CN109309978B

CN109309978B - Coil panel, manufacturing method thereof and electromagnetic cooking appliance with coil panel

Info

Publication number: CN109309978B
Application number: CN201710633585.4A
Authority: CN
Inventors: 龚弦; 何柏锋; 黄维; 曹达华; 杨玲
Original assignee: Midea Group Co Ltd; Foshan Shunde Midea Electrical Heating Appliances Manufacturing Co Ltd
Current assignee: Midea Group Co Ltd; Foshan Shunde Midea Electrical Heating Appliances Manufacturing Co Ltd
Priority date: 2017-07-28
Filing date: 2017-07-28
Publication date: 2021-05-25
Anticipated expiration: 2037-07-28
Also published as: CN109309978A

Abstract

The invention discloses a coil panel, a manufacturing method thereof and an electromagnetic cooking appliance with the coil panel, wherein the coil panel comprises: the coil disc support comprises a coil disc support, wherein at least one part of the outer surface of the coil disc support is a rough surface, and an activation layer is formed on the rough surface; the coil comprises a chemical plating layer and an electroplated layer in the thickness direction, the chemical plating layer is arranged on the activation layer, and the electroplated layer is arranged on the chemical plating layer. The coil panel provided by the embodiment of the invention has low cost, and the coil is not easy to delaminate at high temperature.

Description

Coil panel, manufacturing method thereof and electromagnetic cooking appliance with coil panel

Technical Field

The invention relates to the field of electric appliance manufacturing, in particular to a coil panel and a coil panel manufacturing method for manufacturing the coil panel, and further relates to an electromagnetic cooking appliance with the coil panel.

Background

In the related art, a coil panel, such as a coil panel for an electric cooker, is manufactured by adding metal elements to plastic, activating the area of the plastic to be plated by using a laser forming technique, performing chemical plating to plate a thin copper layer on the activated area of the plastic surface, and thickening the plated layer by using an electroplating method.

The coil plate needs to adopt special magnetic conductive plastic containing metal ions due to chemical copper plating, has high material cost, generally has low temperature resistance, and is easy to delaminate after being heated at high temperature, so that an improvement space exists.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a coil panel which is low in cost and not easy to delaminate.

The invention also provides an electromagnetic cooking appliance with the coil panel.

The invention also provides a coil panel manufacturing method for manufacturing the coil panel.

A coil disk according to an embodiment of a first aspect of the present invention includes: the coil disc support comprises a coil disc support, wherein at least one part of the outer surface of the coil disc support is a rough surface, and an activation layer is formed on the rough surface; the coil comprises a chemical plating layer and an electroplated layer in the thickness direction, the chemical plating layer is arranged on the activation layer, and the electroplated layer is arranged on the chemical plating layer.

According to the coil panel provided by the embodiment of the invention, at least one part of the outer surface of the coil panel support is a rough surface, so that the coil and the coil panel support mutually permeate during chemical plating and electroplating, the bonding force between the coil and the coil panel support is improved, the material requirement on the coil panel support is greatly reduced, the high-temperature-resistant coil panel support can be selected, the temperature-resistant requirement of the coil panel is met, and the coil is prevented from delaminating during high-temperature heating.

Optionally, the at least a portion of the outer surface of the coil disk carrier is provided with a plurality of dimples to form the roughened surface.

Optionally, at least a portion of the dimples are configured as crater-like dimples.

Optionally, the thickness of the chemical plating layer is D1, and D1 satisfies: d1 is more than or equal to 1 mu m and less than or equal to 2 mu m.

Optionally, the coil has a thickness D2, and D2 satisfies: d2 is more than or equal to 200 mu m and less than or equal to 500 mu m.

Optionally, the coil disc support is a non-metallic support as a whole.

Optionally, the coil panel support is integrally made of a PBT material or a PPS material.

Optionally, the coil disc holder is injection molded.

The electromagnetic cooking appliance according to the second aspect of the invention comprises the coil panel of the first aspect, so that the electromagnetic cooking appliance has long service life and low cost.

A coil disk manufacturing method according to an embodiment of a third aspect of the invention for manufacturing the coil disk of the first aspect includes the steps of:

forming a rough surface on at least a portion of an outer surface of the coil disc holder;

carrying out sensitization treatment on the rough surface to form an activation layer;

carrying out chemical plating on the activation layer to form a chemical plating layer of the coil;

the plating layer is subjected to a plating treatment to form a plating layer of the coil on the plating layer.

According to the manufacturing method of the coil panel, the rough surface is formed on at least one part of the outer surface of the coil panel support, so that the coil and the coil panel support mutually permeate during chemical plating and electroplating, the binding force of the coil and the coil panel support is improved, the material requirement on the coil panel support is greatly reduced, the high-temperature-resistant coil panel support can be selected, the temperature-resistant requirement of the coil panel is met, and the coil is prevented from delaminating during high-temperature heating.

Optionally, a plurality of dimples are provided on at least a portion of the outer surface of the coil disk carrier to form the roughened surface.

Optionally, the dimples are formed by roughening the at least a portion of the outer surface of the coil disk support.

Optionally, the roughening treatment is sand blasting roughening.

Optionally, the chemical plating layer is provided with a plurality of circles, and when the chemical plating layer is subjected to electroplating treatment, one conductive electrode is arranged every 2-5 circles.

Alternatively, when the plating layer is subjected to the plating treatment, the coil disk with the conductive electrode is immersed in a plating solution, and the conductive electrode is energized to perform the plating treatment.

Optionally, the activation layer is electroless plated to form a metal layer, and a portion of the metal layer is removed to form a plated layer of the coil.

Optionally, the metal layer is removed by laser scanning cutting to form the chemical plating layer.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a coil disk support before roughening treatment according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a coil disk support after roughening treatment according to an embodiment of the invention;

FIG. 3 is an exploded view of a coil disk after electroless plating according to an embodiment of the invention;

FIG. 4 is an exploded view of a coil disk with a portion of the metal layer removed to form a plated layer of the coil in accordance with an embodiment of the present invention;

fig. 5 is a schematic structural view of a coil disk after electrodes are installed thereon according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a coil disk according to an embodiment of the present invention;

fig. 7 is a flowchart of a coil disk manufacturing method according to an embodiment of the present invention;

fig. 8 is a flowchart of a coil disk manufacturing method according to an embodiment of the present invention.

Reference numerals:

a coil panel 100,

A coil panel holder 1, an outer surface 11, a recess 12, a housing mounting portion 13,

A coil 2, a metal layer 21, a chemical plating layer 22,

A conductive electrode 3.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "inside", "outside", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

A coil disk 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 6. As shown in fig. 6, the coil disk 100 according to the embodiment of the present invention includes a coil disk support 1 and at least one turn of a coil 2.

Optionally, the coil panel support 1 is a non-metal support as a whole, and no metal element is added to the coil panel support 1, so that the coil panel support 1 is low in manufacturing cost.

Alternatively, the coil disc holder 1 is manufactured by injection molding, and the structure thereof is as shown in fig. 1. Further optionally, the coil panel bracket 1 is integrally made of a PBT material or a PPS material, wherein the PBT material has the advantages of high temperature resistance, low cost and the like, and the PPS material has the advantages of high temperature resistance, corrosion resistance, good mechanical properties and the like.

At least a part of the outer surface 11 of the coil disk support 1 is a rough surface on which an active layer is formed, for example, by sensitizing the rough surface to form an active layer, that is, sensitizing the rough surface of the coil disk support 1 to form an active layer having higher activity than other parts of the coil disk support 1.

Optionally, at least a part of the outer surface 11 of the coil disc holder 1 is provided with a plurality of dimples 12 to form a rough surface. As shown in fig. 2, a plurality of concave pits 12 may be distributed at intervals on the outer surface 11 of the coil disc holder 1, and the outer surface 11 of the coil disc holder 1 having the concave pits 12 may improve the bonding force between the coil 2 and the coil disc holder 1 during the subsequent electroless plating and electroplating.

Optionally, at least a part of the recess 12 is configured as a reduced-diameter recess 12, i.e. the size of the open end of the recess 12 is smaller than the size of the interior of the recess 12, so that the coupling force of the coil 2 to the coil disk holder 1 can be further increased and the coil 2 is more firmly fixed to the coil disk holder 1.

The coil 2 includes a chemical plating layer 22 and a plating layer in the thickness direction, the chemical plating layer 22 being provided on the active layer, and the plating layer being provided on the chemical plating layer 22. It will be appreciated that the electroless plating layer 22 is formed by electroless plating and the electroplated layer is formed by electroplating.

When the coil disc 100 is manufactured, the rough surface (i.e., at least a portion of the outer surface 11 of the coil disc 100) shown in fig. 2 is processed to form an active layer, and then is subjected to chemical plating, so that the metal element can be conveniently attached to the active layer by chemical plating to form the chemical plating layer 22, and since at least a portion of the outer surface 11 of the coil disc 100 is a rough surface, the chemical plating layer 22 and the coil disc support 1 can mutually penetrate, so that the bonding force is ensured, that is, the chemical plating layer 22 is more firmly attached to the active layer.

Since the thickness of the chemical plating layer 22 is not enough to satisfy the thickness requirement of the coil 2, a plating layer is formed on the chemical plating layer 22 by electroplating to increase the thickness of the coil 2, and the coil 2 meeting the requirement is finally formed.

In some embodiments, the thickness of the electroless plating layer 22 is D1, and D1 satisfies: d1 is less than or equal to 1 mu m and less than or equal to 2 mu m, so that the chemical plating layer 22 is thin and has good uniformity.

Further, in some embodiments, the thickness of the coil 2 is D2, and D2 satisfies: d2 is more than or equal to 200 mu m and less than or equal to 500 mu m, so that the thickness of the coil 2 is far larger than that of the chemical plating layer 22, the thickness of the plating layer is larger than that of the chemical plating layer 22, and the thickness of the coil 2 is increased by plating, thereby meeting the requirements of the coil panel 100.

According to the coil panel 100 of the embodiment of the invention, at least one part of the outer surface 11 of the coil panel support 1 is a rough surface, so that the coil 2 and the coil panel support 1 mutually permeate during chemical plating and electroplating, the binding force of the coil 2 and the coil panel support 1 is improved, the material requirement on the coil panel support 1 is greatly reduced, the high-temperature-resistant coil panel support 1 can be selected, the temperature-resistant requirement of the coil panel 100 is met, and the coil 2 is prevented from delaminating during high-temperature heating.

Further, in some embodiments, as shown in fig. 1 to 6, the coil panel support 1 has a housing mounting part 13, and the coil panel 100 may further include a housing (not shown) connected to the housing mounting part 13 to define a space for accommodating the coil 2 therebetween, that is, the housing covers the coil 2, prevents the coil 2 from leaking outside, and improves the safety of the coil panel 100.

Alternatively, a housing may be provided separately for covering the coil 2, and the housing may also be a part of the outer case of the electromagnetic cooking appliance having the coil disk 100.

Further alternatively, the housing and the housing mounting portion 13 may be removably connected by a threaded connection and/or a snap-fit arrangement.

An electromagnetic cooking appliance according to the present invention, which includes the coil panel 100 in the above-described embodiment, is briefly described below, so that the electromagnetic cooking appliance has a long service life and is low in cost.

Optionally, the electromagnetic cooking appliance is an electric cooker, a microwave oven, a wall breaking machine, an electromagnetic tea stove, a water kettle, or the like.

A method of manufacturing a coil disk according to an embodiment of the present invention is described below with reference to fig. 1 to 7. As shown in fig. 7, a coil disk manufacturing method according to an embodiment of the present invention includes the steps of:

forming a rough surface on at least a portion of the outer surface 11 of the coil disc holder 1;

sensitizing the rough surface to form an active layer so as to improve the activity of the outer surface 11 of the coil panel bracket 1;

the activation layer is chemically plated to form a chemical plating layer 22 of the coil 2, and the chemical plating layer 22 formed by chemical plating is more uniform and has higher efficiency due to the high activity of the activation layer;

the plating layer 22 is subjected to a plating process to form a plated layer of the coil 2 on the plating layer 22.

The coil disk 100 having the structure shown in fig. 6 can be formed after the above steps are completed.

In some specific embodiments, the coil disc holder 1 may be formed by injection molding by providing a plurality of dimples 12 on at least a portion of the outer surface 11 of the coil disc holder 1 to form a rough surface.

Further, the dimples 12 as shown in fig. 2 may be formed by roughening at least a portion of the outer surface 11 of the coil disk holder 1. Thus, the process of forming the pits 12 is simple.

Alternatively, the roughening treatment can be sand blasting roughening, so that the process is simple, the efficiency is high, and the manufacturing cost is low.

In some embodiments, the chemical plating layer 22 has a plurality of circles, and when the chemical plating layer 22 is electroplated, one conductive electrode 3 is disposed every 2-5 circles, so that the uniformity of the electroplating layer can be maintained by disposing the conductive electrode 3, and the uniformity of the electric field intensity during electroplating can be ensured by disposing a plurality of conductive electrodes 3, thereby ensuring the uniformity of the thickness of the electroplating layer.

Further, when the plating layer 22 is subjected to the plating treatment, the coil disk 100 with the conductive electrode 3 is immersed in the plating solution, and the conductive electrode 3 is energized to perform the plating treatment. Since the conductive electrode 3 is provided only on the plating layer 22 of the coil 2, that is, only the plating layer 22 is electrically conducted, a plating layer is formed only on the plating layer 22 at the time of the plating treatment, thereby increasing the thickness of the coil 2.

In some embodiments, as shown in fig. 8, the electroless plating is formed by:

the metal layer 21 is formed by performing chemical plating on the activation layer, and the metal layer 21 formed by the chemical plating is more uniform and has higher efficiency due to the high activity of the activation layer;

removing a portion of the metal layer 21 forms the plated layer 22 of the coil 2, and the removed portion of the metal layer 21 forms a gap between adjacent coils 2. Specifically, in order to form the plating layer 22 of the coil 2, it is necessary to remove a part of the metal layer 21 to form at least one turn of the plating layer 22, and it is understood that when the plating layer 22 has a plurality of turns, a part of the metal layer 21 between two adjacent turns is removed to form a gap between two adjacent turns of the plating layer 22.

That is, the plating layer 22 is formed by removing a portion of the metal layer 21, the metal layer 21 is attached to the active layer by electroless plating, and the plating layer is attached to the plating layer 22 by electroplating. Alternatively, the metal layer 21 may be a copper layer or a nickel layer.

Alternatively, the metal layer 21 may match the shape of the rough surface of the coil disk carrier 1. For example, in some embodiments, the entire outer surface 11 of the coil disk support 1 forms a rough surface, and the metal layer 21 is integrally covered on the outer surface 11 of the coil disk support 1. In the particular embodiment shown in fig. 3, the coil disk carrier 1 is basin-shaped, as is the metal layer 21. In other embodiments of course, the outer surface 11 of the base of the coil disk carrier 1 forms a rough surface, and the metal layer 21 covers the outer surface 11 of the base of the coil disk carrier 1.

Optionally, the metal layer 21 is cut by laser scanning to remove a part of the metal layer 21 to form the chemical plating layer 22, so that the process is simple, the machining dimensional accuracy is high, the efficiency is high, the deformation of the chemical plating layer 22 is small or no deformation, and the dimensional accuracy of the chemical plating layer 22 is ensured. It will be appreciated that the thickness of the metal layer 21, i.e. the thickness of the plated layer 22.

According to the manufacturing method of the coil panel of the embodiment of the invention, the plurality of pits 12 are formed on the outer surface 11 of the coil panel support 1, so that the coil 2 and the coil panel support 1 mutually permeate during chemical plating and electroplating, the binding force of the coil 2 and the coil panel support 1 is improved, the material requirement on the coil panel support 1 is greatly reduced, the high-temperature-resistant coil panel support 1 can be selected, the temperature-resistant requirement of the coil panel 100 is met, and the coil 2 is prevented from delaminating during high-temperature heating.

The results of the 1250W water boiling temperature rise test of the coil disk 100 manufactured by the coil disk manufacturing method of the present invention and the coil disk manufactured by the conventional LDS method are compared as shown in the following table, wherein the distribution of the test points is shown as T1, T2, T3, T4, T5, T6, and T7 in fig. 6.

TABLE 11250W Water boiling 1h temperature rise test results comparison

Item	Traditional LDS coil panel	The invention coil panel
			Maximum temperature rise of coil panel	146.093℃	122.226℃
Whether or not delamination occurred	Is that	Whether or not

By comparison, the coil disk 100 according to the present invention has a small maximum temperature rise, and the coil 2 does not delaminate at a high temperature.

In short, according to the coil panel manufacturing method of the present invention, the coil panel 100 is manufactured at a low cost, and the coil 2 is tightly bonded to the coil panel support 1, so that the coil 2 is not easily delaminated at a high temperature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A coil disc, comprising:

a coil disk support, at least a part of the outer surface of which is a rough surface on which an activation layer is formed, wherein the at least a part of the outer surface of the coil disk support is provided with a plurality of pits to form the rough surface;

at least one coil, wherein the coil comprises a chemical plating layer and an electroplated layer in the thickness direction, the chemical plating layer is arranged on the activation layer, and the electroplated layer is arranged on the chemical plating layer; wherein

The thickness of the chemical plating layer is D1, and D1 satisfies: d1 is more than or equal to 1 mu m and less than or equal to 2 mu m, the thickness of the coil is D2, and D2 satisfies: d2 is more than or equal to 200 mu m and less than or equal to 500 mu m.

2. Coil disk according to claim 1, characterized in that at least a part of the recesses are configured as crater-like recesses.

3. Coil disk according to claim 1, characterized in that the coil disk support is entirely a non-metallic support.

4. Coil disc according to claim 3, characterized in that the coil disc holder is entirely a holder of PBT material or PPS material.

5. Coil disk according to claim 1, characterized in that the coil disk carrier is injection molded.

6. An electromagnetic cooking appliance, characterized in that it comprises a coil disc according to any one of claims 1 to 5.

7. A coil disk manufacturing method of manufacturing a coil disk according to any of claims 1-6, characterized by comprising the steps of:

forming a rough surface on at least a portion of an outer surface of a coil disk holder, wherein a plurality of dimples are provided on at least a portion of the outer surface of the coil disk holder to form the rough surface;

8. The coil disk manufacturing method according to claim 7, wherein the dimples are formed by roughening treatment of the at least a portion of the outer surface of the coil disk holder.

9. The coil disk manufacturing method according to claim 8, wherein the roughening treatment is sand blast roughening.

10. The coil disk manufacturing method as claimed in claim 7, wherein the plating layer is formed in a plurality of turns, and a conductive electrode is provided every 2 to 5 turns when the plating layer is subjected to the plating treatment.

11. The coil disk manufacturing method according to claim 10, wherein the plating layer is subjected to a plating treatment by immersing the coil disk with the conductive electrode in a plating solution and energizing the conductive electrode.

12. The method of claim 7, wherein the metal layer is formed by electroless plating the active layer, and the electroless plating layer of the coil is formed by removing a portion of the metal layer.

13. A coil disk manufacturing method according to claim 12, wherein said plated layer is formed by removing a part of said metal layer by laser scanning cutting.