil panel carrier 1 is not changed.
EXAMPLE III
Similarly, the technical contents of the third embodiment that are the same as those of the first embodiment and the second embodiment are not repeated, and the third embodiment differs from the second embodiment in the forming manner of the slot 3, which can be seen by comparing the third embodiment with the second embodiment as follows:
the line groove 3 of the second embodiment is formed while roughening treatment (i.e., laser engraving treatment) is performed on the carrier 1; the wire groove 3 in this embodiment is formed at the same time as the carrier 1 is molded, or is formed by a cutting tool engraving process (such as CNC processing) after the carrier 1 is molded, and then the wire groove 3 is roughened. Specifically, when the carrier is made of plastic, a convex ring extending according to the predetermined winding path may be provided on the inner surface of the mold, so that the wire grooves extending according to the predetermined winding path may be formed on the surface of the carrier while the carrier is injection molded. The depth of the wire grooves 3 in the second embodiment is generally several micrometers; whereas the depth of the raceway 3 in this embodiment is typically a few millimeters. Taking the cross section of the wire chase 3 as an example, under the condition that the wire chase 3 has the same opening width, the attachment surface of the conductive layer 2 in the second embodiment is only the bottom wall of the wire chase 3; and the attachment surface of the conductive layer 2 of the present embodiment adds two side walls of the wire groove 3 in addition to the bottom wall of the wire groove 3. That is, the cross-sectional width of the conductive layer 2 in this embodiment is larger than the width of the conductive layer 2 in the second embodiment, and the cross-sectional area of the conductive layer 2 in this embodiment is larger than the cross-sectional area of the conductive layer 2 in the second embodiment in the case where the thicknesses of the conductive layers 2 are the same. From the resistance formula R = ρ.l/S, it can be seen that increasing the cross-sectional area reduces the resistance without changing the number of turns of the resistivity wire. According to the power formula P = U2/R, the resistance is reduced and the heating power of the coil disk can be increased without changing the voltage.
The inner surface of the wire groove 3 formed by adopting the two modes is relatively smooth, and if the wire groove 3 is directly subjected to activation treatment, the noble metal layer 6 is difficult to be uniformly attached to the inner surface of the wire groove 3. A preferred embodiment of this embodiment is to roughen the raceway 3 prior to the activation process to provide a roughened surface on the inner surface of the raceway so that the noble metal layer 6 is uniformly and securely attached to the inner surface of the raceway 3. The roughening treatment provided by this embodiment is to perform engraving treatment on the line groove by using laser according to the extending direction of the line groove. Chemical roughening may of course also be used. In order to facilitate the roughening treatment of the wire slot only by one-time laser engraving, the cross section of the wire slot 3 in the embodiment is in an expansion shape gradually widening from the slot bottom to the slot opening, namely, from the slot bottom of the wire slot to the slot opening, the side walls on two sides of the wire slot are respectively expanded outwards, and the wire slot 3 in the shape can ensure that the laser can be engraved on the bottom wall and two side walls of the wire slot 3 at the same time.
Preferably, the cross section of the wire groove 3 is preferably in an inverted trapezoid shape, an inverted triangle shape or a semicircular arc shape. When the laser engraving roughening treatment is carried out on the wire groove 3 in the shapes, the laser can simultaneously irradiate the bottom wall and the two side walls of the wire groove 3, namely, the roughening treatment of the wire groove 3 can be completed through one-time laser irradiation. For the wire groove 3 with the rectangular cross section, laser irradiates the wire groove 3 for one time and can only simultaneously process one side wall and one bottom wall of the wire groove 3 at most, and the bottom wall and the two side walls of the wire groove 3 are difficult to be simultaneously processed, namely, the wire groove 3 with the rectangular cross section can be roughened only by laser irradiation for at least two times.
Referring to fig. 4 and 6, the cross section of the wire casing 3 of this embodiment is in the shape of an inverted isosceles trapezoid, and the included angle between the side wall of the wire casing 3 and the normal of the bottom wall is 15-75 °. The thickness h of the carrier 1 is 2-8mm, the width range L1 of the bottom wall of the wire groove 3 is 0.5-1.5 mm, and the depth range of the wire groove 3 is 2-8 mm. An isolation rib is arranged between every two adjacent wire grooves 3, the cross section of the isolation rib is in an isosceles trapezoid shape, and the width range L2 of the top of the isolation rib is 0.2 mm-1.0 mm. The setting of the parameters can ensure that the coil in the wire slot has good conductivity and the adjacent coils of the coil have good insulativity.
It can be seen that, in this embodiment, the carrier 1 is formed by injection molding of plastic particles, and the wire groove 3 is formed during the molding of the carrier 1, that is, the wire groove 3 and the carrier 1 are integrally injection molded. The surface of the wire groove 3 is a rough surface for adsorbing the noble metal layer 6, and the carrier 1 is subjected to roughening treatment before the surface of the wire groove 3 is subjected to activation treatment. When the roughening treatment is laser etching treatment, the wire groove 3 is formed in the process of performing the laser etching treatment on the carrier 1. Specifically, the trunking 3 is laser-engraved on the resultant carrier 1 by using a laser machine to obtain a rough surface for adsorbing the noble metal layer 6. Can be according to different demands, radium-shine different wire casing 3's number of turns, then carry out activation process to carrier 1, form noble metal layer 6 on the internal surface of wire casing 3, utilize the rough surface to form strong adsorption affinity, make it more firm with noble metal layer 6 contact.
Example four
Fourth embodiment, on the basis of the first, second and third embodiments, there is provided a method for manufacturing the coil disk, which includes the following steps:
s1, forming a carrier 1; specifically, when the carrier 1 is made of plastic, the molten plastic is injected into a mold to form the carrier; when the carrier 1 is made of ceramic, firstly extruding the petuntse into a blank through a die, and then sintering the blank into the carrier; when the carrier 1 is made of metal coated with an insulating material, the metal material is firstly punched and formed, and then the insulating layer is formed on the metal in a spraying or injection molding mode.
S2, forming a wire slot, wherein the wire slot extending according to a preset winding path is formed on the carrier; further, the forming of the wire groove in the step S2 is to perform laser etching treatment on the carrier according to a predetermined winding path by using laser to form the wire groove with a rough inner surface. That is, the wire groove 3 is roughened while being formed
Besides, the wire groove 3 can be formed by engraving the carrier 1 according to a predetermined winding path by using a cutter after the carrier 1 is molded, for example, performing CNC machining on the carrier 1, where the CNC machining trajectory is the predetermined winding path. Or the wire grooves 3 can also be formed at the same time as the carrier 1 is shaped. The process of forming the carrier 1 comprises: and putting the carrier material into a mould, wherein the inner surface of the mould is provided with a convex ring extending according to a preset winding path, so that a wire groove extending according to the preset winding path is imprinted on the surface of the carrier while the carrier is molded. The wire grooves formed by adopting the two modes can increase the area of the wire grooves attached with the conductive layer under the condition that the surface area of the carrier is unchanged relative to the wire grooves formed by laser etching, so that the resistance of the coil is reduced.
S3, performing activation treatment, namely immersing the carrier 1 into an activation solution, wherein the activation solution comprises a noble metal compound, and noble metal ions in the noble metal compound are reduced into noble metal particles and adsorbed on the inner surface of the wire slot 3 to form a noble metal layer 6;
the activating solution also comprises concentrated acid, a reducing agent and a complexing agent. Correspondingly, the preparation method of the activating solution in the step S3 comprises the following steps: s31, dissolving a noble metal compound solution into a concentrated acid solution, and adding a reducing agent into the concentrated acid solution to form a first mixed solution; and S32, adding a complexing agent into the first mixed solution. Wherein the noble metal compound is palladium chloride or silver chloride, the concentrated acid is concentrated hydrochloric acid or concentrated sulfuric acid, the reducing agent is tin dichloride, and the complexing agent is sodium citrate, sodium cyanide, sodium tartrate or sodium pyrophosphate.
This step S3 can be further illustrated by the following preferred embodiments: 0.3g of PdCl 2 The solution was dissolved in a mixed solution of 10ml of concentrated HCl and 10ml of distilled water, and 12g of SnCl was added thereto 2 Forming a first mixed solution; dissolving 250g of sodium citrate, naCN, sodium tartrate or sodium pyrophosphate in 1.5L of distilled water to form a second mixed solution; and stirring and mixing the first mixed solution and the second mixed solution. And continuously stirring and mixing the first mixed solution and the second mixed solution to obtain the activated colloid. Wherein the sodium citrate mainly plays a role of a stabilizer and is complexed with Sn 2+ Prevention of Sn 2+ Is oxidized to Sn 4+ 。
And S4, adhering the conductive layer 2 on the noble metal layer 6.
The step S4 specifically includes the following steps (refer to the following table):
s41, cleaning the activated carrier 1; specifically, the washing may be performed by high-pressure water at 20 to 30 ℃, preferably 25 ℃, although the temperature range is not limited.
S42, soaking the carrier 1 in chemical plating solution, and performing oxidation-reduction reaction on conductive metal ions in the chemical plating solution under the catalysis of a noble metal layer to generate conductive metal particles to be attached to the wire slot 3 so as to form a first conductive layer; further, when the temperature in step S42 is selected from 40 ℃ to 60 ℃, it is preferably 52 ℃, although the temperature range is not limited. Furthermore, the electroless plating time is controlled to 60 to 90 minutes to achieve sufficient reaction.
S43, immersing the carrier subjected to the chemical plating treatment into a plating solution, wherein conductive metal ions in the plating solution are subjected to oxidation-reduction reaction under the action of current to generate conductive metal particles to be attached to the first conductive layer to form a second conductive layer, preferably, the implementation temperature in the step S43 can be selected from 20-60 ℃, the temperature range is not limited to the range, and different reaction time is controlled according to different plating materials, and the time is controlled to be 60-90 minutes when copper is plated; when electroplating nickel, the time is controlled to be 10-20 minutes.
And S44, drying the carrier 1 plated with the second conductive layer, specifically, drying the carrier 1 at the temperature of 100 ℃ through a drying cabinet.
After step S43 is completed, the oxidation preventing layer 5 is formed on the second conductive layer by electroplating at a temperature of 55 ℃ to 60 ℃, and the carrier 1 after the oxidation preventing layer 5 is plated is dried.
Conductive layer metallization art table
As can be seen from the above analysis, the method for manufacturing the coil disk according to the present embodiment can reduce the material requirement of the carrier 1. Compared with the prior selective plating process technology based on Laser (Laser Direct Structuring in English name, the chinese name is Laser Direct Structuring technology), the advantages are obvious. Firstly, the noble metal layer 6 is attached to the surface of the carrier 1 in an activation treatment mode, and then the conducting layer 2 is attached to the noble metal layer 6, so that the requirement on the material of the carrier 1 is greatly reduced, the method is applicable to common plastics, ceramics and insulating layer-coated metal materials with various types and colors, and the cost is lower.
EXAMPLE five
The present embodiment also provides an electromagnetic heating apparatus, which includes the coil disk in the first to third embodiments. Namely, the coil disk includes: the coil panel comprises a carrier 1, wherein a wire groove 3 extending according to a preset winding path is arranged on the carrier 1, a noble metal layer 6 formed by activation treatment is attached to the inner surface of the wire groove 3, and a conductive layer 2 is attached to the noble metal layer 6. The material and the forming method of the coil panel carrier 1, the forming method of the wire slot 3, the composition of the conductive layer 2, the manner of attaching the conductive layer 2 to the inner wall of the wire slot 3, and the like can all refer to the description of the coil panel, and are not described herein again. In addition, improvements can be made to the coil disks, for example: and the two ends of the conductive layer 2 of the coil disc are also provided with stop blocks 4, the stop blocks 4 can be used as wiring ends, and the material of the stop blocks can be copper or other conductive materials.
The electromagnetic heating equipment comprises an electromagnetic oven, a frying and copying machine, a soybean milk machine, an electric kettle, a coffee machine, an electric stewing cup, an electric cooker or an electric pressure cooker. For the electromagnetic oven, the coil panel provided in the first, second or third embodiment is assembled with the power board, the main board, the lamp panel (control display panel), the temperature controller, the heat sensitive bracket, the fan, the power line, the oven panel (porcelain panel, black crystal panel), the plastic upper and lower covers, etc. to form a complete electromagnetic oven.
It is worth mentioning that the shape of the coil disc carrier 1 may vary differently depending on the product of the specific application. For example, for induction cookers and electric kettles, the coil panel carrier 1 is generally disk-shaped. For electric cookers and electric pressure cookers, the coil panel carrier 1 is shaped like a hollow hemisphere or a bowl. And if the coil panel carrier 1 is to directly heat the side wall of the inner pot of the electric cooker or the electric pressure cooker, the coil panel carrier 1 may also be cylindrical, that is, hollow cylindrical. I.e. the discs in the coil disc do not constitute any limitation to the shape of the coil disc. The rest of the embodiments are the same as those of the first to fourth embodiments, and are not described herein again.
In summary, the present invention provides a coil disc, a manufacturing method thereof, and an electromagnetic heating apparatus, in which a coil is directly wound on a surface of a carrier by attaching a conductive metal layer, and compared with the prior art, the coil disc has the following technical effects:
1. the winding process is simple, and structures such as a limiting groove for clamping the coil and a positioning rib do not need to be arranged on the carrier, so that the structure of the carrier is simpler.
2. The coil has flexible and various forms, can be used for winding coils in various shapes according to the requirements of users, and has the characteristic of flexible production.
3. The production efficiency is high, and the manufacturing efficiency of the coil panel is much higher than that of the conventional mode of producing the coil panel by winding the copper wire, so that the coil panel is beneficial to mass production.
4. The material requirement of the carrier is reduced, the coil panel is firstly attached with a noble metal layer on the surface of the carrier in an activation treatment mode, and then the conductive layer is attached on the noble metal layer, so that the material requirement on the carrier is greatly reduced.
5. The coil panel is convenient to use and high in safety factor, compared with a traditional enameled wire winding mode, the coil panel can avoid the problems of poor manufacturing processes of jumper wires, scratches and short wires in the using process, and has the advantages of high safety factor, energy conservation and consumption reduction.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (15)
1. A coil panel, the coil panel is used for electromagnetic heating, its characterized in that: the wire winding device comprises a carrier, wherein a wire groove extending according to a preset wire winding path is formed in the carrier, a precious metal layer formed through activation treatment is attached to the surface of the wire groove, and a conductive layer is attached to the precious metal layer;
the inner surface of the wire slot is a rough surface, and the rough surface is formed by roughening the inner surface of the wire slot;
the carrier has two mounting surfaces opposite to each other in the thickness direction, and the wire slots include a first wire slot arranged on one of the mounting surfaces according to a first predetermined winding path and a second wire slot arranged on the other mounting surface according to a second predetermined winding path.
2. Coil disk according to claim 1, characterized in that: the conductive layer at least comprises a first conductive layer, and the first conductive layer is attached to the noble metal layer in an electroless plating mode.
3. Coil disk according to claim 2, characterized in that: the conducting layer also comprises a second conducting layer, and the second conducting layer is attached to the first conducting layer in an electroplating mode.
4. Coil disk according to claim 1, characterized in that: an anti-oxidation layer is also attached to the conductive layer.
5. Coil disk according to any of claims 1 to 4, characterized in that: the wire groove is formed by carving the carrier through laser according to a preset wire winding path.
6. Coil disk according to any of claims 1 to 4, characterized in that: the wire casing is in the carrier forming process forms simultaneously or the wire casing is formed through the cutter sculpture after the carrier shaping, certainly the tank bottom of wire casing is to the direction of notch, the lateral wall of wire casing both sides is outwards expanded respectively.
7. Coil disk according to claim 6, characterized in that: the cross section of the wire groove is in an inverted trapezoid shape, an inverted triangle shape or a semicircular arc shape.
8. Coil disk according to claim 1, characterized in that: the carrier is made of plastics, ceramics or metal coated with an insulating layer.
9. An electromagnetic heating apparatus characterized by: comprising a coil disc according to any of claims 1-8.
10. A manufacturing method of a coil panel is characterized by comprising the following steps:
s1, forming a carrier; wherein the carrier has two mounting surfaces opposite in a thickness direction;
s2, forming a wire slot, wherein the wire slot extending according to a preset winding path is formed on the carrier; the inner surface of the wire groove is a rough surface, and the rough surface is formed by roughening the inner surface of the wire groove; the wire grooves comprise a first wire groove arranged on one of the installation surfaces according to a first preset winding path and a second wire groove arranged on the other installation surface according to a second preset winding path; s3, performing activation treatment, namely immersing the carrier into an activation solution, wherein the activation solution comprises a noble metal compound, and noble metal ions in the noble metal compound are reduced into noble metal particles and adsorbed on the inner surface of the wire slot to form a noble metal layer;
and S4, attaching a conductive layer on the noble metal layer.
11. The method of manufacturing a coil disk according to claim 10, wherein: and step S2, forming the wire groove by laser engraving the carrier according to a preset wire winding path to form the wire groove with the inner surface being a rough surface.
12. The method of manufacturing a coil disk according to claim 10, wherein: the wire slot forming in the step S2 comprises the following steps: carving the molded carrier by using a cutter according to a preset winding path;
or the step S2 of forming the wire grooves and the step S1 of forming the carrier are the same, and the step S1 of forming the carrier includes: and putting the carrier material into a mould, wherein the inner surface of the mould is provided with a convex ring extending according to a preset winding path, so that a wire groove extending according to the preset winding path is imprinted on the surface of the carrier while the carrier is molded.
13. The method of manufacturing a coil disk according to claim 12, wherein: roughening treatment is further included between the wire groove forming in the step S2 and the activating treatment in the step S3:
the roughening treatment is laser etching treatment of the wire groove extending according to a preset wire winding path.
14. The method of manufacturing a coil disk according to claim 10, wherein: the attaching of the conductive layer on the noble metal layer in step S4 includes:
s42, soaking the carrier in chemical plating solution, wherein conductive metal ions in the chemical plating solution are subjected to oxidation-reduction reaction under the catalytic action of a noble metal layer to generate conductive metal particles which are attached to the wire grooves to form a first conductive layer;
and S43, immersing the carrier subjected to the chemical plating treatment into electroplating solution, wherein conductive metal ions in the electroplating solution are subjected to oxidation-reduction reaction under the action of current to generate conductive metal particles which are attached to the first conductive layer to form a second conductive layer.
15. The method of manufacturing a coil disk according to claim 10, wherein: step S4 further includes, after attaching a conductive layer on the noble metal layer: and attaching an anti-oxidation layer on the conductive layer in an electroplating mode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510828701.9A CN106804069B (en) | 2015-11-25 | 2015-11-25 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
| PCT/CN2015/096054 WO2017088197A1 (en) | 2015-11-25 | 2015-11-30 | Coil disc and manufacturing method therefor, and electromagnetic heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510828701.9A CN106804069B (en) | 2015-11-25 | 2015-11-25 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN106804069A CN106804069A (en) | 2017-06-06 |
| CN106804069B true CN106804069B (en) | 2023-04-18 |
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| CN201510828701.9A Active CN106804069B (en) | 2015-11-25 | 2015-11-25 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106900098B (en) * | 2015-12-21 | 2020-06-23 | 佛山市顺德区美的电热电器制造有限公司 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
| CN109309977B (en) * | 2017-07-28 | 2021-10-26 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel for electromagnetic cooking appliance, manufacturing method of coil panel and electromagnetic cooking appliance |
| CN109309978B (en) * | 2017-07-28 | 2021-05-25 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel, manufacturing method thereof and electromagnetic cooking appliance with coil panel |
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| CN102906306A (en) * | 2010-03-19 | 2013-01-30 | 恩索恩公司 | Method for direct metallization of non-conductive substrates |
| TW201332405A (en) * | 2012-01-19 | 2013-08-01 | Kuang Hong Prec Co Ltd | Circuit substrate structure and method of manufacturing the same |
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| CN205249519U (en) * | 2015-11-25 | 2016-05-18 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and electromagnetic heating equipment |
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| CN102906306A (en) * | 2010-03-19 | 2013-01-30 | 恩索恩公司 | Method for direct metallization of non-conductive substrates |
| TW201332405A (en) * | 2012-01-19 | 2013-08-01 | Kuang Hong Prec Co Ltd | Circuit substrate structure and method of manufacturing the same |
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| CN106804069A (en) | 2017-06-06 |
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